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Электронный компонент: RG4BC10UD

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Parameter
Max.
Units
V
CES
Collector-to-Emitter Voltage
600
V
I
C
@ T
C
= 25C
Continuous Collector Current
8.5
I
C
@ T
C
= 100C
Continuous Collector Current
5.0
I
CM
Pulsed Collector Current
34
A
I
LM
Clamped Inductive Load Current
34
I
F
@ T
C
= 100C
Diode Continuous Forward Current
4.0
I
FM
Diode Maximum Forward Current
16
V
GE
Gate-to-Emitter Voltage
20
V
P
D
@ T
C
= 25C
Maximum Power Dissipation
38
P
D
@ T
C
= 100C
Maximum Power Dissipation
15
T
J
Operating Junction and
-55 to +150
T
STG
Storage Temperature Range
C
Soldering Temperature, for 10 sec.
300 (0.063 in. (1.6mm) from case)
Mounting Torque, 6-32 or M3 Screw.
10 lbfin (1.1 Nm)
IRG4BC10UD
INSULATED GATE BIPOLAR TRANSISTOR WITH
ULTRAFAST SOFT RECOVERY DIODE
E
G
n - ch a n n e l
C
V
CES
= 600V
V
CE(on) typ.
=
2.15V
@V
GE
= 15V, I
C
= 5.0A
t
f
(typ.) = 140ns
UltraFast CoPack IGBT
9/2/97
Absolute Maximum Ratings
PRELIMINARY
PD -9.1677A
W
TO-220AB
Features
UltraFast: Optimized for high operating
up to 80 kHz in hard switching, >200 kHz in
resonant mode
Generation 4 IGBT design provides tighter
parameter distribution and higher efficiency than
previous Generation
IGBT co-packaged with HEXFRED
TM
ultrafast,
ultra-soft-recovery anti-parallel diodes for use in
bridge configurations
Industry standard TO-220AB package
Benefits
Generation 4 IGBT's offer highest efficiencies
available
IGBT's optimized for specific application conditions
HEXFRED diodes optimized for performance with
IGBT's . Minimized recovery characteristics require
less/no snubbing
Parameter
Min.
Typ.
Max.
Units
R
JC
Junction-to-Case - IGBT
--
--
3.3
R
JC
Junction-to-Case - Diode
--
--
7.0
C/W
R
CS
Case-to-Sink, flat, greased surface
--
0.50
--
R
JA
Junction-to-Ambient, typical socket mount
--
--
80
Wt
Weight
--
2 (0.07)
--
g (oz)
Thermal Resistance
IRG4BC10UD
Parameter
Min. Typ. Max. Units
Conditions
Q
g
Total Gate Charge (turn-on)
--
15
22
I
C
= 5.0A
Qge
Gate - Emitter Charge (turn-on)
--
2.6
4.0
nC
V
CC
= 400V
See Fig. 8
Q
gc
Gate - Collector Charge (turn-on)
--
5.8
8.7
V
GE
= 15V
t
d(on)
Turn-On Delay Time
--
40
--
T
J
= 25C
t
r
Rise Time
--
16
--
ns
I
C
= 5.0A, V
CC
= 480V
t
d(off)
Turn-Off Delay Time
--
87
130
V
GE
= 15V, R
G
= 100
t
f
Fall Time
--
140
210
Energy losses include "tail" and
E
on
Turn-On Switching Loss
--
0.14
--
diode reverse recovery.
E
off
Turn-Off Switching Loss
--
0.12
--
mJ
See Fig. 9, 10, 18
E
ts
Total Switching Loss
--
0.26 0.33
t
d(on)
Turn-On Delay Time
--
38
--
T
J
= 150C, See Fig. 11, 18
t
r
Rise Time
--
18
--
ns
I
C
= 5.0A, V
CC
= 480V
t
d(off)
Turn-Off Delay Time
--
95
--
V
GE
= 15V, R
G
= 100
t
f
Fall Time
--
250
--
Energy losses include "tail" and
E
ts
Total Switching Loss
--
0.45
--
mJ
diode reverse recovery.
L
E
Internal Emitter Inductance
--
7.5
--
nH
Measured 5mm from package
C
ies
Input Capacitance
--
270
--
V
GE
= 0V
C
oes
Output Capacitance
--
21
--
pF
V
CC
= 30V
See Fig. 7
C
res
Reverse Transfer Capacitance
--
3.5
--
= 1.0MHz
t
rr
Diode Reverse Recovery Time
--
28
42
ns
T
J
= 25C See Fig.
--
38
57
T
J
= 125C 14 I
F
= 4.0A
I
rr
Diode Peak Reverse Recovery Current
--
2.9
5.2
A
T
J
= 25C See Fig.
--
3.7
6.7
T
J
= 125C 15 V
R
= 200V
Q
rr
Diode Reverse Recovery Charge
--
40
60
nC
T
J
= 25C See Fig.
--
70
105
T
J
= 125C 16 di/dt = 200A/s
di
(rec)M
/dt
Diode Peak Rate of Fall of Recovery
--
280
--
A/s
T
J
= 25C See Fig.
During t
b
--
235
--
T
J
= 125C 17
Parameter
Min. Typ. Max. Units
Conditions
V
(BR)CES
Collector-to-Emitter Breakdown Voltage
600
--
--
V
V
GE
= 0V, I
C
= 250A
V
(BR)CES
/
T
J
Temperature Coeff. of Breakdown Voltage
--
0.54
--
V/C
V
GE
= 0V, I
C
= 1.0mA
V
CE(on)
Collector-to-Emitter Saturation Voltage
--
2.15
2.6
I
C
= 5.0A
V
GE
= 15V
--
2.61
--
V
I
C
= 8.5A
See Fig. 2, 5
--
2.30
--
I
C
= 5.0A, T
J
= 150C
V
GE(th)
Gate Threshold Voltage
3.0
--
6.0
V
CE
= V
GE
, I
C
= 250A
V
GE(th)
/
T
J
Temperature Coeff. of Threshold Voltage
--
-8.7
--
mV/C V
CE
= V
GE
, I
C
= 250A
g
fe
Forward Transconductance
2.8
4.2
--
S
V
CE
= 100V, I
C
= 5.0A
I
CES
Zero Gate Voltage Collector Current
--
--
250
A
V
GE
= 0V, V
CE
= 600V
--
--
1000
V
GE
= 0V, V
CE
= 600V, T
J
= 150C
V
FM
Diode Forward Voltage Drop
--
1.5
1.8
V
I
C
= 4.0A
See Fig. 13
--
1.4
1.7
I
C
= 4.0A, T
J
= 125C
I
GES
Gate-to-Emitter Leakage Current
--
--
100
nA
V
GE
= 20V
Switching Characteristics @ T
J
= 25C (unless otherwise specified)
Electrical Characteristics @ T
J
= 25C (unless otherwise specified)
Details of note
through
are on the last page
IRG4BC10UD
0.1
1
10
100
0
1
2
3
4
5
6
7
f, Frequency (KHz)
LOAD CURRENT (A)
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = I
RMS
of fundamental)
Fig. 2 - Typical Output Characteristics
Fig. 3 - Typical Transfer Characteristics
For both:
Duty c yc le: 50%
T = 125 C
T = 90C
G ate driv e a s spec ified
si nk
J
Power Diss ipation = W
9.2
1
10
100
5
6
7
8
9
10
11
12
13
14
V , Gate-to-Emitter Voltage (V)
I , Collector-to-Emitter Current (A)
GE
C
V = 50V
5s PULSE WIDTH
CC
T = 25 C
J
o
T = 150 C
J
o
60% of rated
voltage
I
Id e al d io de s
Sq uare wav e :
0.1
1
10
100
1
10
V , Collector-to-Emitter Voltage (V)
I , Collector-to-Emitter Current (A)
CE
C
V = 15V
20s PULSE WIDTH
GE
T = 25 C
J
o
T = 150 C
J
o
IRG4BC10UD
Fig. 6 - Maximum Effective Transient Thermal Impedance, Junction-to-Case
Fig. 5 - Typical Collector-to-Emitter Voltage
vs. Junction Temperature
Fig. 4 - Maximum Collector Current vs. Case
Temperature
-60 -40 -20
0
20
40
60
80 100 120 140 160
1.0
2.0
3.0
4.0
5.0
T , Junction Temperature ( C)
V , Collector-to-Emitter Voltage(V)
J
CE
V = 15V
80 us PULSE WIDTH
GE
I = A
2.5
C
I = A
5
C
I = A
10
C
25
50
75
100
125
150
0
2
4
6
8
10
T , Case Temperature ( C)
Maximum DC Collector Current(A)
C
5.0 A
0.01
0.1
1
10
0.00001
0.0001
0.001
0.01
0.1
1
Notes:
1. Duty factor D =
t / t
2. Peak T = P
x Z
+ T
1
2
J
DM
thJC
C
P
t
t
DM
1
2
t , Rectangular Pulse Duration (sec)
Thermal Response (Z )
1
thJC
0.01
0.02
0.05
0.10
0.20
D = 0.50
SINGLE PULSE
(THERMAL RESPONSE)
IRG4BC10UD
50
60
70
80
90
100
0.20
0.25
0.30
R , Gate Resistance (Ohm)
Total Switching Losses (mJ)
G
V = 480V
V = 15V
T = 25 C
I = 5.0A
CC
GE
J
C
Fig. 9 - Typical Switching Losses vs. Gate
Resistance
Fig. 10 - Typical Switching Losses vs.
Junction Temperature
-60 -40 -20
0
20
40
60
80
100 120 140 160
0.01
0.1
1
10
T , Junction Temperature ( C )
Total Switching Losses (mJ)
J
R = Ohm
V = 15V
V = 480V
G
GE
CC
I = A
10
C
I = A
5
C
I = A
2.5
C
100
R
G
, Gate Resistance (
)
Fig. 7 - Typical Capacitance vs.
Collector-to-Emitter Voltage
Fig. 8 - Typical Gate Charge vs.
Gate-to-Emitter Voltage
0
4
8
12
16
0
4
8
12
16
20
Q , Total Gate Charge (nC)
V , Gate-to-Emitter Voltage (V)
G
GE
V
= 400V
I
= 5.0A
CC
C
1
10
100
0
100
200
300
400
500
V , Collector-to-Emitter Voltage (V)
C, Capacitance (pF)
CE
V
C
C
C
=
=
=
=
0V,
C
C
C
f = 1MHz
+ C
+ C
C SHORTED
GE
ies
ge
gc ,
ce
res
gc
oes
ce
gc
Cies
Coes
Cres
5.0A