HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6111
Issued Date : 1992.09.30
Revised Date : 2002.03.06
Page No. : 1/4
HE8051S
HSMC Product Specification
HE8051S
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HE8051S is designed for general purpose amplifier applications.
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150
C
Junction Temperature .................................................................................... +150
C Maximum
Maximum Power Dissipation
Total Power Dissipation (Ta=25
C) ................................................................................ 625 mW
Maximum Voltages and Currents (Ta=25
C)
VCBO Collector to Base Voltage ......................................................................................... 25 V
VCEO Collector to Emitter Voltage ...................................................................................... 20 V
VEBO Emitter to Base Voltage .............................................................................................. 5 V
IC Collector Current ....................................................................................................... 700 mA
Characteristics
(Ta=25
C)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
BVCBO
25
-
-
V
IC=10uA
BVCEO
20
-
-
V
IC=1mA
BVEBO
5
-
-
V
IE=10uA
ICBO
-
-
1
uA
VCB=20V
IEBO
-
-
100
nA
VEB=6V
*VCE(sat)
-
-
0.5
V
IC=0.5A, IB=50mA
VBE(on)
-
-
1
V
VCE=1V, IC=150mA
*hFE1
100
-
500
VCE=1V, IC=150mA
*hFE2
-
140
-
VCE=1V, IC=500mA
fT
150
-
-
MHz
VCE=10V, IC=20mA, f=100MHz
Cob
-
-
10
pF
VCB=10V, f=1MHz, IE=0
*Pulse Test: Pulse Width
380us, Duty Cycle
2%
Classification Of hFE
Rank
C
C1
D
D1
E
hFE1
100-180
100-180
160-300
160-300
250-500
hFE2
-
>
100
-
>
100
-
TO-92
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6111
Issued Date : 1992.09.30
Revised Date : 2002.03.06
Page No. : 2/4
HE8051S
HSMC Product Specification
Characteristics Curve
Current Gain & Collector Current
100
1000
1
10
100
1000
Collector Current-I
C
(mA)
hFE
hFE @ V
CE
=1V
25
o
C
75
o
C
125
o
C
Saturation Voltage & Collector Current
1
10
100
1000
0.1
1
10
100
1000
Collector Current-I
C
(mA)
S
a
t
u
r
a
t
i
on V
o
l
t
a
ge (
m
V
)
V
CE(sat)
@ I
C
=10I
B
25
o
C
75
o
C
125
o
C
ON Voltage & Collector Current
100
1000
0.1
1
10
100
1000
Collector Current-I
C
(mA)
O
N
V
o
l
t
ag
e (
m
V
)
V
BE(ON)
@ V
CE
=1V
25
o
C
75
o
C
125
o
C
Capacitance & Reverse-Biased Voltage
1
10
100
0.1
1
10
100
Reverse-Biased Voltage (V)
C
a
pa
c
i
t
a
n
c
e (
p
F
)
Cob
Cutoff Frequency & Collector Current
10
100
1000
1
10
100
1000
Collector Current (mA)
C
u
to
ff F
r
e
q
u
e
n
c
y
(
M
H
z
)
...
V
CE
=10V
Safe Operating Area
1
10
100
1000
10000
1
10
100
Forward Voltage-V
CE
(V)
Co
lle
c
t
o
r
Cu
r
r
e
n
t
-
I
C
(mA
)
PT=1ms
PT=100ms
PT=1s
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6111
Issued Date : 1992.09.30
Revised Date : 2002.03.06
Page No. : 4/4
HE8051S
HSMC Product Specification
TO-92 Dimension
*: Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.1704
0.1902
4.33
4.83
G
0.0142
0.0220
0.36
0.56
B
0.1704
0.1902
4.33
4.83
H
-
*
0.1000
-
*
2.54
C
0.5000
-
12.70
-
I
-
*
0.0500
-
*
1.27
D
0.0142
0.0220
0.36
0.56
1
-
*
5
-
*
5
E
-
*
0.0500
-
*
1.27
2
-
*
2
-
*
2
F
0.1323
0.1480
3.36
3.76
3
-
*
2
-
*
2
Notes:
1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
3
1
A
D
B
C
I
1
E
F
2
3
G
H
2
Style: Pin 1.Emitter 2.Base 3.Collector
3-Lead TO-92 Plastic Package
HSMC Package Code: A
Marking:
H
E
0
8
5
Date Code
Control Code
Rank
1 S
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