2001 Microchip Technology Inc.
DS11184D-page 1
MCP120/130
FEATURES
Holds microcontroller in reset until supply voltage
reaches stable operating level
Resets microcontroller during power loss
Precision monitoring of 3V, 3.3V and 5V systems
7 voltage trip points available
Active low RESET pin
Open drain output
Internal pull-up resistor (5 k
) for MCP130
Holds RESET for 350 ms (typical)
RESET to V
CC
= 1.0V
Accuracy of 125 mV for 5V systems and 75 mV
for 3V systems over temperature
45
A typical operating current
Temperature range:
- Industrial (I): -40
C to +85
C
DESCRIPTION
The Microchip Technology Inc. MCP120/130 is a volt-
age supervisory device designed to keep a microcon-
troller in reset until the system voltage has reached the
proper level and stabilized. It also operates as protec-
tion from brown-out conditions when the supply voltage
drops below a safe operating level. Both devices are
available with a choice of seven different trip voltages
and both have open drain outputs. The MCP130 has an
internal 5 k
pullup resistor. Both devices have active
low RESET pins. The MCP120/130 will assert the
RESET signal whenever the voltage on the V
DD
pin is
below the trip-point voltage.
PACKAGES
BLOCK DIAGRAM
V
SS
V
DD
RST
V
SS
V
DD
V
SS
V
DD
RST
V
SS
V
DD
RST
V
SS
RST
V
DD
TO-92 with
`D' Bondout
TO-92 WITH
`F' BONDOUT
TO-92 with
`G' Bondout
TO-92 with
`H' Bondout
SOT-23-3
MCP120
MCP130
MCP130
MCP120
MCP130
MCP120
MCP120
MCP130
RST
V
DD
NC
V
SS
1
2
3
4
8
7
6
5
NC
NC
NC
NC
150mil SOIC
MCP120
MCP130
RST
Delay
Circuit
Output
Driver
RESET
V
DD
+
-
Comparator
pull-up on
MCP130
5k
internal
Bandgap
Reference
only
Microcontroller Supervisory Circuit with Open Drain Output
2001 Microchip Technology Inc.
DS11184D-page 2
MCP120/130
1.0
ELECTRICAL CHARACTERISTICS
1.1
Maximum Ratings*
V
DD
........................................................................ 7.0V
All inputs and outputs w.r.t. V
SS
.....-0.6V to V
DD
+1.0V
Storage temperature .......................... -65C to +150C
Ambient temp. with power applied ..... -65C to +125C
ESD protection on all pins
.....................................
2 kV
*Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational listings of this specification
is not implied. Exposure to maximum rating conditions
for extended periods may affect device reliability.
DC AND AC CHARACTERISTICS
All parameters apply at the
specified temp and voltage
ranges unless otherwise noted.
V
DD
= 1.0 - 5.5V
Industrial (I): -40C to +85C
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Operating Voltage Range
V
DD
1.0
--
5.5
V
V
DD
Value to RESET
V
DD
MIN
1.0
--
--
V
Operating Current
I
DD
--
45
60
A
V
DD
= 5.5V (no load)
V
DD
Trip Point
MCP1X0-270
MCP1X0-300
MCP1X0-315
MCP1X0-450
MCP1X0-460
MCP1X0-475
MCP1X0-485
V
TRIP
2.55
2.85
3.0
4.25
4.35
4.50
4.60
2.625
2.925
3.075
4.375
4.475
4.625
4.725
2.7
3.0
3.15
4.50
4.60
4.75
4.85
V
RESET Low
Level Output
Voltage
MCP1X0-270
MCP1X0-300
MCP1X0-315
V
OL
--
--
0.4
V
I
OL
= 3.2 mA,
V
DD
= V
TRIP
MIN
MCP1X0-450
MCP1X0-460
MCP1X0-475
MCP1X0-485
--
--
0.6
I
OL
= 8.5 mA,
V
DD
= V
TRIP
MIN
RESET High
Level Output
Voltage
(MCP130 Only)
MCP130-xxx
(All V
TRIP
Points)
V
OH
V
DD
-0.7
--
--
V
I
OH
= 50
A,V
DD
> V
TRIP
MAX
Pull-up Resistor (MCP130 Only)
--
5
--
k
Output Leakage (MCP120 Only)
--
1
--
A
Threshold Hysteresis
V
HYS
--
50
--
mV
V
DD
Detect to RESET Inactive
t
RPU
150
350
700
ms
V
DD
Detect to RESET
t
RPD
--
10
--
s
V
DD
ramped from V
TRIP
MAX
+
250 mV
down to V
TRIP
MIN
-
250 mV
Note:
Typical values are for 25C and V
DD
= 5.0V
2001 Microchip Technology Inc.
DS11184D-page 3
MCP120/130
Figure 1-1:
MCP120/130 Timing Diagram
V
DD
RESET
V
OH
t
RPU
V
TRIP
t
RPD
V
OH
MCP120/130
DS11184D-page 4
2001 Microchip Technology Inc.
2.0
APPLICATIONS INFORMATION
2.1
The Need for Supervisory Circuits
For many of today's microcontroller applications, care
must be taken to prevent low power conditions that can
cause many different system problems. The most com-
mon causes are brown-out conditions where the sys-
tem supply drops below the operating level momentar-
ily, and the second, is when a slowly decaying power
supply causes the microcontroller to begin executing
instructions without enough voltage to sustain SRAM
and producing indeterminate results.
Figure 2-1:
Typical Application
2.2
Negative Going V
DD
Transients
Many system designers implementing POR circuits are
concerned about the minimum pulse width required to
cause a reset. Figure 2-2 shows typical transient
voltage below the trip point (V
TRIP
- V
DD
) vs. transient
duration. It shows that the farther below the trip point
the transient pulse goes, the duration of the pulse
required to cause a reset gets shorter. A 0.1
F bypass
cap mounted as close as possible to the V
DD
pin pro-
vides additional transient immunity.
Figure 2-2:
Typical Transient Response
Microcontroller
MCLR
V
SS
RST
MCP120
or
RESET
V
SS
V
DD
V
DD
Bypass
Capacitor
V
DD
TIME
SUP
P
L
Y
VO
L
T
AG
E
0
0
5V
V
TRIP
MAX
V
TRIP
MIN
Transient
Duration
(V
TRIP
MIN
-
V
DD
)
0
1
2
3
V
TRIP
- V
DD
(V)
10
8
6
4
2
0
T
R
ANS
I
ENT
DURA
T
ION (
S
)
4
5
T
A
= +25C
Transients above the
curve will cause a reset
Transients below
the curve will NOT
cause a reset
2001 Microchip Technology Inc.
DS11184D-page 5
MCP120/130
2.3
Effect of Temperature on Timeout
Period (t
RPU
)
The timeout period (t
RPU
) determines how long the
device remains in the reset condition. This is controlled
by an internal RC timer and is effected by both V
DD
and temperature. The graph shown in Figure 2-3
shows typical response for different V
DD
values and
temperatures.
Figure 2-3:
t
RPU
vs. Temperature
Figure 2-4:
I
DD
vs. Temperature
Figure 2-5:
Normalized V
TRIP
vs. Temperature
Figure 2-6:
V
OL
vs. I
OL
Figure 2-7:
Normalized I
OL
vs. Temperature
-40
-20
20
60
TEMPERATURE (C)
600
500
400
300
200
100
T
I
ME
OUT
P
E
R
IOD
(t
RP
U
) (
m
s
)
80
100
0
40
700
V
DD
= 5V
V
DD
= 4V
V
DD
= 3V
V
DD
= 6V
-40
-20
20
60
TEMPERATURE (C)
50
40
30
20
10
0
OPERA
T
IN
G CURRENT
(
A)
80
100
0
40
60
V
DD
= 5V
V
DD
= 3V
V
DD
= 5.5V
V
DD
= 4V
-40
-20
20
60
TEMPERATURE (C)
1.000
0.998
0.996
0.994
0.992
0.997
NORM
AL
IZ
ED T
HRESHOL
D*
(
V
TR
I
P
)
80
100
0
40
1.002
* Multiply value at 25C by this
factor to determine the value at
temperature
0
2
6
10
500
400
300
200
100
0
V
OL
(m
V
)
12
4
8
600
700
800
14 16 18 20
V
DD
= 3.5V
V
DD
= 1.5V
V
DD
= 4.5V
V
DD
= 2.5V
T
A
= +25C
I
OL
(mA)
-40
-20
20
60
TEMPERATURE (C)
1.2
1.1
1.00
0.9
0.8
0.7
NORM
AL
IZ
ED I
OL
*
80
100
0
40
1.3
* Multiply value at 25C by this
factor to determine the value at
temperature
MCP120/130
DS11184D-page 6
2001 Microchip Technology Inc.
3.0
PACKAGING INFORMATION
3.1
Package Marking Information
3-Lead Plastic Transistor Outline (TO-92)
Example:
3-Lead Plastic Small Outline Transistor (SOT23)
Example:
Legend: XX...X
Customer specific information*
YY
Year code (last 2 digits of calendar year)
WW
Week code (week of January 1 is week `01')
NNN
Alphanumeric traceability code
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
*
Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
For OTP marking beyond this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
XXXXXX
XXXXXX
XXXXXX
YWWNNN
MCP120
XXXXXX
XXXXXX
YWWNNN
XXNN
PKNN
SOT23 PARTS LABELING:
The table below identifies the first 2 characters (XX) in the 4-character field
(XXNN) for marking of the 3-Lead SOT23 package.
Mark
Part Number
Mark
Part Number
SJ
MCP120T-270I/TT
PJ
MCP130T-270I/TT
SK
MCP120T-300I/TT
PK
MCP130T-300I/TT
SL
MCP120T-315I/TT
PL
MCP130T-315I/TT
SM
MCP120T-450I/TT
PM
MCP130T-450I/TT
SN
MCP120T-460I/TT
PN
MCP130T-460I/TT
SO
MCP120T-475I/TT
PO
MCP130T-475I/TT
SP
MCP120T-485I/TT
PP
MCP130T-485I/TT
8-Lead Plastic Small Outline (SOIC)
Example:
XXXXYYWW
NNN
XXXXXXXX
XXXXYYWW
NNN
MCP120
2001 Microchip Technology Inc.
DS11184D-page 7
MCP120/130
3.2
Package Detail Information
3-Lead Plastic Transistor Outline (TO) (TO-92)
4
3
2
4
3
2
Mold Draft Angle Bottom
6
5
4
6
5
4
0.56
0.48
0.41
.022
.019
.016
B
Lead Width
0.51
0.43
0.36
.020
.017
.014
c
Lead Thickness
2.41
2.29
2.16
.095
.090
.085
R
Molded Package Radius
4.95
4.64
4.32
.195
.183
.170
D
Overall Length
4.95
4.71
4.45
.195
.186
.175
E1
Overall Width
3.94
3.62
3.30
.155
.143
.130
A
Bottom to Package Flat
1.27
.050
p
Pitch
3
3
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
INCHES*
Units
R
n
1
3
p
L
B
A
c
1
D
2
E1
Tip to Seating Plane
L
.500
.555
.610
12.70
14.10
15.49
*Controlling Parameter
Mold Draft Angle Top
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010" (0.254mm) per side.
JEDEC Equivalent: TO-92
Drawing No. C04-101
MCP120/130
DS11184D-page 8
2001 Microchip Technology Inc.
3-Lead Plastic Small Outline Transistor (TT) (SOT23)
10
5
0
10
5
0
Mold Draft Angle Bottom
10
5
0
10
5
0
Mold Draft Angle Top
0.51
0.44
0.37
.020
.017
.015
B
Lead Width
0.18
0.14
0.09
.007
.006
.004
c
Lead Thickness
10
5
0
10
5
0
Foot Angle
0.55
0.45
0.35
.022
.018
.014
L
Foot Length
3.04
2.92
2.80
.120
.115
.110
D
Overall Length
1.40
1.30
1.20
.055
.051
.047
E1
Molded Package Width
2.64
2.37
2.10
.104
.093
.083
E
Overall Width
0.10
0.06
0.01
.004
.002
.000
A1
Standoff
1.02
0.95
0.88
.040
.037
.035
A2
Molded Package Thickness
1.12
1.01
0.89
.044
.040
.035
A
Overall Height
1.92
.076
p1
Outside lead pitch (basic)
0.96
.038
p
Pitch
3
3
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
INCHES*
Units
2
1
p
D
B
n
E
E1
L
c
A2
A
A1
p1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010" (0.254mm) per side.
JEDEC Equivalent: TO-236
Drawing No. C04-104
Significant Characteristic
2001 Microchip Technology Inc.
DS11184D-page 9
MCP120/130
8-Lead Plastic Small Outline (SN) Narrow, 150 mil (SOIC
Foot Angle
0
4
8
0
4
8
15
12
0
15
12
0
Mold Draft Angle Bottom
15
12
0
15
12
0
Mold Draft Angle Top
0.51
0.42
0.33
.020
.017
.013
B
Lead Width
0.25
0.23
0.20
.010
.009
.008
c
Lead Thickness
0.76
0.62
0.48
.030
.025
.019
L
Foot Length
0.51
0.38
0.25
.020
.015
.010
h
Chamfer Distance
5.00
4.90
4.80
.197
.193
.189
D
Overall Length
3.99
3.91
3.71
.157
.154
.146
E1
Molded Package Width
6.20
6.02
5.79
.244
.237
.228
E
Overall Width
0.25
0.18
0.10
.010
.007
.004
A1
Standoff
1.55
1.42
1.32
.061
.056
.052
A2
Molded Package Thickness
1.75
1.55
1.35
.069
.061
.053
A
Overall Height
1.27
.050
p
Pitch
8
8
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
INCHES*
Units
2
1
D
n
p
B
E
E1
h
L
c
45
A2
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010" (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
Significant Characteristic
MCP120/130
DS11184D-page 10
2001 Microchip Technology Inc.
ON-LINE SUPPORT
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2001 Microchip Technology Inc.
DS11184D-page 11
MCP120/130
READER RESPONSE
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DS11184D
MCP120/130
MCP120/130
DS11184D-page 12
2001 Microchip Technology Inc.
NOTES:
2001 Microchip Technology Inc.
DS11184D-page 13
MCP120/130
NOTES:
MCP120/130
DS11184D-page 14
2001 Microchip Technology Inc.
PRODUCT IDENTIFICATION SYSTEM
To order or to obtain information (e.g., on pricing or delivery), please refer to the factory or the listed sales offices.
Sales and Support
PART NO.
X
/XX
Package
Temperature
Range
Device
Device:
MCP120:
Supervisor circuit with open drain output
MCP120T:
Supervisor circuit with open drain output
(tape & reel)
MCP130:
Supervisor circuit with open drain output and
internal pull-up resistor
MCP130T:
Supervisor circuit with open drain output and
internal pull-up resistor (tape & reel)
RESET/RESET V
TRIP
Voltage
270
=
2.55
V
TRIP
2.70
300
=
2.85
V
TRIP
3.00
315
=
3.00
V
TRIP
3.15
450
=
4.25
V
TRIP
4.50
460
=
4.35
V
TRIP
4.60
475
=
4.50
V
TRIP
4.75
485
=
4.60
V
TRIP
4.85
Bondout Option:
(TO-92 Only)
D
=
D Bond Option (see bond option chart)
F
=
F Bond Option
G
=
G Bond Option
H
=
H Bond Option
Temperature Range:
I
=
-40
C to +85
C (only offered in I)
Package:
SN
=
SOIC (8-lead, 150 mil body)
TO
=
TO-92 (3-lead) [offered in bags only]
TT
=
SOT-23 (3-lead) [offered in tape & reel only]
Examples:
a)
MCP120270I/SN = V
TRIP
range of 2.55V -
2.70V, Industrial Temp., SOIC package
b)
MCP120300DI/TO = V
TRIP
range of 2.85V -
3.00V, Bonding Option D, Industrial Temp.,
TO-92 package
c)
MCP120T315I/TT = V
TRIP
range of 3.00V -
3.15V, Industrial Temp., SOT-23 package
d)
MCP130450I/SN = V
TRIP
range of 4.25V -
4.50V, Industrial Temp., SOIC package
e)
MCP130460FI/TO = V
TRIP
range of 4.35V -
4.60V, Bonding Option F, Industrial Temp.,
TO-92 package
f)
MCP130T475I/TT = Tape & Reel, V
TRIP
range of 4.50V - 4.75V, Industrial Temp.,
SOT-23 package
X
Bondout
Option
X
RESET/
RESET
V
TRIP
Voltage
V
SS
V
DD
RST
V
SS
V
DD
RST
TO-92 with
`D' Bondout
TO-92 with
`F' Bondout
MCP120
MCP130
MCP130
V
SS
V
DD
RST
V
SS
V
DD
RST
TO-92 with
`G' Bondout
TO-92 with
`H' Bondout
MCP120
MCP130
MCP120
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
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2.
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3.
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Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
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2001 Microchip Technology Inc.
DS11184D-page 15
MCP120/130
"All rights reserved. Copyright 2001, Microchip
Technology Incorporated, USA. Information contained
in this publication regarding device applications and the
like is intended through suggestion only and may be
superseded by updates. No representation or warranty
is given and no liability is assumed by Microchip
Technology Incorporated with respect to the accuracy
or use of such information, or infringement of patents or
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are the property of their respective companies. No
licenses are conveyed, implicitly or otherwise, under
any intellectual property rights."
Trademarks
The Microchip name, logo, PIC, PICmicro,
PICMASTER, PICSTART, PRO MATE, K
EE
L
OQ
,
SEEVAL, MPLAB and The Embedded Control
Solutions Company are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and
other countries.
Total Endurance, ICSP, In-Circuit Serial Programming,
FilterLab, MXDEV, microID, FlexROM, fuzzyLAB,
MPASM, MPLINK, MPLIB, PICDEM, ICEPIC,
Migratable Memory, FanSense, ECONOMONITOR,
SelectMode and microPort are trademarks of
Microchip Technology Incorporated in the U.S.A.
Serialized Quick Term Programming (SQTP) is a
service mark of Microchip Technology Incorporated in
the U.S.A.
All other trademarks mentioned herein are property of
their respective companies.
2001, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999. The
Company's quality system processes and
procedures are QS-9000 compliant for its
PICmicro
8-bit MCUs, K
EE
L
OQ
code hopping
devices, Serial EEPROMs and microperipheral
products. In addition, Microchip's quality
system for the design and manufacture of
development systems is ISO 9001 certified.
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by
updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual
property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with
express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, except as maybe explicitly expressed herein, under any intellec-
tual property rights. The Microchip logo and name are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. All rights
reserved. All other trademarks mentioned herein are the property of their respective companies.
DS11184D-page 16
2001 Microchip Technology Inc.
All rights reserved. 2001 Microchip Technology Incorporated. Printed in the USA. 2/01
Printed on recycled paper.
W
ORLDWIDE
S
ALES
AND
S
ERVICE
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Rocky Mountain
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Tel: 480-792-7966 Fax: 480-792-7456
Atlanta
500 Sugar Mill Road, Suite 200B
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Tel: 770-640-0034 Fax: 770-640-0307
Austin
Analog Product Sales
8303 MoPac Expressway North
Suite A-201
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Tel: 512-345-2030 Fax: 512-345-6085
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Tel: 978-692-3848 Fax: 978-692-3821
Boston
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Dallas
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Tel: 631-273-5305 Fax: 631-273-5335
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Microchip Technology Inc.
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Tel: 408-436-7950 Fax: 408-436-7955
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Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
Australia
Microchip Technology Australia Pty Ltd
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
China - Beijing
Microchip Technology Beijing Office
Unit 915
New China Hong Kong Manhattan Bldg.
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100 Fax: 86-10-85282104
China - Shanghai
Microchip Technology Shanghai Office
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
Hong Kong
Microchip Asia Pacific
RM 2101, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200 Fax: 852-2401-3431
India
Microchip Technology Inc.
India Liaison Office
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O'Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Japan
Microchip Technology Intl. Inc.
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
ASIA/PACIFIC
(continued)
Korea
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Singapore
Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-334-8870 Fax: 65-334-8850
Taiwan
Microchip Technology Taiwan
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
Denmark
Microchip Technology Denmark ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45 4420 9895 Fax: 45 4420 9910
France
Arizona Microchip Technology SARL
Parc d'Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Arizona Microchip Technology GmbH
Gustav-Heinemann Ring 125
D-81739 Munich, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Germany
Analog Product Sales
Lochhamer Strasse 13
D-82152 Martinsried, Germany
Tel: 49-89-895650-0 Fax: 49-89-895650-22
Italy
Arizona Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Arizona Microchip Technology Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
01/30/01
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