HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HN200209
Issued Date : 2000.11.01
Revised Date : 2002.10.25
Page No. : 1/3
HMBTA94
HSMC Product Specification
HMBTA94
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HMBTA94 is designed for application that requires high voltage.
Features
High Breakdown Voltage: VCEO=400(Min.) at IC=1mA
Complementary to HMBTA44
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150
C
Junction Temperature .................................................................................... +150
C Maximum
Maximum Power Dissipation
Total Power Dissipation (Ta=25
C) ................................................................................ 350 mW
Maximum Voltages and Currents (Ta=25
C)
VCBO Collector to Base Voltage ...................................................................................... -400 V
VCEO Collector to Emitter Voltage ................................................................................... -400 V
VEBO Emitter to Base Voltage ............................................................................................. -6 V
IC Collector Current ...................................................................................................... -150 mA
Characteristics
(Ta=25
C)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
BVCBO
-400
-
-
V
IC=-100uA, IE=0
BVCEO
-400
-
-
V
IC=-1mA, IB=0
BVEBO
-6
-
-
V
IE=-10uA, IC=0
ICBO
-
-
-100
nA
VCB=-400V, IE=0
IEBO
-
-
-100
nA
VEB=-6V, IC=0
ICES
-
-
-500
nA
VCE=-400V, VBE=0
*VCE(sat)1
-
-
-200
mV
IC=-1mA, IB=-0.1mA
*VCE(sat)2
-
-
-300
mV
IC=-10mA, IB=-1mA
*VCE(sat)3
-
-
-600
mV
IC=-50mA, IB=-5mA
*VBE(sat)
-
-
-900
mV
IC=-10mA, IB=-1mA
*hFE1
50
-
-
VCE=-10V, IC=-1mA
*hFE2
75
-
200
VCE=-10V, IC=-10mA
*hFE3
60
-
-
VCE=-10V, IC=-50mA
*hFE4
40
-
-
VCE=-10V, IC=-100mA
Cob
-
4
6
pF
VCE=-10V, f=1MHz
*Pulse Test: Pulse Width
380us, Duty Cycle
2%
SOT-23
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HN200209
Issued Date : 2000.11.01
Revised Date : 2002.10.25
Page No. : 2/3
HMBTA94
HSMC Product Specification
Characteristics Curve
Capacitance & Reverse-Biased Voltage
1
10
100
0.1
1
10
100
Reverse-Biased Voltage (V)
C
a
pa
c
i
t
a
n
c
e (
p
F
)
Cob
Current Gain & Collector Current
1
10
100
1000
1
10
100
1000
Collector Current-I
C
(mA)
hFE
25
o
C
75
o
C
125
o
C
hFE @ V
CE
=3V
Current Gain & Collector Current
10
100
1000
1
10
100
1000
Collector Current-I
C
(mA)
hFE
25
o
C
75
o
C
125
o
C
hFE @ V
CE
=10V
Saturation Voltage & Collector Current
10
100
1000
1
10
100
1000
Collector Current-I
C
(mA)
S
a
t
u
r
a
t
i
on V
o
l
t
a
ge (
m
V
)
25
o
C
75
o
C
125
o
C
V
CE(sat)
@ I
C
=10I
B
Saturation Voltage & Collector Current
100
1000
1
10
100
1000
Collector Current-I
C
(mA)
S
a
t
u
r
a
t
i
on V
o
l
t
a
ge (
m
V
)
25
o
C
75
o
C
125
o
C
V
BE(sat)
@ I
C
=10I
B
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HN200209
Issued Date : 2000.11.01
Revised Date : 2002.10.25
Page No. : 3/3
HMBTA94
HSMC Product Specification
SOT-23 Dimension
*: Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.1102
0.1204
2.80
3.04
J
0.0034
0.0070
0.085
0.177
B
0.0472
0.0630
1.20
1.60
K
0.0128
0.0266
0.32
0.67
C
0.0335
0.0512
0.89
1.30
L
0.0335
0.0453
0.85
1.15
D
0.0118
0.0197
0.30
0.50
S
0.0830
0.1083
2.10
2.75
G
0.0669
0.0910
1.70
2.30
V
0.0098
0.0256
0.25
0.65
H
0.0005
0.0040
0.013
0.10
Notes:
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
H
J
K
D
A
L
G
V
C
B
3
2
1
S
Style: Pin 1.Base 2.Emitter 3.Collector
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
Marking:
Rank Code
4 Z
Control Code
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