HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6802
Issued Date : 1995.12.09
Revised Date : 2002.10.25
Page No. : 1/2
HMBD4148
HSMC Product Specification
HMBD4148
HIGH-SPEED SWITCHING DIODE
Description
The HMBD4148 is designed for high-speed switching application in hybrid
thick-and thin-film circuits. The devices is manufactured by the silicon
epitaxial planar process and packed in plastic surface mount package.
Features
Small SMD Package (SOT-23)
Ultra-high Speed
Low Forward Voltage
Fast Reverse Recovery Time
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature ........................................................................................................ -65 ~ +150
C
Junction Temperature ................................................................................................................ +150
C
Maximum Power Dissipation
Total Power Dissipation (Ta=25
C)............................................................................................. 225 mW
Maximum Voltages and Currents (Ta=25
C)
Continuous Reverse Voltage .......................................................................................................... 70 V
Continuous Forward Current....................................................................................................... 200 mA
Peak Forward Surge Current ...................................................................................................... 500 mA
Characteristics
(Ta=25
C)
Characteristic
Symbol
Condition
Min
Max
Unit
Forward Voltage
VF
IF=10mA
-
1
V
Reverse Breakdown
VR
IR=100uA
100
-
V
Reverse Current
IR
VR=75V
-
5
uA
Total Capacitance
CT
VR=0, F=1MHz
-
4
pF
Reverse Recovery Time
Trr
IF=IR=10mA, RL=100
Measured at IR=1mA
-
4
nS
SOT-23
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6802
Issued Date : 1995.12.09
Revised Date : 2002.10.25
Page No. : 2/2
HMBD4148
HSMC Product Specification
SOT-23 Dimension
*: Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.1102
0.1204
2.80
3.04
J
0.0034
0.0070
0.085
0.177
B
0.0472
0.0630
1.20
1.60
K
0.0128
0.0266
0.32
0.67
C
0.0335
0.0512
0.89
1.30
L
0.0335
0.0453
0.85
1.15
D
0.0118
0.0197
0.30
0.50
S
0.0830
0.1083
2.10
2.75
G
0.0669
0.0910
1.70
2.30
V
0.0098
0.0256
0.25
0.65
H
0.0005
0.0040
0.013
0.10
Notes:
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
H
J
K
D
A
L
G
V
C
B
3
2
1
S
Style: Pin 1.Anode 2.NC 3.Cathode
3-Lead SOT-23 Plastic Surface Mounted Package
HSMC Package Code: N
Marking:
Rank Code
5 H
Control Code
Diagram:
PDF 
ZIP