SPEC NO:DSAB2972
REV NO: V.4
DATE: APR/15/2003
PAGE: 1 OF 5
APPROVED :J. Lu
CHECKED :Joe Lee
DRAWN:D.H.FANG
APDA03-41CGKWA GREEN
Package Dimensions& Internal Circuit Diagram
SURFACE MOUNT DISPLAY
Features
l
0.3INCH DIGIT HEIGHT.
l
LOW CURRENT OPERATION.
l
EXCELLENT CHARACTER APPEARANCE.
l
I.C. COMPATIBLE
l
MECHANICALLY RUGGED.
l
GRAY FACE,WHITE SEGMENT.
l
PACKAGE:600PCS/REEL.
Description
The Green source color devices are made with
InGaAlP on GaAs substrate Light Emitting Diode.
Notes:
1. All dimensions are in millimeters (inches), Tolerance is
0.25(0.01")unless otherwise noted.
2. Specifications are subject to change without notice.
SPEC NO:DSAB2972
REV NO: V.4
DATE: APR/15/2003
PAGE: 2 OF 5
APPROVED :J. Lu
CHECKED :Joe Lee
DRAWN:D.H.FANG
Electrical / Optical Characteristics at T
A
=25
C
Absolute Maximum Ratings at T
A
=25
C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Selection Guide
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
ec
iD ec
iD ec
iD ec
iD ec
iD
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
)d
cu
(v
I
)d
cu
(v
I
)d
cu
(v
I
)d
cu
(v
I
)d
cu
(v
I
A
m
01
@
no
itp
irc
se
D
no
itp
irc
se
D
no
itp
irc
se
D
no
itp
irc
se
D
no
itp
irc
se
D
.ni
M .ni
M .ni
M .ni
M .ni
M
.p
yT .p
yT .p
yT .p
yT .p
yT
A
W
K
G
C
14
-3
0
A
D
P
A
)Pl
A
a
G
nI(
N
E
E
R
G
D
E
S
U
F
FI
D
E
TI
H
W
00
91
00
01
1
dn
a
H
.tR
,e
do
n
A
no
m
m
o
C
la
mi
ce
D
lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D
.p
yT .p
yT .p
yT .p
yT .p
yT
.x
a
M .x
a
M .x
a
M .x
a
M .x
a
M
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
ka
ep
ht
gn
el
ev
a
W
ka
e
P
ne
er
G
47
5
m
n
I
F
A
m
02
=
D
ht
gn
el
ev
a
W
et
an
im
o
D
ne
er
G
07
5
m
n
I
F
A
m
02
=
2/
1
ht
di
w-
fla
H
en
iL
lar
tc
ep
S
ne
er
G
02
m
n
I
F
A
m
02
=
C
ec
na
tic
ap
a
C
ne
er
G
51
F
p
V
F
z
H
M
1=
f;
V
0=
V
F
eg
atl
oV
dr
a
wr
oF
ne
er
G
1.
2
5.
2
V
I
F
A
m
02
=
I
R
tn
err
u
C
es
re
ve
R
ne
er
G
01
A
u
V
R
V
5
=
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ne
er
G ne
er
G ne
er
G ne
er
G ne
er
G
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
no
ita
pi
ss
id
re
w
o
P
50
1
W
m
tn
err
u
C
dr
a
wr
oF
C
D
03
A
m
]1[
tn
err
u
C
dr
a
wr
oF
ka
e
P
05
1
A
m
eg
atl
oV
es
re
ve
R
5
V
er
ut
ar
ep
m
eT
eg
ar
ot
S/
gn
ita
re
p
O
04
-
58
+
oT
C
C
SPEC NO:DSAB2972
REV NO: V.4
DATE: APR/15/2003
PAGE: 4 OF 5
APPROVED :J. Lu
CHECKED :Joe Lee
DRAWN:D.H.FANG
Recommended Soldering Pattern
(Units : mm)
APDA03-41CGKWA
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
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