ChipFind - документация

Электронный компонент: CDP68HC68T1M2

Скачать:  PDF   ZIP
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207
|
Copyright
Intersil Corporation 1999
August 1997
CDP68HC68T1
CMOS Serial Real-Time Clock With
RAM and Power Sense/Control
Features
SPI (Serial Peripheral Interface)
Full Clock Features
- Seconds, Minutes, Hours (12/24, AM/PM), Day of
Week, Date, Month, Year (0-99), Automatic Leap Year
32 Word x 8-Bit RAM
Seconds, Minutes, Hours Alarm
Automatic Power Loss Detection
Low Minimum Standby (Timekeeping) Voltage . . . 2.2V
Selectable Crystal or 50/60Hz Line Input
Buffered Clock Output
Battery Input Pin that Powers Oscillator and also
Connects to V
DD
Pin When Power Fails
Three Independent Interrupt Modes
- Alarm
- Periodic
- Power-Down Sense
Description
The CDP68HC68T1 Real-Time Clock provides a
time/calendar function, a 32 byte static RAM, and a 3 wire
Serial Peripheral Interface (SPI Bus). The primary function of
the clock is to divide down a frequency input that can be
supplied by the on-board oscillator in conjunction with an
external crystal or by an external clock source. The internal
oscillator can operate with a 32KHz, 1MHz, 2MHz, or 4MHz
crystal. An external clock source with a 32KHz, 1MHz,
2MHz, 4MHz, 50Hz or 60Hz frequency can be used to drive
the CDP68HC68T1. The time registers hold seconds,
minutes, and hours, while the calendar registers hold day-of-
week, date, month, and year information. The data is stored
in BCD format. In addition, 12 or 24 hour operation can be
selected. In 12 hour mode, an AM/PM indicator is provided.
The T1 has a programmable output which can provide one
of seven outputs for use elsewhere in the system.
Computer handshaking is controlled with a "wired-OR"
interrupt output. The interrupt can be programmed to provide
a signal as the result of: 1) an alarm programmed to occur at
a predetermined combination of seconds, minutes, and
hours; 2) one of 15 periodic interrupts ranging from sub-
second to once per day frequency; 3) a power fail detect.
The PSE output and the V
SYS
input are used for external
power control. The CPUR output is available to reset the
processor under power-down conditions. CPUR is enabled
under software control and can also be activated via the
CDP68HC68T1's watchdog. If enabled, the watchdog
requires a periodic toggle of the CE pin without a serial
transfer.
Pinouts
CDP68HC68T1 (PDIP, SBDIP, SOIC)
TOP VIEW
CDP68HC68T1 (SOIC)
TOP VIEW
Ordering Information
PART NUMBER
TEMP.
RANGE (
o
C)
PACKAGE
PKG.
NO.
CDP68HC68T1E
-40 to 85
16 Ld PDIP
E16.3
CDP68HC68T1D
-40 to 85
16 Ld SBDIP
D16.3
CDP68HC68T1M
-40 to 85
20 Ld SOIC
M20.3
CDP68HC68T1M2
-40 to 85
16 Ld SOIC
M16.3
CDP68HC68T1W
-40 to 85
DIE
NOTE: Pin number references throughout this specification refer to
the 16 lead PDIP/SBDIP/SOIC. See pinouts for cross reference.
9
10
11
12
13
14
16
15
8
7
6
5
4
3
2
1
CLKOUT
CPUR
INT
SCK
MOSI
MISO
V
SS
CE
V
DD
XTAL IN
V
BATT
V
SYS
XTAL OUT
LINE
POR
PSE
11
12
13
14
15
16
17
18
20
19
10
9
8
7
6
5
4
3
2
1
CLK OUT
CPUR
INT
NC
SCK
MOSI
CE
MISO
V
SS
PSE
VDD
XTAL IN
NC
V
BATT
XTAL OUT
V
SYS
NC
NC
LINE
POR
File Number
1547.3
2
Absolute Maximum Ratings
Thermal Information
Supply Voltage, V
DD
. . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7V
Input Voltage, V
IN
. . . . . . . . . . . . . . . . . . . . V
SS
-0.3V to V
DD
+0.3V
Current Drain Per Input Pin Excluding V
DD
and V
SS
, I . . . . . . 10mA
Current Drain Per Output Pin, I. . . . . . . . . . . . . . . . . . . . . . . . . 40mA
Operating Conditions
Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +3.0V to +6.0V
Standby (Timekeeping) Voltage . . . . . . . . . . . . . . . . +2.2V to +6.0V
Temperature Range
CDP68HC68T1D (SBDIP Package) . . . . . . . . . . . -55
o
C to 125
o
C
CDP68HC68T1E (PDIP Package) . . . . . . . . . . . . . -40
o
C to 85
o
C
CDP68HC68T1M/M2 (SOIC Packages) . . . . . . . . . -40
o
C to 85
o
C
Input High Voltage . . . . . . . . . . . . . . . . . . . . . . . (0.7 x V
DD
) to V
DD
Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . .0V to (0.3 x V
DD
)
Serial Clock Frequency (f
SCK
) . . . . . . . . . . . . . . . . . +3.0V to +6.0V
Thermal Resistance (Typical, Note 1)
JA
(
o
C/W)
JC
(
o
C/W)
16 Ld PDIP . . . . . . . . . . . . . . . . . . . . .
90
N/A
16 Ld SOIC . . . . . . . . . . . . . . . . . . . . .
100
N/A
20 Ld SOIC . . . . . . . . . . . . . . . . . . . . .
100
N/A
16 Ld SBDIP . . . . . . . . . . . . . . . . . . . .
75
24
Maximum Junction Temperature (Hermetic) . . . . . . . . . . . . . . . 175
o
C
Maximum Junction Temperature (Plastic) . . . . . . . . . . . . . . . 150
o
C
Maximum Storage Temperature Range (T
STG
) . . . .-65
o
C to 150
o
C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300
o
C
(SOIC, Lead Tips Only)
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
JA
is measured with the component mounted on an evaluation PC board in free air.
Static Electrical Specifications
At T
A
= -40
o
C to +85
o
C, V
DD
= V
BATT
= 5V
5%, except as noted.
PARAMETER
CONDITIONS
LIMITS
UNITS
CDP68HC68T1
MIN
(NOTE 2)
TYP
MAX
Quiescent Device Current
I
DD
-
1
10
A
Output Voltage High Level
V
OH
I
OH
= -1.6mA, V
DD
= 4.5V
3.7
-
-
V
Output Voltage Low Level
V
OL
I
OL
= 1.6mA, V
DD
= 4.5V
-
-
0.4
Output Voltage High Level
V
OH
I
OH
10
A, V
DD
= 4.5V
4.4
-
-
Output Voltage Low Level
V
OL
I
OL
10
A, V
DD
= 4.5V
-
-
0.1
Input Leakage Current
I
IN
-
-
1
A
Three-State Output Leakage Current
I
OUT
-
-
10
Operating Current (Note 3)
(I
D
+ I
B
) V
DD
= V
B
= 5V
Crystal Operation
32kHz
-
0.08
0.01
mA
1MHz
-
0.5
0.6
2MHz
-
0.7
0.84
4MHz
-
1
1.2
Pin 14
External Clock (Squarewave) (Note 3)
(I
D
+ I
B
) V
DD
= V
S
= 5V
32kHz
-
0.02
0.024
1MHz
-
0.1
0.12
2MHz
-
0.2
0.24
4MHz
-
0.4
0.5
Standby Current (Note 3)
I
B
V
S
= 3V
Crystal Operation
32kHz
-
20
25
A
1MHz
-
200
250
2MHz
-
300
360
4MHz
-
500
600
CDP68HC68T1
3
Operating Current (Note 3)
V
DD
= 5V, V
B
= 3V
Crystal Operation
I
D
I
B
I
D
I
S
mA
32kHz
-
25
15
30
20
1MHz
-
0.08
0.15
0.1
0.18
2MHz
-
0.15
0.25
0.18
0.3
4MHz
-
0.3
0.4
0.36
0.5
Standby Current (Note 3)
I
B
V
B
= 2.2V
Crystal Operation
32kHz
-
10
12
A
Input Capacitance
C
IN
V
IN
= 0, T
A
= 25
o
C
-
-
2
pF
Maximum Rise and Fall Times
t
r
, t
f
(Except XTAL Input and POR Pin 10)
-
-
2
s
Input Voltage (Line Input Pin Only, Power Sense Mode)
0
10
12
V
V
SYS
> V
B
V
T
(For V
B
Not Internally Connected to V
DD
)
-
0.7
-
V
Power-On Reset (POR) Pulse Width
100
75
-
ns
NOTES:
2. Typical values are for T
A
= 25
o
C and nominal V
DD
.
3. Clock out (Pin 1) disabled, outputs open circuited. No serial access cycles.
Static Electrical Specifications
At T
A
= -40
o
C to +85
o
C, V
DD
= V
BATT
= 5V
5%, except as noted. (Continued)
PARAMETER
CONDITIONS
LIMITS
UNITS
CDP68HC68T1
MIN
(NOTE 2)
TYP
MAX
CDP68HC68T1
4
CDP68HC68T1
Functional Block Diagram
FREEZE
CIRCUIT
CE
LINE
50/60Hz
AM - PM AND
HOUR LOGIC
DAY/DAY
OF WEEK
OSCILLATOR
XTAL IN
XTAL OUT
V
BATT
PRESCALE
SECOND
MINUTE
HOUR
CALENDAR
LOGIC
MONTH
PRESCALE
SELECT
CLOCK
SELECT
CLOCK
CONTROL
REGISTER
INTERRUPT
CONTROL
REGISTER
CLOCK
AND
INT
LOGIC
CLOCK
OUT
INT
V
DD
V
SS
POWER
SENSE
CONTROL
INT STATUS
REGISTER
LINE
PSE
V
SYS
POR
CPUR
SCK
MISO
MOSI
COMPARATOR
SECOND
LATCH
MINUTE
LATCH
HOUR
LATCH
32 X 8
RAM
SERIAL
INTERFACE
YEAR
8-BIT DATA BUS
FIGURE 1. REAL TIME CLOCK FUNCTIONAL DIAGRAM
5
TABLE 1. CLOCK/CALENDAR AND ALARM DATA MODES
ADDRESS LOCATION
(H)
FUNCTION
DECIMAL RANGE
BCD DATA RANGE
(NOTE 4)
BCD DATE EXAMPLE
20
Seconds
0-59
00-59
18
21
Minutes
0-59
00-59
49
22
Hours
12 Hour Mode
(Note 5)
1-12
81-92 (AM)
A1-B2 (PM)
A3
Hours
24 Hour Mode
0-23
00-23
15
23
Day of the Week
(Sunday = 1)
1-7
01-07
03
24
Day of the Month
(Date)
1-31
01-31
29
25
Month
Jan = 1, Dec = 12
1-12
01-12
10
26
Years
0-99
00-99
85
28
Alarm Seconds
0-59
00-59
18
29
Alarm Minutes
0-59
00-59
49
2A
Alarm Hours (Note 6)
12 Hour Mode
1-12
01-12 (AM)
21-32 (PM)
23
Alarm Hours
24 Hour Mode
0-23
00-23
15
NOTES:
4. Example: 3:49:18, Tuesday. Oct. 29,1985.
5. Most significant Bit, D7, is "0" for 24 hours, and "1" for 12 hour mode. Data Bit D5 is "1" for P.M. and `0" for A.M. in 12 hour mode.
6. Alarm hours. Data Bit D5 is "1" for P.M. and "0" for A.M. in 12 hour mode. Data Bits D7 and D6 are DON'T CARE.
SECONDS
MINUTES
HOURS
DAY OF WEEK
DATE
MONTH
YEARS
NOT USED
SEC ALARM
MIN ALARM
HRS ALARM
NOT USED
NOT USED
NOT USED
NOT USED
NOT USED
STATUS REGISTER
CONTROL REGISTER
INTERRUPT CONTROL REGISTER
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
$20
$21
$22
$23
$24
$25
$26
$27
$28
$29
$2A
$2B
$2C
$2D
$2E
$2F
$30
$31
$32
CLOCK/CALENDAR
13 BYTES UNUSED
TEST MODE
32 RAM LOCATIONS
$00
$1F
$20
$32
$33
$3F
$55
85
63
51
50
32
31
0
R = READABLE
W = WRITABLE
R, W
R, W
R, W
R, W
R, W
R, W
R, W
W
W
W
R
R, W
R, W
FIGURE 2. ADDRESS MAP
CDP68HC68T1
6
Programmers Model - Clock Registers
NAME
WRITE/READ REGISTERS
HEX ADDRESS
TENS 0-5
TENS 0-5
12
HR
24
X
PM/AM
TENS 0-2
DB7
X
X
X
X
TENS 0-3
TENS 0-1
TENS 0-9
UNITS 0-9
UNITS 0-9
UNITS 0-9
UNITS 1-7
UNITS 0-9
UNITS 0-9
UNITS 0-9
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
WRITE ONLY REGISTERS
TENS 0-5
TENS 0-5
UNITS 0-9
UNITS 0-9
UNITS 0-9
PM/AM
TENS 0-2
X
X
7
6
5
4
3
2
1
0
DB0
SECONDS (00-59)
MINUTES (00-59)
DB7, 1 = 12 HR., 0 = 24 HR.
DB = 1 PM, 0 = AM
HOURS (01-12 OR 00-23
DATE
DAY OF MONTH
MONTH (01-12) JAN = 1
DEC = 12
YEARS (00-99)
CONTROL
INTERRUPT
ALARM SECONDS (00-59)
ALARM MINUTES (00-59)
ALARM HOURS (01-12 OR 00-23)
PLUS AM/PM IN 12 HR. MODE
PM = 1, AM = 0
READ ONLY REGISTERS
STATUS
7
6
5
4
3
2
1
0
BIT
HEX ADDRESS 00-1F
20
21
22
23
24
25
26
31
32
28
29
2A
30
RAM DATA BYTE
01-28
29
30
31
NOTE: X = Don't care writes, X = 0 when read.
X
DAY OF WK (01-07) SUNDAY = 1
D7
D6
D5
D4
D3
D2
D1
D0
CDP68HC68T1
7
Functional Description
The SPI real-time clock consists of a clock/calendar and a
32 x 8 RAM. Communications is established via the SPI
(Serial Peripheral Interface) bus. In addition to the clock/cal-
endar data from seconds to years, and system flexibility pro-
vided by the 32-byte RAM, the clock features computer
handshaking with an interrupt output and a separate square-
wave clock output that can be one of 7 different frequencies.
An alarm circuit is available that compares the alarm latches
with the seconds, minutes and hours time counters and acti-
vates the interrupt output when they are equal. The clock is
specifically designed to aid in power-down/up applications
and offers several pins to aid the designer of battery backup
systems.
Mode Select
The voltage level that is present at the V
SYS
input pin at the
end of power-on-reset selects the device to be in the single
supply or battery backup mode.
Single-Supply Mode
If V
SYS
is a logic high when power-on-reset is completed,
CLK OUT, PSE and CPUR will be enabled and the device
will be completely operational. CPUR will be placed low if the
logic level at the V
SYS
pin goes low. If the output signals
CLK OUT, PSE and CPUR are disabled due to a power-
down instruction, V
SYS
brought to a logic low and then to a
logic high will re-enable these outputs. An example of the
single-supply mode is where only one supply is available
and V
DD
, V
BATT
and V
SYS
are tied together to the supply.
Battery Backup Mode
If V
SYS
is a logic low at the end of power-on-reset, CLK
OUT, PSE and CPUR will be disabled (CLK OUT, PSE and
CPUR low). This condition will be held until V
SYS
rises to a
threshold (about 0.7V) above V
BATT
. The outputs CLK OUT,
PSE and CPUR will then be enabled and the device will be
operational. If V
SYS
falls below a threshold above V
BATT
the
outputs CLK OUT, PSE and CPUR will be disabled. An
example of battery backup operation occurs if V
SYS
is tied to
V
DD
and V
DD
is not connected to a supply when a battery is
connected to the V
BATT
pin. (See Pin Functions, V
BATT
for
Battery Backup Operation.)
Clock/Calendar (See Figure 1 and Figure 2)
The clock/calendar portion of this device consists of a long
string of counters that is toggled by a 1Hz input. The 1Hz
input is generated by a prescaler driven by an on-board
oscillator that utilizes one of four possible external crystals or
that can be driven by an external clock source. The 1Hz trig-
ger to the counters can also be supplied by a 50Hz or 60Hz
input source that is connected to the LINE input pin.
The time counters offer seconds, minutes and hours data in
12 hour or 24 hour format. An AM/PM indicator is available
that once set, toggles every 12 hours. The calendar counters
consist of day (day of week), date (day of month), month and
years information. Data in the counters is in BCD format.
The hours counter utilizes BCD for hour data plus bits for
12/24 hour and AM/PM. The 7 time counters are accessed
serially at addresses 20H through 26H. (See Table 1).
RAM
The real-time clock also has a static 32 x 8 RAM that is
located at addresses 00-1FH. Transmitting the address/con-
trol word with bit-5 low selects RAM access. Bits 0 through 4
select the RAM location.
Alarm
The alarm is set by accessing the three alarm latches and
loading the required data. The alarm latches consist of sec-
onds, minutes and hours registers. When their outputs equal
the values in the seconds, minutes and hours time counters,
an interrupt is generated. The interrupt output will go low if
the alarm bit in the Interrupt Control Register is set high. The
alarm interrupt bit in the Status Register is set when the
interrupt occurs (see Pin Functions, INT Pin). To preclude a
false interrupt when loading the time counters, the alarm
interrupt bit should be set low in the Interrupt Control Regis-
ter. This procedure is not required when the alarm time is
set.
Watchdog Function (See Figure 6)
When bit 7 in the Interrupt Control Register is set high, the
Clock's CE (chip enable) pin must be toggled at a regular
interval without a serial data transfer. If the CE is not toggled,
the clock will supply a CPU reset pulse and bit 6 in the Sta-
tus Register will be set. Typical service and reset times are
listed below.
Clock Out
The value in the 3 least significant bits of the Clock Control
Register selects one of seven possible output frequencies.
(See Clock Control Register). This squarewave signal is
available at the CLK OUT pin. When Power-Down operation
is initiated, the output is set low.
Control Registers and Status Registers
The operation of the Real-Time Clock is controlled by the
Clock Control and Interrupt Control Registers. Both registers
are Read-Write Registers. Another register, the Status Reg-
ister, is available to indicate the operating conditions. The
Status Register is a Read only Register.
Power Control
Power control is composed of two operations, Power Sense
and Power Down/Up. Two pins are involved in power sens-
ing, the LINE input pin and the INT output pin. Two additional
pins are utilized during power-down/up operation. They are
the PSE (Power Supply Enable) output pin and V
SYS
input
pin.
50Hz
60Hz
XTAL
MIN
MAX
MIN
MAX
MIN
MAX
Service Time
-
10ms
-
8.3ms
-
7.8ms
Reset Time
20
40ms
16.7
33.3ms
15.6
31.3ms
CDP68HC68T1
8
Power Sensing (See Figure 3)
When Power Sensing is enabled (Bit 5 = 1 in Interrupt Con-
trol Register), AC transitions are sensed at the LINE input pin.
Threshold detectors determine when transitions cease. After
a delay of 2.68ms to 4.64ms, plus the external input circuit RC
time constant, an interrupt is generated and a bit is set in the
Status Register. This bit can then be sampled to see if system
power has turned back on. See PIN FUNCTIONS, LINE PIN.
The power-sense circuitry operates by sensing the level of the
voltage presented at the line input pin. This voltage is cen-
tered around V
DD
and as long as it is either plus or minus a
threshold (about 1V) from V
DD
a power-sense failure will not
be indicated. With an AC signal present, remaining in this
V
DD
window longer than a minimum of 2.68ms will activate
the power-sense circuit. The larger the amplitude of the AC
signal, the less time it spends in the V
DD
window, and the less
likely a power failure will be detected. A 60Hz, 10V
P-P
sine-
wave voltage is an applicable signal to present at the LINE
input pin to setup the power sense function.
Power Down (See Figure 4)
Power down is a processor-directed operation. A bit is set in
the Interrupt Control Register to initiate operation. 3 pins are
affected. The PSE (Power Supply Enable) output, normally
high, is placed low. The CLK OUT is placed low. The CPUR
output, connected to the processors reset input is also
placed low. In addition, the Serial Interface is disabled.
Power Up (See Figure 5 and Figure 6)
Two conditions will terminate the Power-Down mode. The
first condition (See Figure 5) requires an interrupt. The inter-
rupt can be generated by the alarm circuit, the programma-
ble periodic interrupt signal, or the power sense circuit.
The second condition that releases Power Down occurs
when the level on the V
SYS
pin rises about 0.7V above the
level at the V
BATT
input, after previously falling to the level of
V
BATT
(See Figure 6) in the Battery Backup Mode or V
SYS
falls to logic low and returns high in the Single Supply Mode.
FIGURE 3. POWER-SENSING FUNCTIONAL DIAGRAM
FIGURE 4. POWER-DOWN FUNCTIONAL DIAGRAM
FIGURE 5. POWER-UP FUNCTIONAL DIAGRAM (INITIATED
BY INTERRUPT SIGNAL
XTAL IN
XTAL OUT
LINE
V
DD
REAL-TIME CLOCK
CDP68HC68T1
STATUS REGISTER
INT
INT
CPU
CDP68HC05C16B
V
DD
0V
I
V
SYS
INTERRUPT
CONTROL
REGISTER
I
SERIAL
INTERFACE
CLK
OUT
CPUR
REAL-TIME CLOCK
CDP68HC68T1
PSE
OSC
RESET
CPU
CDP68HC05C4B
MISO
MOSI
FROM SYSTEM
POWER
TO SYSTEM
POWER CONTROL
POWER
SENSE
OR
ALARM
CIRCUIT
SERIAL
INTERFACE
PERIODIC
INTERRUPT
SIGNAL
POWER
UP
REAL-TIME CLOCK
CDP68HC68T1
PSE
CPUR
CLK
OUT
INT
MISO
MOSI
CDP68HC68T1
9
CLK OUT
Clock output pin. One of seven frequencies can be selected
(or this output can be set low) by the levels of the three
LSB's in the Clock-Control Register. If a frequency is
selected, it will toggle with a 50% duty cycle except 2Hz in
the 50Hz time base mode. (Ex, if 1Hz is selected, the output
will be high for 500ms and low for the same period). During
power-down operation (bit 6 in Interrupt Control Register set
to "1"), the clock-output pin will be set low.
CPUR
CPU reset output pin. This pin functions as an N-Channel
only, open-drain output and requires an external pull-up
resistor.
INT
Interrupt output pin. This output is driven from a single NFET
pulldown transistor and must be tied to an external pull-up
resistor. The output is activated to a low level when:
1. Power-sense operation is selected (B5 = 1 in Interrupt
Control Register) and a power failure occurs.
2. A previously set alarm time occurs. The alarm bit in the
Status Register and interrupt-out signal are delayed
30.5
s when 32kHz operation is selected and 15.3
s for
2MHz and 7.6
s for 4MHz.
3. A previously selected periodic interrupt signal activates.
The Status Register must be read to set the Interrupt output
high after the selected periodic interval occurs. This is also
true when conditions 1 and 2 activate the interrupt. If power
down had been previously selected, the interrupt will also
reset the power-down functions.
SCK, MOSI, MISO
See Serial Peripheral Interface (SPI) section in this data sheet.
CE
A positive chip-enable input. A low level at this input holds the
serial interface logic in a reset state. This pin is also used for
the watchdog function.
V
SS
The negative power-supply pin that is connected to ground.
PSE
Power-supply enable output pin. This pin is used to control
power to the system. The pin is set high when:
1. V
SYS
rises above the V
BATT
voltage after V
SYS
was
placed low by a system failure.
2. An interrupt occurs.
3. A power-on reset (if V
SYS
is a logic high).
The PSE pin is set low by writing a high into bit 6 (power-
down bit) in the Interrupt Control Register.
POR
Power-on reset. A Schmitt-trigger input that generates a
power-on internal reset signal using an external R-C net-
work. Both control registers and frequency dividers for the
oscillator and line input are reset. The Status Register is
reset except for the first time up bit (B4), which is set.
Single supply or battery backup operation is selected at the
end of POR.
LINE
This input is used for two functions. When not used it
should be connected to V
DD
via a 10k
resistor. The first
function utilizes the input signal as the frequency source for
the timekeeping counters. This function is selected by
setting bit 6 in the Clock Control Register. The second
function enables the line input to sense a power failure.
Threshold detectors operating above and below V
DD
sense
an AC voltage loss. Bit 5 must be set to "1" in the Interrupt
Control Register and crystal or external clock source
operation is required. Bit 6 in the Clock Control Register
must be low to select XTAL operation.
Oscillator Circuit
The CDP68HC68T1 has an on-board 150K resistor that is
switched in series with its internal inverter when 32kHz is
selected via the Clock Control Register. Note: When first
powered up the series resistor is not part of the oscillator
circuit. (The CDP68HC68T1 sets up for a 4MHz oscillator).
MISO
V
BATT
REAL-TIME CLOCK
PSE
CPUR
CLK
OUT
SERIAL
INTERFACE
V
SYS
CDP68HC68T1
MOSI
FIGURE 6. POWER-UP FUNCTIONAL DIAGRAM (INITIATED BY
A RISE IN VOLTAGE ON THE "V
SYS
" PIN)
CDP68HC68T1
10
V
SYS
This input is connected to the system voltage. After the CPU
initiates power down by setting bit 6 in the Interrupt Control
Register to "1", the level on this pin will terminate power
down if it rises about 0.7V above the level at the V
BATT
input
pin after previously falling below V
BATT
+0.7V. When power
down is terminated, the PSE pin will return high and the
Clock Output will be enabled. The CPUR output pin will also
return high. The logic level present at this pin at the end of
POR determines the CDP68HC68T1's operating mode.
V
BATT
The oscillator power source. The positive terminal of the bat-
tery should be connected to this pin. When the level on the
V
SYS
pin falls below V
BATT
+0.7V, the V
BATT
pin will be
internally connected to the V
DD
pin. When the voltage on
V
SYS
rises a threshold above (0.7V) the voltage on V
BATT
,
the connection from V
BATT
to the V
DD
pin is opened. When
the "LINE" input is used as the frequency source, V
BATT
may
be tied to V
DD
or V
SS
. The "XTAL IN" pin must be at V
SS
if
V
BATT
is at V
SS
. If V
BATT
is connected to V
DD
, the "XTAL
IN" pin can be tied to V
SS
or V
DD
.
XTAL IN, XTAL OUT
These pins are connected to a 32,768Hz. 1.048576MHz,
2.097152MHz or 4.194304MHz crystal. If an external clock
is used, it should be connected to "XTAL IN" with `XTAL
OUT" left open.
V
DD
The positive power-supply pin.
Clock Control Register
START-STOP
A high written into this bit will enable the counter stages of
the clock circuitry. A low will hold all bits reset in the divider
chain from 32Hz to 1Hz. A clock out selected by bits 0, 1 and
2 will not be affected by the stop function except the 1Hz and
2Hz outputs.
LlNE-XTAL
When this bit is set high, clock operation will use the 50 or
60-cycle input present at the LINE input pin. When the bit is
low, the crystal input will generate the 1Hz time update.
XTAL Select
One of 4 possible crystals is selected by value in these two
bits:
0 = 4.194304MHz
2 = 1.048576MHz
1 = 2.097152MHz
3 = 32,768Hz
50-60Hz
50Hz is selected as the line input frequency when this bit is
set high. A low will select 60Hz. The power-sense bit in the
Interrupt Control Register must be set low for line frequency
operation.
Clock Out
The three bits specify one of the 7 frequencies to be used as
the squarewave clock output:
0 = XTAL
4 = Disable (low output)
1 = XTAL/2
5 = 1Hz
2 = XTAL/4
6 = 2Hz
3 = XTAL/8
7 = 50Hz or 60Hz
XTAL Operation = 64Hz
All bits are reset by a power-on reset. Therefore, the XTAL is
selected as the clock output at this time.
Interrupt Control Register
Watchdog
When this bit is set high, the watchdog operation will be
enabled. This function requires the CPU to toggle the CE pin
periodically without a serial-transfer requirement. In the
event this does not occur, a CPU reset will be issued. Status
Register must be read before re-enabling watchdog.
Power Down
A high in this location will initiate a power down. A CPU reset
will occur, the CLK OUT and PSE output pins will be set low
and the serial interface will be disabled.
XTAL
IN
22M
T1
XTAL
OUT
R (NO
TE 8)
CR
YST
AL
C2
10 - 40pF
C1
5 - 30pF
NOTES:
7. All frequencies recommended oscillator circuit. C1, C2 values
crystal dependent.
8. R used for 32KHz operation only. 100K - 300K range as specified
by crystal manufacturer.
FIGURE 7. OSCILLATOR CIRCUIT
CLOCK CONTROL REGISTER (Write/Read) - Address 31H
D7
D6
D5
D4
D3
D2
D1
D0
START
LINE
XTAL
XTAL
50Hz
CLK OUT
CLK OUT
CLK OUT
SEL
SEL
STOP
XTAL
1
0
60Hz
2
1
0
CDP68HC68T1
11
Power Sense
This bit is used to enable the line input pin to sense a power
failure. It is set high for this function. When power sense is
selected, the input to the 50Hz to 60Hz prescaler is discon-
nected. Therefore, crystal operation is required when power
sense is enabled. An interrupt is generated when a power
failure is sensed and the power sense and Interrupt True bit
in the Status Register are set. When power sense is acti-
vated, a "0" must be written to this location followed by a "1"
to re-enable power sense.
Alarm
The output of the alarm comparator is enabled when this bit
is set high. When a comparison occurs between the sec-
onds, minutes and hours time and alarm counters, the inter-
rupt output is activated. When loading the time counters, this
bit should be set low to avoid a false interrupt. This is not
required when loading the alarm counters. See Pin Func-
tions, INT for explanation of alarm delay.
Periodic Select
The value in these 4 bits will select the frequency of the peri-
odic output. (See Table 2).
INTERRUPT CONTROL REGISTER (Write/Read) - Address 32H
D7
D6
D5
D4
D3
D2
D1
D0
WATCHDOG
POWER
DOWN
POWER
SENSE
ALARM
PERIODIC SELECT
NOTE: All bits are reset by power-on reset.
TABLE 2. PERIODIC INTERRUPT OUTPUT
D0 - D3 VALUE
PERIODIC INTERRUPT
OUTPUT FREQUENCY
FREQUENCY TIME BASE
XTAL
LINE
0
Disable
1
2048Hz
X
2
1024Hz
X
3
512Hz
X
4
256Hz
X
5
128Hz
X
6
64Hz
X
50 or 60Hz
X
7
32Hz
X
8
16Hz
X
9
8Hz
X
10
4Hz
X
11
2Hz
X
X
12
1Hz
X
X
13
Minute
X
X
14
Hour
X
X
15
Day
X
X
CDP68HC68T1
12
WATCHDOG
If this bit is set high, the watchdog circuit has detected a
CPU failure.
TEST MODE
When this bit is set high, the device is in the TEST MODE.
FIRST-TIME UP
Power-on reset sets this bit high. This signifies that data in
the RAM and Clock is not valid and should be initialized.
INTERRUPT TRUE
A high in this bit signifies that one of the three interrupts
(Power Sense, Alarm, and Clock) is valid.
POWER-SENSE INTERRUPT
This bit set high signifies that the power-sense circuit has
generated an interrupt.
ALARM INTERRUPT
When the seconds, minutes and hours time and alarm
counter are equal, this bit will be set high. Status Register
must be read before loading Interrupt Control Register for
valid alarm indication after alarm activates.
CLOCK INTERRUPT
A periodic interrupt will set this bit high.
All bits are reset by a power-on reset except the "FIRST-
TIME UP" which is set. All bits except the power-sense bit
are reset after a read of this register.
Pin Signal Description
SCK (Serial Clock Input, Note 11)
This input causes serial data to be latched from the MOSI
input and shifted out on the MISO output.
MOSI (Master Out/Slave In, Note 11)
Data bytes are shifted in at this pin, most significant bit
(MSB) first.
MISO (Master In/Slave Out)
Data bytes are shifted out at this pin, most significant bit
(MSB) first.
CE (Chip Enable, Note 12)
A positive chip-enable input. A low level at this input holds
the serial interface logic in a reset state, and disables the
output driver at the MISO pin.
NOTES:
11. These inputs will retain their previous state if the line driving
them goes into a High-Z state.
12. The CE input has as internal pull down device, if the input is in a
low state before going to High Z, the input can be left in a High Z.
Functional Description
The Serial Peripheral Interface (SPI) utilized by the
CDP68HC68T1 is a serial synchronous bus for address and
data transfers. The clock, which is generated by the micro-
computer is active only during address and data transfers. In
systems using the CDP68HC05C4 or CDP68HC05D2, the
STATUS REGISTER (Read Only) - Address 30H
D7
D6
D5
D4
D3
D2
D1
D0
0
WATCHDOG
TEST
MODE
FIRST
TIME
UP
INTERRUPT
TRUE
POWER
SENSE
INTERRUPT
ALARM
INTERRUPT
CLOCK
INTERRUPT
TRUTH TABLE
MODE
SIGNAL
CE
SCK (Note 9)
MOSI
MISO
DISABLE
RESET
L
INPUT DISABLED
INPUT DISABLED
HIGH Z
WRITE
H
CPOL = 1
CPOL = 0
DATA BIT LATCH
HIGH Z
READ
H
CPOL = 1
CPOL = 0
X
NEXT DATA BIT
SHIFTED OUT
(Note 10)
NOTES:
9. When interfacing to CDP68HC05 microcontrollers, serial clock phase bit, CPHA, must be set = 1 in the microcomputer's Control Register.
10. MISO remains at a high Z until 8-bits of data are ready to be shifted out during a READ. It remains at a high Z during the entire WRITE
cycle.
CDP68HC68T1
13
inactive clock polarity is determined by the CPOL bit in the
microcomputer's Control Register. A unique feature of the
CDP68HC68T1 is that it automatically determines the level
of the inactive clock by sampling SCK when CE becomes
active (see Figure 8). Input data (MOSI) is latched internally
on the internal strobe edge and output data (MISO) is shifted
out on the shift edge, as defined by Figure 8. There is one
clock for each data bit transferred (address, as well as data
bits are transferred in groups of 8).
Address And Data Format
There are three types of serial transfer:
1. Address Control - Figure 9.
2. READ or WRITE Data - Figure 10.
3. Watchdog Reset (actually a non-transfer) Figure 11.
The Address/Control and Data bytes are shifted MSB first,
Into the serial data input (MOSI) and out of the serial data
output (MISO).
Any transfer of data requires an Address/Control byte to
specify a Write or Read operation and to select a Clock or
RAM location, followed by one or more bytes of data.
Data is transferred out of MISO for a Read and into MOSI for
a Write operation.
Address/Control Byte - Figure 9
It is always the first byte received after CE goes true. To
transmit a new address, CE must first go false and then true
again. Bit 5 is used to select between Clock and RAM loca-
tions.
SHIFT
INTERNAL
STROBE
INTERNAL
STROBE
SHIFT
CE
SCK
CPOL = 1
SCK
CE
CPOL = 0
MOSI
MSB
MSB -1
NOTE: "CPOL" is a bit that is set in the microcomputer's Control
Register.
FIGURE 8. SERIAL RAM CLOCK (SCK) AS A FUNCTION OF
MCU CLOCK POLARITY (CPOL)
BIT
7
6
5
4
3
2
1
0
W/R
0
CLK RAM
A4
A3
A2
A1
A0
04
A0-A4
Selects 5-Bit HEX Address of RAM or specifies Clock Register. Most Significant Address
Bit. If equal to "1", A0 through A4 selects a Clock Register. If equal to "0", A0 through A4
selects one of 32 RAM locations. Must be set to "0" when not in Test Mode 7W/R W/R = "1"
initiates one or more WRITE cycles.W/R = "0", initiates one or more READ cycles.
5
CLK RAM
6
0
7
W/R
NOTE: SCK can be either polarity.
FIGURE 9. ADDRESS/CONTROL BYTE-TRANSFER WAVEFORMS
A2
A1
A0
A3
A4
CLOCK
0
W/R
MOSI
RAM
SCK (NOTE)
CE
CDP68HC68T1
14
Read/Write Data (See Figure 10)
Read/Write data follows the Address/Control byte.
Watchdog Reset - (See Figure 11)
When watchdog operation is selected, CE must be toggled
periodically or a CPU reset will be outputted.
Address And Data
Data transfers can occur one byte at a time (Figure 12) or in
a multibyte burst mode (Figure 13). After the Real-Time
Clock enabled, an Address/Control word is sent to set the
CLOCK or RAM and select the type of operation (i.e., Read
or Write). For a single-byte Read or Write, one byte is trans-
ferred to or from the Clock Register or RAM location speci-
fied in the Address/Control byte and the Real-Time Clock is
then disabled. Write cycle causes the latched Clock Register
or RAM address to automatically increment. Incrementing
continues after each transfer until the device is disabled.
After incrementing to 1FH the address will "wrap" to 00H and
continue. Therefore, when the RAM is selected the address
will "wrap" to 00H and when the clock is selected the
address will "wrap" 20H.
D7
D6
D5
D4
D3
D2
D1
D0
7
6
5
4
3
2
1
0
BIT
D2
D1
D0
D3
D4
D5
D6
D7
D2
D1
D0
D3
D4
D5
D6
D7
CE
SCK (NOTE)
MOSI
MISO
NOTE: SCK can be either polarity.
FIGURE 10. READ/WRITE DATA TRANSFER WAVEFORMS
CE
SERVICE
TIME
SERVICE
TIME
SCK
CPUR
FIGURE 11. WATCHDOG OPERATION WAVEFORMS
CDP68HC68T1
15
FIGURE 12. SINGLE-BYTE TRANSFER WAVEFORMS
FIGURE 13. MULTIPLE-BYTE TRANSFER WAVEFORMS
CE
SCK
MOSI
WRITE
READ
MOSI
MISO
READ DATA
ADDRESS BYTE
ADDRESS BYTE
WRITE DATA
DATA BYTE
WRITE
DATA BYTE
CE
SCK
DATA BYTE
ADDRESS BYTE
MOSI
DATA BYTE
DATA BYTE +1
W/R ADDRESS
ADDRESS BYTE
MOSI
MISO
READ
DATA BYTE + (n-1)
DATA BYTE
DATA BYTE
DATA BYTE
CDP68HC68T1
16
Dynamic Electrical Specifications
Bus Timing V
DD
10%, V
SS
= 0V
DC
, T
A
= 40
o
C to 85
o
C
IDENT. NO
PARAMETER
LIMITS (ALL TYPES)
UNITS
V
DD
= 3.3V
V
DD
= 5V
MIN
MAX
MIN
MAX
1
Chip Enable Setup Time
t
EVCV
200
-
100
-
ns
2
Chip Enable After Clock Hold Time
t
CVEX
250
-
125
-
ns
3
Clock Width High
t
WH
400
-
200
-
ns
4
Clock Width Low
t
WL
400
-
200
-
ns
5
Data In to Clock Setup Time
t
DVCV
200
-
100
-
ns
7
Clock to Data Propagation Delay
t
CVDV
-
200
-
100
ns
8
Chip Disable to Output High Z
t
EXQZ
-
200
-
100
ns
11
Output Rise Time
t
r
-
200
-
100
ns
12
Output Fall Time
t
f
-
200
-
100
ns
A
Data in After Clock Hold Time
t
CVDX
200
-
100
-
ns
B
Clock to Data Out Active
t
CVQX
-
200
-
100
ns
C
Clock Recovery Time
t
REC
200
-
200
-
ns
CDP68HC68T1
17
Timing Diagrams
FIGURE 14. WRITE-CYCLE TIMING WAVEFORMS
FIGURE 15. READ-CYCLE TIMING WAVEFORMS
System Diagrams
NOTE: Example of a system in which power is always on. Clock circuit driven by line input frequency.
FIGURE 16. POWER-ON ALWAYS SYSTEM DIAGRAM
5
A
5
I
2
3
4
C
MOSI
CE
SCK
W/R
A6
A0
D7
O
D6
O
D1
N
DO
N
12
11
8
A
5
7
8
2
C
I
4
3
MOSI
MISO
CE
SCK
W/R
A6
A0
D7
O
D6
O
DI
N
DO
N
V
DD
IRQ
CDP68HC05C8B
RESET
PORT
SCK
MOSI
MISO
POR
V
DD
INT
V
SYS
LINE
CDP68HC68T1
CE
V
BATT
CPUR
SCK
MOSI
MISO
XTAL IN
BRIDGE
REGULATOR
V
DD
AC
LINE
CDP68HC68T1
18
NOTE: Example of a system in which the power is controlled by an external source. The LINE input pin can sense when the switch opens by use
of the POWER-SENSE INTERRUPT. The CDP68HC68T1 crystal drives the clock input to the CPU using the CLK OUT pin. On power down when
V
SYS
< V
BATT
+ 0.7V. V
BATT
will power the CDP68HC68T1. A threshold detect activates a P-Channel switch, connecting V
BATT
to V
DD
. V
BATT
always supplies power to the oscillator, keeping voltage frequency variation to a minimum.
FIGURE 17. EXTERNALLY CONTROLLED POWER SYSTEM DIAGRAM
A Procedure for Power-Down Operation might consist of the following:
1. Set power sense operation by writing bit 5 high in the Interrupt Control Register.
2. When an interrupt occurs, the CPU reads the Status Register to determine the interrupt source.
3. Sensing a power failure, the CPU does the necessary housekeeping to prepare for shutdown.
4. The CPU reads the Status Register again after several milliseconds to determine validity of power failure.
5. The CPU sets power-down bit 6 and disables all interrupts in the Interrupt Control Register when power down is verified. This
causes the CPU reset and clock out to be held low and disconnects the serial interface.
6. When power returns and V
SYS
rises above V
BATT
, power down is terminated. The CPU reset is released and serial communi-
cation is established.
System Diagrams
(Continued)
POR
V
DD
V
SYS
LINE
CDP68HC68T1
CE
CPUR
MISO
MOSI
SCK
V
BATT
CLK OUT
INT
V
DD
CDP68HC05C8B
PORT (e.g., PCO)
RESET
MISO
MOSI
SCK
OSC 1
IRQ
BRIDGE
GENERATOR
AC
LINE
V
DD
V
DD
CDP68HC68T1
19
FIGURE 18. EXAMPLE OF A SYSTEM WITH A BATTERY BACKUP
System Diagrams
(Continued)
AC
LINE
REGULATOR
POR
V
DD
V
SYS
V
BATT
PSE
CPUR
INT
CLK
XTAL
LINE
OUT
CE
SPI
V
SS
20k
1k
0.047
V
DD
RTC
22M
R
CHARGE
0.1
100k
V
DD
3
NC
V
DD
RESET
CDP68HC05C4B
IRQ
OSC1
PORT
SPI
V
SS
(EPS)
ENABLED
POWER
SUPPLY
CDP68HC68T1
20
Example of an automotive system. The V
SYS
and LINE inputs can be used to sense the ignition turning on and off. An external
switch is included to activate the system without turning on the ignition. Also, the CMOS CPU is not powered down with the system
V
DD
, but is held in a low power reset mode during power down. When restoring power the CDP68HC68T1 will enable the CLK
OUT pin and set the PSE and CPUR high.
Important Application Note: Those units with a code of 6PG have delayed alarm interrupts of 8.3ms regardless of
CDP68HC68T1's operating frequency. (See Pin Functions, INT.) In addition, reading the Status Register before delayed alarm acti-
vates will disable alarm signal.
FIGURE 19. AUTOMOTIVE SYSTEM DIAGRAM
System Diagrams
(Continued)
XTAL
LINE
V
DD
V
SYS
V
BATT
POR
2MHz
PSE
CPUR
CLK OUT
SPI
CE
INT
T1
V
SS
V
DD
RESET
OSC1
IRQ
SPI
PORT
CDP68HC05C4B
V
SS
PORT
5V
REG
+
-
12V
IGNITION
3
CLOCK BUTTON
ENABLED POWER
CDP68HC68T1
21
CDP68HC68T1
Dual-In-Line Plastic Packages (PDIP)
C
L
E
e
A
C
e
B
e
C
SEATING
BASE
PLANE
PLANE
-C-
D1
B1
B
e
D
D1
A
A2
L
A1
0.010 (0.25)
C
A
M
B S
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in JE-
DEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and
are measured with the leads constrained to be perpendic-
ular to datum
.
7. e
B
and e
C
are measured at the lead tips with the leads unconstrained.
e
C
must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
e
A
-C-
E16.3
(JEDEC MS-001-BB ISSUE D)
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
B1
0.045
0.070
1.15
1.77
8, 10
C
0.008
0.014
0.204
0.355
-
D
0.735
0.775
18.66
19.68
5
D1
0.005
-
0.13
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
2.54 BSC
-
e
A
0.300 BSC
7.62 BSC
6
e
B
-
0.430
-
10.92
7
L
0.115
0.150
2.93
3.81
4
N
16
16
9
Rev. 0 12/93
22
CDP68HC68T1
Ceramic Dual-In-Line Metal Seal Packages (SBDIP)
NOTES:
1. Index area: A notch or a pin one identification mark shall be locat-
ed adjacent to pin one and shall be located within the shaded
area shown. The manufacturer's identification shall not be used
as a pin one identification mark.
2. The maximum limits of lead dimensions b and c or M shall be
measured at the centroid of the finished lead surfaces, when
solder dip or tin plate lead finish is applied.
3. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness.
4. Corner leads (1, N, N/2, and N/2+1) may be configured with a
partial lead paddle. For this configuration dimension b3 replaces
dimension b2.
5. Dimension Q shall be measured from the seating plane to the
base plane.
6. Measure dimension S1 at all four corners.
7. Measure dimension S2 from the top of the ceramic body to the
nearest metallization or lead.
8. N is the maximum number of terminal positions.
9. Braze fillets shall be concave.
10. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
11. Controlling dimension: INCH.
bbb
C A - B
S
c
Q
L
A
SEATING
BASE
D
PLANE
PLANE
S
S
-D-
-A-
-C-
e
A
-B-
aaa
C A - B
M
D
S
S
ccc
C A - B
M
D
S
S
D
E
S1
b2
b
A
e
M
c1
b1
(c)
(b)
SECTION A-A
BASE
LEAD FINISH
METAL
e
A/2
S2
M
A
D16.3
MIL-STD-1835 CDIP2-T16 (D-2, CONFIGURATION C)
16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.200
-
5.08
-
b
0.014
0.026
0.36
0.66
2
b1
0.014
0.023
0.36
0.58
3
b2
0.045
0.065
1.14
1.65
-
b3
0.023
0.045
0.58
1.14
4
c
0.008
0.018
0.20
0.46
2
c1
0.008
0.015
0.20
0.38
3
D
-
0.840
-
21.34
-
E
0.220
0.310
5.59
7.87
-
e
0.100 BSC
2.54 BSC
-
eA
0.300 BSC
7.62 BSC
-
eA/2
0.150 BSC
3.81 BSC
-
L
0.125
0.200
3.18
5.08
-
Q
0.015
0.060
0.38
1.52
5
S1
0.005
-
0.13
-
6
S2
0.005
-
0.13
-
7
90
o
105
o
90
o
105
o
-
aaa
-
0.015
-
0.38
-
bbb
-
0.030
-
0.76
-
ccc
-
0.010
-
0.25
-
M
-
0.0015
-
0.038
2
N
16
16
8
Rev. 0 4/94
23
CDP68HC68T1
Small Outline Plastic Packages (SOIC)
INDEX
AREA
E
D
N
1
2
3
-B-
0.25(0.010)
C A
M
B S
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45
o
C
H
0.25(0.010)
B
M
M
NOTES:
1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension "D" does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension "E" does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. "L" is the length of terminal for soldering to a substrate.
7. "N" is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width "B", as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm (0.024
inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
M16.3
(JEDEC MS-013-AA ISSUE C)
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.0200
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.3977
0.4133
10.10
10.50
3
E
0.2914
0.2992
7.40
7.60
4
e
0.050 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.010
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
N
16
16
7
0
o
8
o
0
o
8
o
-
Rev. 0 12/93
24
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (407) 724-7000
FAX: (407) 724-7240
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
ASIA
Intersil (Taiwan) Ltd.
Taiwan Limited
7F-6, No. 101 Fu Hsing North Road
Taipei, Taiwan
Republic of China
TEL: (886) 2 2716 9310
FAX: (886) 2 2715 3029
CDP68HC68T1
Small Outline Plastic Packages (SOIC)
INDEX
AREA
E
D
N
1
2
3
-B-
0.25(0.010)
C A
M
B S
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45
o
C
H
0.25(0.010)
B
M
M
NOTES:
1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension "D" does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension "E" does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. "L" is the length of terminal for soldering to a substrate.
7. "N" is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width "B", as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
M20.3
(JEDEC MS-013-AC ISSUE C)
20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.0200
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.4961
0.5118
12.60
13.00
3
E
0.2914
0.2992
7.40
7.60
4
e
0.050 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.010
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
N
20
20
7
0
o
8
o
0
o
8
o
-
Rev. 0 12/93