SPEC NO: DSAC1071
REV NO: V.2
DATE:DEC/29/2002
PAGE: 1 OF 4
APPROVED: J.LU
CHECKED:Allen Liu
DRAWN:S.J.HOU
Package Dimensions
3.0x1.0 mm SMD CHIP LED LAMP
Features
!
3.0mmx1.0mm SMT LED, 2.0mm THICKNESS.
!
LOW POWER CONSUMPTION.
!
WIDE VIEWING ANGLE.
!
IDEAL FOR BACK LIGHT AND INDICATOR.
!
VARIOUS COLORS AND LENS TYPES AVAILABLE.
!
PACKAGE : 2000PCS / REEL.
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.15(0.006") unless otherwise noted.
3. Specifications are subject to change without notice.
APA3010MGC MEGA GREEN
Description
The Mega Green source color devices are
made with DH InGaAlP on GaAs substrate
Light Emitting Diode.
SPEC NO: DSAC1071
REV NO: V.2
DATE:DEC/29/2002
PAGE: 2 OF 4
APPROVED: J.LU
CHECKED:Allen Liu
DRAWN:S.J.HOU
Electrical / Optical Characteristics at T
A
=25
C
Absolute Maximum Ratings at T
A
=25
C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Selection Guide
Note:
1.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
.
o
N
t
r
a
P
.
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N
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r
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.
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)
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c
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(
v
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)
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c
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(
v
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)
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c
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(
v
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)
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c
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(
v
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)
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c
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v
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A
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0
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.
p
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T
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T
2
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1
2 2
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1
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1
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T
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6
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8
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p
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a
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a
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s
ti
n
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s
ti
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=
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/
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6
2
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0
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=
C
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c
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a
ti
c
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r
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a
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0
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p
V
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1
=
f;
V
0
=
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tl
o
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.
2
5
.
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=
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0
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V
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V
5
=
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w
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5
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1
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m
t
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C
d
r
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w
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C
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0
3
A
m
]
1
[
t
n
e
r
r
u
C
d
r
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w
r
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a
e
P
0
5
1
A
m
e
g
a
tl
o
V
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s
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R
5
V
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r
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t
a
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p
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a
r
o
t
S
/
g
n
it
a
r
e
p
O
0
4
-
5
8
+
o
T
C
C
SPEC NO: DSAC1071
REV NO: V.2
DATE:DEC/29/2002
PAGE: 4 OF 4
APPROVED: J.LU
CHECKED:Allen Liu
DRAWN:S.J.HOU
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
APA3010MGC
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
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