ChipFind - документация

Электронный компонент: HM64

Скачать:  PDF   ZIP
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE9512
Issued Date : 1996.04.17
Revised Date : 2001.09.20
Page No. : 1/3
HM64
HSMC Product Specification
HM64
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HM64 is a darlington amplifier transistor designed for
applications requiring extremely high current gain.
Features
High D.C current gain
HM64 is complementary to HM14
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150
C
Junction Temperature .................................................................................... +150
C Maximum
Maximum Power Dissipation
Total Power Dissipation (Ta=25
C) ....................................................................................... 1 W
Maximum Voltages and Currents (Ta=25
C)
VCBO Collector to Base Voltage ........................................................................................ -30 V
VCES Collector to Emitter Voltage ..................................................................................... -30 V
VEBO Emitter to Base Voltage ........................................................................................... -10 V
IC Collector Current ...................................................................................................... -300 mA
Characteristics
(Ta=25
C)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
BVCBO
-30
-
-
V
IC=-100uA
BVCES
-30
-
-
V
IC=-100uA
BVEBO
-10
-
-
V
IE=-10uA
ICBO
-
-
-100
nA
VCB=-30V
IEBO
-
-
-100
nA
VEB=-10V
*VCE(sat)
-
-
-1.5
V
IC=-100mA, IB=-0.1mA
*VBE(on)
-
-
-2
V
VCE=-5V, IC=-100mA
*hFE1
10
-
-
K
VCE=-5V, IC=-10mA
*hFE2
20
-
-
K
VCE=-5V, IC=-100mA
fT
125
-
-
MHz
VCE=-5V, IC=-10mA
*Pulse Test : Pulse Width
380us, Duty Cycle
2%
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE9512
Issued Date : 1996.04.17
Revised Date : 2001.09.20
Page No. : 2/3
HM64
HSMC Product Specification
Characteristics Curve
Current Gain & Collector Current
1000
10000
100000
10
100
1000
Collector Current (mA)
hF
E
V
CE
=5V
Saturation Voltage & Collector Current
100
1000
10000
1
10
100
1000
Collector Current (mA)
S
a
tu
ra
ti
o
n
V
o
lta
g
e
(m
V
)
V
CE(sat)
@ I
C
=1000I
B
On Voltage & Collector Current
1
10
1
10
100
1000
Collector Current (mA)
O
n
V
o
l
t
ag
e (
m
V
)
V
BE(on)
@ V
CE
=5V
Capacitance & Reverse-Biased Voltage
1
10
100
1
10
100
Reverse Biased Voltage (V)
C
a
p
a
c
i
ta
n
c
e
(P
f)
Cob
Cutoff Frequency & I
C
10
100
1000
1
10
100
1000
Collector Current (mA)
C
u
to
ff F
r
e
q
u
e
n
c
y
(
M
Hz
)
fT
Safe Operating Area
1
10
100
1000
10000
1
10
100
Forward Voltage (V)
Co
l
l
e
c
t
o
r
Cu
r
r
e
n
t
(
m
A)
P
T
=1ms
P
T
=100ms
P
T
=1s
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE9512
Issued Date : 1996.04.17
Revised Date : 2001.09.20
Page No. : 3/3
HM64
HSMC Product Specification
SOT-89 Dimension
*: Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.1732
0.1811
4.40
4.60
F
0.0583
0.0598
1.48
1.52
B
0.1594
0.1673
4.05
4.25
G
0.1165
0.1197
2.96
3.04
C
0.0591
0.0663
1.50
1.70
H
0.0551
0.0630
1.40
1.60
D
0.0945
0.1024
2.40
2.60
I
0.0138
0.0161
0.35
0.41
E
0.0141
0.0201
0.36
0.51
Notes:
1.Dimension and tolerance based on our Spec. dated May. 05,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
Lead: 42 Alloy ; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
3
2
1
A
B
C
D
E
F
G
H
I
Style: Pin 1.Base 2.Collector 3.Emitter
Marking:
Part Number
Date Code
HSMC Logo
Package Code
3-Lead SOT-89 Plastic Surface Mounted Package
HSMC Package Code: M