IRFP27N60K
03/20/02
www.irf.com
1
PD - 94407
SMPS MOSFET
HEXFET
Power MOSFET
Parameter
Max.
Units
I
D
@ T
C
= 25C
Continuous Drain Current, V
GS
@ 10V
27
I
D
@ T
C
= 100C
Continuous Drain Current, V
GS
@ 10V
18
A
I
DM
Pulsed Drain Current
110
P
D
@T
C
= 25C
Power Dissipation
500
W
Linear Derating Factor
4.0
W/C
V
GS
Gate-to-Source Voltage
30
V
dv/dt
Peak Diode Recovery dv/dt
13
V/ns
T
J
Operating Junction and
-55 to + 150
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds
300
(1.6mm from case )
C
Mounting torqe, 6-32 or M3 screw
10 lbfin (1.1Nm)
Absolute Maximum Ratings
Symbol
Parameter
Typ.
Max.
Units
E
AS
Single Pulse Avalanche Energy
530
mJ
I
AR
Avalanche Current
27
A
E
AR
Repetitive Avalanche Energy
50
mJ
Avalanche Characteristics
Symbol
Parameter
Typ.
Max.
Units
R
JC
Junction-to-Case
0.29
R
CS
Case-to-Sink, Flat, Greased Surface
0.24
C/W
R
JA
Junction-to-Ambient
40
Thermal Resistance
l
Hard Switching Primary or PFC Switch
l
Switch Mode Power Supply (SMPS)
l
Uninterruptible Power Supply
l
High Speed Power Switching
l
Motor Drive
Benefits
Applications
l
Low Gate Charge Qg results in Simple
Drive Requirement
l
Improved Gate, Avalanche and Dynamic
dv/dt Ruggedness
l
Fully Characterized Capacitance and
Avalanche Voltage and Current
l
Enhanced Body Diode dv/dt Capability
TO-247AC
V
DSS
R
DS(on)
typ.
I
D
600V
180m
27A
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Symbol
Parameter
Min. Typ. Max. Units
Conditions
I
S
Continuous Source Current
MOSFET symbol
(Body Diode)
showing the
I
SM
Pulsed Source Current
integral reverse
(Body Diode)
p-n junction diode.
V
SD
Diode Forward Voltage
1.5
V
T
J
= 25C, I
S
= 27A, V
GS
= 0V
t
rr
Reverse Recovery Time
620
920
ns
T
J
= 25C, I
F
= 27A
Q
rr
Reverse RecoveryCharge
11
16
C
di/dt = 100A/s
I
RRM
Reverse RecoveryCurrent
36
53
A
t
on
Forward Turn-On Time
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
Symbol
Parameter
Min. Typ. Max. Units
Conditions
g
fs
Forward Transconductance
14
S
V
DS
= 50V, I
D
= 16A
Q
g
Total Gate Charge
180
I
D
= 27A
Q
gs
Gate-to-Source Charge
56
nC
V
DS
= 480V
Q
gd
Gate-to-Drain ("Miller") Charge
86
V
GS
= 10V, See Fig. 6 and 13
t
d(on)
Turn-On Delay Time
27
V
DD
= 300V
t
r
Rise Time
110
I
D
= 27A
t
d(off)
Turn-Off Delay Time
43
R
G
= 4.3
t
f
Fall Time
38
V
GS
= 10V,See Fig. 10
C
iss
Input Capacitance
4660
V
GS
= 0V
C
oss
Output Capacitance
460
V
DS
= 25V
C
rss
Reverse Transfer Capacitance
41
pF
= 1.0MHz, See Fig. 5
C
oss
Output Capacitance
5490
V
GS
= 0V, V
DS
= 1.0V, = 1.0MHz
C
oss
Output Capacitance
120
V
GS
= 0V, V
DS
= 480V, = 1.0MHz
C
oss
eff.
Effective Output Capacitance
250
V
GS
= 0V, V
DS
= 0V to 480V
Dynamic @ T
J
= 25C (unless otherwise specified)
ns
S
D
G
Diode Characteristics
27
110
A
Symbol
Parameter
Min. Typ. Max. Units
Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage
600
V
V
GS
= 0V, I
D
= 250A
V
(BR)DSS
/
T
J
Breakdown Voltage Temp. Coefficient
0.64
V/C
Reference to 25C, I
D
= 1mA
R
DS(on)
Static Drain-to-Source On-Resistance
180
220
m
V
GS
= 10V, I
D
= 16A
V
GS(th)
Gate Threshold Voltage
3.0
5.0
V
V
DS
= V
GS
, I
D
= 250A
50
A
V
DS
= 600V, V
GS
= 0V
250
V
DS
= 480V, V
GS
= 0V, T
J
= 125C
Gate-to-Source Forward Leakage
100
V
GS
= 30V
Gate-to-Source Reverse Leakage
-100
nA
V
GS
= -30V
Static @ T
J
= 25C (unless otherwise specified)
I
GSS
I
DSS
Drain-to-Source Leakage Current
Repetitive rating; pulse width limited by
max. junction temperature. (See Fig. 11)
I
SD
27A, di/dt
390A/s, V
DD
V
(BR)DSS
,
T
J
150C.
Notes:
Starting T
J
= 25C, L = 1.4mH, R
G
= 25
,
I
AS
= 27A, dv/dt = 13V/ns. (See Figure 12a)
Pulse width
300s; duty cycle
2%.
C
oss
eff. is a fixed capacitance that gives the same charging time
as C
oss
while V
DS
is rising from 0 to 80% V
DSS.
IRFP27N60K
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3
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 2. Typical Output Characteristics
Fig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
0.1
1
10
100
VDS, Drain-to-Source Voltage (V)
0.01
0.1
1
10
100
I D
, Drain-to-Source Current (A)
5.0V
20s PULSE WIDTH
Tj = 150C
VGS
TOP 15V
12V
10V
8.0V
7.0V
6.0V
5.5V
BOTTOM 5.0V
5.0
7.0
9.0
11.0
13.0
15.0
VGS, Gate-to-Source Voltage (V)
0.01
0.10
1.00
10.00
100.00
1000.00
I D
, Drain-to-Source Current
(
)
TJ = 25C
TJ = 150C
VDS = 100V
20s PULSE WIDTH
-60
-40
-20
0
20
40
60
80
100
120
140
160
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
T , Junction Temperature
( C)
R , Drain-to-Source On Resistance
(Normalized)
J
DS(on)
V
=
I
=
GS
D
10V
28A
0.1
1
10
100
VDS, Drain-to-Source Voltage (V)
0.001
0.01
0.1
1
10
100
1000
I D
, Drain-to-Source Current (A)
5.0V
20s PULSE WIDTH
Tj = 25C
VGS
TOP 15V
12V
10V
8.0V
7.0V
6.0V
5.5V
BOTTOM 5.0V
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Fig 8. Maximum Safe Operating Area
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
Fig 7. Typical Source-Drain Diode
Forward Voltage
1
10
100
1000
VDS, Drain-to-Source Voltage (V)
10
100
1000
10000
100000
C, Capacitance(pF)
Coss
Crss
Ciss
VGS = 0V, f = 1 MHZ
Ciss = Cgs + Cgd, Cds SHORTED
Crss = Cgd
Coss = Cds + Cgd
0
30
60
90
120
150
0
2
5
7
10
12
Q , Total Gate Charge (nC)
V , Gate-to-Source Voltage (V)
G
GS
I
=
D
28A
V
= 120V
DS
V
= 300V
DS
V
= 480V
DS
0.1
1
10
100
1000
0.2
0.5
0.8
1.1
1.4
V ,Source-to-Drain Voltage (V)
I , Reverse Drain Current (A)
SD
SD
V = 0 V
GS
T = 150 C
J
T = 25 C
J
10
100
1000
10000
VDS , Drain-toSource Voltage (V)
0.1
1
10
100
1000
I D
, Drain-to-Source Current (A)
Tc = 25C
Tj = 150C
Single Pulse
1msec
10msec
OPERATION IN THIS AREA
LIMITED BY RDS(on)
100sec
IRFP27N60K
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5
Fig 10a. Switching Time Test Circuit
V
DS
90%
10%
V
GS
t
d(on)
t
r
t
d(off)
t
f
Fig 10b. Switching Time Waveforms
V
DS
Pulse Width
1
s
Duty Factor
0.1 %
R
D
V
GS
R
G
D.U.T.
10V
+
-
V
DD
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
Fig 9. Maximum Drain Current Vs.
Case Temperature
25
50
75
100
125
150
0
5
10
15
20
25
30
T , Case Temperature
( C)
I , Drain Current (A)
C
D
0.001
0.01
0.1
1
0.00001
0.0001
0.001
0.01
0.1
1
Notes:
1. Duty factor D =
t / t
2. Peak T
= P
x Z
+ T
1
2
J
DM
thJC
C
P
t
t
DM
1
2
t , Rectangular Pulse Duration (sec)
Thermal Response
(Z )
1
thJC
0.01
0.02
0.05
0.10
0.20
D = 0.50
SINGLE PULSE
(THERMAL RESPONSE)
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