HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE9511
Issued Date : 1996.04.12
Revised Date : 2002.10.01
Page No. : 1/3
HM965
HSMC Product Specification
HM965
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HM965 is designed for use as AF output amplifier and glash unit.
Features
Low VCE(sat)
High performance at low supply voltage
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150
C
Junction Temperature .................................................................................... +150
C Maximum
Maximum Power Dissipation
Total Power Dissipation (Ta=25
C) .................................................................................... 1.2 W
Maximum Voltages and Currents (Ta=25
C)
BVCBO Collector to Base Voltage....................................................................................... 40 V
BVCEO Collector to Emitter Voltage.................................................................................... 20 V
BVEBO Emitter to Base Voltage............................................................................................ 7 V
IC Collector Current (Continuous) ......................................................................................... 5 A
IC Collector Current (Peak PT=10mS) .................................................................................. 8 A
Characteristics
(Ta=25
C)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
BVCBO
40
-
-
V
IC=100uA
BVCEO
20
-
-
V
IC=1mA
BVEBO
7
-
-
V
IE=10uA
ICBO
-
-
0.1
uA
VCB=10V
IEBO
-
-
0.1
uA
VEB=7V
*VCE(sat)
-
0.35
1
V
IC=3A, IB=0.1A
*hFE1
340
-
800
VCE=2V, IC=0.5A
*hFE2
150
-
-
VCE=2V, IC=2A
fT
-
150
-
MHz
VCE=6V, IE=50mA
Cob
-
-
50
pF
VCB=20V, f=1MHz
*Pulse Test: Pulse Width
380us, Duty Cycle
2%
Classifications Of hFE1
Rank
R
S
Range
340-600
560-800
SOT-89
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE9511
Issued Date : 1996.04.12
Revised Date : 2002.10.01
Page No. : 2/3
HM965
HSMC Product Specification
Characteristics Curve
Current Gain & Collector Current
10
100
1000
10000
10
100
1000
10000
Collector Current-I
C
(mA)
HF
E
25
o
C
75
o
C
125
o
C
hFE @ V
CE
=2V
Saturation Voltage & Collector Current
10
100
1000
1
10
100
1000
10000
Collector Current-I
C
(mA)
S
a
tu
r
a
ti
o
n
V
o
l
t
a
g
e
(
m
V
)
25
o
C
75
o
C
125
o
C
V
CE(sat)
@ I
C
=30I
B
Capacitance & Reverse-Biased Voltage
10
100
0.1
1
10
100
Reverse-Biased Voltage (V)
C
apa
c
i
t
anc
e (
p
F
)
Cob
Cutoff Frequency & Collector Current
10
100
1000
1
10
100
1000
Collector Current (mA)
C
u
to
ff F
r
e
q
u
e
n
c
y
(
M
H
z
)
...
V
CE
=6V
Safe Operating Area
10
100
1000
10000
100000
1
10
100
Forward Biased Voltage-V
CE
(V)
Co
lle
c
t
o
r
Cu
r
r
e
n
t
-
I
C
(mA
)
P
T
=1ms
P
T
=100ms
P
T
=1s
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE9511
Issued Date : 1996.04.12
Revised Date : 2002.10.01
Page No. : 3/3
HM965
HSMC Product Specification
SOT-89 Dimension
*: Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.1732
0.1811
4.40
4.60
F
0.0583
0.0598
1.48
1.52
B
0.1594
0.1673
4.05
4.25
G
0.1165
0.1197
2.96
3.04
C
0.0591
0.0663
1.50
1.70
H
0.0551
0.0630
1.40
1.60
D
0.0945
0.1024
2.40
2.60
I
0.0138
0.0161
0.35
0.41
E
0.0141
0.0201
0.36
0.51
Notes:
1.Dimension and tolerance based on our Spec. dated May. 05,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
3
2
1
A
B
C
D
E
F
G
H
I
Style: Pin 1.Base 2.Collector 3.Emitter
Marking:
Date Code
9
H M
6 5
Laser Marking
3-Lead SOT-89 Plastic Surface Mounted Package
HSMC Package Code: M
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