1
TM
File Number
4875
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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Copyright Intersil Corporation 2000
IS-1715ARH
Radiation Hardened
Complementary Switch FET Driver
The Radiation Hardened IS-
1715ARH is a high speed, high
current complementary power FET
driver designed for use in
synchronous rectification circuits. Soft switching transitions
for the two output waveforms may be managed by setting the
independently programmable delays. The delay pins can
alternatively be configured for zero-voltage sensing to allow
for precise switching control.
The IS-1715ARH has a single input, which is PWM and TTL
compatible, and can run at frequencies up to 1MHz. The
AUX output switches immediately at the rising edge of the
INPUT, but waits for the T2 delay before responding to the
falling edge. A logic low on the enable pin (ENBL) places
both outputs into an active-low mode, and an under voltage
lock-out (UVLO) function is set at 9V(max).
Constructed with the Intersil dielectrically isolated Rad Hard
Silicon Gate (RSG) process, these devices are immune to
single event latch-up (SEL) and have been specifically
designed to provide highly reliable performance in harsh
radiation environments.
Specifications for Rad Hard QML devices are controlled
by the Defense Supply Center in Columbus (DSCC). The
SMD numbers listed here must be used when ordering.
Detailed Electrical Specifications for these devices are
contained in SMD 5962-00521. A "hot-link" is provided
on our homepage for downloading.
http://www.intersil.com/spacedefense/space.htm
Pinout
IS9-1715ARH
FLATPACK (CDFP4-F16)
TOP VIEW
Features
Electrically Screened to SMD # 5962-00521
QML Qualified per MIL-PRF-38535 Requirements
Radiation Environment
- Gamma Dose 3x10
5
RAD(Si)
- Latch-up Immune
PWR Output Current (Source and sink) . . . . . . . 3A (peak)
AUX Output Current (Source and sink) . . . . . . . 3A (peak)
Low Operating Supply Current . . . . . . . . . . . . . 6mA (max)
Wide Programmable Delay Range . . . . . . 100ns to 600ns
Configurable for Zero-Voltage Switching
Switching Frequency to 1MHz
Both Outputs Active-Low in Sleep Mode
9V(max) Under Voltage Lock-out
Applications
Synchronous Rectification in Power Supplies
TM
NC
V
CC
PWR
V
SS
V
SS
AUX
NC
NC
2
3
4
5
6
7
8
1
16
15
14
13
12
11
10
9
ENBL
T1
INPUT
V
SS
V
SS
T2
V
CC
NC
Ordering Information
ORDERING NUMBER
INTERNAL
MKT. NUMBER
TEMP. RANGE
(
o
C)
5962F0052101VXC
IS9-1715ARH-Q
-55 to 125
5962F0052101QXC
IS9-1715ARH-8
-55 to 125
IS9-1715ARH/Proto
IS9-1715ARH/Proto
-55 to 125
Data Sheet
August 2000
2
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
Die Characteristics
DIE DIMENSIONS:
3559
m x 4420
m (129 mils x 174 mils)
Thickness: 483
m
25.4
m (19 mils
1 mil)
INTERFACE MATERIALS
Glassivation
Type: Phosphorus Silicon Glass (PSG)
Thickness: 8.0k
1.0k
Top Metallization
Type: AlSiCu
Thickness: 16.0k
2k
Substrate:
Radiation Hardened Silicon Gate,
Dielectric Isolation
Backside Finish:
Silicon
ASSEMBLY RELATED INFORMATION
Substrate Potential:
Unbiased (DI)
ADDITIONAL INFORMATION
Worst Case Current Density:
<2.0 x 10
5
A/cm
2
Transistor Count:
222
Metallization Mask Layout
IS-1715ARH
NOTES:
1. All double sized pads should be double bonded.
2. All pin 2 and pin 10 VCC pads are bonded to VCC for power and
noise considerations. (These are lead-frame connected in
packaged devices.)
V
CC
(10)
V
SS
(13)
INPUT (14)
T1 (15)
ENBL (16)
V
CC
(2)
PWR (3)
V
SS
(4)
V
CC
(2)
(10) V
CC
(12) V
SS
(11) T2
(10) V
CC
(6) AUX
(5) V
SS
(2) V
CC
IS-1715ARH
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