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IRF9Z24NS/L
HEXFET
Power MOSFET
PD - 91742A
l
Advanced Process Technology
l
Surface Mount (IRF9Z24NS)
l
Low-profile through-hole (IRF9Z24NL)
l
175C Operating Temperature
l
P-Channel
l
Fast Switching
l
Fully Avalanche Rated
7/16/99
S
D
G
Parameter
Typ.
Max.
Units
R
JC
Junction-to-Case
3.3
R
JA
Junction-to-Ambient ( PCB Mounted,steady-state)**
40
Thermal Resistance
C/W
Parameter
Max.
Units
I
D
@ T
C
= 25C
Continuous Drain Current, V
GS
@ -10V
-12
I
D
@ T
C
= 100C
Continuous Drain Current, V
GS
@ -10V
-8.5
A
I
DM
Pulsed Drain Current
-48
P
D
@T
A
= 25C
Power Dissipation
3.8
W
P
D
@T
C
= 25C
Power Dissipation
45
W
Linear Derating Factor
0.30
W/C
V
GS
Gate-to-Source Voltage
20
V
E
AS
Single Pulse Avalanche Energy
96
mJ
I
AR
Avalanche Current
-7.2
A
E
AR
Repetitive Avalanche Energy
4.5
mJ
dv/dt
Peak Diode Recovery dv/dt
-5.0
V/ns
T
J
Operating Junction and
-55 to + 175
T
STG
Storage Temperature Range
C
Soldering Temperature, for 10 seconds
300 (1.6mm from case )
Absolute Maximum Ratings
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power MOSFETs
are well known for, provides the designer with an extremely
efficient and reliable device for use in a wide variety of
applications.
The D
2
Pak is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-
resistance in any existing surface mount package. The
D
2
Pak is suitable for high current applications because of
its low internal connection resistance and can dissipate
up to 2.0W in a typical surface mount application.
The through-hole version (IRF9Z24NL) is available for
low-profile applications.
Description
V
DSS
= -55V
R
DS(on)
= 0.175
I
D
= -12A
2
D P ak
T O -26 2
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1
IRF9Z24NS/L
2
www.irf.com
Starting T
J
= 25C, L = 3.7mH
R
G
= 25
, I
AS
= -7.2A. (See Figure 12)
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
Notes:
** When mounted on 1" square PCB (FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.
I
SD
-7.2A, di/dt
-280A/s, V
DD
V
(BR)DSS
,
T
J
175C
Pulse width
300s; duty cycle
2%.
Uses IRF9Z24N data and test conditions
Parameter
Min. Typ. Max. Units
Conditions
I
S
Continuous Source Current
MOSFET symbol
(Body Diode)
showing the
I
SM
Pulsed Source Current
integral reverse
(Body Diode)
p-n junction diode.
V
SD
Diode Forward Voltage
-1.6
V
T
J
= 25C, I
S
= -7.2A, V
GS
= 0V
t
rr
Reverse Recovery Time
47
71
ns
T
J
= 25C, I
F
= -7.2A
Q
rr
Reverse RecoveryCharge
84
130
nC
di/dt = -100A/s
t
on
Forward Turn-On Time
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
Source-Drain Ratings and Characteristics
A
S
D
G
Parameter
Min. Typ. Max. Units
Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage
-55
V
V
GS
= 0V, I
D
= -250A
V
(BR)DSS
/
T
J
Breakdown Voltage Temp. Coefficient
-0.05
V/C
Reference to 25C, I
D
= -1mA
R
DS(on)
Static Drain-to-Source On-Resistance
0.175
V
GS
= -10V, I
D
= -7.2A
V
GS(th)
Gate Threshold Voltage
-2.0
-4.0
V
V
DS
= V
GS
, I
D
= -250A
g
fs
Forward Transconductance
2.5
S
V
DS
= -25V, I
D
= -7.2A
-25
A
V
DS
= -55V, V
GS
= 0V
-250
V
DS
= -44V, V
GS
= 0V, T
J
= 150C
Gate-to-Source Forward Leakage
100
V
GS
= 20V
Gate-to-Source Reverse Leakage
-100
nA
V
GS
= -20V
Q
g
Total Gate Charge
19
I
D
= -7.2A
Q
gs
Gate-to-Source Charge
5.1
nC
V
DS
= -44V
Q
gd
Gate-to-Drain ("Miller") Charge
10
V
GS
= -10V, See Fig. 6 and 13
t
d(on)
Turn-On Delay Time
13
V
DD
= -28V
t
r
Rise Time
55
I
D
= -7.2A
t
d(off)
Turn-Off Delay Time
23
R
G
= 24
t
f
Fall Time
37
R
D
= 3.7
, See Fig. 10
Between lead,
and center of die contact
C
iss
Input Capacitance
350
V
GS
= 0V
C
oss
Output Capacitance
170
pF
V
DS
= -25V
C
rss
Reverse Transfer Capacitance
92
= 1.0MHz, See Fig. 5
Electrical Characteristics @ T
J
= 25C (unless otherwise specified)
I
GSS
ns
I
DSS
Drain-to-Source Leakage Current
nH
7.5
L
S
Internal Source Inductance
-12
-48
IRF9Z24NS/L
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3
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 2. Typical Output Characteristics
Fig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
1
1 0
1 0 0
0 . 1
1
1 0
1 0 0
D
D S
2 0 s P U LS E W ID T H
T = 2 5C
A
-I
,
D
r
a
i
n
-
t
o
-S
o
u
rc
e
C
u
rre
n
t
(A
)
-V , D rain -to-S ourc e V o ltage (V )
VGS
TO P - 15V
- 10V
- 8.0V
- 7.0V
- 6.0V
- 5.5V
- 5.0V
BOT TOM - 4.5V
-4.5 V
c
1
1 0
1 0 0
0.1
1
1 0
1 0 0
D
D S
A
-
I
,
Dr
ai
n
-
t
o
-
S
ou
r
c
e Cur
r
e
n
t
(
A
)
-V , D rain-to-S ource V oltage (V )
VGS
TOP - 15V
- 10V
- 8.0V
- 7.0V
- 6.0V
- 5.5V
- 5.0V
BOTTOM - 4.5V
-4 .5 V
2 0 s P U LS E W ID T H
T = 1 75 C
C
1
1 0
1 0 0
4
5
6
7
8
9
1 0
T = 25 C
J
G S
D
A
-
I
,
D
r
ai
n-
t
o
-
S
ourc
e
C
u
rr
ent
(
A
)
-V , Ga te -to-S ource V olta ge (V )
V = -2 5 V
2 0 s P U L S E W ID TH
DS
T = 1 7 5 C
J
0 . 0
0 . 5
1 . 0
1 . 5
2 . 0
- 6 0
- 4 0
- 2 0
0
2 0
4 0
6 0
8 0
1 0 0 1 2 0 1 4 0 1 6 0 1 8 0
J
T , Junction T em perature (C )
R
, D
r
a
i
n
-
to
-
S
o
u
r
c
e
O
n
R
e
s
i
s
ta
n
c
e
D
S
(
on)
(N
o
r
m
a
l
i
z
e
d
)
A
V = -1 0V
G S
I = -12 A
D
T
J
= 25C
T
J
= 175C
IRF9Z24NS/L
4
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Fig 8. Maximum Safe Operating Area
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
Fig 7. Typical Source-Drain Diode
Forward Voltage
0
4
8
1 2
1 6
2 0
0
5
1 0
1 5
2 0
2 5
G
GS
A
-
V
, G
a
te
-
t
o
-
S
o
u
r
c
e
V
o
l
t
a
g
e
(
V
)
Q , Total G ate C harge (nC )
F O R T E S T C IR C U IT
S E E F IG U R E 1 3
I = -7 .2 A
V = -44 V
V = -28 V
D
D S
D S
0 . 1
1
1 0
1 0 0
0 . 4
0 . 6
0 . 8
1 . 0
1 . 2
1 . 4
1 . 6
1 . 8
T = 2 5C
T = 15 0C
J
J
V = 0V
G S
S D
SD
A
-
I
,
Rev
er
s
e
D
r
a
i
n Cur
r
e
n
t
(
A
)
-V , S ourc e-to-D ra in V oltage (V )
1
1 0
1 0 0
1
1 0
1 0 0
O P E R A TIO N IN T H IS A R E A L IM IT E D
B Y R
D S (o n)
1 0 m s
A
-I
,
D
r
a
i
n
C
u
rre
n
t
(A
)
-V , D ra in -to -S o urc e V o lta g e (V )
D S
D
1 0 s
1 0 0 s
1 m s
T = 25 C
T = 17 5C
S ing le P u ls e
C
J
0
1 0 0
2 0 0
3 0 0
4 0 0
5 0 0
6 0 0
7 0 0
1
1 0
1 0 0
C
,
Cap
ac
i
t
a
n
c
e
(
p
F
)
D S
V , D rain-to-S ourc e V oltage (V )
A
V = 0V , f = 1M H z
C = C + C , C S H O R T E D
C = C
C = C + C
G S
is s g s g d d s
rs s g d
o ss d s gd
C
is s
C
os s
C
rs s
IRF9Z24NS/L
www.irf.com
5
Fig 10a. Switching Time Test Circuit
Fig 10b. Switching Time Waveforms
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
Fig 9. Maximum Drain Current Vs.
Case Temperature
V
DS
-10V
Pulse Width
1
s
Duty Factor
0.1 %
R
D
V
GS
V
DD
R
G
D.U.T.
+
-
V
DS
90%
10%
V
GS
t
d(on)
t
r
t
d(off)
t
f
0
3
6
9
1 2
2 5
5 0
7 5
1 0 0
1 2 5
1 5 0
1 7 5
C
T , C as e Tem peratu re (C )
A
-I
,
D
r
a
i
n
C
u
rre
n
t
(A
m
p
s
)
D
0 . 0 1
0 . 1
1
1 0
0 . 0 0 0 0 1
0 . 0 0 0 1
0 . 0 0 1
0 . 0 1
0 . 1
1
t , R e c ta n g u la r P u lse D u ra tio n (s e c )
1
th
J
C
D = 0 .5 0
0 .0 1
0 .0 2
0 .0 5
0 .1 0
0 .2 0
S IN G L E P U L S E
(T H E R M A L R E S P O N S E )
A
T
h
er
m
a
l
R
e
s
p
on
s
e
(
Z
)
P
t 2
1
t
D M
N o tes :
1 . D u ty f ac to r D = t / t
2 . P e a k T = P x Z + T
1
2
J
D M
th J C
C
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