HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6716
Issued Date : 1996.02.01
Revised Date : 2001.05.28
Page No. : 1/2
HBU407
HSMC Product Specification
HBU407
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HBU407 is designed for use in TV Horizontal output and
Switching applications.
Features
High Breakdown Voltage
Absolute Maximum Ratings
(Ta=25
C)
Maximum Temperatures
Storage Temperature ............................................................................................ -50 ~ +150
C
Junction Temperature ..................................................................................... 150
C Maximum
Maximum Power Dissipation
Total Power Dissipation (Tc=25
C) .................................................................................... 60 W
Maximum Voltages and Currents (Ta=25
C)
VCEO Collector to Emitter Voltage ................................................................................... 150 V
VEBO Emitter to Base Voltage ............................................................................................. 6 V
IC Collector Current ............................................................................................................. 7 A
IB Base Current .................................................................................................................... 4 A
Characteristics
(Ta=25
C)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
*BVCEO
150
-
-
V
IC=100mA, IB=0
ICES
-
-
5
mA
VCE=400V
IEBO
-
-
1
mA
VEB=6V, IC=0
*VCE(sat)
-
-
1
V
IC=5A, IB=0.5A
*VBE(sat)
-
-
1.2
V
IC=5A, IB=0.5A
*hFE1
25
-
-
IC=500mA, VCE=5V
*hFE2
35
-
200
IC=2A, VCE=5V
*hFE3
10
-
-
IC=5A, VCE=5V
FT
10
-
-
MHz
IC=500mA, VCE=10V, f=1MHz
*Pulse Test : Pulse Width
380us, Duty Cycle
2%
Classification Of hFE2
Rank
B
C
D
Range
35-85
75-125
115-200
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6716
Issued Date : 1996.02.01
Revised Date : 2001.05.28
Page No. : 2/2
HBU407
HSMC Product Specification
TO-220AB Dimension
*:Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.2197
0.2949
5.58
7.49
I
-
*
0.1508
-
*
3.83
B
0.3299
0.3504
8.38
8.90
K
0.0295
0.0374
0.75
0.95
C
0.1732
0.185
4.40
4.70
M
0.0449
0.0551
1.14
1.40
D
0.0453
0.0547
1.15
1.39
N
-
*
0.1000
-
*
2.54
E
0.0138
0.0236
0.35
0.60
O
0.5000
0.5618
12.70
14.27
G
0.3803
0.4047
9.66
10.28
P
0.5701
0.6248
14.48
15.87
H
-
*
0.6398
-
*
16.25
Notes :
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
Lead : 42 Alloy ; solder plating
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
A
B
E
G
I
K
M
O
P
3
2
1
C
N
H
D
4
Style : Pin 1.Base 2.Collector 3.Emitter
3-Lead TO-220AB Plastic Package
HSMC Package Code : E
Marking :
HSMC Logo
Part Number
Date Code
Product Series
Rank
PDF 
ZIP