SCOPE: CMOS, 12-BIT BUFFERED, MULTIPLYING D/A CONVERTER
Device Type Generic Number
01
MX7545S(x)/883B
02 MX7545T(x)/883B
03
MX7545U(x)/883B
04 MX7545GU(x)/883B
Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows:
Outline Letter Mil-Std-1835 Case Outline Package Code
MAXIM SMD
Q R
GDIP1-T20 or CDIP2-T20 20 LEAD CERDIP J20
E 2 CQCC1-N20 20 LCC L20
Absolute Maximum Ratings:
V
REF
to GND ...................................................................................................... -0.3V, + 17V
Digital Input to DGND ....................................................................................... -0.3V to V
DD
V
RFB
to GND ..................................................................................................................
25V
V
REF
to GND ..................................................................................................................
25V
V
OUT1
to AGND ................................................................................................. -0.3V to V
DD
AGND to DGND ............................................................................................... -0.3V to V
DD
Lead Temperature (soldering, 10 seconds) ........................................................................ +300
C
Storage Temperature ........................................................................................... -65
C to +150
C
Continuous Power Dissipation .................................................................................. T
A
=
+
70
C
20 pin CERDIP(derate 11.1mW/
C above +70
C) ......................................................... 889mW
20 pin LCC(derate 9.1mW/
C above +70
C) ................................................................. 727mW
Junction Temperature T
J
.............................................................................................. +150
C
Thermal Resistance, Junction to Case,
JC
20 pin CERDIP.......................................................................................................... 40
C/W
20 pin LCC ............................................................................................................... 20
C/W
Thermal Resistance, Junction to Ambient,
JA:
20 pin CERDIP.......................................................................................................... 90
C/W
20 pin LCC ............................................................................................................. 110
C/W
Recommended Operating Conditions
Ambient Operating Range (T
A
) .................................................................... -55
C to
+
125
C
Supply Voltage Range ......................................................................................... +5V to +15V
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
----------------------------
Electrical Characteristics of MX7545/883B for
19-0277
Rev. C
SMD 5962-87702
Page 2 of
7
TABLE 1. ELECTRICAL TESTS:
TEST
Symbol
CONDITIONS
-55
C
T
A
+125
C 1/
Unless otherwise specified
Group A
Subgroup
Device
type
Limits
Min
Limits
Max
Units
Resolution NOTE 4
RES
V
DD
=+5V and +15V
All
12
Bits
Relative Accuracy
RA
V
DD
=+5V and +15V
1,2,3
01
02
03,04
2.0
1.0
0.5
LSB
Differential Nonlinearity
DNL
10-bit monotonic, V
DD
=+5V and
+15V
12-bit monotonic, V
DD
=+5V and
+15V
1,2,3
01
02,03,
04
4.0
1.0
LSB
Gain Error NOTE 3
AE
V
DD
=5V
1,2,3
1
2,3
1
2,3
01
02
03
04
20
10
5.0
6.0
1.0
2.0
LSB
Gain Error NOTE 3
AE
V
DD
=15V
1,2,3
1
2,3
01
02
03
04
25
15
10
6.0
7.0
LSB
Gain Temperature
Coefficient NOTE 4
TC
AE
V
DD
=+5V
V
DD
=+15V
All
5
10
ppm/
C
Power Supply Rejection
PSRR
V
DD
=
5%, V
DD
=5V
V
DD
=
5%, V
DD
=15V
1
2,3
1
2,3
All
0.015
0.03
0.01
0.02
%/%
Out1 Leakage Current
I
OUT1
V
DD
=+5V & +15V, ___ __
D0-D11=0V, WR=CS=0V
1
2,3
All
10
200
nA
Feedthrough Error
NOTE 4, NOTE 5
FTE
VREF=
10V, 10kHz sine wave
V
DD
=5V
VREF=
10V, 10kHz sine wave
V
DD
=15V
4,5,6
All
10 mVp-p
Input Resistance
R
IN
V
DD
=+5V and +15V
1,2,3
All
7
25 k
Digital Input High
Voltage
V
IH
V
DD
=+5V
V
DD
=+15V
1,2,3
All
2.4
13.5
V
Digital Input Low
Voltage
V
IL
V
DD
=+5V
V
DD
=+15V
1,2,3
All
0.8
1.5
V
----------------------------
Electrical Characteristics of MX7545/883B for
19-0277
Rev. C
SMD 5962-87702
Page 3 of
7
TEST
Symbol
CONDITIONS
-55
C
T
A
+125
C 1/
Unless otherwise specified
Group A
Subgroup
Device
type
Limits
Min
Limits
Max
Units
Digital Input Leakage
Current
I
IN
V
IN
=0V or V
DD
V
DD
=+5V or +15V
1
2,3
All
1.0
10
A
Digital Input Capacitance
NOTE 2, NOTE 6
C
IN
D0-D11, V
DD
=5V
___ __
WR, CS, V
DD
=5V
D0-D11, V
IN
=0V, V
DD
=15V
___ __
WR, CS, V
IN
=0V, V
DD
=15V
4
All
5
20
5
20
pF
Output Capacitance
NOTE 2, NOTE 6
C
OUT1
V
DD
=5V ___ __
D0-D11=0V, WR, CS=0V
V
DD
=5V ___ __
D0-D11=V
DD
, WR, CS=0V
V
DD
=15V ___ __
D0-D11=0V, WR, CS=0V
V
DD
=15V ___ __
D0-D11=V
DD
, WR, CS=0V
4
All
70
200
70
200
pF
Chip Select to Write-
Setup Time NOTE 7
t
CS
V
DD
=5V
V
DD
=15V
9,10,11
All
170
95
ns
Chip Select to Write-Hold
Time NOTE 7
t
CH
V
DD
=+5V and +15V
9,10,11
All
0
ns
Write Pulse Width NOTE
7
t
WR
t
CS
t
WR
, t
CH
0, V
DD
=+5V
t
CS
t
WR
, t
CH
0, V
DD
=15V
9,10,11
All
170
95
ns
Data-Setup Time
NOTE 7
t
DS
V
DD
=5V
V
DD
=15V
9,10,11
All
150
80
ns
Data-Hold Time NOTE 7
t
DH
V
DD
=+5V and +15V
9,10,11
All
5
ns
Supply Current
I
DD
All digital inputs V
IL
or V
IH
V
DD
=+5V and +15V
All digital inputs 0V or V
DD
V
DD
=+5V and +15V
1,2,3
1
2,3
All
2.0
100
500
mA
A
NOTE 1: V
DD
=+15V, V
OUT1
=0V; VREF=+10V, AGND=DGND, unless otherwise specified.
NOTE 2: These parameters may be guaranteed if not tested at 25
C to the limits specified in Table 1.
NOTE 3: Measured using internal feedback resistor and includes effect of 5ppm max gain TC.
NOTE 4: These parameters may be guaranteed if not tested over the full military temp range to the
limits specified in Table 1.
NOTE 5: Feedthrough error can be reduced by connecting the metal lid on the package to ground.
NOTE 6: Subgroup 4 (C
IN
measurement) shall be measured only for the initial test and after process
or design changes which may affect capacitance.
NOTE 7: Timing Diagram. See Commercial Datasheet.
----------------------------
Electrical Characteristics of MX7545/883B for
19-0277
Rev. C
SMD 5962-87702
Page 4 of
7
ORDERING INFORMATION:
Package
Pkg. Code
MAXIM PART #
SMD Number
01
20 pin CERDIP
J20
MX7545SQ/883B
5962-8770201RA
01
20 pin LCC
L20
MX7545SE/883B
5962-87702012C
02
20 pin CERDIP
J20
MX7545TQ/883B
5962-8770202RA
02
20 pin LCC
L20
MX7545TE/883B
5962-87702022C
03
20 pin CERDIP
J20
MX7545UQ/883B
5962-8770203RA
03
20 pin LCC
L20
MX7545UE/883B
5962-87702032C
04
20 pin CERDIP
J20
MX7545GUQ/883B
5962-8770204RA
04
20 pin LCC
L20
MX7545GUE/883B
5962-87702042C
TERMINAL CONNECTIONS:
J20 & L20
Pin
1
OUT1
2
AGND
3
DGND
4
D11(MSB)
5
D10
6
D9
7
D8
8
D7
9
D6
10
D5
11
D4
12
D3
13
D2
14
D1
15
D0(LSB)
16
__
CS
17
___
WR
18
V
DD
19
VREF
20
R
FB
----------------------------
Electrical Characteristics of MX7545/883B for
19-0277
Rev. C
SMD 5962-87702
Page 5 of
7
QUALITY ASSURANCE
Sampling and inspection procedures shall be in accordance with MIL-Prf-38535, Appendix A as specified in Mil-
Std-883.
Screening shall be in accordance with Method 5004 of Mil-Std-883. Burn-in test Method 1015:
1. Test Condition, A, B, C, or D.
2. TA = +125
C minimum.
3. Interim and final electrical test requirements shall be specified in Table 2.
Quality conformance inspection shall be in accordance with Method 5005 of Mil-Std-883, including Groups A, B,
C, and D inspection.
Group A inspection:
1. Tests as specified in Table 2.
2. Selected subgroups in Table 1, Method 5005 of Mil-Std-883 shall be omitted.
Group C and D inspections:
a. End-point electrical parameters shall be specified in Table 1.
b. Steady-state life test, Method 1005 of Mil-Std-883:
1. Test condition A, B, C, D.
2. TA = +125
C, minimum.
3. Test duration, 1000 hours, except as permitted by Method 1005 of Mil-Std-883.
TABLE 2. ELECTRICAL TEST REQUIREMENTS
Mil-Std-883 Test Requirements
Subgroups
per Method 5005, Table 1
Interim Electric Parameters
Method 5004
1
Final Electrical Parameters
Method 5005
1*, 2, 3
Group A Test Requirements
Method 5005
1, 2, 3, 4**, 5, 6, 9, 10***, 11***
Group C and D End-Point Electrical Parameters
Method 5005
1
* PDA applies to Subgroup 1 only.
** Subgroup 4 shall be tested at initial qualification and upon redesign. Sample size will
be 116 units.
*** Subgroups 10 and 11, if not tested shall be guaranteed to the specified limits of Table 1.
----------------------------
Electrical Characteristics of MX7545/883B for
19-0277
Rev. C
SMD 5962-87702
Page 6 of
7
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