1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143
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Copyright
Intersil Corporation 1999
HA4314B
400MHz, 4 x 1 Video Crosspoint Switch
The HA4314B is a very wide bandwidth 4 x 1 crosspoint
switch ideal for professional video switching, HDTV,
computer monitor routing, and other high performance
applications. The circuit features very low power dissipation
(105mW Enabled, 4mW Disabled), excellent differential gain
and phase, and very high off isolation. When disabled, the
output is switched to a high impedance state, making the
HA4314B ideal for routing matrix equipment.
The HA4314B requires no external current source, and
features fast switching and symmetric slew rates.
For a 4 x 1 crosspoint with Tally outputs (channel indicators)
or with synchronous control signals, please refer to the
HA4404B and HA4344B data sheets, respectively.
For audio channels requiring larger signal swings, please
refer to the CD74HC22106 (8 x 8), CD22M3493 (12 x 8),
and CD22M3494 (16 x 8) data sheets.
Truth Table
Features
Low Power Dissipation . . . . . . . . . . . . . . . . . . . . . 105mW
Symmetrical Slew Rates . . . . . . . . . . . . . . . . . . 1400V/
s
0.1dB Gain Flatness. . . . . . . . . . . . . . . . . . . . . . . 100MHz
-3dB Bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . 400MHz
Off Isolation (100MHz) . . . . . . . . . . . . . . . . . . . . . . . 70dB
Crosstalk Rejection (30MHz) . . . . . . . . . . . . . . . . . . 80dB
Differential Gain and Phase . . . . . . . 0.01%/0.01 Degrees
High ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . >2000V
TTL Compatible Control Inputs
Improved Replacement for GX4314 and GX4314L
Applications
Professional Video Switching and Routing
HDTV
Computer Graphics
RF Switching and Routing
PCM Data Routing
Pinouts
HA4314B (PDIP, SOIC)
TOP VIEW
HA4314B (SSOP)
TOP VIEW
NOTE: These pins must be left floating or connected to ground.
Ordering Information
PART NUMBER
TEMP.
RANGE (
o
C)
PACKAGE
PKG.
NO.
HA4314BCP
0 to 70
14 Ld PDIP
E14.3
HA4314BCB
0 to 70
14 Ld SOIC
M14.15
HA4314BCB96
0 to 70
14 Ld SOIC Tape and
Reel
M14.15
HA4314BCA
0 to 70
16 Ld SSOP
M16.15A
HA4314BCA96
0 to 70
16 Ld SSOP Tape
and Reel
M16.15A
CS
A1
A0
OUT
0
0
0
IN0
0
0
1
IN1
0
1
0
IN2
0
1
1
IN3
1
X
X
HIGH - Z
13
12
11
8
1
2
3
4
5
7
6
IN0
IN1
IN2
GND
IN3
V+
A1
CS
NC
V-
A0
14
10
9
GND
GND
OUT
15
14
13
10
1
2
3
4
5
7
6
IN0
IN1
IN2
GND
IN3
V+
A1
CS
NOTE
NOTE
A0
16
12
11
GND
GND
OUT
V-
9
8
GND
Data Sheet
January 1999
File Number
3679.7
2
Absolute Maximum Ratings
Thermal Information
Voltage Between V+ and V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
SUPPLY
Digital Input Current (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . .
25mA
Analog Input Current (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . .
5mA
Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20mA
ESD Rating
Human Body Model (Per MIL-STD-883 Method 3015.7) . . . .2000V
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . 0
o
C to 70
o
C
Thermal Resistance (Typical, Note 1)
JA
(
o
C/W)
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
100
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
120
SSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . .
140
Maximum Junction Temperature (Die) . . . . . . . . . . . . . . . . . . . 175
o
C
Maximum Junction Temperature (Plastic Package) . . . . . . . 150
o
C
Maximum Storage Temperature Range . . . . . . . . . . -65
o
C to 150
o
C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300
o
C
(SOIC and SSOP - Lead Tips Only)
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1.
JA
is measured with the component mounted on an evaluation PC board in free air.
2. If an input signal is applied before the supplies are powered up, the input current must be limited to these maximum values.
Electrical Specifications
V
SUPPLY
=
5V, R
L
= 10k
, V
CS
= 0.8V, Unless Otherwise Specified
PARAMETER
TEST CONDITIONS
(NOTE 4)
TEMP. (
o
C)
MIN
TYP
MAX
UNITS
DC SUPPLY CHARACTERISTICS
Supply Voltage
Full
4.5
5.0
5.5
V
Supply Current (V
OUT
= 0V)
V
CS
= 0.8V
25, 70
-
10.5
13
mA
V
CS
= 0.8V
0
-
-
15.5
mA
V
CS
= 2.0V
25, 70
-
400
450
A
V
CS
= 2.0V
0
-
400
580
A
ANALOG DC CHARACTERISTICS
Output Voltage Swing without Clipping
V
OUT
= V
IN
V
IO
20mV
25, 70
2.7
2.8
-
V
0
2.4
2.5
-
V
Output Current
Full
15
20
-
mA
Input Bias Current
Full
-
30
50
A
Output Offset Voltage
Full
-10
-
10
mV
Output Offset Voltage Drift (Note 3)
Full
-
25
50
V/
o
C
SWITCHING CHARACTERISTICS
Turn-On Time
25
-
160
-
ns
Turn-Off Time
25
-
320
-
ns
Output Glitch During Switching
25
-
10
-
mV
DIGITAL DC CHARACTERISTICS
Input Logic High Voltage
Full
2
-
-
V
Input Logic Low Voltage
Full
-
-
0.8
V
Input Current
0V to 4V
Full
-2
-
2
A
AC CHARACTERISTICS
Insertion Loss
1V
P-P
25
-
0.055
0.063
dB
Full
-
0.07
0.08
dB
Channel-to-Channel Insertion Loss Match
Full
-
0.004
0.006
dB
-3dB Bandwidth
R
S
= 50
, C
L
= 10pF
25
-
400
-
MHz
R
S
= 20
, C
L
= 20pF
25
-
280
-
MHz
R
S
= 16
, C
L
= 36pF
25
-
140
-
MHz
R
S
= 13
, C
L
= 49pF
25
-
110
-
MHz
HA4314B
3
AC Test Circuit
PC Board Layout
The frequency response of this circuit depends greatly on
the care taken in designing the PC board. The use of low
inductance components such as chip resistors and chip
capacitors is strongly recommended, while a solid
ground plane is a must!
Attention should be given to decoupling the power supplies.
A large value (10
F) tantalum in parallel with a small value
(0.1
F) chip capacitor works well in most cases.
Keep input and output traces as short as possible, because
trace inductance and capacitance can easily become the
performance limiting items.
Application Information
General
The HA4314B is a 4 x 1 crosspoint switch that is ideal for the
matrix element of high performance switchers and routers.
This crosspoint's low input capacitance and high input
resistance provide excellent video terminations when used
with an external 75
resistor. Nevertheless, if several
HA4314B inputs are connected together, the use of an input
buffer should be considered (see Figure 1). This crosspoint
contains no feedback or gain setting resistors, so the output
is a true high impedance load when the IC is disabled
(CS = 1).
Ground Connections
All GND pins are connected to a common point on the die,
so any one of them will suffice as the functional GND
connection. For the best isolation and crosstalk rejection,
however, all GND pins must connect to the GND plane.
Frequency Response
Most applications utilizing the HA4314B require a series
output resistor, R
S
, to tune the response for the specific load
0.1dB Flat Bandwidth
R
S
= 50
, C
L
= 10pF
25
-
100
-
MHz
R
S
= 20
, C
L
= 20pF
25
-
100
-
MHz
R
S
= 16
, C
L
= 36pF
25
-
85
-
MHz
R
S
= 13
, C
L
= 49pF
25
-
75
-
MHz
Input Resistance
Full
200
400
-
k
Input Capacitance
Full
-
1.5
-
pF
Enabled Output Resistance
Full
-
15
-
Disabled Output Capacitance
V
CS
= 2.0V
Full
-
2.5
-
pF
Differential Gain
4.43MHz, Note 3
25
-
0.01
0.02
%
Differential Phase
4.43MHz, Note 3
25
-
0.01
0.02
Degrees
Off Isolation
1V
P-P
, 100MHz, V
CS
= 2.0V,
R
L
= 10
Full
-
70
-
dB
Crosstalk Rejection
1V
P-P
, 30MHz
Full
-
80
-
dB
Slew Rate (1.5V
P-P
, +SR/-SR)
R
S
= 50
, C
L
= 10pF
25
-
1425/1450
-
V/
s
R
S
= 20
, C
L
= 20pF
25
-
1010/1010
-
V/
s
R
S
= 16
, C
L
= 36pF
25
-
725/750
-
V/
s
R
S
= 13
, C
L
= 49pF
25
-
600/650
-
V/
s
Total Harmonic Distortion
10MHz, R
L
= 1k
, Note 3
Full
-
0.01
0.1
%
Disabled Output Resistance
V
CS
= 2.0V
Full
-
12
-
M
NOTES:
3. This parameter is not tested. The limits are guaranteed based on lab characterization, and reflect lot-to-lot variation.
4. Units are 100% tested at 25
o
C; Guaranteed but not tested at 0
o
C and 70
o
C.
Electrical Specifications
V
SUPPLY
=
5V, R
L
= 10k
, V
CS
= 0.8V, Unless Otherwise Specified (Continued)
PARAMETER
TEST CONDITIONS
(NOTE 4)
TEMP. (
o
C)
MIN
TYP
MAX
UNITS
HA4314
R
S
C
X
75
HFA1100
75
V
OUT
V
IN
10k
500
400
510
+
-
NOTE:
C
L
= C
X
+ Test Fixture Capacitance.
HA4314B
4
capacitance, C
L
, driven. Bandwidth and slew rate degrade
as C
L
increases (as shown in the Electrical Specification
table), so give careful consideration to component
placement to minimize trace length. In big matrix
configurations where C
L
is large, better frequency response
is obtained by cascading two levels of crosspoints in the
case of multiplexed outputs (see Figure 2), or distributing the
load between two drivers if C
L
is due to bussing and
subsequent stage input capacitance.
Control Signals
CS - This is a TTL/CMOS compatible, active low Chip Select
input. When driven high, CS forces the output to a true high
impedance state and reduces the power dissipation by a
factor of 25. The CS input has no on-chip pull-down resistor,
so it must be connected to a logic low (recommend GND) if
the enable function isn't utilized.
A0, A1 - These are binary coded, TTL/CMOS compatible
address inputs that select which one of the four inputs
connect to the crosspoint output.
Switcher/Router Applications
Figure 1 illustrates one possible implementation of a
wideband, low power, 4 x 4 switcher/router utilizing the
HA4314B for the switch matrix. A 4 x 4 switcher/router allows
any of the four outputs to be driven by any one of the four
inputs (e.g., each of the four inputs may connect to a
different output, or an input may connect to multiple outputs).
This application utilizes the HA4600 (video buffer with output
disable) for the input buffer, the HA4314B as the switch
matrix, and the HFA1112 (programmable gain buffer) as the
gain of two output driver. Figure 2 details a 16 x 1 switcher
(basically a 16:1 mux) which uses the HA4201 (1 x 1
crosspoint) and the HA4314B in a cascaded stage
configuration to minimize capacitive loading at each output
node, thus increasing system bandwidth.
Power Up Considerations
No signals should be applied to the analog or digital inputs
before the power supplies are activated. Latch-up may occur
if the inputs are driven at the time of power up. To prevent
latch-up, the input currents during power up must not exceed
the values listed in the Absolute Maximum Ratings.
Intersil's Crosspoint Family
Intersil offers a variety of 4 x 1 and 1 x 1 crosspoint switches.
In addition to the HA4314B, the 4 x 1 family includes the
HA4404 and HA4344. The HA4404 is a 16 lead device with
Tally outputs to indicate the selected channel. The HA4344
is a 16 lead crosspoint with synchronized control lines (A0,
A1, CS). With synchronization, the control information for the
next channel switch can be loaded into the crosspoint
without affecting the current state. On a subsequent clock
edge the stored control state effects the desired channel
switch.
The 1 x 1 family is comprised of the HA4201 and HA4600.
They are essentially similar devices, but the HA4201
includes a Tally output (enable indicator). The 1 x 1s are
useful as high performance video input buffers, or in a switch
matrix requiring very high off isolation.
+
-
SOURCE 0
75
OUT
SOURCE 1
SOURCE 2
SOURCE 3
75
75
75
HA4314
OUT
CS
IN3
IN0
HA4600
HA4600
EN
OUT
EN
X2
R
S
R
S
75
OUT0
R
S
HA4314
OUT
CS
IN3
IN0
X2
R
S
75
OUT1
HA4314
OUT
CS
IN3
IN0
X2
R
S
75
OUT2
HA4314
OUT
CS
IN3
IN0
X2
R
S
75
OUT3
OUTPUT BUFFERS
(HFA1112 OR HFA1115)
INPUT BUFFERS
SWITCH MATRIX
+5V
+5V
+
-
+
-
+
-
FIGURE 1. 4 x 4 SWITCHER/ROUTER APPLICATION
HA4314B
5
SOURCE0
75
HA4201
OUT
IN0
CS
IN3
SOURCE3
75
SOURCE4
75
OUT
CS
SOURCE7
75
R
S
SOURCE8
75
OUT
CS
SOURCE11
75
SOURCE12
75
OUT
CS
SOURCE15
75
HA4314
HA4314
R
S
R
S
HA4314
1/4 CD74HCT00
SEL0:3
HFA1112 OR HFA1115
SEL4:7
EN
HA4201
R
S
R
S
R
S
1/4 CD74HCT00
SEL8:11 SEL12:15
EN
SWITCHING
MATRIX
ISOLATION
MUX
OUTPUT
BUFFER
75
+
-
X2
OUT
IN1
IN2
IN0
IN3
IN1
IN2
IN0
IN3
IN1
IN2
IN0
IN3
IN1
IN2
FIGURE 2. 16 x 1 SWITCHER APPLICATION
Typical Performance Curves
V
SUPPLY
=
5V, T
A
= 25
o
C, R
L
= 10k
, Unless Otherwise Specified
FIGURE 3. LARGE SIGNAL PULSE RESPONSE
FIGURE 4. CHANNEL-TO-CHANNEL SWITCHING RESPONSE
1.0
0.75
0.5
0.25
0
-0.25
-0.75
-1.0
OUTPUT V
O
L
T
A
GE (V)
TIME (5ns/DIV.)
-0.5
TIME (200ns/DIV.)
IN1 = +250mV
A0 = +3V
OUTPUT V
O
L
T
A
GE (mV)
0
125
250
A1 (V)
0
0.8
1.6
2.4
IN3 = 0V
HA4314B
6
FIGURE 5. FREQUENCY RESPONSE
FIGURE 6. GAIN FLATNESS
FIGURE 7. ALL HOSTILE CROSSTALK REJECTION
FIGURE 8. ALL HOSTILE OFF ISOLATION
FIGURE 9. TOTAL HARMONIC DISTORTION vs FREQUENCY
FIGURE 10. INPUT CAPACITANCE vs FREQUENCY
Typical Performance Curves
V
SUPPLY
=
5V, T
A
= 25
o
C, R
L
= 10k
, Unless Otherwise Specified (Continued)
C
L
= 20pF
C
L
= 36pF
C
L
= 49pF
C
L
= 10pF
12
9
6
3
0
-3
-6
-9
-12
1
10
100
500
V
IN
= 1V
P-P
FREQUENCY (MHz)
GAIN (dB)
0.4
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
-0.4
GAIN (dB)
1
10
100
200
FREQUENCY (MHz)
V
IN
= 1V
P-P
C
L
= 49pF
C
L
= 36pF
C
L
= 20pF
C
L
= 10pF
C
L
= 20pF
-60
-70
-80
-90
-100
-110
-120
-50
-40
0.6
1
10
100
200
FREQUENCY (MHz)
CR
OSST
ALK (dB)
V
IN
= 1V
P-P
R
L
= 10k
PDIP
SOIC
SSOP
-30
-40
-50
-60
-70
-80
-90
-100
0.3
100
200
-20
-10
10
1
V
IN
= 1V
P-P
R
L
= 10
PDIP
SOIC
FREQUENCY (MHz)
OFF ISOLA
TION (dB)
SSOP
10
20
30
40
50
60
70
80
90
100
0
0.05
0.1
0.15
0.2
TOTAL HARMONIC DISTORTION (%)
FREQUENCY (MHz)
V
IN
= 1V
P-P
R
L
= 1k
1
10
100
FREQUENCY (MHz)
1.4
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
500
CH. 3
CH. 2
CH. 1
INPUT CAP
A
CIT
ANCE (pF)
CH. 0
HA4314B
7
Die Characteristics
DIE DIMENSIONS:
65 mils x 118 mils x 19 mils
1640
m x 3000
m x 483
m
METALLIZATION:
Type: Metal 1: AlCu (1%)/TiW
Thickness: Metal 1: 6k
0.8k
Type: Metal 2: AlCu (1%)
Thickness: Metal 2: 16k
1.1k
PASSIVATION:
Type: Nitride
Thickness: 4k
0.5k
TRANSISTOR COUNT:
200
SUBSTRATE POTENTIAL (POWERED UP):
V-
Metallization Mask Layout
HA4314B
IN0
GND
IN1
IN2
GND
GND
GND
NC
NC
NC
IN3
V-
NC
NC
NC
OUT
CS
A1
A0
V+
HA4314B
8
HA4314B
Dual-In-Line Plastic Packages (PDIP)
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English
and Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and
are measured with the leads constrained to be perpen-
dicular to datum
.
7. e
B
and e
C
are measured at the lead tips with the leads uncon-
strained. e
C
must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 -
1.14mm).
e
A
-C-
C
L
E
e
A
C
e
B
e
C
-B-
E1
INDEX
1 2 3
N/2
N
AREA
SEATING
BASE
PLANE
PLANE
-C-
D1
B1
B
e
D
D1
A
A2
L
A1
-A-
0.010 (0.25)
C
A
M
B S
E14.3
(JEDEC MS-001-AA ISSUE D)
14 LEAD DUAL-IN-LINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
B1
0.045
0.070
1.15
1.77
8
C
0.008
0.014
0.204
0.355
-
D
0.735
0.775
18.66
19.68
5
D1
0.005
-
0.13
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
2.54 BSC
-
e
A
0.300 BSC
7.62 BSC
6
e
B
-
0.430
-
10.92
7
L
0.115
0.150
2.93
3.81
4
N
14
14
9
Rev. 0 12/93
9
HA4314B
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension "D" does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension "E" does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. "L" is the length of terminal for soldering to a substrate.
7. "N" is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width "B", as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
INDEX
AREA
E
D
N
1
2
3
-B-
0.25(0.010)
C A
M
B S
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45
o
C
H
0.25(0.010)
B
M
M
M14.15
(JEDEC MS-012-AB ISSUE C)
14 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.3367
0.3444
8.55
8.75
3
E
0.1497
0.1574
3.80
4.00
4
e
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N
14
14
7
0
o
8
o
0
o
8
o
-
Rev. 0 12/93
10
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (321) 724-7000
FAX: (321) 724-7240
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
ASIA
Intersil (Taiwan) Ltd.
7F-6, No. 101 Fu Hsing North Road
Taipei, Taiwan
Republic of China
TEL: (886) 2 2716 9310
FAX: (886) 2 2715 3029
HA4314B
Shrink Small Outline Plastic Packages (SSOP)
INDEX
AREA
E
D
N
1
2
3
-B-
0.17(0.007)
C A
M
B S
e
-A-
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45
o
C
H
0.25(0.010)
B
M
M
L
0.25
0.010
GAUGE
PLANE
A2
NOTES:
1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension "D" does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension "E" does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. "L" is the length of terminal for soldering to a substrate.
7. "N" is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension "B" does not include dambar protrusion. Allowable dambar
protrusion shall be 0.10mm (0.004 inch) total in excess of "B" dimen-
sion at maximum material condition.
10. Controlling dimension: INCHES. Converted millimeter dimensions are
not necessarily exact.
M16.15A
16 LEAD SHRINK NARROW BODY SMALL OUTLINE
PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.053
0.069
1.35
1.75
-
A1
0.004
0.010
0.10
0.25
-
A2
-
0.061
-
1.54
-
B
0.008
0.012
0.20
0.30
9
C
0.007
0.010
0.18
0.25
-
D
0.189
0.196
4.80
4.98
3
E
0.150
0.157
3.81
3.98
4
e
0.025 BSC
0.635 BSC
-
H
0.228
0.244
5.80
6.19
-
h
0.0099
0.0196
0.26
0.49
5
L
0.016
0.050
0.41
1.27
6
N
16
16
7
0
o
8
o
0
o
8
o
-
Rev. 0 5/96
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