ChipFind - документация

Электронный компонент: APCA03-41PWFA

Скачать:  PDF   ZIP
SPEC NO: DSAD1497
REV NO: V.1
DATE: APR/14/2003 PAGE: 1 OF 4
APPROVED: J. Lu
CHECKED: Joe Lee
DRAWN: K.ZHANG
APCA03-41PWFA WHITE
Package Dimensions& Internal Circuit Diagram
SURFACE MOUNT DISPLAY
Features
!
0.3INCH DIGIT HEIGHT.
!
LOW CURRENT OPERATION.
!
EXCELLENT CHARACTER APPEARANCE.
!
I.C. COMPATIBLE.
!
MECHANICALLY RUGGED.
!
GRAY FACE,YELLOW FLUORESCENT SEGMENT.
!
PACKAGE : 800PCS / REEL.
Notes:
1. All dimensions are in millimeters (inches), Tolerance is
0.25(0.01")unless otherwise noted.
2. Specifications are subject to change without notice.
Description
The source color devices are made with InGaN on SiC
Light Emitting Diode.
WHITE(PB)
SPEC NO: DSAD1497
REV NO: V.1
DATE: APR/14/2003 PAGE: 2 OF 4
APPROVED: J. Lu
CHECKED: Joe Lee
DRAWN: K.ZHANG
Electrical / Optical Characteristics at T
)
=25


C
Absolute Maximum Ratings at T
)
=25


C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Selection Guide
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
.
p
y
T .
p
y
T .
p
y
T .
p
y
T .
p
y
T
.
x
a
M .
x
a
M .
x
a
M .
x
a
M .
x
a
M
s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
V
F
e
g
a
tl
o
V
d
r
a
w
r
o
F
e
ti
h
W
5
6
.
3
2
.
4
V
I
F
A
m
0
2
=
I
R
t
n
e
rr
u
C
e
s
r
e
v
e
R
e
ti
h
W
0
1
A
u
V
R
V
5
=
X
s
e
t
a
n
i
d
r
o
o
C
y
ti
c
it
a
m
o
r
h
C
e
ti
h
W
3
3
.
0
Y
4
3
.
0
C
e
c
n
a
ti
c
a
p
a
c
e
ti
h
W
5
6
F
p
V
F
z
H
M
1
=
f,
V
0
=
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
e
ti
h
W e
ti
h
W e
ti
h
W e
ti
h
W e
ti
h
W
s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U
n
o
it
a
p
i
s
s
i
d
r
e
w
o
P
2
0
1
W
m
t
n
e
r
r
u
C
d
r
a
w
r
o
F
C
D
0
3
A
m
]
1
[
t
n
e
r
r
u
C
d
r
a
w
r
o
F
k
a
e
P
0
6
1
A
m
e
g
a
tl
o
V
e
s
r
e
v
e
R
5
V
e
r
u
t
a
r
e
p
m
e
T
e
g
a
r
o
t
S
/
g
n
it
a
r
e
p
O
0
4
-
5
8
+
o
T
C
C
.
o
N
t
r
a
P
.
o
N
t
r
a
P
.
o
N
t
r
a
P
.
o
N
t
r
a
P
.
o
N
t
r
a
P
e
c
i
D e
c
i
D e
c
i
D e
c
i
D e
c
i
D
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
)
d
c
u
(
v
I
)
d
c
u
(
v
I
)
d
c
u
(
v
I
)
d
c
u
(
v
I
)
d
c
u
(
v
I
A
m
0
2
@
n
o
it
p
ir
c
s
e
D
n
o
it
p
ir
c
s
e
D
n
o
it
p
ir
c
s
e
D
n
o
it
p
ir
c
s
e
D
n
o
it
p
ir
c
s
e
D
.
n
i
M .
n
i
M .
n
i
M .
n
i
M .
n
i
M
.
p
y
T .
p
y
T .
p
y
T .
p
y
T .
p
y
T
A
F
W
P
1
4
-
3
0
A
C
P
A
)
N
a
G
n
I(
E
T
I
H
W
T
N
E
C
S
E
R
O
U
L
F
W
O
L
L
E
Y
0
0
0
6
3
0
0
0
4
9
d
n
a
H
.t
R
,
e
d
o
n
A
n
o
m
m
o
C
l
a
m
i
c
e
D
SPEC NO: DSAD1497
REV NO: V.1
DATE: APR/14/2003 PAGE: 3 OF 4
APPROVED: J. Lu
CHECKED: Joe Lee
DRAWN: K.ZHANG
White APCA03-41PWFA
APCA03-41PWFA
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
SPEC NO: DSAD1497
REV NO: V.1
DATE: APR/14/2003 PAGE: 4 OF 4
APPROVED: J. Lu
CHECKED: Joe Lee
DRAWN: K.ZHANG
Recommended Soldering Pattern
(Units : mm)
Tape Specification
(Units : mm)