SCOPE: CMOS, TTL-COMPATIBLE ANALOG MULTIPLEXER
Device Type Generic Number SMD Number Circuit Function
01
DG506AA(x)/883B 5962-8513107 Single 16-channel MUX/DEMUX
02
DG507AA(x)/883B 5962-8513108 Differential 8-channel MUX/DEMUX
03 DG509AA(x)/883B 5962-8513109 Differential 4-channel MUX/DEMUX
Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows:
Outline Letter Mil-Std-1835 Case Outline Package Code
Maxim SMD
Z 3 CQCC1-N28 28-Pin Ceramic LCC L28
Z 2 CQCC1-N20 20-Pin Ceramic LCC L20
Absolute Maximum Ratings
Voltage Referenced to V
-
V
+
to V
-
.............................................................................................................................. 44V
V
+
to GND ........................................................................................................................ +22V
V
-
to GND ......................................................................................................................... -25V
Digital Inputs, Overvoltage Range (V
A
, V
EN
) ......................................... (V
-
) -4V to (V
+
)+4V
or 20mA whichever comes first
Analog Inputs, Overvoltage Range (V
S
) ................................................ (V
-
) -2V to (V
+
)+2V
Continuous Current, S or D ............................................................................................. 20mA
Peak Current (Pulsed at 1ms, 10% duty cycle max) S or D............................................ 40mA
Lead Temperature (soldering, 10 seconds) ........................................................................ +300
C
Storage Temperature ........................................................................................... -65
C to +150
C
Continuous Power Dissipation .................................................................................... T
A
=
+
70
C
20 lead LCC (derate 9.1mW/
C above +70
C) ............................................................... 727mW
28 lead LCC (derate 10.2mW/
C above +70
C) ............................................................. 816mW
Junction Temperature T
J
.............................................................................................. +150
C
Thermal Resistance, Junction to Case,
JC:
Case Outline 20 lead LCC ............................................................................... 20
C/W
Case Outline 28 lead LCC ............................................................................... 15
C/W
Thermal Resistance, Junction to Ambient,
JA:
Case Outline 20 lead LCC ............................................................................. 110
C/W
Case Outline 28 lead LCC ............................................................................... 98
C/W
Recommended Operating Conditions.
Ambient Operating Range (T
A
) ..................................................................... -55
C to
+
125
C
Positive Supply Voltage (V+) ........................................................................................... +15V
Negative Supply Current (V-) ........................................................................................... -15V
V
AL
(max) .......................................................................................................................... 0.8V
V
AH
(min) .......................................................................................................................... 2.4V
V
EN
.................................................................................................................................... 2.4V
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
----------------------------
Electrical Characteristics of
DG506A/DG507A/DG509A/883B
19-0364
Rev. B
for SMD 5962-8513107/08/09
Page 2
of 6
TABLE 1. ELECTRICAL TESTS
TEST
Symbol
CONDITIONS
-55
C <=T
A
<= +125
C
V+=+15V, V-=-15V, GND=0V
V
EN
=2.4V
Unless otherwise specified
Group A
Subgroup
Device
type
Limits
Min
Limits
Max
Units
SWITCH
Input Leakage
Current NOTE 1
I
IH
I
IL
Measure address inputs sequentially,
connect all unused address inputs to
GND
1,2,3
All
1.0
1.0
A
Leakage Current
into the source
terminal of an
"OFF" switch
+I
S(OFF)
-I
S(OFF)
V
S
=+10V, V
EN
=0.8V, All unused
inputs=-10V, V
D
=-10V
V
S
=-10V, V
EN
=0.8V, All unused
inputs=+10V, V
D
=+10V
1,2,3
All
-10
-50
+10
+50
nA
Leakage Current
into the drain
terminal of an
"OFF" switch
+I
D(OFF)
-I
D(OFF)
V
D
=+10V, V
EN
=0.8V, All unused
inputs=-10V
V
D
=-10V, V
EN
=0.8V, All unused
inputs=+10V
1
2,3
2,3
2,3
All
01
02
03
-10
-300
-200
-100
+10
+300
+200
+100
nA
Leakage Current
from an "ON"
driver into the
switch (drain)
+I
D(ON)
-I
D(ON)
V
D
=+10V, V
S
=+10V, All unused
inputs=-10V
V
D
=-10V, V
S
=-10V, All unused
inputs=+10V
1
2,3
2,3
2,3
All
01
02
03
-10
-300
-200
-100
+10
+300
+200
+100
nA
Switch "ON"
Resistance
+
r
DS
(ON1)
V
S
=+10V, I
D
=-1mA
1
2,3
All
300
400
Switch ON
Resistance
-
r
DS(ON2)
V
S
=-10V, I
D
=+1mA
1
2,3
All
300
400
SUPPLY
Positive Supply
Current
I+
V
A
=0V, V
EN
=2.4V
1,2,3
01,02
03
3.0
2.4
mA
Negative Supply
Current
I-
V
A
=0V, V
EN
=2.4V
1,2,3
All
-1.0
mA
Standby Positive
Supply Current
+I
SBY
V
A
=0V, V
EN
=0V
1,2,3
01,02
03
3.0
2.4
mA
Standby Negative
Supply Current
-I
SBY
V
A
=0V, V
EN
=0V
1,2,3
All
-1.0
mA
DYNAMIC
Capacitance:
Address
C
A
V+=V-=0V, f=1MHz, NOTE 2
4
01,02
03
12
10
pF
Capacitance:
Output Switch
C
OS
V+=V-=0V, f=1MHz, NOTE 2
4
01
02
03
90
50
25
pF
Capacitance:
Input Switch
C
IS
V+=V-=0V, f=1MHz, NOTE 2
4
All
12 pF
Charge Transfer
Error
V
CTE
V
S
=GND. V
GEN
=0V to 5V, NOTE 2
7
All
10 mV
Off Isolation
V
ISO
V
EN
=0.8V, R
L
=1k
, f=100kHz,
C
L
=15pF, V
S
=7Vrms
7
All
-50 dB
Break-before-
make Time Delay
t
D
R
L
=1000
, C
L
=50pF, Figure 3
9
All
25
ns
----------------------------
Electrical Characteristics of
DG506A/DG507A/DG509A/883B
19-0364
Rev. B
for SMD 5962-8513107/08/09
Page 3
of 6
TABLE 1. ELECTRICAL TESTS
TEST
Symbol
CONDITIONS
-55
C <=T
A
<= +125
C
V+=+15V, V-=-15V, GND=0V
V
AH
=2.4V, V
AL
=0.8V
Unless otherwise specified
Group A
Subgroup
Device
type
Limits
Min
Limits
Max
Units
Propagation
Delay Times:
Address Inputs to
I/O Channels
t
ON(A)
t
OFF(A)
R
L
=10k
, C
L
=50pF
9
10,11
All
500
1000
ns
Enable to I/O
t
ON(EN)
t
OFF(EN)
R
L
=1000
, C
L
=50pF
9
10,11
All
500
1000
ns
NOTE 1: Input current of one input mode.
NOTE 2: Guaranteed, if not tested, to the limits specified.
FIGURE 3: Break-Before-Make Interval: See Commercial Datasheet.
TRUTH TABLE TERMINAL CONNECTION
A3
A2
A1
A0
EN
DG506A
Selected Channel
TERMINAL
NUMBER
01
DG506A
02
DG507A
03
DG509A
X
X
X
X
L
None
L28
L28
L20
L
L
L
L
H
1
1
V+
V+
NC
L
L
L
H
H
2
2
NC
DB
A0
L
L
H
L
H
3
3
NC
NC
EN
L
L
H
H
H
4
4
S16
S8B
V-
L
H
L
L
H
5
5
S15
S7B
IN 1A
L
H
L
H
H
6
6
S14
S6B
NC
L
H
H
L
H
7
7
S13
S5B
IN 2A
L
H
H
H
H
8
8
S12
S4B
IN 3A
H
L
L
L
H
9
9
S11
S3B
IN 4A
H
L
L
H
H
10
10
S10
S2B
OUT A
H
L
H
L
H
11
11
S9
S1B
NC
H
L
H
H
H
12
12
GND
GND
OUT B
H
H
L
L
H
13
13
NC
NC
IN 4B
H
H
L
H
H
14
14
A3
NC
IN 3B
H
H
H
L
H
15
15
A2
A2
IN 2B
H
H
H
H
H
16
16
A1
A1
NC
17
A0
A0
IN 1B
DG507A
18
EN
EN
V+
A2
A1
A0
EN
Selected Channel
19
S1
S1A
GND
X
X
X
L
None
20
S2
S2A
A1
L
L
L
H
1A, 1B
21
S3
S3A
L
L
H
H
2A, 2B
22
S4
S4A
L
H
L
H
3A, 3B
23
S5
S5A
L
H
H
H
4A, 4B
24
S6
S6A
H
L
L
H
5A, 5B
25
S7
S7A
H
L
H
H
6A, 5B
26
S8
S8A
H
H
L
H
7A, 7B
27
V-
V-
H
H
H
H
8A, 8B
28
D
DA
----------------------------
Electrical Characteristics of
DG506A/DG507A/DG509A/883B
19-0364
Rev. B
for SMD 5962-8513107/08/09
Page 4
of 6
TRUTH TABLE: DG509A
A1
A0
EN
CHANNEL SELECTED
X
X
L
NONE
L
L
H
1A, 1B
L
H
H
2A, 2B
H
L
H
3A, 3B
H
H
H
4A, 4B
ORDERING INFORMATION:
SMD NUMBER
PACKAGE CODE
DG506AAZ/883B
5962-85131073C
28 LCC
DG507AAZ/883B
5962-85131083C
28LCC
DG509AAZ/883B
5962-85131092C
20 LCC
QUALITY ASSURANCE
Sampling and inspection procedures shall be in accordance with MIL-Prf-38535, Appendix A as specified in Mil-
Std-883.
Screening shall be in accordance with Method 5004 of Mil-Std-883. Burn-in test Method 1015:
1. Test Condition, A, B, C, or D.
2. TA = +125
C minimum.
3. Interim and final electrical test requirements shall be specified in Table 2.
Quality conformance inspection shall be in accordance with Method 5005 of Mil-Std-883, including Groups A, B,
C, and D inspection.
Group A inspection:
1. Tests as specified in Table 2.
2. Selected subgroups in Table 1, Method 5005 of Mil-Std-883 shall be omitted.
Group C and D inspections:
a. End-point electrical parameters shall be specified in Table 1.
b. Steady-state life test, Method 1005 of Mil-Std-883:
1. Test condition A, B, C, D.
2. TA = +125
C, minimum.
3. Test duration, 1000 hours, except as permitted by Method 1005 of Mil-Std-883.
TABLE 2. ELECTRICAL TEST REQUIREMENTS
Mil-Std-883 Test Requirements
Subgroups
per Method 5005, Table 1
Interim Electric Parameters
Method 5004
1
Final Electrical Parameters
Method 5005
1*, 2, 3, 9
Group A Test Requirements
Method 5005
1, 2, 3, 4**,7, 9, 10***, 11***
Group C and D End-Point Electrical Parameters
Method 5005
1
* PDA applies to Subgroup 1 only.
** Subgroup 4 capacitance measurements shall be measured only for the initial test and after
process or design changes which may affect capacitance.
*** Subgroups 10 and 11, if not tested shall be guaranteed to the limits of Table 1.
----------------------------
Electrical Characteristics of
DG506A/DG507A/DG509A/883B
19-0364
Rev. B
for SMD 5962-8513107/08/09
Page 5
of 6
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