Security & Chip Card ICs
SLE 55R16
Intelligent 2560Byte EEPROM
with Contactless Interface complying to ISO/IEC 14443 Type A
and Security Logic
Short Product Information
January 2001
SLE 55R16 Short Product Information
Ref.: SPI_SLE55R16_0101.doc
Revision History:
Current Version 2001-01-31
Previous Releases:
Page
Subjects (changes since last revision)
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Infineon Technologies AG in Munich, Germany,
Security & Chip Card ICs,
Tel +49 - (0)89 / 234-80000
Fax +49 - (0)89 / 234-81000
E-Mail: security.chipcard.ics@infineon.com
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Infineon Technologies AG 2001
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SLE 55R16
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2001-01-31
Intelligent 2560Byte EEPROM
with Contactless Interface complying to ISO/IEC 14443 Type A
and Security Logic
Features
2560 bytes EEPROM
Organised in 256 pages located in up to 16 sectors
Each page organised in 8 bytes for data storage + 2 bytes for administrative purposes
Configurable number of sectors (1 to 15) & sector size (1 to up to 256 pages)
Service Area 4 pages
Configurable Key Area with up to 14 key pairs
Configurable User Area
Unique chip identification number
Access conditions unchangeable in user mode
Value Counters: up to 65536 units
(with a value range from 0 to 2
16
-1)
Each page in User Area configurable as a Counter
Support of Anti-Tearing
High Security Authentication Unit
2-way authentication with 64-bit secret key between reader and card
2 keys for each sector allow hierarchical key management
Multi-level security structure possible
Individual access rights for each key within a sector for each page
Only one sector can be opened at a time
Data integrity supported by 16 bit CRC (ISO 3309) and 32 bit MAC (after authentication)
Access protection of EEPROM by transport keys on chip delivery
Physical Interface and Anticollision complying to ISO/IEC 14443 Type A
Carrier frequency: 13.56 MHz
106 kbit/s data rate transfer
Bit oriented anticollision method complying with ISO/IEC 14443
Contactless transmission of data and supply energy
Coupling distance from 0 to 10 cm (typ.)
EEPROM updating (erase and program) time maximum 4 ms per page
EEPROM endurance minimum 10
5
write/erase cycles
1
)
Data retention for minimum of 10 years
1
)
ESD
protection typical 4
kV
Ambient temperature 25 ...
...
...
... +85C
1)
Values are temperature dependent
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Ordering and Packaging information
Table 1
Ordering Information
Type
Package
1)
Memory
Pages Ordering Code
User
Admin.
SLE 55R16C
Die
2048 bytes
512 bytes
256
on request
SLE 55R16LM
MCC2-2-1
2048 bytes
512 bytes
256
on request
Pin Description
Figure 1 Pin Configuration Module Contactless Card (top view)
SLE 55R16
LB
LA
Figure 2
Pad Configuration Die
Table 2
Pin Definitions and Functions
Symbol
Function
LA
Antenna connection
LB
Antenna connection
1)
Available as a Module Contactless Card (MCC) for embedding in plastic cards or as a die (C) for customer packaging
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1 General
Description
SLE 55Rxx-family of contactless memory chips focuses on high security and flexible memory and
sector configuration. This family of memory chips supplies the user with different memory sizes
meeting the requirements of variable applications.
SLE 55R16 complies to ISO/IEC 14443 part 2 and part 3 Type-A (modulation ASK 100%) for
contactless proximity smart cards. The power supply and data are transferred to SLE 55R16 via an
antenna. SLE 55R16 is designed to communicate with a contactless card reader up to a typical
operating distance of 10 cm.
Key Area
up to 14 Key Pairs
Legend
Blocks marked by cross hatch - Defined by chip manufacturer
Administration
Area
Control of Memory
Access
User Area
1 up to 15 Sectors
Service Area
Configurable Sector Size
up to 256 Pages
Unique Serial Number
Figure 3 Memory principle of SLE 55R16
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