HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6844
Issued Date : 1994.07.29
Revised Date : 2002.10.25
Page No. : 1/2
HMBT4125
HSMC Product Specification
HMBT4125
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HMBT4125 is designed for general purpose switching and
amplifier applications.
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature ............................................................................................ -65 ~ +150
C
Junction Temperature .................................................................................................... +150
C
Maximum Power Dissipation
Total Power Dissipation (Ta=25
C) ................................................................................ 225 mW
Maximum Voltages and Currents (Ta=25
C)
VCBO Collector to Base Voltage ........................................................................................ -30 V
VCEO Collector to Emitter Voltage ..................................................................................... -30 V
VEBO Emitter to Base Voltage .......................................................................................... -4.0 V
IC Collector Current....................................................................................................... -200 mA
Characteristics
(Ta=25
C)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
BVCBO
-30
-
-
V
IC=-10uA
BVCEO
-30
-
-
V
IC=-1mA
BVEBO
-4
-
-
V
IE=-10uA
ICBO
-
-
-50
nA
VCB=-20V
IEBO
-
-
-50
nA
VBE=-3V
*VCE(sat)
-
-
-0.4
V
IC=-50mA, IB=-5mA
*VBE(sat)
-
-
-950
mV
IC=-50mA, IB=-5mA
*hFE1
50
-
150
VCE=-1V, IC=-2mA
*hFE2
25
-
-
VCE=-1V, IC=-50mA
fT
200
-
-
MHz
VCE=-20V, IC=-10mA, f=100MHz
Cob
-
-
4.5
pF
VCB=-5V, f=1MHz
*Pulse Test: Pulse Width
380us, Duty Cycle
2%
SOT-23
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6844
Issued Date : 1994.07.29
Revised Date : 2002.10.25
Page No. : 2/2
HMBT4125
HSMC Product Specification
SOT-23 Dimension
*: Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.1102
0.1204
2.80
3.04
J
0.0034
0.0070
0.085
0.177
B
0.0472
0.0630
1.20
1.60
K
0.0128
0.0266
0.32
0.67
C
0.0335
0.0512
0.89
1.30
L
0.0335
0.0453
0.85
1.15
D
0.0118
0.0197
0.30
0.50
S
0.0830
0.1083
2.10
2.75
G
0.0669
0.0910
1.70
2.30
V
0.0098
0.0256
0.25
0.65
H
0.0005
0.0040
0.013
0.10
Notes:
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
H
J
K
D
A
L
G
V
C
B
3
2
1
S
Style: Pin 1.Base 2.Emitter 3.Collector
Marking:
Rank Code
Z D
Control Code
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
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