SPEC NO:DSAC1638
REV NO: V.1
DATE: DEC/15/2002
PAGE: 1 OF 5
APPROVED:J.LU
CHECKED: Joe Lee
DRAWN: L.ZHANG
SURFACE MOUNT DISPLAY
Package Dimensions
& Internal Circuit Diagram
Features
!
0.3 INCH DIGIT HEIGHT.
!
LOW CURRENT OPERATION.
!
EXCELLENT CHARACTER APPEARANCE.
!
I.C. COMPATIBLE.
!
MECHANICALLY RUGGED.
!
GRAY FACE,WHITE SEGMENT.
!
PACKAGE: 800PCS/REEL.
APBC03-41SYKWA SUPER BIRHGT YELLOW
Notes:
1. All dimensions are in millimeters (inches), Tolerance is
0.25(0.01")unless otherwise noted.
2. Specifications are subject to change whitout notice.
Description
The Super Bright Yellow source color devices are made
with DH InGaAlP on GaAs substrate Light Emitting
Diode.
Digitally signed by Nenuphar
cn=Nenuphar, ou=d3e, o=display, c=CN
Date: 2002.12.15 18:24:25 +08'00'
Reason: Document is certified
SPEC NO: DSAC1638
REV NO: V.1
DATE: DEC/15/2002
PAGE: 2 OF 5
APPROVED:J.LU
CHECKED: Joe Lee
DRAWN: L.ZHANG
Electrical / Optical Characteristics at T
)
=25
C
Absolute Maximum Ratings at T
)
=25
C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Selection Guide
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
.
p
y
T .
p
y
T .
p
y
T .
p
y
T .
p
y
T
.
x
a
M .
x
a
M .
x
a
M .
x
a
M .
x
a
M
s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
k
a
e
p
h
t
g
n
e
l
e
v
a
W
k
a
e
P
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
0
9
5
m
n
I
F
A
m
0
2
=
D
h
t
g
n
e
l
e
v
a
W
e
t
a
n
i
m
o
D
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
0
9
5
m
n
I
F
A
m
0
2
=
2
/
1
h
t
d
i
w
-f
l
a
H
e
n
i
L
l
a
rt
c
e
p
S
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
0
2
m
n
I
F
A
m
0
2
=
C
e
c
n
a
ti
c
a
p
a
C
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
0
2
F
p
V
F
z
H
M
1
=
f;
V
0
=
V
F
e
g
a
tl
o
V
d
r
a
w
r
o
F
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
0
.
2
5
.
2
V
I
F
A
m
0
2
=
I
R
t
n
e
rr
u
C
e
s
r
e
v
e
R
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
0
1
A
u
V
R
V
5
=
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
w
o
ll
e
Y
t
h
g
ir
B
r
e
p
u
S
s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U
n
o
it
a
p
i
s
s
i
d
r
e
w
o
P
5
2
1
W
m
t
n
e
rr
u
C
d
r
a
w
r
o
F
C
D
0
3
A
m
]
1
[
t
n
e
rr
u
C
d
r
a
w
r
o
F
k
a
e
P
5
7
1
A
m
e
g
a
tl
o
V
e
s
r
e
v
e
R
5
V
e
r
u
t
a
r
e
p
m
e
T
e
g
a
r
o
t
S
/
g
n
it
a
r
e
p
O
0
4
-
5
8
+
o
T
C
C
.
o
N
t
r
a
P
.
o
N
t
r
a
P
.
o
N
t
r
a
P
.
o
N
t
r
a
P
.
o
N
t
r
a
P
e
c
i
D e
c
i
D e
c
i
D e
c
i
D e
c
i
D
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
)
d
c
u
(
v
I
)
d
c
u
(
v
I
)
d
c
u
(
v
I
)
d
c
u
(
v
I
)
d
c
u
(
v
I
A
m
0
1
@
n
o
it
p
ir
c
s
e
D
n
o
it
p
ir
c
s
e
D
n
o
it
p
ir
c
s
e
D
n
o
it
p
ir
c
s
e
D
n
o
it
p
ir
c
s
e
D
.
n
i
M .
n
i
M .
n
i
M .
n
i
M .
n
i
M
.
p
y
T .
p
y
T .
p
y
T .
p
y
T .
p
y
T
A
W
K
Y
S
1
4
-
3
0
C
B
P
A
)
P
l
A
a
G
n
I(
W
O
L
L
E
Y
T
H
G
I
R
B
R
E
P
U
S
D
E
S
U
F
F
I
D
E
T
I
H
W
0
0
0
8
0
0
4
5
3
.t
R
,
e
d
o
h
t
a
C
n
o
m
m
o
C
l
a
m
i
c
e
D
d
n
a
H
SPEC NO: DSAC1638
REV NO: V.1
DATE: DEC/15/2002
PAGE: 4 OF 5
APPROVED:J.LU
CHECKED: Joe Lee
DRAWN: L.ZHANG
Recommended Soldering Pattern
(Units : mm)
APBC03-41SYKWA
SMT Reflow Soldering Instruction
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
PDF 
ZIP
