2006 Microchip Technology Inc.

Preliminary

DS21832C-page 1

25AA010A/25LC010A

Device Selection Table

Features:

· 10 MHz max. clock frequency

· Low-power CMOS technology:

- Max. Write Current: 5 mA at 5.5V, 10 MHz

- Read Current: 5 mA at 5.5V, 10 MHz

- Standby Current: 5

A at 5.5V

· 128 x 8-bit organization

· Write Page mode (up to 16 bytes)

· Sequential Read

· Self-timed Erase and Write cycles (5 ms max.)

· Block Write protection:

- Protect none, 1/4, 1/2 or all of array

· Built-in Write protection:

- Power-on/off data protection circuitry

- Write enable latch

- Write-protect pin

· High reliability:

- Endurance: 1,000,000 Erase/Write cycles

- Data retention: > 200 years

- ESD protection: > 4000V

· Temperature ranges supported:

· Pb-Free packages available

Pin Function Table

Description:

The Microchip Technology Inc. 25XX010A* is a 1 Kbit
Serial Electrically Erasable Programmable Read-Only
Memory (EEPROM). The memory is accessed via a
simple Serial Peripheral InterfaceTM (SPI) compatible
serial bus. The bus signals required are a clock input
(SCK) plus separate data in (SI) and data out (SO)
lines. Access to the device is controlled through a Chip
Select (CS) input.

Communication to the device can be paused via the
hold pin (HOLD). While the device is paused,
transitions on its inputs will be ignored, with the
exception of Chip Select, allowing the host to service
higher priority interrupts.

The 25XX010A is available in standard packages
including 8-lead PDIP and SOIC, and advanced
packages including 8-lead MSOP, 8-lead TSSOP and
rotated TSSOP, 8-lead 2x3 DFN, and 6-lead SOT-23.

Package Types (not to scale)

Part Number

Range

Page Size

Temp. Ranges

Packages

25AA010A

1.8-5.5V

16 Bytes

P, MS, SN, ST, MC, OT

25LC010A

2.5-5.5V

16 Bytes

I, E

P, MS, SN, ST, MC, OT

- Industrial (I):

-40

C to

+85

- Automotive (E):

-40

C to +125

Name

Function

Chip Select Input

Serial Data Output

Write-Protect

Ground

Serial Data Input

SCK

Serial Clock Input

HOLD

Hold Input

Supply Voltage

HOLD

SCK

(P, SN)

(OT)

PDIP/SOIC

X-Rotated TSSOP

HOLD

1
2
3
4

8
7
6
5

SCK
SI
V

(X/ST)

1
2
3
4

8
7
6
5

HOLD
SCK
SI

1
2
3
4

8
7
6
5

HOLD
SCK
SI

(ST, MS)

TSSOP/MSOP

SOT-23

SCK

HOLD

SCK

(MC)

DFN

1K SPI Bus Serial EEPROM

*25XX010A is used in this document as a generic part number for the

25AA010A and the 25LC010A.

25AA010A/25LC010A

DS21832C-page 2

Preliminary

2006 Microchip Technology Inc.

1.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings

()

.............................................................................................................................................................................6.5V

All inputs and outputs w.r.t. V

......................................................................................................... -0.6V to V

+1.0V

Storage temperature .................................................................................................................................-65°C to 150°C

Ambient temperature under bias ...............................................................................................................-40°C to 125°C

ESD protection on all pins .......................................................................................................................................... 4 kV

TABLE 1-1:

DC CHARACTERISTICS

NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for an
extended period of time may affect device reliability.

DC CHARACTERISTICS

Industrial (I):

= -40°C to +85°C

= 1.8V to 5.5V

Automotive (E):

= -40°C to +125°C

= 2.5V to 5.5V

Param.

No.

Sym.

Characteristic

Min.

Max.

Units

Test Conditions

D001

IH1

High-level Input
Voltage

0.7 V

D002

IL1

Low-level Input
Voltage

-0.3

0.3 V

2.7V (Note)

D003

IL2

-0.3

0.2 V

< 2.7V (Note)

D004

Low-level Output
Voltage

0.4

= 2.1 mA

D005

0.2

= 1.0 mA, V

< 2.5V

D006

High-level Output
Voltage

-0.5

= -400

D007

Input Leakage
Current

±1

CS = V

, V

= V

D008

Output Leakage
Current

±1

CS = V

, V

OUT

= V

D009

INT

Internal Capacitance
(all inputs and
outputs)

= 25°C, CLK = 1.0 MHz,

= 5.0V (Note)

D010

Read

Operating Current

2.5

= 5.5V; F

CLK

= 10.0 MHz;

SO = Open
V

= 2.5V; F

CLK

= 5.0 MHz;

SO = Open

D011

Write

--
--

5
3

mA
mA

= 5.5V

= 2.5V

D012

CCS

Standby Current

CS = V

= 5.5V, Inputs tied to V

, T

= +125°C

CS = V

= 2.5V, Inputs tied to V

, T

= +85°C

Note:

This parameter is periodically sampled and not 100% tested.

2006 Microchip Technology Inc.

Preliminary

DS21832C-page 3

25AA010A/25LC010A

TABLE 1-2:

AC CHARACTERISTICS

Industrial (I):

= -40°C to +85°C

= 1.8V to 5.5V

Automotive (E): T

= -40°C to +125°C

= 2.5V to 5.5V

Param.

No.

Sym.

Characteristic

Min.

Max.

Units

Test Conditions

CLK

Clock Frequency

--
--
--

5
3

MHz
MHz
MHz

4.5V

5.5V

2.5V

4.5V

1.8V

2.5V

CSS

CS Setup Time

100
150

--
--
--

ns
ns
ns

4.5V

5.5V

2.5V

4.5V

1.8V

2.5V

CSH

CS Hold Time

100
200
250

--
--
--

ns
ns
ns

4.5V

5.5V

2.5V

4.5V

1.8V

2.5V

CSD

CS Disable Time

Tsu

Data Setup Time

10
20
30

--
--
--

ns
ns
ns

4.5V

5.5V

2.5V

4.5V

1.8V

2.5V

Data Hold Time

20
40
50

--
--
--

ns
ns
ns

4.5V

5.5V

2.5V

4.5V

1.8V

2.5V

CLK Rise Time

(Note 1)

CLK Fall Time

(Note 1)

Clock High Time

0.05

0.1

0.15

1000
1000
1000

4.5V

5.5V

2.5V

4.5V

1.8V

2.5V

Clock Low Time

0.05

0.1

0.15

1000
1000
1000

4.5V

5.5V

2.5V

4.5V

1.8V

2.5V

CLD

Clock Delay Time

CLE

Clock Enable Time

Output Valid from Clock
Low

--
--
--

100
160

ns
ns
ns

4.5V

5.5V

2.5V

4.5V

1.8V

2.5V

Output Hold Time

(Note 1)

DIS

Output Disable Time

--
--
--

40
80

160

ns
ns
ns

4.5V

5.5V (Note 1)

2.5V

4.5V (Note 1)

1.8V

2.5V (Note 1)

HOLD Setup Time

20
40
80

--
--
--

ns
ns
ns

4.5V

5.5V

2.5V

4.5V

1.8V

2.5V

Note 1: This parameter is periodically sampled and not 100% tested.

2: This parameter is not tested but ensured by characterization. For endurance estimates in a specific

application, please consult the Total EnduranceTM Model which can be obtained from our web site:
www.microchip.com.

3: T

begins on the rising edge of CS after a valid write sequence and ends when the internal write cycle

is complete.

25AA010A/25LC010A

DS21832C-page 4

Preliminary

2006 Microchip Technology Inc.

TABLE 1-3:

AC TEST CONDITIONS

HOLD Hold Time

20
40
80

--
--
--

ns
ns
ns

4.5V

5.5V

2.5V

4.5V

1.8V

2.5V

HOLD Low to Output
High-Z

30
60

160

--
--
--

ns
ns
ns

4.5V

5.5V (Note 1)

2.5V

4.5V (Note 1)

1.8V

2.5V (Note 1)

HOLD High to Output
Valid

30
60

160

--
--
--

ns
ns
ns

4.5V

5.5V

2.5V

4.5V

1.8V

2.5V

Internal Write Cycle Time
(byte or page)

OTE

Endurance

E/W

Cycles

OTE

TABLE 1-2:

AC CHARACTERISTICS (CONTINUED)

AC CHARACTERISTICS

Industrial (I):

= -40°C to +85°C

= 1.8V to 5.5V

Automotive (E): T

= -40°C to +125°C

= 2.5V to 5.5V

Param.

No.

Sym.

Characteristic

Min.

Max.

Units

Test Conditions

Note 1: This parameter is periodically sampled and not 100% tested.

2: This parameter is not tested but ensured by characterization. For endurance estimates in a specific

application, please consult the Total EnduranceTM Model which can be obtained from our web site:
www.microchip.com.

3: T

begins on the rising edge of CS after a valid write sequence and ends when the internal write cycle

is complete.

AC Waveform:

= 0.2V

H I

= V

- 0.2V

(Note 1)

H I

= 4.0V

(Note 2)

= 100 pF

Timing Measurement Reference Level

Input

0.5 V

Output

0.5 V

Note 1: For V

4.0V

2: For V

4.0V

25AA010A/25LC010A

DS21832C-page 6

Preliminary

2006 Microchip Technology Inc.

2.0

FUNCTIONAL DESCRIPTION

2.1

Principles of Operation

The 25XX010A is a 128 byte Serial EEPROM designed
to interface directly with the Serial Peripheral Interface
(SPI) port of many of today's popular microcontroller
families, including Microchip's PICmicro

microcontrol-

lers. It may also interface with microcontrollers that do
not have a built-in SPI port by using discrete I/O lines
programmed properly in firmware to match the SPI
protocol.

The 25XX010A contains an 8-bit instruction register.
The device is accessed via the SI pin, with data being
clocked in on the rising edge of SCK. The CS pin must
be low and the HOLD pin must be high for the entire
operation.

Table 2-1 contains a list of the possible instruction
bytes and format for device operation. All instructions,
addresses, and data are transferred MSb first, LSb last.

Data (SI) is sampled on the first rising edge of SCK
after CS goes low. If the clock line is shared with other
peripheral devices on the SPI bus, the user can assert
the HOLD input and place the 25XX010A in `HOLD'
mode. After releasing the HOLD pin, operation will
resume from the point when the HOLD was asserted.

2.2

Read Sequence

The device is selected by pulling CS low. The 8-bit

READ

instruction is transmitted to the 25XX010A

followed by an 8-bit address. See Figure 2-1 for more
details.

After the correct

READ

instruction and address are sent,

the data stored in the memory at the selected address
is shifted out on the SO pin. Data stored in the memory
at the next address can be read sequentially by
continuing to provide clock pulses to the slave. The
internal Address Pointer automatically increments to
the next higher address after each byte of data is
shifted out. When the highest address is reached
(7Fh), the address counter rolls over to address 00h
allowing the read cycle to be continued indefinitely. The
read operation is terminated by raising the CS pin
(Figure 2-1).

2.3

Write Sequence

Prior to any attempt to write data to the 25XX010A, the
write enable latch must be set by issuing the

WREN

instruction (Figure 2-4). This is done by setting CS low
and then clocking out the proper instruction into the
25XX010A. After all eight bits of the instruction are
transmitted, CS must be driven high to set the write
enable latch. If the write operation is initiated immedi-
ately after the

WREN

instruction without CS driven high,

data will not be written to the array since the write
enable latch was not properly set.

After setting the write enable latch, the user may
proceed by driving CS low, issuing a

WRITE

instruction,

followed by the remainder of the address, and then the
data to be written. Up to 16 bytes of data can be sent to
the device before a write cycle is necessary. The only
restriction is that all of the bytes must reside in the
same page. Additionally, a page address begins with

XXXX 0000

and ends with

XXXX 1111

. If the internal

address counter reaches

XXXX 1111

and clock signals

continue to be applied to the chip, the address counter
will roll back to the first address of the page and over-
write any data that previously existed in those
locations.

For the data to be actually written to the array, the CS
must be brought high after the Least Significant bit (D0)
of the n

data byte has been clocked in. If CS is driven

high at any other time, the write operation will not be
completed. Refer to Figure 2-2 and Figure 2-3 for more
detailed illustrations on the byte write sequence and
the page write sequence, respectively. While the write
is in progress, the STATUS register may be read to
check the status of the WIP, WEL, BP1 and BP0 bits
(Figure 2-6). Attempting to read a memory array
location will not be possible during a write cycle. Polling
the WIP bit in the STATUS register is recommended in
order to determine if a write cycle is in progress. When
the write cycle is completed, the write enable latch is
reset.

Note:

Page write operations are limited to writing
bytes within a single physical page,
regardless of the number of bytes
actually being written. Physical page
boundaries start at addresses that are
integer multiples of the page buffer size (or
`page size') and, end at addresses that are
integer multiples of page size 1. If a
Page Write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page as might be
expected. It is therefore necessary for the
application software to prevent page write
operations that would attempt to cross a
page boundary.

2006 Microchip Technology Inc.

Preliminary

DS21832C-page 7

25AA010A/25LC010A

BLOCK DIAGRAM

FIGURE 2-1:

READ SEQUENCE

SCK

HOLD

STATUS

I/O Control

Memory

Control

Logic

Dec

HV Generator

EEPROM

Array

Page Latches

Y Decoder

Sense Amp.
R/W Control

Logic

TABLE 2-1:

INSTRUCTION SET

Instruction Name

Instruction Format

Description

READ

0000 x011

Read data from memory array beginning at selected address

WRITE

0000 x010

Write data to memory array beginning at selected address

WRDI

0000 x100

Reset the write enable latch (disable write operations)

WREN

0000 x110

Set the write enable latch (enable write operations)

RDSR

0000 x101

Read STATUS register

WRSR

0000 x001

Write STATUS register

= don't care

SCK

9 10 11

data out

high-impedance

Address byte

12 13 14 15 16 17 18 19 20 21 22 23

Instruction

2006 Microchip Technology Inc.

Preliminary

DS21832C-page 9

25AA010A/25LC010A

2.4

Write Enable (

WREN

) and Write

Disable (

WRDI

)

The 25XX010A contains a write enable latch. See
Table 2-4 for the Write-Protect Functionality Matrix.
This latch must be set before any write operation will be
completed internally. The

WREN

instruction will set the

latch, and the

WRDI

will reset the latch.

The following is a list of conditions under which the
write enable latch will be reset:

· Power-up

WRDI

instruction successfully executed

WRSR

instruction successfully executed

WRITE

instruction successfully executed

· WP pin is brought low

FIGURE 2-4:

WRITE ENABLE SEQUENCE (

WREN

)

FIGURE 2-5:

WRITE DISABLE SEQUENCE (

WRDI

)

SCK

high-impedance

SCK

high-impedance

25AA010A/25LC010A

DS21832C-page 10

Preliminary

2006 Microchip Technology Inc.

2.5

Read Status Register Instruction
(

RDSR

)

The Read Status Register instruction (

RDSR

) provides

access to the STATUS register. See Figure 2-6 for the

RDSR

timing sequence. The STATUS register may be

read at any time, even during a write cycle. The STA-
TUS register is formatted as follows:

TABLE 2-2:

STATUS REGISTER

The Write-In-Process (WIP) bit indicates whether the
25XX010A is busy with a write operation. When set to
a `

', a write is in progress, when set to a `

', no write

is in progress. This bit is read-only.

The Write Enable Latch (WEL) bit indicates the status
of the write enable latch and is read-only. When set to
a `

', the latch allows writes to the array, when set to a

', the latch prohibits writes to the array. The state of

this bit can always be updated via the

WREN

WRDI

commands regardless of the state of write protection
on the STATUS register. These commands are shown
in Figure 2-4 and Figure 2-5.

The Block Protection (BP0 and BP1) bits indicate
which blocks are currently write-protected. These bits
are set by the user issuing the

WRSR

instruction, which

is shown in Figure 2-7. These bits are nonvolatile and
are described in more detail in Table 2-3.

FIGURE 2-6:

READ STATUS REGISTER TIMING SEQUENCE (

RDSR

)

W/R

BP1

BP0

WEL

WIP

W/R = writable/readable. R = read-only.

instruction

data from STATUS register

high-impedance

SCK

2006 Microchip Technology Inc.

Preliminary

DS21832C-page 11

25AA010A/25LC010A

2.6

Write Status Register Instruction
(

WRSR

)

The Write Status Register instruction (

WRSR

) allows the

user to write to the nonvolatile bits in the STATUS reg-
ister as shown in Table 2-2. See Figure 2-7 for the

WRSR

timing sequence. Four levels of protection for the

array are selectable by writing to the appropriate bits in
the STATUS register. The user has the ability to write-
protect none, one, two or all four of the segments of the
array as shown in Table 2-3.

TABLE 2-3:

ARRAY PROTECTION

FIGURE 2-7:

WRITE STATUS REGISTER TIMING SEQUENCE (

WRSR

)

BP1

BP0

Array Addresses

Write-Protected

none

upper 1/4

(60h-7Fh)

upper 1/2

(40h-7Fh)

all

(00h-7Fh)

instruction

data to STATUS register

high-impedance

SCK

Note:

An internal write cycle (T

) is initiated on the rising edge of CS after a valid write STATUS register

sequence.

25AA010A/25LC010A

DS21832C-page 12

Preliminary

2006 Microchip Technology Inc.

2.7

Data Protection

The following protection has been implemented to
prevent inadvertent writes to the array:

· The write enable latch is reset on power-up
· A write enable instruction must be issued to set

the write enable latch

· After a byte write, page write or STATUS register

write, the write enable latch is reset

· CS must be set high after the proper number of

clock cycles to start an internal write cycle

· Access to the array during an internal write cycle

is ignored and programming is continued

2.8

Power-On State

The 25XX010A powers on in the following state:

· The device is in low-power Standby mode

(CS =

)

· The write enable latch is reset
· SO is in high-impedance state
· A high-to-low-level transition on CS is required to

enter active state

TABLE 2-4:

WRITE-PROTECT FUNCTIONALITY MATRIX

(pin 3)

WEL

(SR bit 1)

Protected Blocks

Unprotected Blocks

Status Register

(low)

Protected

(high)

Protected

(high)

Protected

Writable

= don't care

2006 Microchip Technology Inc.

Preliminary

DS21832C-page 13

25AA010A/25LC010A

3.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1:

PIN FUNCTION TABLE

3.1

Chip Select (CS)

A low level on this pin selects the device. A high level
deselects the device and forces it into Standby mode.
However, a programming cycle which is already
initiated or in progress will be completed, regardless of
the CS input signal. If CS is brought high during a
program cycle, the device will go into Standby mode as
soon as the programming cycle is complete. When the
device is deselected, SO goes to the high-impedance
state, allowing multiple parts to share the same SPI
bus. A low-to-high transition on CS after a valid write
sequence initiates an internal write cycle. After power-
up, a low level on CS is required prior to any sequence
being initiated.

3.2

Serial Output (SO)

The SO pin is used to transfer data out of the
25XX010A. During a read cycle, data is shifted out on
this pin after the falling edge of the serial clock.

3.3

Write-Protect (WP)

The WP pin is a hardware write-protect input pin.
When it is low, all writes to the array or STATUS reg-
ister are disabled, but any other operations function
normally. When WP is high, all functions, including
nonvolatile writes operate normally. At any time, when
WP is low, the write enable reset latch will be reset
and programming will be inhibited. However, if a write
cycle is already in progress, WP going low will not
change or disable the write cycle. See Table 2-4 for
the Write-Protect Functionality Matrix.

3.4

Serial Input (SI)

The SI pin is used to transfer data into the device. It
receives instructions, addresses and data. Data is
latched on the rising edge of the serial clock.

3.5

Serial Clock (SCK)

The SCK is used to synchronize the communication
between a master and the 25XX010A. Instructions,
addresses or data present on the SI pin are latched on
the rising edge of the clock input, while data on the SO
pin is updated after the falling edge of the clock input.

3.6

Hold (HOLD)

The HOLD pin is used to suspend transmission to the
25XX010A while in the middle of a serial sequence
without having to retransmit the entire sequence again.
It must be held high any time this function is not being
used. Once the device is selected and a serial
sequence is underway, the HOLD pin may be pulled
low to pause further serial communication without
resetting the serial sequence. The HOLD pin must be
brought low while SCK is low, otherwise the HOLD
function will not be invoked until the next SCK high-to-
low transition. The 25XX010A must remain selected
during this sequence. The SI, SCK and SO pins are in
a high-impedance state during the time the device is
paused and transitions on these pins will be ignored. To
resume serial communication, HOLD must be brought
high while the SCK pin is low, otherwise serial
communication will not resume. Lowering the HOLD
line at any time will tri-state the SO line.

Name

PDIP, SOIC,

MSOP,

TSSOP,

DFN

Rotated

TSSOP

SOT-

Function

Chip Select Input

Serial Data Output

Write-Protect Pin

Ground

Serial Data Input

SCK

Serial Clock Input

HOLD

Hold Input

Supply Voltage

25AA010A/25LC010A

DS21832C-page 14

Preliminary

2006 Microchip Technology Inc.

4.0

PACKAGING INFORMATION

4.1

Package Marking Information

T/XXXNNN

XXXXXXXX

YYWW

8-Lead PDIP

8-Lead SOIC

XXXXYYWW

XXXXXXXT

NNN

XXXX
TYWW

8-Lead TSSOP

NNN

I/P 1L7

25AA010A

0627

Example:

SN 0627

25AA01AI

1L7

5A1A
I627

Example:

1st Line Marking Codes

25AA010A

5A1A

8-Lead MSOP (150 mil)

Example:

XXXXXT

YWWNNN

5L1AI

6271L7

25LC010A

A1AX

5L1A

L1AX

Legend: XX...X

Customer-specific information

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week `01')

NNN

Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.

Note:

In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.

Part Number

TSSOP

Standard

Rotated

MSOP

SOT-23

DFN

5A1AT

5L1AT

12NN

15NN

16NN

401

404

405

I Temp.

E Temp.

I Temp.

E Temp.

Note: T = Temperature grade (I, E) NN = Alphanumeric traceability code

25AA010A/25LC010A

DS21832C-page 16

Preliminary

2006 Microchip Technology Inc.

8-Lead Plastic Dual In-line (P) 300 mil (PDIP)

Units

INCHES*

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

MIN

NOM

MAX

Number of Pins

Pitch

.100

2.54

Top to Seating Plane

.140

.155

.170

3.56

3.94

4.32

Molded Package Thickness

.115

.130

.145

2.92

3.30

3.68

Base to Seating Plane

.015

0.38

Shoulder to Shoulder Width

.300

.313

.325

7.62

7.94

8.26

Molded Package Width

.240

.250

.260

6.10

6.35

6.60

Overall Length

.360

.373

.385

9.14

9.46

9.78

Tip to Seating Plane

.125

.130

.135

3.18

3.30

3.43

Lead Thickness

.008

.012

.015

0.20

0.29

0.38

Upper Lead Width

.045

.058

.070

1.14

1.46

1.78

Lower Lead Width

.014

.018

.022

0.36

0.46

0.56

Overall Row Spacing

.310

.370

.430

7.87

9.40

10.92

Mold Draft Angle Top

Mold Draft Angle Bottom

* Controlling Parameter

Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018

§ Significant Characteristic

2006 Microchip Technology Inc.

Preliminary

DS21832C-page 17

25AA010A/25LC010A

8-Lead Plastic Small Outline (SN) Narrow, 150 mil (SOIC)

Foot Angle

Mold Draft Angle Bottom

Mold Draft Angle Top

0.51

0.42

0.33

.020

.017

.013

Lead Width

0.25

0.23

0.20

.010

.009

.008

Lead Thickness

0.76

0.62

0.48

.030

.025

.019

Foot Length

0.51

0.38

0.25

.020

.015

.010

Chamfer Distance

5.00

4.90

4.80

.197

.193

.189

Overall Length

3.99

3.91

3.71

.157

.154

.146

Molded Package Width

6.20

6.02

5.79

.244

.237

.228

Overall Width

0.25

0.18

0.10

.010

.007

.004

Standoff

1.55

1.42

1.32

.061

.056

.052

Molded Package Thickness

1.75

1.55

1.35

.069

.061

.053

Overall Height

1.27

.050

Pitch

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

* Controlling Parameter

Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.

JEDEC Equivalent: MS-012
Drawing No. C04-057

§ Significant Characteristic

25AA010A/25LC010A

DS21832C-page 18

Preliminary

2006 Microchip Technology Inc.

8-Lead Plastic Thin Shrink Small Outline (ST) 4.4 mm (TSSOP)

10°

5°

0°

10°

5°

0°

Mold Draft Angle Bottom

10°

5°

0°

10°

5°

0°

Mold Draft Angle Top

0.30

0.25

0.19

.012

.010

.007

Lead Width

0.20

0.15

0.09

.008

.006

.004

Lead Thickness

0.70

0.60

0.50

.028

.024

.020

Foot Length

3.10

3.00

2.90

.122

.118

.114

Molded Package Length

4.50

4.40

4.30

.177

.173

.169

Molded Package Width

6.50

6.38

6.25

.256

.251

.246

Overall Width

0.15

0.10

0.05

.006

.004

.002

Standoff

0.95

0.90

0.85

.037

.035

.033

Molded Package Thickness

1.10

1.05

1.00

.043

.041

.039

Overall Height

0.65

.026

Pitch

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS*

INCHES

Units

Foot Angle

0°

4°

8°

0°

4°

8°

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.

Notes:

JEDEC Equivalent: MO-153

Revised 07-21-05

* Controlling Parameter

Drawing No. C04-086

2006 Microchip Technology Inc.

Preliminary

DS21832C-page 19

25AA010A/25LC010A

8-Lead Plastic Micro Small Outline Package (MS) (MSOP)

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.

.037 REF

Footprint (Reference)

Notes:

Revised 07-21-05

* Controlling Parameter

Mold Draft Angle Top

Mold Draft Angle Bottom

Foot Angle

Lead Width

Lead Thickness

.003

.009

.006

.012

Dimension Limits

Overall Height

Molded Package Thickness

Molded Package Width

Overall Length

Foot Length

Standoff

Overall Width

Number of Pins

Pitch

.016

.024

.118 BSC

.000

.030

.193 BSC

.033

MIN

Units

.026 BSC

NOM

INCHES

0.95 REF

.009

.016

0.08

0.22

0°

0.23

0.40

8°

MILLIMETERS*

0.65 BSC

0.85

3.00 BSC

0.60

4.90 BSC

.043

.031

.037

.006

0.40

0.00

0.75

MIN

MAX

NOM

1.10

0.80

0.15

0.95

MAX

15°

5°

15°

5°

JEDEC Equivalent: MO-187

0°

8°

5°

15°

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

See ASME Y14.5M

Drawing No. C04-111

25AA010A/25LC010A

DS21832C-page 20

Preliminary

2006 Microchip Technology Inc.

8-Lead Plastic Dual-Flat, No-Lead Package (MC) 2x3x0.9 mm Body (DFN) Saw Singulated

TOP VIEW

EXPOSED

PAD

METAL

BOTTOM VIEW

(NOTE 3)

EXPOSED

TIE BAR

PIN 1

(NOTE 1)

ID INDEX

AREA

(NOTE 2)

CONFIGURATION

CONTACT

ALTERNATE

DETAIL

3. Package may have one or more exposed tie bars at ends.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

JEDEC Equivalent MO-229 VCED-2

See ASME Y14.5M

MILLIMETERS*

0.50 BSC

2.00 BSC

0.20 REF.

3.00 BSC

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

.039

.035

.031

0.80

Overall Height

2. Exposed pad may vary according to die attach paddle size.

* Controlling Parameter

Contact Length §

Notes:

Contact Width

Standoff

Overall Width

Overall Length

Contact Thickness

Exposed Pad Width

Exposed Pad Length

.010

.008

.012

0.20

.001

.008 REF.

.079 BSC

.118 BSC

.051

.059

.000

.069

.075

1.30**

1.50**

.002

0.00

Dimension Limits

Pitch

Number of Pins

INCHES

.020 BSC

MIN

NOM

Units

MAX

MIN

1.00

0.90

0.25

0.30

1.75

1.90

0.02

0.05

NOM

MAX

Contact-to-Exposed Pad

.012

.016

0.40

.020

0.30

0.50

** Not within JEDEC parameters
§ Significant Characteristic

.008

0.20

DWG No. C04-123

Revised 09-12-05

2006 Microchip Technology Inc.

Preliminary

DS21832C-page 21

25AA010A/25LC010A

6-Lead Plastic Small Outline Transistor (CH or OT) (SOT-23)

Mold Draft Angle Bottom

Mold Draft Angle Top

0.50

0.43

0.35

.020

.017

.014

Lead Width

0.20

0.15

0.09

.008

.006

.004

Lead Thickness

Foot Angle

0.55

0.45

0.35

.022

.018

.014

Foot Length

3.10

2.95

2.80

.122

.116

.110

Overall Length

1.75

1.63

1.50

.069

.064

.059

Molded Package Width

3.00

2.80

2.60

.118

.110

.102

Overall Width

0.15

0.08

0.00

.006

.003

.000

Standoff

1.30

1.10

0.90

.051

.043

.035

Molded Package Thickness

1.45

1.18

0.90

.057

.046

.035

Overall Height

1.90 BSC

.075 BSC

Outside lead pitch

0.95 BSC

.038 BSC

Pitch

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.

Notes:

JEITA (formerly EIAJ) equivalent: SC-74A

* Controlling Parameter

Drawing No. C04-120

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

See ASME Y14.5M

Revised 09-12-05

2006 Microchip Technology Inc.

Preliminary

DS21832C-page 21

25AA010A/25LC010A

THE MICROCHIP WEB SITE

Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:

· Product Support Data sheets and errata,

application notes and sample programs, design
resources, user's guides and hardware support
documents, latest software releases and archived
software

· General Technical Support Frequently Asked

Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing

· Business of Microchip Product selector and

ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives

CUSTOMER CHANGE NOTIFICATION
SERVICE

Microchip's customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.

To register, access the Microchip web site at
www.microchip.com, click on Customer Change
Notification and follow the registration instructions.

CUSTOMER SUPPORT

Users of Microchip products can receive assistance
through several channels:

· Distributor or Representative

· Local Sales Office

· Field Application Engineer (FAE)

· Technical Support

· Development Systems Information Line

Customers should contact their distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.

Technical support is available through the web site
at: http://support.microchip.com

25AA010A/25LC010A

DS21832C-page 22

Preliminary

2006 Microchip Technology Inc.

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

To:

Technical Publications Manager

RE:

Reader Response

Total Pages Sent ________

From: Name

Company

Address

City / State / ZIP / Country

Telephone: (_______) _________ - _________

Application (optional):

Would you like a reply? Y N

Device: Literature

Number:

Questions:

FAX: (______) _________ - _________

DS21832C

25AA010A/25LC010A

What are the best features of this document?

How does this document meet your hardware and software development needs?

Do you find the organization of this document easy to follow? If not, why?

What additions to the document do you think would enhance the structure and subject?

What deletions from the document could be made without affecting the overall usefulness?

Is there any incorrect or misleading information (what and where)?

How would you improve this document?

2006 Microchip Technology Inc.

Preliminary

DS21832C-page 23

25AA010A/25LC010A

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office

Sales and Support

PART NO.

/XX

Package

Tape & Reel

Device

Device:

25AA010A
25LC010A

1k-Bit, 1.8V, 16 Byte Page, SPI Serial EEPROM
1k-Bit, 2.5V, 16 Byte Page, SPI Serial EEPROM

Tape & Reel:

Blank =
T

Standard packaging
Tape & Reel

Temperature
Range:

-40

C to+85

-40

C to+125

Package:

Plastic MSOP (Micro Small Outline), 8-lead
Plastic DIP (300 mil body), 8-lead
Plastic SOIC (150 mil body), 8-lead
TSSOP, 8-lead
2x3 DFN, 8-lead
SOT-23, 6-lead (Tape and Reel only)

Examples:

25AA010A-I/MS = 1k-bit, 16-byte page, 1.8V
Serial EEPROM, Industrial temp., MSOP
package

25AA010AT-I/SN = 1k-bit, 16-byte page, 1.8V
Serial EEPROM, Industrial temp., Tape & Reel,
SOIC package

25LC010AT-I/SN = 1k-bit, 16-byte page, 2.5V
Serial EEPROM, Industrial temp., Tape & Reel,
SOIC package

25LC010AT-I/ST = 1k-bit, 16-byte page, 2.5V
Serial EEPROM, Industrial temp., Tape & Reel,
TSSOP package

25LC010AT-E/SN = 1k-bit, 16-byte page, 2.5V
serial EEPROM, Extended temp., Tape & Reel,
SOIC Package

Temperature

Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

Your local Microchip sales office

The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

2006 Microchip Technology Inc.

Preliminary

DS21832C-page 25

Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR WAR-
RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION, INCLUDING BUT NOT
LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE.
Microchip disclaims all liability arising from this information and
its use. Use of Microchip devices in life support and/or safety
applications is entirely at the buyer's risk, and the buyer agrees
to defend, indemnify and hold harmless Microchip from any and
all damages, claims, suits, or expenses resulting from such
use. No licenses are conveyed, implicitly or otherwise, under
any Microchip intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, K

, micro

, MPLAB, PIC, PICmicro, PICSTART,

PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.

AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Linear Active Thermistor,
MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM,
PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo,
PowerMate, PowerTool, Real ICE, rfLAB, rfPICDEM, Select
Mode, Smart Serial, SmartTel, Total Endurance, UNI/O,
WiperLock and Zena are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.

All other trademarks mentioned herein are property of their
respective companies.

Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:

Microchip products meet the specification contained in their particular Microchip Data Sheet.

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as "unbreakable."

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company's quality system processes and
procedures are for its PICmicro

8-bit MCUs, K

code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip's quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

DS21832C-page 26

Preliminary

2006 Microchip Technology Inc.

AMERICAS

Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com

Atlanta
Alpharetta, GA
Tel: 770-640-0034
Fax: 770-640-0307

Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088

Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075

Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924

Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260

Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387

Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608

San Jose
Mountain View, CA
Tel: 650-215-1444
Fax: 650-961-0286

Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509

ASIA/PACIFIC

Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755

China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104

China - Chengdu
Tel: 86-28-8676-6200
Fax: 86-28-8676-6599

China - Fuzhou
Tel: 86-591-8750-3506
Fax: 86-591-8750-3521

China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431

China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205

China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066

China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393

China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760

China - Shunde
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571

China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118

China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256

ASIA/PACIFIC

India - Bangalore
Tel: 91-80-2229-0061
Fax: 91-80-2229-0062

India - New Delhi
Tel: 91-11-5160-8631
Fax: 91-11-5160-8632

India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513

Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122

Korea - Gumi
Tel: 82-54-473-4301
Fax: 82-54-473-4302

Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934

Malaysia - Penang
Tel: 60-4-646-8870
Fax: 60-4-646-5086

Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069

Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850

Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459

Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803

Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102

Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350

EUROPE

Austria - Wels
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829

France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79

Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44

Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781

Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340

Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91

UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820

ORLDWIDE

ALES

AND

ERVICE

10/31/05

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: 25LC010A

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: 25LC010A