SPEC NO: DSAD1352
REV NO: V.1
DATE: MAR/29/2003
PAGE: 1 OF 4
APPROVED: J.Lu
CHECKED: Allen Liu
DRAWN: Z.Y.YANG
3.4mm SURFACE MOUNT LED
W1387QMP/EGW HIGH EFFICIENCY RED
GREEN
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.25(0.01") unless otherwise noted.
3. Specifications are subject to change without notice.
Package Dimensions
Features
l
SURFACE MOUNT TYPE.
l
I.C. COMPATIBLE.
l
BLACK CASE ENHANCES CONTRAST
l
WIDE VIEWING ANGLE.
l
HIGH RELIABILITY LIFE MEASURED IN YEARS.
l
PACKAGE: 1000PCS / REEL.
l
HOUSING MATERIAL: PPA
Description
The High Efficiency Red source color devices are made
with Gallium Arsenide Phosphide on Gallium Phosphide
Orange Light Emitting Diode.
The Green source color devices are made with Gallium
Phosphide Green Light Emitting Diode.
SPEC NO: DSAD1352
REV NO: V.1
DATE: MAR/29/2003
PAGE: 2 OF 4
APPROVED: J.Lu
CHECKED: Allen Liu
DRAWN: Z.Y.YANG
Selection Guide
Note:
1
.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at T
A
=25
C
Absolute Maximum Ratings at T
A
=25
C
lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D
.p
yT .p
yT .p
yT .p
yT .p
yT
.x
a
M .x
a
M .x
a
M .x
a
M .x
a
M
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
ka
ep
ht
gn
el
ev
a
W
ka
e
P
de
R
yc
ne
icif
fE
hg
iH nee
rG
72
6 56
5
m
n
I
F
A
m
02
=
D
ht
gn
el
ev
a
W
et
an
im
o
D
de
R
yc
ne
icif
fE
hg
iH nee
rG
52
6 86
5
m
n
I
F
A
m
02
=
2/
1
ht
di
w-
fla
H
en
iL
lar
tc
ep
S
de
R
yc
ne
icif
fE
hg
iH nee
rG
54
03
m
n
I
F
A
m
02
=
C
ec
na
tic
ap
a
C
de
R
yc
ne
icif
fE
hg
iH nee
rG
51
51
F
p
V
F
z
H
M
1=
f;
V
0=
V
F
eg
atl
oV
dr
a
wr
oF
de
R
yc
ne
icif
fE
hg
iH nee
rG
0.
2 2.
2
5.
2 5.
2
V
I
F
A
m
02
=
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
de
R
yc
ne
ici
ff
E
hg
iH
de
R
yc
ne
ici
ff
E
hg
iH
de
R
yc
ne
ici
ff
E
hg
iH
de
R
yc
ne
ici
ff
E
hg
iH
de
R
yc
ne
ici
ff
E
hg
iH
ne
er
G ne
er
G ne
er
G ne
er
G ne
er
G
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
no
ita
pi
ss
id
re
w
o
P
50
1
50
1
W
m
tn
err
u
C
dr
a
wr
oF
C
D
03
52
A
m
]1[
tn
err
u
C
dr
a
wr
oF
ka
e
P
06
1
04
1
A
m
er
ut
ar
ep
m
eT
eg
ar
ot
S/
gn
ita
re
p
O
04
-
58
+
oT
C
C
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
ec
iD ec
iD ec
iD ec
iD ec
iD
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
A
m
02
@
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V elg
n
A
.ni
M .ni
M .ni
M .ni
M .ni
M
.p
yT .p
yT .p
yT .p
yT .p
yT
2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2
W
G
E/
P
M
Q
78
31
W
)P
a
G/
Ps
A
a
G(
D
E
R
Y
C
N
EI
CI
F
F
E
H
GI
H
D
E
S
U
F
FI
D
E
TI
H
W
7
02
0
6
)P
a
G(
N
E
E
R
G
7
02
SPEC NO: DSAD1352
REV NO: V.1
DATE: MAR/29/2003
PAGE: 4 OF 4
APPROVED: J.Lu
CHECKED: Allen Liu
DRAWN: Z.Y.YANG
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
W1387QMP/EGW
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
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