SCOPE: TRUE RMS-to-DC CONVERTER
Device Type Generic Number
01
MX536AS(x)/883B
Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows:
Outline Letter Mil-Std-1835 Case Outline Package Code
MAXIM SMD
Q C GDIP1-T14 or CDIP2-T14 14 LEAD CERDIP J14
D C GDIP1-T14 or CDIP2-T14 14 LEAD SIDEBRAZE D14
E 2 CQCC1-N20 or CQCC2-N20 20 Pin Leadless Chip Carrier L20
H I MACY1-X10 10 Pin Can, TO-100 H10
Absolute Maximum Ratings:
Supply Voltage ............................................................................................................
18V
Input Voltage ...............................................................................................................
25V
Output Short-Circuit Duration .............................................................................. Indefinite
Lead Temperature (soldering, 10 seconds) ....................................................................... +300
C
Storage Temperature .......................................................................................... -65
C to +150
C
Continuous Power Dissipation .................................................................................. T
A
=
+
70
C
14 pin CERDIP(derate 9.1mW/
C above +70
C) ........................................................... 727mW
14 pin Sidebraze(derate 10mW/
C above +70
C) .......................................................... 800mW
20 pin LCC(derate 9.1mW/
C above +70
C) ................................................................. 727mW
10 pin TO-100(derate 6.7mW/
C above +70
C) ............................................................. 533mW
Junction Temperature T
J
.............................................................................................. +150
C
Thermal Resistance, Junction to Case,
JC
14 pin CERDIP......................................................................................................... 55
C/W
14 pin Sidebraze ...................................................................................................... 45
C/W
20 pin LCC ............................................................................................................... 20
C/W
10 pin TO-100 .......................................................................................................... 45
C/W
Thermal Resistance, Junction to Ambient,
JA:
14 pin CERDIP....................................................................................................... 110
C/W
14 pin Sidebraze ..................................................................................................... 100
C/W
20 pin LCC ............................................................................................................. 110
C/W
10 pin TO-100 ........................................................................................................ 150
C/W
Recommended Operating Conditions
Ambient Operating Range (T
A
) .................................................................... -55
C to
+
125
C
Input Range (V
IN
) ............................................................................................................
15V
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
----------------------------
Electrical Characteristics of MX536AS/883B for
19-0052
Rev. C
/883B and SMD 5962-89805
Page 2 of
6
TABLE 1. ELECTRICAL TESTS:
TEST
Symbol
CONDITIONS
-55
C
T
A
+125
C
V
SS
=
15V
Unless otherwise specified
Group A
Subgroup
Device
type
Limits
Min
Limits
Max
Units
Total Error
E
r
V
IN
=
300mV to
10V
1
All
5 +
0.5
mV + %
of
reading
Total Error vs.
Temperature
E
T
/
T
1,2
3
All
0.3 +
0.005
0.1 +
0.005
mV + %
of
reading
/
C
Buffer-Output Offset
Voltage
V
OS
I
OUT
to BUFIN, V
IN
=0V
1
All
2.0 mV
Buffer-Output Offset
Drift
V
OS
/
T
I
OUT
to BUFIN, V
IN
=0V
2,3
All
0.2 mV/
C
Buffer-Output Voltage
Swing
V
OP
I
OUT
to BUFIN, VS=
15V
I
OUT
to BUFIN, VS=
5V
1
All
11
2
V
dB Output Error
E
dB
7mV
V
IN
7V
1
All
0.6 dB
IREF for 0dB=1VRMS
IREF
1
All
5
80
A
Internal Reference Range
IREF
1
All
1
100
A
Buffer-Input Offset
Voltage
V
OS
1
All
4.0 mV
Buffer-Input Bias Current
I
S
1
All
60 nA
Power Supply Range,
Dual Voltage
V
S
1
All
-18
+18 V
Power Supply Range,
Single Voltage
V
S
1
All
36 V
Quiescent Current
I
Q
5V
VS
18V
1,2,3
All
2 mA
----------------------------
Electrical Characteristics of MX536AS/883B for
19-0052
Rev. C
/883B and SMD 5962-89805
Page 3 of
6
QUALITY ASSURANCE
Sampling and inspection procedures shall be in accordance with MIL-Prf-38535, Appendix A as specified in Mil-
Std-883.
Screening shall be in accordance with Method 5004 of Mil-Std-883. Burn-in test Method 1015:
1. Test Condition, A, B, C, or D.
2. TA = +125
C minimum.
3. Interim and final electrical test requirements shall be specified in Table 2.
Quality conformance inspection shall be in accordance with Method 5005 of Mil-Std-883, including Groups A, B,
C, and D inspection.
Group A inspection:
1. Tests as specified in Table 2.
2. Selected subgroups in Table 1, Method 5005 of Mil-Std-883 shall be omitted.
Group C and D inspections:
a. End-point electrical parameters shall be specified in Table 1.
b. Steady-state life test, Method 1005 of Mil-Std-883:
1. Test condition A, B, C, D.
2. TA = +125
C, minimum.
3. Test duration, 1000 hours, except as permitted by Method 1005 of Mil-Std-883.
TABLE 2. ELECTRICAL TEST REQUIREMENTS
Mil-Std-883 Test Requirements
Subgroups
per Method 5005, Table 1
Interim Electric Parameters
Method 5004
1
Final Electrical Parameters
Method 5005
1*, 2, 3
Group A Test Requirements
Method 5005
1, 2, 3
Group C and D End-Point Electrical Parameters
Method 5005
1
* PDA applies to Subgroup 1 only.
----------------------------
Electrical Characteristics of MX536AS/883B
19-0052
Rev. C
for /883B and SMD 5962-89805
Page 5 of
6
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