HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6857
Issued Date : 1994.01.25
Revised Date : 2002.10.25
Page No. : 1/2
HMBD2003, HMBD2003C, HMBD2003S
HSMC Product Specification
HMBD2003\C\S
Description
The HMBD2003\C\S are general purpose diodes fabricated in planar
technology, and encapsulated in small plastic SMD SOT-23 package.
Features
Small plastic SMD package
Switching speed: max. 50 nS
General application:
Continuous reverse voltage: Max. 200 V
Repetitive peak reverse voltage: Max. 250 V
Repetitive peak forward current: Max. 625 mA
Absolute Maximum Ratings
(Ta=25
C)
Characteristic
Symbol
Value
Unit
HMBD2003 Repetitive Peak Reverse Voltage
250
HMBD2003C Repetitive Peak Reverse Voltage
250
HMBD2003S Repetitive Peak Reverse Voltage
VRRM
250
V
HMBD2003 Continuous reverse voltage
200
HMBD2003C Continuous reverse voltage
200
HMBD2003S Continuous reverse voltage
VR
200
V
Forward Continuous Current at Ta=25
C
lF
225
mA
Repetitive Peak Forward Current at Ta=25
C
IFRM
625
mA
Surge Forward Current at t =1mS, Ta=25
C
IFSM
1
A
Power Dissipation
PD
250 Max
mV
Junction Temperature
Tj
150
C
Storage Temperature Range
Tstg
-65~+150
C
Characteristics
(Ta=25
C)
Characteristic
Symbol
Condition
Min
Max
Unit
VF(1)
IF=100mA
-
1
Forward Voltage
VF(2)
IF=200mA
-
1.25
V
HMBD2003 Reverse Current
VR=200V
-
100
HMBD2003C Reverse Current
VR=200V
-
100
HMBD2003S Reverse Current
IR
VR=200V
-
100
nA
Total Capacitance
CT
VR=0V, f=1MHz
5
-
pF
Reverse Recovery Time
Trr
IF=30mA to IR=30mA
RL=100
measured at
IR=3mA
50
-
nS
BV
R
BV
R
IR=100uA
250
-
V
SOT-23
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6857
Issued Date : 1994.01.25
Revised Date : 2002.10.25
Page No. : 2/2
HMBD2003, HMBD2003C, HMBD2003S
HSMC Product Specification
SOT-23 Dimension
*: Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.1102
0.1204
2.80
3.04
J
0.0034
0.0070
0.085
0.177
B
0.0472
0.0630
1.20
1.60
K
0.0128
0.0266
0.32
0.67
C
0.0335
0.0512
0.89
1.30
L
0.0335
0.0453
0.85
1.15
D
0.0118
0.0197
0.30
0.50
S
0.0830
0.1083
2.10
2.75
G
0.0669
0.0910
1.70
2.30
V
0.0098
0.0256
0.25
0.65
H
0.0005
0.0040
0.013
0.10
Notes:
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
H
J
K
D
A
L
G
V
C
B
3
2
1
S
3-Lead SOT-23 Plastic Surface Mounted Package
HSMC Package Code: N
Marking:
HMBD2003
HMBD2003C
2
1
HMBD2003S
A82
C3C
C3S
Diagram:
HMBD2003
HMBD2003C
1
2
3
3
2
1
HMBD2003S
1
2
3
PDF 
ZIP