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Электронный компонент: ACS03KMSR

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CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright Intersil Corporation 1999
TM
ACS03MS
Radiation Hardened Quad 2-Input
NAND Gate with Open Drain
January 1996
Pinouts
14 PIN CERAMIC DUAL-IN-LINE
MIL-STD-1835 DESIGNATOR CDIP2-T14,
LEAD FINISH C
TOP VIEW
14 PIN CERAMIC FLATPACK
MIL-STD-1835 DESIGNATOR CDFP3-F14,
LEAD FINISH C
TOP VIEW
1
2
3
4
5
6
7
14
13
12
11
10
9
8
A1
B1
Y1
A2
B2
Y2
GND
VCC
B4
A4
Y4
B3
A3
Y3
14
13
12
11
10
9
8
2
3
4
5
6
7
1
A1
B1
Y1
A2
B2
Y2
GND
VCC
B4
A4
Y4
B3
A3
Y3
Features
Devices QML Qualified in Accordance with MIL-PRF-38535
Detailed Electrical and Screening Requirements are Contained in
SMD# 5962-96703 and Intersil's QM Plan
1.25 Micron Radiation Hardened SOS CMOS
Total Dose . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >300K RAD (Si)
Single Event Upset (SEU) Immunity: <1 x 10
-10
Errors/Bit/Day
(Typ)
SEU LET Threshold . . . . . . . . . . . . . . . . . . . . . . . >100 MEV-cm
2
/mg
Dose Rate Upset . . . . . . . . . . . . . . . . >10
11
RAD (Si)/s, 20ns Pulse
Dose Rate Survivability . . . . . . . . . . . >10
12
RAD (Si)/s, 20ns Pulse
Latch-Up Free Under Any Conditions
Military Temperature Range . . . . . . . . . . . . . . . . . . -55
o
C to +125
o
C
Significant Power Reduction Compared to ALSTTL Logic
DC Operating Voltage Range . . . . . . . . . . . . . . . . . . . . 4.5V to 5.5V
Input Logic Levels
- VIL = 30% of VCC Max
- VIH = 70% of VCC Min
Input Current
1
A at VOL, VOH
Fast Propagation Delay . . . . . . . . . . . . . . . . 15ns (Max), 10ns (Typ)
Description
The Intersil ACS03MS is a Radiation Hardened quad 2-input NAND gate
with open drain outputs. The open drain output can drive resistive loads
from a separate supply voltage.
The ACS03MS utilizes advanced CMOS/SOS technology to achieve
high-speed operation. This device is a member of a radiation hardened,
high-speed, CMOS/SOS Logic Family.
The ACS03MS is supplied in a 14 lead Ceramic Flatpack (K suffix) or a
Ceramic Dual-In-Line Package (D suffix).
Ordering Information
PART NUMBER
TEMPERATURE RANGE
SCREENING LEVEL
PACKAGE
5962F9670301VCC
-55
o
C to +125
o
C
MIL-PRF-38535 Class V
14 Lead SBDIP
5962F9670301VXC
-55
o
C to +125
o
C
MIL-PRF-38535 Class V
14 Lead Ceramic Flatpack
ACS03D/Sample
25
o
C
Sample
14 Lead SBDIP
ACS03K/Sample
25
o
C
Sample
14 Lead Ceramic Flatpack
ACS03HMSR
25
o
C
Die
Die
Spec Number
518779
File Number
3064.1
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ey-
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ter-
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ion,
mi-
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L,
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2
ACS03MS
Functional Diagram
TRUTH TABLE
INPUTS
OUTPUT
An
Bn
Yn
L
L
Z (Note 2), H (Note 3)
L
H
Z (Note 2), H (Note 3)
H
L
Z (Note 2), H (Note 3)
H
H
L
NOTES:
1. L = Low, H = High, Z = High Impedance
2. Without Pull-up Resistor
3. With Pull-up Resistor
An
Bn
Yn
Spec Number
518779
3
ACS03MS
Die Characteristics
DIE DIMENSIONS:
68 mils x 79 mils
1730mm x 2010mm
METALLIZATION:
Type: AlSi
Metal 1 Thickness: 7.125k
1.125k
Metal 2 Thickness: 9k
1k
GLASSIVATION:
Type: SiO
2
Thickness: 8k
1k
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
110
m x 110
m
4.3 mils x 4.3 mils
Metallization Mask Layout
ACS03MS
B1
VCC
B4
(12) A4
(11) Y4
(10) B3
(7)
(8)
(9) A3
Y1 (3)
A2 (4)
B2 (5)
Y2 (6)
(14)
Y3
GND
(2)
(13)
A1
(1)
Spec Number
518779