2003 Microchip Technology Inc.

DS21710B-page 1

24AA08/24LC08B

Device Selection Table

Features

· Single supply with operation down to 1.8V
· Low power CMOS technology

- 1 mA active current typical
- 1 µA standby current typical (I-temp)

· Organized as 4 blocks of 256 bytes (4 x 256 x 8)
· 2-wire serial interface bus, I

CTM compatible

· Schmitt Trigger inputs for noise suppression
· Output slope control to eliminate ground bounce
· 100 kHz (<2.5V) and 400 kHz (

2.5V) compatibility

· Self-timed write cycle (including auto-erase)
· Page write buffer for up to 16 bytes
· 2 ms typical write cycle time for page write
· Hardware write protect for entire memory
· Can be operated as a serial ROM
· Factory programming (QTP) available
· ESD protection > 4,000V
· 1,000,000 erase/write cycles
· Data retention > 200 years
· 8-lead PDIP, SOIC, TSSOP and MSOP packages
· 5-lead SOT-23 package
· Standard and Pb-free finishes available
· Available for extended temperature ranges:

- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C

Description

The Microchip Technology Inc. 24AA08/24LC08B
(24XX08*) is a 8 Kbit Electrically Erasable PROM. The
device is organized as four blocks of 256 x 8-bit
memory with a 2-wire serial interface. Low voltage
design permits operation down to 1.8V, with standby
and active currents of only 1 µA and 1 mA,
respectively. The 24XX08 also has a page write capa-
bility for up to 16 bytes of data. The 24XX08 is available
in the standard 8-pin PDIP, surface mount SOIC,
TSSOP and MSOP packages and is also available in
the 5-lead SOT-23 package.

Package Types

Block Diagram

Part

Number

Range

Max Clock

Frequency

Temp

Ranges

24AA08

1.8-5.5

400 kHz

(1)

24LC08B

2.5-5.5

400 kHz

I, E

Note 1:

100 kHz for V

<2.5V

24XX08

Vss

Vcc

SCL

SDA

PDIP/SOIC/TSSOP/MSOP

SOT-23-5

24XX08

SCL

Vss

SDA

Vcc

Note:

Pins A0, A1 and A2 are not used by the
24XX08. (No internal connections).

EEPROM

ARRAY

PAGE

YDEC

XDEC

SENSE AMP

MEMORY

CONTROL

LOGIC

I/O

CONTROL

LOGIC

I/O

SDA

SCL

R/W CONTROL

LATCHES

GENERATOR

8K I

CTM Serial EEPROM

*24XX08 is used in this document as a generic part number for the 24AA08/24LC08B devices.

24AA08/24LC08B

DS21710B-page 2

2003 Microchip Technology Inc.

1.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings

()

.............................................................................................................................................................................6.5V

All inputs and outputs w.r.t. V

......................................................................................................... -0.3V to V

+1.0V

Storage temperature ...............................................................................................................................-65°C to +150°C

Ambient temperature with power applied ................................................................................................-65°C to +125°C

ESD protection on all pins

...................................................................................................................................................... 4 kV

1.1

DC C

haracteristics

NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at those or any other conditions
above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.

DC CHARACTERISTICS

= +1.8V to +5.5V

Industrial (I): T

AMB

= -40°C to +85°C

Automotive (E): T

AMB

= -40°C to +125°C

Param.

No.

Symbol

Characteristic

Min

Typ

Max

Units

Conditions

WP, SCL and SDA pins

High level input voltage

0.7 V

Low level input voltage

0.3 V

HYS

Hysteresis of Schmitt
trigger inputs

0.05 V

(Note)

Low level output voltage

0.40

= 3.0 mA, V

= 2.5V

Input leakage current

±10

µA

=.1V to V

Output leakage current

±10

µA

OUT

=.1V to V

OUT

Pin capacitance
(all inputs/outputs)

= 5.0V (Note)

AMB

= 25°C, F

CLK

= 1 MHz

write Operating current

0.1

= 5.5V, SCL = 400 kHz

D10

read

0.05

D11

CCS

Standby current

--
--

0.01

1
5

µA

Industrial
Automotive
SDA = SCL = V

WP = V

Note:

This parameter is periodically sampled and not 100% tested.

2003 Microchip Technology Inc.

DS21710B-page 3

24AA08/24LC08B

1.2

AC C

haracteristics

AC CHARACTERISTICS

= +1.8V to +5.5V

Industrial (I):

AMB

= -40°C to +85°C

Automotive (E):

AMB

= -40°C to +125°C

Param.

No.

Symbol

Characteristic

Min

Typ

Max

Units

Conditions

CLK

Clock frequency

--
--

400
100

kHz

2.5V

5.5V

1.8V

< 2.5V (24AA08)

HIGH

Clock high time

600

4000

--
--

2.5V

5.5V

1.8V

< 2.5V (24AA08)

LOW

Clock low time

1300
4700

--
--

2.5V

5.5V

1.8V

< 2.5V (24AA08)

SDA and SCL rise time
(Note 1)

--
--

300

1000

2.5V

5.5V (Note 1)

1.8V

< 2.5V (24AA08)

(Note 1)

SDA and SCL fall time

--
--

300

(Note 1)

STA

START condition hold
time

600

4000

--
--

2.5V

5.5V

1.8V

< 2.5V (24AA08)

STA

START condition setup
time

600

4700

--
--

2.5V

5.5V

1.8V

< 2.5V (24AA08)

DAT

Data input hold time

--
--

(Note 2)

DAT

Data input setup time

100
250

--
--

2.5V

5.5V

1.8V

< 2.5V (24AA08)

STO

STOP condition setup
time

600

4000

--
--

2.5V

5.5V

1.8V

< 2.5V (24AA08)

Output valid from clock
(Note 2)

--
--

900

3500

2.5V

5.5V

1.8V

< 2.5V (24AA08)

BUF

Bus free time: Time the
bus must be free before
a new transmission can
start

1300
4700

--
--

2.5V

5.5V

1.8V

< 2.5V (24AA08)

Output fall time from V

minimum to V

maximum

20+0.1C

--
--

250
250

2.5V

5.5V

1.8V

< 2.5V (24AA08)

Input filter spike
suppression
(SDA and SCL pins)

(Notes 1 and 3)

Write cycle time (byte or
page)

Endurance

cycles 25°C, (Note 4)

Note 1:

Not 100% tested. C

= total capacitance of one bus line in pF.

As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of START or STOP
conditions.

The combined T

and V

HYS

specifications are due to new Schmitt Trigger inputs which provide improved

noise spike suppression. This eliminates the need for a

specification for standard operation.

This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total EnduranceTM Model which can be obtained on Microchip's web site:
www.microchip.com.

2003 Microchip Technology Inc.

DS21710B-page 5

24AA08/24LC08B

2.0

FUNCTIONAL DESCRIPTION

The 24XX08 supports a bi-directional, 2-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as a transmitter, while a device
receiving data is defined as a receiver. The bus has to
be controlled by a master device which generates the
serial clock (SCL), controls the bus access and gener-
ates the START and STOP conditions, while the
24XX08 works as slave. Both master and slave can
operate as transmitter or receiver, but the master
device determines which mode is activated.

3.0

BUS CHARACTERISTICS

The following bus protocol has been defined:

· Data transfer may be initiated only when the bus

is not busy.

· During data transfer, the data line must remain

stable whenever the clock line is HIGH. Changes
in the data line while the clock line is HIGH will be
interpreted as a START or STOP condition.

Accordingly, the following bus conditions have been
defined (Figure 3-1).

3.1

Bus not Busy (A)

Both data and clock lines remain HIGH.

3.2

Start Data Transfer (B)

A HIGH-to-LOW transition of the SDA line while the
clock (SCL) is HIGH determines a START condition. All
commands must be preceded by a START condition.

3.3

Stop Data Transfer (C)

A LOW-to-HIGH transition of the SDA line while the
clock (SCL) is HIGH determines a STOP condition. All
operations must be ended with a STOP condition.

3.4

Data Valid (D)

The state of the data line represents valid data when,
after a START condition, the data line is stable for the
duration of the HIGH period of the clock signal.

The data on the line must be changed during the LOW
period of the clock signal. There is one clock pulse per
bit of data.

Each data transfer is initiated with a START condition
and terminated with a STOP condition. The number of
the data bytes transferred between the START and
STOP conditions is determined by the master device
and is theoretically unlimited, although only the last
sixteen will be stored when doing a write operation.
When an overwrite does occur it will replace data in a
first-in first-out (FIFO) fashion.

3.5

Acknowledge

Each receiving device, when addressed, is obliged to
generate an acknowledge after the reception of each
byte. The master device must generate an extra clock
pulse which is associated with this Acknowledge bit.

The device that acknowledges, has to pull down the
SDA line during the acknowledge clock pulse in such a
way that the SDA line is stable LOW during the HIGH
period of the acknowledge related clock pulse. Of
course, setup and hold times must be taken into
account. During reads, a master must signal an end of
data to the slave by not generating an Acknowledge bit
on the last byte that has been clocked out of the slave.
In this case, the slave (24XX08) will leave the data line
HIGH to enable the master to generate the STOP
condition.

FIGURE 3-1:

DATA TRANSFER SEQUENCE ON THE SERIAL BUS

Note:

The 24XX08 does not generate any
Acknowledge bits if an internal program-
ming cycle is in progress.

SCL

SDA

(A)

(B)

(D)

(A)

(C)

START

CONDITION

ADDRESS OR

ACKNOWLEDGE

VALID

DATA

ALLOWED

TO CHANGE

STOP

CONDITION

24AA08/24LC08B

DS21710B-page 6

2003 Microchip Technology Inc.

3.6

Device Addressing

A control byte is the first byte received following the
START condition from the master device (Figure 3-1).
The control byte consists of a four-bit control code. For
the 24XX08,this is set as

1010

binary for read and

write operations. The next three bits of the control byte
are the block-select bits (B2, B1, B0). B2 is a `don't
care' for the 24XX08. They are used by the master
device to select which of the four 256 word-blocks of
memory are to be accessed. These bits are in effect the
three Most Significant bits of the word address.

The last bit of the control byte defines the operation to
be performed. When set to `

', a read operation is

selected. When set to `

' a write operation is selected.

Following the START condition, the 24XX08 monitors
the SDA bus checking the device type identifier being
transmitted and, upon receiving a

1010

code, the

slave device outputs an Acknowledge signal on the
SDA line. Depending on the state of the R/W bit, the
24XX08 will select a read or write operation.

FIGURE 3-1:

CONTROL BYTE

ALLOCATION

Operation

Control

Code

Block Select

R/W

Read

1010

Block Address

Write

1010

Block Address

R/W A

START

READ/WRITE

SLAVE ADDRESS

X = `Don't care'

2003 Microchip Technology Inc.

DS21710B-page 7

24AA08/24LC08B

4.0

WRITE OPERATION

4.1

Byte Write

Following the START condition from the master, the
device code (4 bits), the block address (3 bits) and the
R/W bit, which is a logic-LOW, is placed onto the bus
by the master transmitter. This indicates to the
addressed slave receiver that a byte with a word
address will follow once it has generated an Acknowl-
edge bit during the ninth clock cycle. Therefore, the
next byte transmitted by the master is the word address
and will be written into the address pointer of the
24XX08. After receiving another Acknowledge signal
from the 24XX08, the master device will transmit the
data word to be written into the addressed memory
location. The 24XX08 acknowledges again and the
master generates a STOP condition. This initiates the
internal write cycle and, during this time, the 24XX08
will not generate Acknowledge signals (Figure 4-1).

4.2

Page Write

The write-control byte, word address and the first data
byte are transmitted to the 24XX08 in the same way as
in a byte write. However, instead of generating a STOP
condition, the master transmits up to 16 data bytes to
the 24XX08, which are temporarily stored in the on-
chip page buffer and will be written into memory once
the master has transmitted a STOP condition. Upon
receipt of each word, the four lower-order address
pointer bits are internally incremented by `

'. The

higher-order 7 bits of the word address remain
constant. If the master should transmit more than 16
words prior to generating the STOP condition, the
address counter will roll over and the previously
received data will be overwritten. As with the byte write
operation, once the STOP condition is received an
internal write cycle will begin (Figure 4-2).

FIGURE 4-1:

BYTE WRITE

FIGURE 4-2:

PAGE WRITE

Note:

Page write operations are limited to writing
bytes within a single physical page,
regardless of the number of bytes
actually being written. Physical page
boundaries start at addresses that are
integer multiples of the page buffer size (or
`page-size') and end at addresses that are
integer multiples of [page size - 1]. If a
page write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page, as might be
expected. It is therefore necessary for the
application software to prevent page write
operations that would attempt to cross a
page boundary.

BUS ACTIVITY
MASTER

SDA LINE

BUS ACTIVITY

CONTROL

BYTE

WORD

ADDRESS

DATA

BUS ACTIVITY
MASTER

SDA LINE

BUS ACTIVITY

CONTROL

BYTE

WORD

ADDRESS (n)

DATA (n)

DATA (n + 15)

DATA (n + 1)

24AA08/24LC08B

DS21710B-page 8

2003 Microchip Technology Inc.

5.0

ACKNOWLEDGE POLLING

Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the STOP condition for a Write
command has been issued from the master, the device
initiates the internally-timed write cycle and ACK polling
can then be initiated immediately. This involves the
master sending a START condition followed by the
control byte for a Write command (R/W =

). If the

device is still busy with the write cycle, no ACK will be
returned. If the cycle is complete, the device will return
the ACK and the master can then proceed with the next
Read or Write command. See Figure 5-1 for a flow
diagram of this operation.

FIGURE 5-1:

ACKNOWLEDGE POLLING

FLOW

6.0

WRITE PROTECTION

The 24XX08 can be used as a serial ROM when the
WP pin is connected to V

. Programming will be

inhibited and the entire memory will be write protected.

Send

Write Command

Send STOP
Condition to

Initiate Write Cycle

Send Start

Send Control Byte

with R/W = 0

Did Device

Acknowledge

(ACK = 0)?

Operation

Yes

2003 Microchip Technology Inc.

DS21710B-page 9

24AA08/24LC08B

7.0

READ OPERATION

Read operations are initiated in the same way as write
operations, with the exception that the R/W bit of the
slave address is set to `

'. There are three basic types

of read operations: current address read, random read
and sequential read.

7.1

Current Address Read

The 24XX08 contains an address counter that main-
tains the address of the last word accessed, internally
incremented by `

'. Therefore, if the previous access

(either a read or write operation) was to address

, the

next current address read operation would access data
from address

n + 1

. Upon receipt of the slave address

with R/W bit set to `

', the 24XX08 issues an acknowl-

edge and transmits the 8-bit data word. The master will
not acknowledge the transfer but does generate a
STOP condition and the 24XX08 discontinues
transmission (Figure 7-1).

7.2

Random Read

Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, the word address must first
be set. This is accomplished by sending the word
address to the 24XX08 as part of a write operation.
Once the word address is sent, the master generates a
START condition following the acknowledge. This
terminates the write operation, but not before the inter-
nal address pointer is set. The master then issues the
control byte again, but with the R/W bit set to a `

'. The

24XX08 will then issue an acknowledge and transmit
the 8-bit data word. The master will not acknowledge
the transfer but does generate a STOP condition and
the 24XX08 will discontinue transmission (Figure 7-2).

7.3

Sequential Read

Sequential reads are initiated in the same way as a
random read, except that once the 24XX08 transmits
the first data byte, the master issues an acknowledge
as opposed to a STOP condition in a random read. This
directs the 24XX08 to transmit the next sequentially-
addressed 8-bit word (Figure 7-3).

To provide sequential reads, the 24XX08 contains an
internal address pointer that is incremented by one
upon completion of each operation. This address
pointer allows the entire memory contents to be serially
read during one operation.

7.4

Noise Protection

The 24XX08 employs a V

threshold detector circuit

which disables the internal erase/write logic if the V

is below 1.5V at nominal conditions.

The SCL and SDA inputs have Schmitt Trigger and
filter circuits which suppress noise spikes to assure
proper device operation, even on a noisy bus.

FIGURE 7-1:

CURRENT ADDRESS READ

BUS ACTIVITY
MASTER

SDA LINE

BUS ACTIVITY

CONTROL

BYTE

DATA (n)

R
T

2003 Microchip Technology Inc.

DS21710B-page 11

24AA08/24LC08B

8.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 8-1.

TABLE 8-1:

PIN FUNCTION TABLE

8.1

Serial Address/Data Input/Output
(SDA)

SDA is a bi-directional pin used to transfer addresses
and data into and out of the device. Since it is an open-
drain terminal, the SDA bus requires a pull-up resistor
to V

(typical 10 k

for 100 kHz, 2 k for 400 kHz).

For normal data transfer, SDA is allowed to change
only during SCL LOW. Changes during SCL HIGH are
reserved for indicating START and STOP conditions.

8.2

Serial Clock (SCL)

The SCL input is used to synchronize the data transfer
to and from the device.

8.3

Write Protect (WP)

The WP pin must be connected to either V

or V

If tied to V

, normal memory operation is enabled

(read/write the entire memory

00-03FFH

If tied to V

, WRITE operations are inhibited. The

entire memory will be write protected. Read operations
are not affected.

This feature allows the user to use the 24XX08 as a
serial ROM when WP is enabled (tied to V

8.4

A0, A1, A2

The A0, A1 and A2 pins are not used by the 24XX08.
They may be left floating or tied to either V

or V

Name

PDIP

SOIC

TSSOP

MSOP

SOT-23

Description

Not Connected

Ground

SDA

Serial Address/Data I/O

SCL

Serial Clock

Write Protect Input

+1.8V to 5.5V Power Supply

24AA08/24LC08B

DS21710B-page 12

2003 Microchip Technology Inc.

9.0

PACKAGING INFORMATION

9.1

Package Marking Information

8-Lead SOIC (150 mil)

Example:

XXXXXXXX
T/XXYYWW

NNN

24LC08B

I/SN0327

13F

5-Lead SOT-23

Example:

XXNN

M43F

Legend: XX...X Customer specific information*

Temperature grade (I, E)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week `01')

NNN

Alphanumeric traceability code

Note:

In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.

*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.

Device

TSSOP/MSOP

Marking Codes

STD

Pb-free

24AA08

4A08

G4A8

24LC08B

4L8B

G4L8

Device

SOT-23

Marking Codes

STD

Pb-free

24AA08

24LC08B-I

24LC08B-E

Note:

Pb-free part number using "G"
suffix is marked on carton

XXXXXXXX
T/XXXNNN

YYWW

8-Lead PDIP (300 mil)

Example:

24LC08B
I/P13F

0327

8-Lead TSSOP

Example:

8-Lead MSOP

Example:

XXXX

TYWW

NNN

XXXXXT

YWWNNN

4L08

I327

13F

4L08BI

Y32713F

2003 Microchip Technology Inc.

DS21710B-page 13

24AA08/24LC08B

8-Lead Plastic Dual In-line (P) 300 mil (PDIP)

Units

INCHES*

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

MIN

NOM

MAX

Number of Pins

Pitch

.100

2.54

Top to Seating Plane

.140

.155

.170

3.56

3.94

4.32

Molded Package Thickness

.115

.130

.145

2.92

3.30

3.68

Base to Seating Plane

.015

0.38

Shoulder to Shoulder Width

.300

.313

.325

7.62

7.94

8.26

Molded Package Width

.240

.250

.260

6.10

6.35

6.60

Overall Length

.360

.373

.385

9.14

9.46

9.78

Tip to Seating Plane

.125

.130

.135

3.18

3.30

3.43

Lead Thickness

.008

.012

.015

0.20

0.29

0.38

Upper Lead Width

.045

.058

.070

1.14

1.46

1.78

Lower Lead Width

.014

.018

.022

0.36

0.46

0.56

Overall Row Spacing

.310

.370

.430

7.87

9.40

10.92

Mold Draft Angle Top

Mold Draft Angle Bottom

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

JEDEC Equivalent: MS-001
Drawing No. C04-018

.010" (0.254mm) per side.

§ Significant Characteristic

24AA08/24LC08B

DS21710B-page 14

2003 Microchip Technology Inc.

8-Lead Plastic Small Outline (SN) Narrow, 150 mil (SOIC)

Foot Angle

Mold Draft Angle Bottom

Mold Draft Angle Top

0.51

0.42

0.33

.020

.017

.013

Lead Width

0.25

0.23

0.20

.010

.009

.008

Lead Thickness

0.76

0.62

0.48

.030

.025

.019

Foot Length

0.51

0.38

0.25

.020

.015

.010

Chamfer Distance

5.00

4.90

4.80

.197

.193

.189

Overall Length

3.99

3.91

3.71

.157

.154

.146

Molded Package Width

6.20

6.02

5.79

.244

.237

.228

Overall Width

0.25

0.18

0.10

.010

.007

.004

Standoff

1.55

1.42

1.32

.061

.056

.052

Molded Package Thickness

1.75

1.55

1.35

.069

.061

.053

Overall Height

1.27

.050

Pitch

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

45×

* Controlling Parameter

Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010" (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057

§ Significant Characteristic

2003 Microchip Technology Inc.

DS21710B-page 15

24AA08/24LC08B

8-Lead Plastic Thin Shrink Small Outline (ST) 4.4 mm (TSSOP)

Mold Draft Angle Bottom

Mold Draft Angle Top

0.30

0.25

0.19

.012

.010

.007

Lead Width

0.20

0.15

0.09

.008

.006

.004

Lead Thickness

0.70

0.60

0.50

.028

.024

.020

Foot Length

3.10

3.00

2.90

.122

.118

.114

Molded Package Length

4.50

4.40

4.30

.177

.173

.169

Molded Package Width

6.50

6.38

6.25

.256

.251

.246

Overall Width

0.15

0.10

0.05

.006

.004

.002

Standoff

0.95

0.90

0.85

.037

.035

.033

Molded Package Thickness

1.10

.043

Overall Height

0.65

.026

Pitch

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS*

INCHES

Units

Foot Angle

* Controlling Parameter

Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005" (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086

§ Significant Characteristic

24AA08/24LC08B

DS21710B-page 16

2003 Microchip Technology Inc.

8-Lead Plastic Micro Small Outline Package (MSOP)

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not

.037

.035

Footprint (Reference)

exceed .010" (0.254mm) per side.

Notes:

Drawing No. C04-111

*Controlling Parameter

Mold Draft Angle Top

Mold Draft Angle Bottom

Foot Angle

Lead Width

Lead Thickness

.004

.010

.006

.012

(F)

Dimension Limits

Overall Height

Molded Package Thickness

Molded Package Width

Overall Length

Foot Length

Standoff §

Overall Width

Number of Pins

Pitch

.016

.114

.022

.118

.002

.030

.193

.034

MIN

Units

.026

NOM

INCHES

1.00

0.95

0.90

.039

0.15

0.30

.008

.016

0.10

0.25

0.20

0.40

MILLIMETERS*

0.65

0.86

3.00

0.55

4.90

.044

.122

.028

.122

.038

.006

0.40

2.90

0.05

0.76

MIN

MAX

NOM

1.18

0.70

3.10

0.15

0.97

MAX

§ Significant Characteristic

.184

.200

4.67

.5.08

2003 Microchip Technology Inc.

DS21710B-page 17

24AA08/24LC08B

5-Lead Plastic Small Outline Transistor (OT) (SOT-23)

Mold Draft Angle Bottom

Mold Draft Angle Top

0.50

0.43

0.35

.020

.017

.014

Lead Width

0.20

0.15

0.09

.008

.006

.004

Lead Thickness

Foot Angle

0.55

0.45

0.35

.022

.018

.014

Foot Length

3.10

2.95

2.80

.122

.116

.110

Overall Length

1.75

1.63

1.50

.069

.064

.059

Molded Package Width

3.00

2.80

2.60

.118

.110

.102

Overall Width

0.15

0.08

0.00

.006

.003

.000

Standoff

1.30

1.10

0.90

.051

.043

.035

Molded Package Thickness

1.45

1.18

0.90

.057

.046

.035

Overall Height

1.90

.075

Outside lead pitch (basic)

0.95

.038

Pitch

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

* Controlling Parameter

Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010" (0.254mm) per side.
JEDEC Equivalent: MO-178
Drawing No. C04-091

§ Significant Characteristic

2003 Microchip Technology Inc.

DS21710B-page 19

24AA08/24LC08B

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office

Sales and Support

Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

Your local Microchip sales office

The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

PART NO.

/XX

Package

Temperature

Range

Device

24AA08:

= 1.8V, 16 Kbit I

C Serial EEPROM

24AA08T:

= 1.8V, 16 Kbit I

C Serial EEPROM

(Tape and Reel)

24LC08B: = 2.5V, 16 Kbit I

C Serial EEPROM

24LC08BT: = 2.5V, 16 Kbit I

C Serial EEPROM

(Tape and Reel)

Temperature
Range:

= -40°C to +85°C

= -40°C to +125°C

Package:

Plastic DIP (300 mil body), 8-lead

Plastic SOIC (150 mil body), 8-lead

Plastic TSSOP (4.4 mm), 8-lead

Plastic Micro Small Outline (MSOP), 8-lead

SOT-23, 5-lead (Tape and Reel only)

Lead Finish

Blank =

Standard 63% / 37% SnPb

Matte Tin (Pure Sn)

Examples:

24AA08-I/P: Industrial Temperature,1.8V,
PDIP package

24AA08-I/SN: Industrial Temperature,1.8V,
SOIC package

24AA08T-I/OT: Industrial Temperature,
1.8V, SOT-23 package, Tape and Reel

24LC08B-I/P: Industrial Temperature, 2.5V,
PDIP package

24LC08B-E/SN: Automotive Temp.,2.5V
SOIC package

24LC08BT-I/OT: Industrial Temperature,
2.5V, SOT-23 package, Tape and Reel

24LC08B-I/PG: Industrial Temperature,
2.5V, PDIP package, Pb-free

24LC08BT-I/SNG: Industrial Temperature,
2.5V, SOIC package, Tape and Reel,
Pb-free

Lead Finish

2003 Microchip Technology Inc.

DS21710B-page 21

Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip's products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,
K

, MPLAB, PIC, PICmicro, PICSTART, PRO MATE and

PowerSmart are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.

FilterLab, micro

ID, MXDEV, MXLAB, PICMASTER, SEEVAL

and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.

Accuron, Application Maestro, dsPICDEM, dsPICDEM.net,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-
Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
PICC, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo,
PowerMate, PowerTool, rfLAB, rfPIC, Select Mode,
SmartSensor, SmartShunt, SmartTel and Total Endurance are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.

Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their
respective companies.

Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:

Microchip products meet the specification contained in their particular Microchip Data Sheet.

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as "unbreakable."

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company's quality system processes and
procedures are QS-9000 compliant for its
PICmicro

8-bit MCUs, K

code hopping

devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip's quality system for the
design and manufacture of development
systems is ISO 9001 certified.

DS21710B-page 22

2003 Microchip Technology Inc.

AMERICAS

Corporate Office

2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com

Atlanta

3780 Mansell Road, Suite 130
Alpharetta, GA 30022
Tel: 770-640-0034 Fax: 770-640-0307

Boston

2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848 Fax: 978-692-3821

Chicago

333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: 630-285-0071 Fax: 630-285-0075

Dallas

4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423 Fax: 972-818-2924

Detroit

Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250 Fax: 248-538-2260

Kokomo

2767 S. Albright Road
Kokomo, IN 46902
Tel: 765-864-8360 Fax: 765-864-8387

Los Angeles

18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888 Fax: 949-263-1338

Phoenix

2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966 Fax: 480-792-4338

San Jose

Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950 Fax: 408-436-7955

Toronto

6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509

ASIA/PACIFIC

Australia

Microchip Technology Australia Pty Ltd
Marketing Support Division
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755

China - Beijing

Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
Bei Hai Wan Tai Bldg.
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100 Fax: 86-10-85282104

China - Chengdu

Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401-2402, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-86766200 Fax: 86-28-86766599

China - Fuzhou

Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506 Fax: 86-591-7503521

China - Hong Kong SAR

Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200 Fax: 852-2401-3431

China - Shanghai

Microchip Technology Consulting (Shanghai)
Co., Ltd.
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060

China - Shenzhen

Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Rm. 1812, 18/F, Building A, United Plaza
No. 5022 Binhe Road, Futian District
Shenzhen 518033, China
Tel: 86-755-82901380 Fax: 86-755-8295-1393

China - Qingdao

Rm. B505A, Fullhope Plaza,
No. 12 Hong Kong Central Rd.
Qingdao 266071, China
Tel: 86-532-5027355 Fax: 86-532-5027205

India

Microchip Technology Inc.
India Liaison Office
Marketing Support Division
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O'Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062

Japan

Microchip Technology Japan K.K.
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122

Korea

Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: 82-2-554-7200 Fax: 82-2-558-5934

Singapore

Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850

Taiwan

Microchip Technology (Barbados) Inc.,
Taiwan Branch
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139

EUROPE

Austria

Microchip Technology Austria GmbH
Durisolstrasse 2
A-4600 Wels
Austria
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393

Denmark

Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45-4420-9895 Fax: 45-4420-9910

France

Microchip Technology SARL
Parc d'Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79

Germany

Microchip Technology GmbH
Steinheilstrasse 10
D-85737 Ismaning, Germany
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44

Italy

Microchip Technology SRL
Via Quasimodo, 12
20025 Legnano (MI)
Milan, Italy
Tel: 39-0331-742611 Fax: 39-0331-466781

United Kingdom

Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44-118-921-5869 Fax: 44-118-921-5820

05/30/03

ORLDWIDE

ALES

AND

ERVICE

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: 24LC08B-I

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: 24LC08B-I