HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6601-C
Issued Date : 1993.03.15
Revised Date : 2000.10.01
Page No. : 1/3
HSMC Product Specification
HSA1538
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HSA1538 is designed for high-definition CRT display video output,
wide-band amplifier.
Features
High fT: fT=500MHz
High breakdown voltage: BVCEO=120Vmin
Small reverse transfer capacitance
Absolute Maximum Ratings
(Ta=25
C)
Maximum Temperatures
Storage Temperature ....................................................................................................... -50 ~ +150
C
Junction Temperature ............................................................................................... +150
C Maximum
Maximum Power Dissipation
Total Power Dissipation (Ta=25
C) ............................................................................................... 1.3 W
Total Power Dissipation (Tc=25
C) ................................................................................................... 8 W
Maximum Voltages and Currents
BVCBO Collector to Base Voltage ............................................................................................... -120 V
BVCEO Collector to Emitter Voltage ............................................................................................ -120 V
BVEBO Emitter to Base Voltage ...................................................................................................... -3 V
IC Collector Current .................................................................................................................. -200 mA
Icp Peak Collector Current (Pulse) ............................................................................................ -400 mA
Electrical Characteristics
(Ta=25
C)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
BVCBO
-120
-
-
V
IC=-10uA
BVCEO
-120
-
-
V
IC=-1mA
BVEBO
-3
-
-
V
IE=-100uA
ICBO
-
-
-0.1
uA
VCB=-80V, IE=0
IEBO
-
-
-0.1
uA
VBE=-2V, IC=0
*VCE(sat)
-
-
-1
V
IC=-30mA, IB=-3mA
*VBE(sat)
-
-
-1
V
IC=-30mA, IB=-3mA
*hFE1
60
160
320
IC=-10mA, VCE=-10V
*hFE2
40
-
-
IC=-100mA, VCE=-10V
fT
-
400
-
MHz
VCE=-10V, IC=-50mA
Cob
-
2.8
-
pF
VCB=-30V, f=-1MHz
Cre
-
2.2
-
pF
VCB=-30V, f=-1MHz
*Pulse Test : Pulse Width
380us, Duty Cycle
2%
Classification Of hFE1
Rank
D
E
F
Range
60-120
100-200
160-320
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6601-C
Issued Date : 1993.03.15
Revised Date : 2000.10.01
Page No. : 2/3
HSMC Product Specification
Characteristics Curve
Current Gain & Collector Current
1
10
100
1000
1
10
100
1000
Collector Current (mA)
hF
E
V
CE
=10V
Saturation Voltage & Collector Current
1
10
100
1000
10000
10
100
1000
Collector Current (mA)
S
a
tu
r
a
ti
o
n
V
o
l
t
a
g
e
(
m
V
)
V
CE(sat)
@ I
C
=10I
B
Saturation Voltage & Collector Current
100
1000
10000
1
10
100
1000
Collector Current (mA)
S
a
t
u
r
a
t
i
on
V
o
l
t
age (
m
V
)
V
BE(sat)
@ I
C
=10I
B
Capacitance & Reverse-Biased Voltage
1
10
100
1
10
100
Reverse Biased Voltage (V)
C
a
pa
c
i
t
a
n
c
e (
P
f
)
Cob
Cutoff Frequency & IC
10
100
1000
1
10
100
1000
Collector Current (mA)
C
u
to
ff F
r
e
q
u
e
n
c
y
(
M
H
z
)
fT
Safe Operating Area
0.01
0.1
1
1
10
100
1000
Forward Voltage (V)
C
o
l
l
e
c
t
o
r
C
u
rre
n
t
(A
)
P
T
=1 ms
P
T
=100 ms
P
T
=1 s
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6601-C
Issued Date : 1993.03.15
Revised Date : 2000.10.01
Page No. : 3/3
HSMC Product Specification
TO-126ML Dimension
*:Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.1356
0.1457
3.44
3.70
I
-
*0.1795
-
*4.56
B
0.0170
0.0272
0.43
0.69
J
0.0268
0.0331
0.68
0.84
C
0.0344
0.0444
0.87
1.12
K
0.5512
0.5906
14.00
15.00
D
0.0501
0.0601
1.27
1.52
L
0.2903
0.3003
7.37
7.62
E
0.1131
0.1231
2.87
3.12
M
0.1378
0.1478
3.50
3.75
F
0.0737
0.0837
1.87
2.12
N
0.1525
0.1625
3.87
4.12
G
0.0294
0.0494
0.74
1.25
O
0.0740
0.0842
1.88
2.14
H
0.0462
0.0562
1.17
1.42
Notes :
1.Dimension and tolerance based on our Spec. dated Mar. 6,1995.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
Lead : 42 Alloy ; solder plating
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
N
D
E
M
L
K
F
I
A
B
C
H
J
3
2
1
O
G
Style : Pin 1.Emitter 2.Collector 3.Base
3-Lead TO-126ML Plastic Package
HSMC Package Code : D
Marking :
HSMC Logo
Part Number
Date Code
Product Series
Rank
Ink Marking
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