HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6518
Issued Date : 1993.02.24
Revised Date : 2002.02.20
Page No. : 1/4
HSD471A
HSMC Product Specification
HSD471A
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HSD471A is designed for use in drive and output stage of
frequency amplifier applications.
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150
C
Junction Temperature ...................................................................................... 150
C Maximum
Maximum Power Dissipation
Total Power Dissipation (Ta=25
C) ................................................................................ 800 mW
Maximum Voltages and Currents (Ta=25
C)
VCBO Collector to Base Voltage ......................................................................................... 40 V
VCEO Collector to Emitter Voltage ...................................................................................... 30 V
VEBO Emitter to Base Voltage .............................................................................................. 5 V
IC Collector Current............................................................................................................... 1 A
Characteristics
(Ta=25
C)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
BVCBO
40
-
-
V
IC=100uA, IE=0
BVCEO
30
-
-
V
IC=10mA, IB=0
BVEBO
5
-
-
V
IE=100uA, IC=0
ICBO
-
-
100
nA
VCB=30V, IE=0
*VCE(sat)
-
-
0.5
V
IC=1A, IB=100mA
*VBE(sat)
-
-
1.2
V
IC=1A, IB=100mA
*hFE
70
-
400
VCE=1V, IC=100mA
fT
-
130
-
MHz
VCE=6V, IC=10mA
Cob
-
16
-
pF
VCB=6V, f=1MHz, IE=0
*Pulse Test: Pulse Width
380us, Duty Cycle
2%
Classification of hFE
Rank
O
Y
GR
Range
70-140
120-240
200-400
TO-92
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6518
Issued Date : 1993.02.24
Revised Date : 2002.02.20
Page No. : 2/4
HSD471A
HSMC Product Specification
Characteristics Curve
Current Gain & Collector Current
100
1000
1
10
100
1000
Collector Current-I
C
(mA)
hFE
25
o
C
hFE @ V
CE
=1V
125
o
C
75
o
C
Saturation Voltage & Collector Current
10
100
1000
1
10
100
1000
Collector Current-I
C
(mA)
Sa
t
u
r
a
t
i
o
n
Vo
l
t
a
g
e
(
m
V)
25
o
C
125
o
C
75
o
C
V
CE(sat)
@ I
C
=10I
B
Saturation Voltage & Collector Current
100
1000
1
10
100
1000
Collector Current-I
C
(mA)
S
a
t
u
r
a
t
i
on V
o
l
t
a
ge (
m
V
)
25
o
C
125
o
C
75
o
C
V
BE(sat)
@ I
C
=10I
B
Capacitance & Reverse-Biased Voltage
1
10
100
0.1
1
10
100
1000
Reverse Biased Voltage (V)
C
apa
c
i
t
anc
e (
p
F
)
Cob
Cutoff Frequency & Ic
10
100
1000
1
10
100
1000
Collector Current (mA)
C
u
to
ff F
r
e
q
u
e
n
c
y
(
M
H
z
)
...
V
CE
=6V
Safe Operating Area
1
10
100
1000
10000
1
10
100
Forward Biased Voltage-V
CE
(V)
C
o
l
l
e
c
t
o
r C
u
rre
n
t
-I
C
(mA
)
P
T
=1ms
P
T
=100ms
P
T
=1s
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6518
Issued Date : 1993.02.24
Revised Date : 2002.02.20
Page No. : 3/4
HSD471A
HSMC Product Specification
Temperature Profile for Dip Soldering
0
50
100
150
200
250
300
0
50
100
150
200
250
300
350
Time(sec)
T
e
m
per
a
t
ur
e(
o
C)
10+/-2 sec
120+/-20 sec
IR Reflow Profile
0
20
40
60
80
100
120
140
160
180
200
220
240
260
0
50
100
150
200
250
300
Time(sec)
T
e
m
per
a
t
ur
e(
o
C)
150+/-30
40+/-20 sec
10+/-2 sec
Power Temperature Derating
0
100
200
300
400
500
600
700
800
900
0
20
40
60
80
100
120
140
160
Ta , Case Temperature (
o
C)
P
D
, P
o
w
e
r
D
i
s
s
i
p
a
ti
o
n
(
m
W
)
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6518
Issued Date : 1993.02.24
Revised Date : 2002.02.20
Page No. : 4/4
HSD471A
HSMC Product Specification
TO-92 Dimension
*: Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.1704
0.1902
4.33
4.83
G
0.0142
0.0220
0.36
0.56
B
0.1704
0.1902
4.33
4.83
H
-
*0.1000
-
*2.54
C
0.5000
-
12.70
-
I
-
*0.0500
-
*1.27
D
0.0142
0.0220
0.36
0.56
1
-
*5
-
*5
E
-
*0.0500
-
*1.27
2
-
*2
-
*2
F
0.1323
0.1480
3.36
3.76
3
-
*2
-
*2
Notes:
1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
3
1
A
D
B
C
I
1
E
F
2
3
G
H
2
Style: Pin 1.Emitter 2.Collector 3.Base
3-Lead TO-92 Plastic Package
HSMC Package Code: A
Marking:
H
D
7
4
1
Date Code
Control Code
S
Rank
A
PDF 
ZIP