SPEC NO: DSAB0337
REV NO: V.6
DATE:APR/04/2003
PAGE: 1 OF 4
APPROVED : J. Lu
CHECKED :Allen Liu
DRAWN: X.T.HU
Description
The Hyper Red source color devices are made with DH
InGaAlP on GaAs substrate Light Emitting Diode.
APED3820SURC HYPER RED
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.2(0.008") unless otherwise noted.
3. Specifications are subject to change without notice.
Package Dimensions
3.8x2.0mm DOME LENS SMD CHIP LED LAMP
Features
l
3.8mmx2.0mm SMT LED,3.2mm THICKNESS.
l
LOW POWER CONSUMPTION.
l
IDEAL FOR BACKLIGHT AND INDICATOR.
l
VARIOUS COLORS AND LENS TYPES AVAILABLE.
l
PACKAGE :500PCS / REEL.
SPEC NO: DSAB0337
REV NO: V.6
DATE:APR/04/2003
PAGE: 2 OF 4
APPROVED : J. Lu
CHECKED :Allen Liu
DRAWN: X.T.HU
Electrical / Optical Characteristics at T
A
=25
C
Absolute Maximum Ratings at T
A
=25
C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Selection Guide
Note:
1.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
ec
iD ec
iD ec
iD ec
iD ec
iD
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
A
m
02
@
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V elg
n
A
.ni
M .ni
M .ni
M .ni
M .ni
M
.p
yT .p
yT .p
yT .p
yT .p
yT
2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2
C
R
U
S
02
83
D
E
P
A
)PI
A
a
G
nI(
D
E
R
R
E
P
Y
H
R
A
E
L
C
R
E
T
A
W
08
1
00
5
06
)H
(
53
)V
(
lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D
.p
yT .p
yT .p
yT .p
yT .p
yT
.x
a
M .x
a
M .x
a
M .x
a
M .x
a
M
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
ka
ep
ht
gn
el
ev
a
W
ka
e
P
de
R
re
py
H
04
6
m
n
I
F
A
m
02
=
D
ht
gn
el
ev
a
W
et
an
im
o
D
de
R
re
py
H
82
6
m
n
I
F
A
m
02
=
2/
1
ht
di
w-
fla
H
en
iL
lar
tc
ep
S
de
R
re
py
H
72
m
n
I
F
A
m
02
=
C
ec
na
tic
ap
a
C
de
R
re
py
H
54
Fp
V
F
zH
M
1=
f;V
0=
V
F
eg
atl
oV
dr
a
wr
oF
de
R
re
py
H
9.
1
5.
2
V
I
F
A
m
02
=
I
R
tn
err
u
C
es
re
ve
R
de
R
re
py
H
01
Au
V
R
V5
=
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
de
R
re
py
H
de
R
re
py
H
de
R
re
py
H
de
R
re
py
H
de
R
re
py
H
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
no
ita
pi
ss
id
re
w
o
P
07
1
W
m
tn
err
u
C
dr
a
wr
oF
C
D
03
A
m
]1[
tn
err
u
C
dr
a
wr
oF
ka
e
P
58
1
A
m
eg
atl
oV
es
re
ve
R
5
V
er
ut
ar
ep
m
eT
eg
ar
ot
S/
gn
ita
re
p
O
04
-
58
+
oT
C
C
SPEC NO: DSAB0337
REV NO: V.6
DATE:APR/04/2003
PAGE: 4 OF 4
APPROVED : J. Lu
CHECKED :Allen Liu
DRAWN: X.T.HU
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
APED3820SURC
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
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