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Электронный компонент: 5962D9567101VPC

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1
File Number
3650.1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright Intersil Corporation 1999
HS-2600RH
Radiation Hardened Wideband, High
Impedance Operational Amplifier
HS-2600RH is a radiation hardened internally compensated
bipolar operational amplifier that features very high input
impedance coupled with wideband AC performance. The
high resistance of the input stage is complemented by low
offset voltage (4mV
max
at 25
o
C for HS-2600RH) and low
bias and offset current (10nA max at 25
o
C for HS-2600RH)
to facilitate accurate signal processing. Offset voltage can be
reduced further by means of an external nulling
potentiometer. The 4V/
s minimum slew rate at 25
o
C and
the minimum open loop gain of 100kV/V at 25
o
C enables the
HS-2600RH to perform high gain amplification of fast,
wideband signals. These dynamic characteristics, coupled
with fast settling times, make these amplifiers ideally suited
to pulse amplification designs as well as high frequency or
video applications. The frequency response of the amplifier
can be tailored to exact design requirements by means of an
external bandwidth control capacitor. Other high
performance designs such as high gain, low distortion audio
amplifiers, high-Q and wideband active filters and high
speed comparators, are excellent uses of this part.
Specifications for Rad Hard QML devices are controlled
by the Defense Supply Center in Columbus (DSCC). The
SMD numbers listed here must be used when ordering.
Detailed Electrical Specifications for these devices are
contained in SMD 5962-95671. A "hot-link" is provided
on our homepage for downloading.
www.intersil.com/spacedefense/space.asp
Features
Electrically Screened to SMD # 5962-95671
QML Qualified per MIL-PRF-38535 Requirements
High Input Impedance . . . . . . . . . . . . . . . . . 100M
(Min)
500M
(Typ)
High Slew Rate. . . . . . . . . . . . . . . . . . . . . . . . 3V/
s (Min)
7V/
s (Typ)
Low Input Bias Current . . . . . . . . . . . . . . . . . . 10nA (Max)
1nA (Typ)
Low Input Offset Current (HS-2600RH) . . . . . . 4mV (Max)
Wide Unity Gain Bandwidth . . . . . . . . . . . . . .12MHz (Typ)
Output Short Circuit Protection
Total Gamma Dose. . . . . . . . . . . . . . . . . . . . . 10kRAD(Si)
Applications
Video Amplifier
Pulse Amplifier
High-Q Active Filters
High Speed Comparators
Low Distortion Oscillators
Pinout
HS7-2600RH (CERDIP) GDIP1-T8
OR
HS7B-2600RH (SBDIP) CDIP2-T8
TOP VIEW
Ordering Information
ORDERING NUMBER
INTERNAL
MKT. NUMBER
TEMP. RANGE
(
o
C)
5962D9567101VPA
HS7-2600RH-Q
-55 to 125
5962D9567101VPC
HS7B-2600RH-Q
-55 to 125
BAL
-IN
+IN
V-
1
2
3
4
8
7
6
5
COMP
V+
OUT
BAL

+
Data Sheet
August 1999
2
Test Circuit
NOTE: For Detailed Information, Refer to HS-2600RH Test Technical Brief.
S5A
2
1
V
AC
100
100
+V
CC
S5B
2
1
+
1
2
3
S8
2K
10K
-V
EE
OPEN
S9
1
2
100pF
AC
OUT
1
+
V2
E
OUT
S4
2
1
5K
50K
1
100K
S1
+
- 1
50K
V1
S2
S6
1
2
DUT
S3B
2
OPEN
1
1
0.1
2
3
OPEN
1
S7
BAL
ADJ
500K
BUFFER
FOR LOOP STABILITY,
USE MIN VALUE CAPACITOR
TO PREVENT OSCILLATION
INCLUDES STRAY
CAPACITANCES
OPEN 2
OPEN 2
100K
S3A
1
0.1
1 OPEN
2
OPEN
2K
2
x
-1/10
ALL RESISTORS =
1% (
)
ALL CAPACITORS =
10% (
F)
Test Waveforms
SIMPLIFIED TEST CIRCUIT
SLEW RATE WAVEFORMS
OVERSHOOT, RISE AND FALL TIME WAVE FORMS
NOTE:
Measured on both positive and negative transitions. Capacitance at compensation pin should be minimized.
2k
100pF
V
AC
V
OUT
-
+
+5.0V
-5.0V
+5.0V
-5.0V
INPUT
+5.0V
-5.0V
T
+5.0V
-5.0V
T
T
V
SR =
+SL
-SL
V
OUTPUT
V
25%
75%
75%
25%
+200mV
0V
0V
-200mV
INPUT
OUTPUT
90%
t
r
,+OS
t
f
,-OS
t
r
t
f
V
PEAK
V
FINAL
= +200mV
-200mV
10%
0V
10%
0V
90%
V
PEAK
HS-2600RH
3
Burn-In Circuit
HS-2600RH CERDIP
NOTES:
1. R
1
= 1M
,
5%, 1/4W (Min)
2. C
1
= C
2
= 0.01
F/Socket (Min) or 0.1
F/Row (Min)
3. C
3
= 0.01
F/Socket (10%)
4. D
1
= D
2
= IN4002 or Equivalent/Board
5. | (V+) - (V-) | = 30V
Irradiation Circuit
NOTES:
6. V
1
= +15V
10%
7. V
2
= -15V
10%
8. R = 1M
5%
9. C = 0.1
F
10%
1
2
3
4
8
7
6
5
+
V-
C
2
C
3
R
1
D
2
C
1
D
1
V+
1
2
3
4
8
7
6
5
V
2
C
C
R
C
V
1
GND
HS-2600RH
4
Schematic Diagram
BAL
R1
1K
R2
4.18K
R3
1.56K
R4
1.56K
Q1
Q3
Q4
Q5
Q6
Q7
Q11
+INPUT
Q8
Q13
Q16
Q30
Q29
Q31
Q28
Q26
Q25
Q9
Q10
Q17
Q18
Q27
Q12
Q15
Q2
Q40
Q38
Q37
Q24
Q19
R7
1.35
R19
2.5K
RP1
BAL
C2
9pF
R5
600
R6
30
V+
Q41
Q42
Q60
Q61
Q59
Q58
Q57
Q55
Q54
Q43
Q44
Q45
Q46
Q47
COMPENSATION
OUT
R18
30
R17
30
Q52
Q51
R11
4.0K
Q49
Q50
C1
16pF
R12
1.6K
R13
1.6K
R14
2.1K
Q22
Q23
R9
4.5K
R10
2.0K
Q21
Q48
R15
800
Q36
Q35
Q32
Q33
Q56
Q53
R16
30
V-
Q20
R8
1K
-INPUT
Q39
C3
16pF
C4
4pF
HS-2600RH
5
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Die Characteristics
DIE DIMENSIONS:
69 mils x 56 mils x 19 mils
1 mils
1750
m x 1420
m x 483
m
25.4
m
INTERFACE MATERIALS:
Glassivation:
Type: Nitride (Si3N4) over Silox (SiO2, 5% Phos.)
Silox Thickness: 12k
2k
Nitride Thickness: 3.5k
1.5k
Top Metallization:
Type: Al, 1% Cu
Thickness: 16k
2k
Substrate:
Linear Bipolar DI
Backside Finish:
Silicon
ASSEMBLY RELATED INFORMATION:
Substrate Potential (Powered Up):
Unbiased
ADDITIONAL INFORMATION:
Worst Case Current Density:
<2 x 10
5
A/cm
2
Transistor Count:
140
Metallization Mask Layout
HS-2600RH
+IN
-IN
BAL
COMP
V+
OUT
BAL
V-
HS-2600RH