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Электронный компонент: HA3-2505-5

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1
File Number
2890.5
HA-2505
12MHz, High Input Impedance,
Operational Amplifier
HA-2505 is an operational amplifier whose design is
optimized to deliver excellent slew rate, bandwidth, and
settling time specifications. The outstanding dynamic
features of this internally compensated device are
complemented with low offset voltage and offset current.
This dielectrically isolated amplifier is ideally suited for
applications such as data acquisition, RF, video, and pulse
conditioning circuits. Slew rates of
30V/
s and 330ns
(0.1%) settling time make this device an excellent
component in fast, accurate data acquisition and pulse
amplification designs. 12MHz small signal bandwidth and
500kHz power bandwidth make this device well suited to RF
and video applications. With 2mV typical offset voltage plus
offset trim capability and 10nA offset current, HA-2505 is
particularly useful in signal conditioning designs.
The gain and offset voltage figures of the HA-2505 are
optimized by internal component value changes while the
similar design of the HA-2515 is maximized for slew rate.
MIL-STD-883 product and data sheets are available upon
request.
Features
Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30V/
s
Fast Settling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 330ns
Full Power Bandwidth . . . . . . . . . . . . . . . . . . . . . . 500kHz
Gain Bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . . 12MHz
High Input Impedance . . . . . . . . . . . . . . . . . . . . . . 50M
Low Offset Current . . . . . . . . . . . . . . . . . . . . . . . . . . 10nA
Internally Compensated For Unity Gain Stability
Applications
Data Acquisition Systems
RF Amplifiers
Video Amplifiers
Signal Generators
Pinout
HA-2505 (PDIP)
TOP VIEW
Ordering Information
PART
NUMBER
TEMP RANGE
(
o
C)
PACKAGE
PKG. NO.
HA3-2505-5
0 to 75
8 Ld PDIP
E8.3
1
2
3
4
8
7
6
5
COMP
V+
OUT
BAL
BAL
-IN
+IN
V-
+
-
Data Sheet
May 1999
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143
|
Copyright
Intersil Corporation 1999
2
Schematic
Q
37
Q
28
R
26
Q
32
Q
35
Q
4
Q
2
Q
34
Q
33
Q
24
Q
23
Q
22
Q
19
Q
13
Q
25
Q
20
V-
- INPUT
R
2
2K
Q
27
Q
18
Q
21
R
15
740
R
16
1.48K
R
17
1.48K
R
18
1.48K
Q
3
COMP
Q
6
Q
8
Q
7
Q
9
Q
40
Q
39
Q
38
800
800
R
25
Q
29
Q
26
Q
30
Q
31
Q
36
R
4
11.13K
R
20
3.3K
R
23
3.3K
R
22
1.12K
R
14
30
Q
12
Q
15
Q
17
R
10
1.8K
R
7
1.8K
200
R
9
200
R
6
Q
16
V+
R
12
1.1K
Q
14
Q
11
R
13
30
C
1
10pF
10.6pF
C
2
Q
10
R
11
2K
R
1
4K
200
R
5
200
R
8
+ INPUT
R
3
960
Q
5
R
19
6.3K
BAL
OUTPUT
BAL
Q
1
HA-2505
3
Absolute Maximum Ratings
Thermal Information
Supply Voltage Between V+ and V- Terminals. . . . . . . . . . . . . . 40V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15V
Peak Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA
Operating Conditions
Temperature Range
HA-2505-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0
o
C to 75
o
C
Thermal Resistance (Typical, Note 1)
JA
(
o
C/W)
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
96
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150
o
C
Maximum Storage Temperature Range . . . . . . . . . -65
o
C to 150
o
C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300
o
C
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
JA
is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
V
S
=
15V
PARAMETER
TEMP
(
o
C)
HA-2505-5
UNITS
MIN
TYP
MAX
INPUT CHARACTERISTICS
Offset Voltage
25
-
4
8
mV
Full
-
-
10
mV
Offset Voltage Average Drift
Full
-
20
-
V/
o
C
Bias Current
25
-
125
250
nA
Full
-
-
500
nA
Offset Current
25
-
20
50
nA
Full
-
-
100
nA
Input Resistance (Note 2)
25
20
50
-
M
Common Mode Range
Full
10
-
-
V
TRANSFER CHARACTERISTICS
Large Signal Voltage Gain (Notes 3, 6)
25
15
25
-
kV/V
Full
10
-
-
kV/V
Common Mode Rejection Ratio (Note 4)
Full
74
90
-
dB
Gain Bandwidth Product (Note 5)
25
-
12
-
MHz
OUTPUT CHARACTERISTICS
Output Voltage Swing (Note 3)
Full
10
12
-
V
Output Current (Note 6)
25
10
20
-
mA
Full Power Bandwidth (Notes 6, 11)
25
300
500
-
kHz
TRANSIENT RESPONSE
Rise Time (Notes 3, 7, 8, 9)
25
-
25
50
ns
Overshoot (Notes 3, 7, 8, 9)
25
-
25
50
%
Slew Rate (Notes 3, 7, 9, 12)
25
20
30
-
V/
s
Settling Time to 0.1% (Notes 3, 7, 9, 12)
25
-
0.33
-
s
POWER SUPPLY CHARACTERISTICS
Supply Current
25
-
4
6
mA
PSRR (Note 10)
Full
74
90
-
dB
NOTES:
2. This parameter value is based on design calculations.
3. R
L
= 2k
.
4. V
CM
=
10V.
5. A
V
> 10.
6. V
O
=
10V.
7. C
L
= 50pF.
8. V
O
=
200mV.
9. See Transient Response Test Circuits and Waveforms.
10.
V =
5V.
11. Full Power Bandwidth guaranteed based on slew rate measurement
using: FPBW = Slew Rate/2
V
PEAK
.
12. V
OUT
=
5V.
HA-2505
4
Test Circuits and Waveforms
FIGURE 1. SLEW RATE AND SETTLING TIME
NOTE:
Measured on both positive and negative transitions from
0V to +200mV and 0V to -200mV at the output.
FIGURE 2. TRANSIENT RESPONSE
FIGURE 3. SLEW RATE AND TRANSIENT RESPONSE
R
L
= 2k
, C
L
= 50pF
Vertical = 5V/Div.
Upper Trace: Input
Horizontal = 200ns/Div.
Lower Trace: Output
T
A
= 25
o
C, V
S
=
15V
FIGURE 4. VOLTAGE FOLLOWER PULSE RESPONSE
13. A
V
= -1.
14. Feedback and Summing Resistor Ratios should be 0.1%
matched.
15. Clipping Diodes CR
1
and CR
2
are optional. HP5082-2810
recommended.
FIGURE 5. SETTLING TIME TEST CIRCUIT
FIGURE 6. SUGGESTED V
OS
ADJUSTMENT AND
COMPENSATION HOOK UP
25%
-5V
-5V
+5V
INPUT
+5V
75%
OUTPUT
ERROR BAND
10mV FROM
FINAL VALUE
t
SLEW
=
V/
t
SETTLING
TIME
V
RATE
INPUT
90%
OUTPUT
10%
0mV
RISE TIME
+200mV
0mV
+200mV
OVERSHOOT
+
-
OUT
IN
2k
50pF
OUTPUT
INPUT
+
2k
5k
2
3
4
6
7
50pF
V+
V-
D
G
S
2N4416
CR
1
CR
2
SETTLING TIME
TEST POINT
1
F
0.01
F
1
F
0.01
F
2k
5k
2k
-
OUT
IN
BAL
V-
V+
20k
COMP
C
C
R
T
NOTE: Tested offset adjustment range is |V
OS
+ 1mV| minimum
referred to output. Typical ranges are
6mV with R
T
= 20k
.
HA-2505
5
Typical Performance Curves
V
S
=
15V, T
A
= 25
o
C, Unless Otherwise Specified
FIGURE 7. INPUT BIAS AND OFFSET CURRENT vs
TEMPERATURE
FIGURE 8. EQUIVALENT INPUT NOISE vs BANDWIDTH
(WITH 10Hz HIGH PASS FILTER)
FIGURE 9. NORMALIZED AC PARAMETERS vs TEMPERATURE
FIGURE 10. OPEN LOOP FREQUENCY AND PHASE
RESPONSE
FIGURE 11. NORMALIZED AC PARAMETERS vs SUPPLY
VOLTAGE
NOTE: External compensation components are not required for
stability, but may be added to reduce bandwidth if desired.
FIGURE 12. OPEN LOOP FREQUENCY RESPONSE FOR
VARIOUS VALUES OF CAPACITORS FROM
COMPENSATION PIN TO GROUND
100
80
60
40
20
0
-20
-40
-50
-25
0
25
50
75
100
125
CURRENT (nA)
TEMPERATURE (
o
C)
BIAS CURRENT
OFFSET CURRENT
FREQUENCY (Hz)
100
10
1.0
0.1
100Hz
1kHz
10kHz
100kHz
1MHz
EQ
UIV
ALENT INPUT NOISE (
V
RMS
)
THERMAL NOISE
OF 10K RESISTOR
10K SOURCE RESISTANCE
0 SOURCE RESISTANCE
1.1
1.0
0.9
0.8
-50
-25
0
25
50
75
100
125
NORMALIZED P
ARAMETERS REFERRED
TEMPERATURE (
o
C)
T
O
V
ALUES A
T
25
o
C
SLEW RATE
BANDWIDTH
FREQUENCY (Hz)
120
0
100
10K
1M
10M
100M
OPEN LOOP V
O
L
T
A
GE GAIN (dB)
100
80
60
40
20
-20
10
100K
1K
180
30
60
90
120
150
PHASE
GAIN
PHASE (DEGREES)
0
1.1
1.0
0.9
0.8
10
15
20
NORMALIZED P
ARAMETERS REFERRED
SUPPLY VOLTAGE (
V)
T
O
V
ALUES A
T
15V
SLEW RATE
BANDWIDTH
FREQUENCY (Hz)
120
0
100
10K
1M
10M
100M
OPEN LOOP V
O
L
T
A
GE GAIN (dB)
100
80
60
40
20
-20
10
100K
1K
100pF
0pF
30pF
1000pF
300pF
HA-2505
6
FIGURE 13. OPEN LOOP VOLTAGE GAIN vs TEMPERATURE
FIGURE 14. OUTPUT VOLTAGE SWING vs FREQUENCY
FIGURE 15. POWER SUPPLY CURRENT vs TEMPERATURE
Typical Performance Curves
V
S
=
15V, T
A
= 25
o
C, Unless Otherwise Specified
(Continued)
90
80
-50
-25
0
25
50
75
100
125
GAIN (dB)
TEMPERATURE (
o
C)
V
SUPPLY
=
20V
V
SUPPLY
=
15V
V
SUPPLY
=
10V
0
10K
100K
1MEG
10MEG
FREQUENCY (Hz)
5
15
20
25
30
35
10
OUTPUT V
O
L
T
A
GE SWING (V
P-P
)
V
SUPPLY
=
20V
V
SUPPLY
=
15V
V
SUPPLY
=
10V
4
3
SUPPL
Y CURRENT (mA)
TEMPERATURE (
o
C)
5
V
SUPPLY
=
20V
V
SUPPLY
=
15V
V
SUPPLY
=
10V
-50
-25
0
25
50
75
100
125
HA-2505
7
Die Characteristics
DIE DIMENSIONS:
57 mils x 65 mils x 19 mils
1450
m x 1650
m x 483
m
METALLIZATION:
Type: Al, 1% Cu
Thickness: 16k
2k
PASSIVATION:
Type: Nitride (Si3N4) over Silox (SiO2, 5% Phos.)
Silox Thickness: 12k
2k
Nitride Thickness: 3.5k
1.5k
SUBSTRATE POTENTIAL (POWERED UP):
Unbiased
TRANSISTOR COUNT:
40
PROCESS:
Bipolar Dielectric Isolation
Metallization Mask Layout
HA-2505
V+
OUT
BAL
V-
BAL
-IN
+IN
COMP
HA-2505
8
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (321) 724-7000
FAX: (321) 724-7240
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
ASIA
Intersil (Taiwan) Ltd.
7F-6, No. 101 Fu Hsing North Road
Taipei, Taiwan
Republic of China
TEL: (886) 2 2716 9310
FAX: (886) 2 2715 3029
HA-2505
Dual-In-Line Plastic Packages (PDIP)
C
L
E
e
A
C
e
B
e
C
-B-
E1
INDEX
1 2 3
N/2
N
AREA
SEATING
BASE
PLANE
PLANE
-C-
D1
B1
B
e
D
D1
A
A2
L
A
1
-A-
0.010 (0.25)
C
A
M
B S
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between
English and Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the "MO Series Symbol List" in Section
2.2 of Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated
in JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protru-
sions. Mold flash or protrusions shall not exceed 0.010 inch
(0.25mm).
6. E and
are measured with the leads constrained to be per-
pendicular to datum
.
7. e
B
and e
C
are measured at the lead tips with the leads uncon-
strained. e
C
must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions.
Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,
E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch
(0.76 - 1.14mm).
e
A
-C-
E8.3
(JEDEC MS-001-BA ISSUE D)
8 LEAD DUAL-IN-LINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
B1
0.045
0.070
1.15
1.77
8, 10
C
0.008
0.014
0.204
0.355
-
D
0.355
0.400
9.01
10.16
5
D1
0.005
-
0.13
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
2.54 BSC
-
e
A
0.300 BSC
7.62 BSC
6
e
B
-
0.430
-
10.92
7
L
0.115
0.150
2.93
3.81
4
N
8
8
9
Rev. 0 12/93