600nA Rail-to-Rail Input/Output Op Amps

2002 Microchip Technology Inc.

DS21669B-page 1

MCP6041/2/3/4

Features

· Low Quiescent Current: 600 nA/Amplifier (typ)
· Rail-to-Rail Input: -0.3 V to V

+0.3 V (max)

· Rail-to-Rail Output:

+10 mV to V

-10 mV (max)

· Gain Bandwidth Product: 14 kHz (typ)
· Wide Supply Voltage Range: 1.4 V to 5.5 V (max)
· Unity Gain Stable
· Available in Single, Dual and Quad
· Chip Select (CS) with MCP6043
· 5-lead SOT-23 package (MCP6041 only)

Applications

· Toll Booth Tags
· Wearable Products
· Temperature Measurement
· Battery Powered

Available Tools

· Spice macro models (at www.microchip.com)
· FilterLab

Software (at www.microchip.com)

Package Types

Description

The MCP6041/2/3/4 family of operational amplifiers
from Microchip Technology, Inc. operate with a single
supply voltage as low as 1.4 V, while drawing less than
1 µA (max) of quiescent current per amplifier. These
devices are also designed to support rail-to-rail input
and output operation. This combination of features sup-
ports battery-powered and portable applications.

The MCP6041/2/3/4 amplifiers have a typical gain
bandwidth product of 14 kHz (typ) and are unity gain
stable. These specs make these operational amplifiers
appropriate for low frequency applications, such as
battery current monitoring and sensor conditioning.

The MCP6041/2/3/4 family operational amplifiers are
offered in single (MCP6041), single with a Chip Select
(CS) feature (MCP6043), dual (MCP6042) and quad
(MCP6044) configurations. The MCP6041 device is
available in the 5-lead SOT-23 package.

Typical Application

+IN

-IN

OUT

3
4

7
6

+INA

-INA

2
3

7
6

OUTA

+ -

OUTB

-INB
+INB

+IN

-IN

OUT

3
4

7
6

+INA1

-INA1

2
3
4

14
13

OUTA

+ -

OUTD

-IND
+IND

5
6
7

OUTB1

-INB

+INB

+INC

-INC

OUTC

MCP6041

PDIP, SOIC, MSOP

MCP6042

PDIP, SOIC, MSOP

MCP6043

PDIP, SOIC, MSOP

MCP6044

PDIP, SOIC, TSSOP

MCP6041

SOT-23-5

+IN

-IN

OUT

MCP604X

100 k

1 M

+2.5 V

5.5 V

High Side Batter

y Current Sensor

600 nA, Rail-to-Rail Input/Output Op Amps

MCP6041/2/3/4

DS21669B-page 2

2002 Microchip Technology Inc.

1.0

ELECTRICAL
CHARACTERISTICS

1.1

Maximum Ratings*

- V

......................................................................................7.0 V

All inputs and outputs................................... V

0.3 V to V

+0.3 V

Difference Input voltage ..................................................... |V

- V

Output Short Circuit Current ...............................................continuous
Current at Input Pins ..................................................................±2 mA
Current at Output and Supply Pins ..........................................±30 mA
Storage temperature ...................................................-65°C to +150°C
Ambient temp. with power applied ..............................-55°C to +125°C
ESD protection on all pins (HBM)

.....................................................

4 kV

*Notice: Stresses above those listed under "Maximum Ratings" may
cause permanent damage to the device. This is a stress rating only and
functional operation of the device at those or any other conditions
above those indicated in the operational listings of this specification is
not implied. Exposure to maximum rating conditions for extended peri-
ods may affect device reliability.

PIN FUNCTION TABLE

MCP6041/2/3/4 DC ELECTRICAL SPECIFICATIONS

Name

Function

+IN/+INA/+INB/+INC/+IND

Non-inverting Inputs

-IN/-INA/-INB/-INC/-IND

Inverting Inputs

Positive Power Supply

Negative Power Supply

OUT/OUTA/OUTB/OUTC/OUTD Outputs
CS

Chip Select

No internal connection to
IC

Electrical Characteristics: Unless otherwise indicated, all limits are specified for V

= +1.4 V to +5.5 V, V

= GND, T

= 25 °C,

= V

/2, R

= 1 M

to V

/2, and V

OUT

~ V

Parameters

Sym

Min

Typ

Max

Units

Conditions

Input Offset:

= V

Input Offset Voltage

-3.0

+3.0

Drift with Temperature

±1.5

µV/°C

= -40°C to+85°C

Power Supply Rejection

PSRR

Input Bias Current and Impedance:

Input Bias Current

1.0

Input Bias Current Over Temperature

100

= -40°C to+85°

Input Offset Current

1.0

Common Mode Input Impedance

||6

||pF

Differential Input Impedance

DIFF

||6

||pF

Common Mode:

Common-Mode Input Range

VCMR

0.3

+0.3

Common-Mode Rejection Ratio

CMRR

= 5 V,

= -0.3 V to 5.3 V

= 5 V,

= 2.5 V to 5.3 V

= 5 V,

= -0.3 V to 2.5 V

Open Loop Gain:

DC Open Loop Gain (large signal)

115

= 50 k

to V

/2,

100 mV < V

OUT

< (V

100 mV)

Output:

Maximum Output Voltage Swing

, V

+ 10

= 50 k

to V

Linear Region Output Voltage Swing

OVR

+ 100

100

= 50 k

to V

/2,

95 dB

Output Short Circuit Current

OUT

= 2.5 V, V

= 5 V

Power Supply:

Supply Voltage

1.4

5.5

Quiescent Current per amplifier

0.3

0.6

1.0

µA

= 0

2002 Microchip Technology Inc.

DS21669B-page 3

MCP6041/2/3/4

MCP6041/2/3/4 AC ELECTRICAL SPECIFICATIONS

SPECIFICATIONS FOR MCP6043 CHIP SELECT FEATURE

MCP6041/2/3/4 TEMPERATURE SPECIFICATIONS

Electrical Characteristics: Unless otherwise indicated, all limits are specified for V

= +5 V, V

= GND, T

= 25 °C,

= V

/2, R

= 1 M

to V

/2, C

= 60 pF, and V

OUT

~ V

Parameters

Sym

Min

Typ

Max

Units

Conditions

Gain Bandwidth Product

GBWP

kHz

Slew Rate

3.0

V/ms

Phase Margin

G = +1

Input Voltage Noise

5.0

µVp-p

f = 0.1 Hz to 10 Hz

Input Voltage Noise Density

170

nV/

f = 1 kHz

Input Current Noise Density

0.6

fA/

f = 1 kHz

Electrical Characteristics: Unless otherwise indicated, all limits are specified for V

= +1.4 V to +5.5 V, V

= GND, T

= 25 °C,

= V

/2, R

= 1 M

to V

/2, C

= 60 pF, and V

OUT

~ V

Parameters

Sym

Min

Typ

Max

Units

Conditions

CS Low Specifications:

CS Logic Threshold, Low

+ 0.3

For entire V

range

CS Input Current, Low

CSL

5.0

CS = V

CS High Specifications:

CS Logic Threshold, High

- 0.3

For entire V

range

CS Input Current, High

CSH

5.0

CS = V

CS Input High, GND Current

CS = V

Amplifier Output Leakage, CS High

CS = V

Dynamic Specifications:

CS Low to Amplifier Output High
Turn-on Time

2.0

CS low = V

+ 0.3 V, G = +1 V/V,

OUT

= 0.9 V

CS High to Amplifier Output High Z

OFF

µs

CS high = V

- 0.3 V, G = +1 V/V

OUT

= 0.1 V

Hysteresis

HYST

0.6

= 5 V

Electrical Characteristics: Unless otherwise indicated, all limits are specified for V

= +1.4 V to +5.5 V, V

= GND

Parameters

Symbol

Min

Typ

Max

Units

Conditions

Temperature Ranges:

Specified Temperature Range

-40

+85

°C

Operating Temperature Range

-40

+125

°C

Note 1

Storage Temperature Range

-65

+150

°C

Thermal Package Resistances:

Thermal Resistance, 5L-SOT23

256

°C/W

Thermal Resistance, 8L-PDIP

°C/W

Thermal Resistance, 8L-SOIC

163

°C/W

Thermal Resistance, 8L-MSOP

206

°C/W

Thermal Resistance, 14L-PDIP

°C/W

Thermal Resistance, 14L-SOIC

120

°C/W

Thermal Resistance, 14L-TSSOP

100

°C/W

Note 1: The MCP6041/2/3/4 family of op amps operates over this extended range, but with reduced performance.

MCP6041/2/3/4

DS21669B-page 4

2002 Microchip Technology Inc.

2.0

TYPICAL PERFORMANCE CURVES

Note:

Unless otherwise indicated, V

= +5 V, V

= GND, T

= 25°C, V

= V

/2, R

= 1 M

to V

/2,

= 60 pF

and V

OUT

~ V

/2.

FIGURE 2-1:

Histogram of Input Offset

Voltage with V

= 5.5 V, V

= V

FIGURE 2-2:

Histogram of Input Offset

Voltage with V

= 5.5 V, V

= V

/2.

FIGURE 2-3:

Histogram of Input Offset

Voltage with V

= 5.5 V, V

= V

FIGURE 2-4:

Histogram of Input Offset

Voltage with V

= 1.4 V, V

= V

FIGURE 2-5:

Histogram of Input Offset

Voltage with V

= 1.4 V, V

= V

/2.

FIGURE 2-6:

Histogram of Input Offset

Voltage with V

= 1.4 V, V

= V

Note:

The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

10%

15%

20%

25%

30%

35%

-4.0

-3.0

-2.0

-1.0

0.0

1.0

2.0

3.0

4.0

Input Offset Voltage (mV)

Percentage

1196 Samples
V

= 5.5V

= V

10%

15%

20%

25%

30%

35%

-4.0

-3.0

-2.0

-1.0

0.0

1.0

2.0

3.0

4.0

Input Offset Voltage (mV)

Percentage

1199 Samples
V

= 5.5V

= V

10%

15%

20%

25%

30%

35%

-4.0

-3.0

-2.0

-1.0

0.0

1.0

2.0

3.0

4.0

Input Offset Voltage (mV)

Percentage

1199 Samples
V

= 5.5V

= V

10%

15%

20%

25%

30%

35%

-4.0

-3.0

-2.0

-1.0

0.0

1.0

2.0

3.0

4.0

Input Offset Voltage (mV)

Percentage

1196 Samples
V

= 1.4V

= V

10%

15%

20%

25%

30%

35%

-4.0

-3.0

-2.0

-1.0

0.0

1.0

2.0

3.0

4.0

Input Offset Voltage (mV)

Percentage

1199 Samples
V

= 1.4V

= V

10%

15%

20%

25%

30%

35%

-4.0

-3.0

-2.0

-1.0

0.0

1.0

2.0

3.0

4.0

Input Offset Voltage (mV)

Percentage

1199 Samples
V

= 1.4V

= V

2002 Microchip Technology Inc.

DS21669B-page 5

MCP6041/2/3/4

Note:

Unless otherwise indicated, V

= +5 V, V

= GND, T

= 25°C, V

= V

/2, R

= 1 M

to V

/2,

= 60 pF

and V

OUT

~ V

/2.

FIGURE 2-7:

Histogram of Input Offset

Voltage Drift with V

= 5.5 V, V

= V

/2.

FIGURE 2-8:

Histogram of Input Offset

Voltage Drift with V

= 5.5 V, V

= V

FIGURE 2-9:

Histogram of Input Offset

Voltage Drift with V

= 1.4 V, V

= V

FIGURE 2-10:

Input Offset Voltage vs.

Common Mode Input Voltage vs. Temperature
with V

= 5.5 V.

FIGURE 2-11:

Input Offset Voltage vs.

Common Mode Input Voltage vs. Temperature
with V

= 1.4 V.

FIGURE 2-12:

Input Offset Voltage vs.

Output Voltage vs. Power Supply Voltage.

10%

15%

20%

25%

30%

35%

-10

-8

-6

-4

-2

Input Offset Voltage Drift (µV/°C)

Percentage

1176 Samples
V

= 5.5V

= V

10%

15%

20%

25%

30%

35%

-10

-8

-6

-4

-2

Input Offset Voltage Drift (µV/°C)

Percentage

1143 Samples
V

= 5.5V

= V

10%

15%

20%

25%

30%

35%

-10

-8

-6

-4

-2

Input Offset Voltage Drift (µV/°C)

Percentage

1124 Samples
V

= 1.4V

= V

-400

-300

-200

-100

100

200

300

400

-0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Common Mode Input Voltage (V)

Input Offset Voltage (µV)

= -40°C

= 5.5V

= +25°C

= +85°C

= -40°C

= +25°C

= +85°C

-1000

-800

-600

-400

-200

200

400

600

800

1000

-0.5

0.0

0.5

1.0

1.5

2.0

Common Mode Input Voltage (V)

Input Offset Voltage (µV)

= +85°C

= 1.4V

= -40°C

= +25°C

= +85°C

250

300

350

400

450

500

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

Output Voltage (V)

Input Offset Voltage (µV)

= 50 k

= 5.5V

= 1.4V

MCP6041/2/3/4

DS21669B-page 6

2002 Microchip Technology Inc.

Note:

Unless otherwise indicated, V

= +5 V, V

= GND, T

= 25°C, V

= V

/2, R

= 1 M

to V

/2,

= 60 pF

and V

OUT

~ V

/2.

FIGURE 2-13:

Input Noise Voltage Density

vs. Frequency.

FIGURE 2-14:

Common Mode Rejection

Ratio, Power Supply Rejection Ratio vs.
Frequency.

FIGURE 2-15:

Input Bias, Offset Currents

vs. Common Mode Input Voltage with
Temperature = 85°C.

FIGURE 2-16:

Input Noise Voltage Density

vs. Common Mode Input Voltage.

FIGURE 2-17:

Common Mode Rejection

Ratio, Power Supply Rejection Ratio vs.
Temperature.

FIGURE 2-18:

Input Bias, Offset Currents

vs. Temperature.

100

1000

0.1

100

1000

Frequency (Hz)

= 170 nV/ Hz, f = 1 kHz

= 5.0 µVp-p, f = 0.1 to 10 Hz

Input Noise Voltage Density (nV/

Hz)

0.1

100

1000

Frequency (Hz)

CMRR, PSRR (dB)

= 5.0V

CMRR

PSRR+

PSRR-

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

Common Mode Input Voltage (V)

Input Bias and Offset Current (pA)

Input Bias Current

Input Offset Current

= 85°C

= 5.5V

100

150

200

250

300

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

Common Mode Input Voltage (V)

f = 1 kHz

= 5V

Input Noise Voltage Density (nV/

Hz)

100

-40

-20

Temperature (°C)

PSRR, CMRR (dB)

PSRR

CMRR

1182 Samples
V

= 5.0V

= V

-40

-20

Temperature ( °C)

Input Bias and Offset Current (pA)

Input Offset Current

Input Bias Current

= 5.5V

= V

2002 Microchip Technology Inc.

DS21669B-page 7

MCP6041/2/3/4

Note:

Unless otherwise indicated, V

= +5 V, V

= GND, T

= 25°C, V

= V

/2, R

= 1 M

to V

/2,

= 60 pF

and V

OUT

~ V

/2.

FIGURE 2-19:

Quiescent Current vs.

Temperature vs. Power Supply Voltage.

FIGURE 2-20:

Open Loop Gain, Phase vs.

Frequency with V

= 5.5 V.

FIGURE 2-21:

Open Loop Gain vs. Power

Supply Voltage.

FIGURE 2-22:

Quiescent Current Vs.

Power Supply Voltage vs. Temperature.

FIGURE 2-23:

Open Loop Gain vs. Load

Resistance vs. Power Supply Voltage.

FIGURE 2-24:

Open Loop Gain vs. Output

Voltage Headroom vs. Power Supply Voltage.

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

-40

-20

Temperature (° C)

Quiescent Current (µA/Amplifier)

= 1.4V

= 5.5V

-20

100

120

140

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

1.E+05

Frequency (Hz)

Open Loop Gain (dB)

-240

-210

-180

-150

-120

-90

-60

-30

Open Loop Phase (°)

= 5.5V

0.001 0.01

0.1

100

10k 100k

Open Loop Gain

Open Loop Phase

100

110

120

130

140

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

Power Supply Voltage, V

(V)

DC Open Loop Gain (dB)

= 50 k

+ 100 mV < V

OUT

< V

- 100 mV

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0

Power Supply Voltage, V

(V)

Quiescent Current (µA/Amplifier)

= -40°C

= +25°C

= +85°C

100

110

120

130

1. E+0 2

1. E+0 3

1. E+0 4

1. E+0 5

Load Resistance (

)

DC Open Loop Gain (dB)

= 1.4V

OUT

= 0.5V to 0.9V

= 5.5V

OUT

= 0.5V to 5.0V

100

10k

100k

100

110

120

130

140

0.00

0.05

0.10

0.15

0.20

0.25

Output Voltage Headroom, V

-V

OUT

or V

OUT

-V

(V)

Open Loop Gain (dB)

= 50 k

= 5.5V

= 1.4V

MCP6041/2/3/4

DS21669B-page 8

2002 Microchip Technology Inc.

Note:

Unless otherwise indicated, V

= +5 V, V

= GND, T

= 25°C, V

= V

/2, R

= 1 M

to V

/2,

= 60 pF

and V

OUT

~ V

/2.

FIGURE 2-25:

Channel to Channel

Separation vs. Frequency (MCP6042 and
MCP6044 only).

FIGURE 2-26:

Gain Bandwidth Product,

Phase Margin vs. Temperature with V

= 5.5 V,

Unity Gain.

FIGURE 2-27:

Unity Loop Gain Frequency,

Phase Margin vs. Load Capacitance.

FIGURE 2-28:

Gain Bandwidth Product,

Phase Margin vs. Common Mode Input Voltage
with Unity Gain.

FIGURE 2-29:

Gain Bandwidth Product,

Phase Margin vs. Temperature with V

= 1.4 V,

Unity Gain.

FIGURE 2-30:

Output Short Circuit Current

vs. Temperature vs. Power Supply Voltage.

100

110

120

130

1.E+02

1.E+03

1.E+04

Frequency (Hz)

100

10k

Input Referred

Channel to Channel Separation (dB)

-40

-20

Temperature (°C)

Phase Margin (°)

Phase Margin

Gain Bandwidth Product

= 5.5V

G = +1 V/V

Gain Bandwidth Product (kHz)

100

1000

Load Capacitance (pF)

Phase Margin (°)

Unity Loop Gain Frequency

Phase Margin

= 5.5V

G = +1 V/V
R

= 10 k

Unity Loop Gain Frequency (kHz)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

Common Mode Input Voltage(V)

Phase Margin (°)

Phase Margin

Gain Bandwidth Product

= 5V

= 100 k

G = +1 V/V

Gain Bandwidth Product (kHz)

-40

-20

Temperature (°C)

Phase Margin (°)

Phase Margin

Gain Bandwidth Product

= 1.4V

G = +1 V/V

Gain Bandwidth Product (kHz)

-40

-20

Temperature (°C)

Output Short Circuit Current (mA)

| I

SC-

| @ V

=5.5V

SC+

@ V

=5.5V

| I

SC-

| @ V

=1.4V

SC+

@ V

=1.4V

2002 Microchip Technology Inc.

DS21669B-page 9

MCP6041/2/3/4

Note:

Unless otherwise indicated, V

= +5 V, V

= GND, T

= 25°C, V

= V

/2, R

= 1 M

to V

/2,

= 60 pF

and V

OUT

~ V

/2.

FIGURE 2-31:

Slew Rate vs. Temperature.

FIGURE 2-32:

Output Voltage Headroom

vs. Load Resistance vs. Power Supply Voltage.

FIGURE 2-33:

Small Signal Non-Inverting

Pulse Response.

FIGURE 2-34:

Output Voltage Swing vs.

Frequency vs. Power Supply Voltage.

FIGURE 2-35:

Output Voltage Headroom

vs. Temperature.

FIGURE 2-36:

Small Signal Inverting Pulse

Response.

-40

-20

Temperature (°C)

Slew Rate (V/ms)

High-to-Low Transition

Low-to-High Transition

= 5.0V

100

1.E+03

1.E+04

1.E+05

Load Resistance ( )

Output Voltage Headroom,

-V

or V

-V

(mV)

-V

@ V

= 5.5V

10k

100k

-V

@ V

= 1.4V

-V

@ V

= 5.5V

-V

@ V

= 1.4V

-3. E-02

-2. E-02

-1. E-02

-5. E-03

0.E+00

5.E-03

1.E-02

2.E-02

3.E-02

0.E+00

1.E-04

2.E-04

3.E-04

4.E-04

5.E-04

6.E-04

7.E-04

8.E-04

9.E-04

1.E-03

Time (100 µs/div)

Output Voltage (5mV/div)

= 5.0V

G = +1 V/V
R

= 50 k

0.1

1.E +01

1.E +02

1.E +03

1.E +04

Frequency (Hz)

Output Voltage Swing (Vp-p)

100

10k

= 5.5V

= 1.4V

-40

-20

Temperature (°C)

Output Voltage Headroom,

- V

or V

- V

(mV)

- V

= 5.5V

= 50 k

-0. 025

-0. 020

-0. 015

-0. 010

-0. 005

0.000

0.005

0.010

0.015

0.020

0.025

0.0E+00

1.0E-04

2.0E-04

3.0E-04

4.0E-04

5.0E-04

6.0E-04

7.0E-04

8.0E-04

9.0E-04

1.0E-03

Time (100 µs/div)

Voltage (5 mV/div)

= 5.0V

G = -1 V/V
R

= 50 k

MCP6041/2/3/4

DS21669B-page 10

2002 Microchip Technology Inc.

Note:

Unless otherwise indicated, V

= +5 V, V

= GND, T

= 25°C, V

= V

/2, R

= 1 M

to V

/2,

= 60 pF

and V

OUT

~ V

/2.

FIGURE 2-37:

Large Signal Non-Inverting

Pulse Response.

FIGURE 2-38:

Chip Select (CS) to

Amplifier Output Response Time (MCP6043
only).

FIGURE 2-39:

The MCP6041/2/3/4 family

shows no phase reversal (for information only
the Maximum Absolute Input Voltage is still
V

-0.3 V and V

+0.3 V).

FIGURE 2-40:

Large Signal Inverting Pulse

Response.

FIGURE 2-41:

Chip Select (CS) Hysteresis

(MCP6043 only).

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

0.E+00

1.E-03

2.E-03

3.E-03

4.E-03

5.E-03

6.E-03

7.E-03

8.E-03

9.E-03

1.E-02

Time (1 ms/div)

Output Voltage (V)

= 5.0V

G = +1 V/V
R

= 50 k

-20.0

-17.5

-15.0

-12.5

-10.0

-7.5

-5.0

-2.5

0.0

2.5

5.0

7.5

0.E+00

1.E-03

2.E-03

3.E-03

4.E-03

5.E-03

6.E-03

7.E-03

8.E-03

9.E-03

1.E-02

Time (1 ms/div)

-1.0

-0.5

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

Output Voltage (V)

= 5.0V

Chip Select (CS) Voltage (V)

OUT

Output Hi-Z

Output Driven

-1

0.00E+00

5.00E-03

1.00E-02

1.50E-02

2.00E-02

2.50E-02

Time (5 ms/div)

Output Voltage (V)

= 5.0V

G = +2 V/V

OUT

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

0.E+00

1.E-03

2.E-03

3.E-03

4.E-03

5.E-03

6.E-03

7.E-03

8.E-03

9.E-03

1.E-02

Time (1 ms/div)

Output Voltage (V)

= 5.0V

G = -1 V/V
R

= 50 k

-0.5

0.0

0.5

1.0

1.5

2.0

2.5

3.0

CS Input Voltage (V)

Amplifier OutputActive (driven)

Amplifier OutputHi-Z

= 5.0V

CS Input High
to Low

CS Input Low
to High

Hysteresi

Internal CS Switch Output (V)

2002 Microchip Technology Inc.

DS21669B-page 11

MCP6041/2/3/4

3.0

APPLICATIONS INFORMATION

The MCP6041/2/3/4 family of operational amplifiers
are fabricated on Microchip's state-of-the-art CMOS
process. They are unity gain stable and suitable for a
wide range of applications requiring very low power
consumption. With these op amps, the power supply
pin needs to be by-passed with a 0.1 µF capacitor.

3.1

Rail to Rail Input

The input stage of the family of devices uses two differ-
ential input stages in parallel; one operates at low V

(common mode input voltage) and the other at high
V

. With this topology, the MCP6041/2/3/4 family

operates with V

up to 300 mV past either supply rail.

The Input Offset Voltage is measured at both
V

= V

- 0.3 V and V

+ 0.3 V to ensure proper

operation.

3.2

Output Loads and Battery Life

The MCP6041/2/3/4 op amp family has outstanding
quiescent current, which supports battery-powered
applications. There is minimal quiescent current glitch-
ing when chip select (CS) is raised or lowered. This
prevents excessive current draw and reduced battery
life, when the part is turned off or on.

Heavy resistive loads at the output can cause exces-
sive battery drain. Driving a DC voltage of 2.5 V across
a 100 k

load resistor will cause the supply current to

increase by 25 µA, depleting the battery 43 times as
fast as I

(0.6 µA typ) alone.

High frequency signals (fast edge rate) across capaci-
tive loads will also significantly increase supply current.
For instance, a 0.1 µF capacitor at the output presents
an AC impedance of 15.9 k

(1/2

fC) to a 100 Hz

sinewave. It can be shown that the average power
drawn from the battery by a 5.0 Vp-p sinewave
(1.77 Vrms), under these conditions, is:

EQUATION

This will drain the battery 18 times as fast as I

alone.

3.3

Rail to Rail Output

The output voltage range of the MCP6041/2/3/4 family
is specified two ways. The first specification, Maximum
Output Voltage Swing, defines the maximum swing
possible under a particular output load. According to
the spec table, the output can reach

10 mV of either

supply rail when R

= 50 k

. See Figure 2-32 for infor-

mation on Maximum Output Voltage Swing vs. load
resistance.

The second specification, Linear Region Output Volt-
age Swing, details the output voltage range that sup-
ports the specified Open Loop Gain (A

95 dB with

= 50 k

3.4

Input Voltage and Phase Reversal

The MCP6041/2/3/4 op amp family uses CMOS tran-
sistors at the input. It is designed to not exhibit phase
inversion when the input pins exceed the supply volt-
ages. Figure 2-39 shows an input voltage exceeding
both supplies with no resulting phase inversion.

The maximum operating V

(common mode input

voltage) that can be applied to the inputs is V

-0.3 V

and V

+0.3 V. Voltage on the input that exceed this

absolute maximum rating can cause excessive current
to flow in or out of the input pins. Current beyond ±2 mA
can cause possible reliability problems. Applications
that exceed this rating must be externally limited with
an input resistor as shown in Figure 3-1.

FIGURE 3-1:

An input resistor, R

should be used to limit excessive input current if
the inputs exceed the Absolute Maximum
specification.

3.5

Capacitive Load and Stability

Driving capacitive loads can cause stability problems
with voltage feedback op amps. A buffer configuration
(G = +1) is the most sensitive to capacitive loads.
Figure 2-27 shows how increasing the load capaci-
tance will decrease the phase margin. While a phase
margin above 60° is ideal, 45° is sufficient. As can be
seen, up to C

= 150 pF can be placed on the

MCP6041/2/3/4 op amp outputs without any problems,
while 250 pF is usable with a 45° phase margin.

When the op amp is required to drive large capacitive
loads (C

>150 pF), a small series resistor (R

ISO

Figure 3-2) at the output of the amplifier improves the
phase margin. This resistor makes the output load
resistive at higher frequencies, which improves the
phase margin. The bandwidth reduction caused by the
capacitive load, however, is not changed. To select
R

ISO

, start with 1 k

, then use the MCP6041 SPICE

SUPPLY

(

)

L p p

(

)

(

)

3.0

W 50

(

)

0.6

A 5.0V

p p

100Hz 0.1

(

)

Minimum expected V

(

)

2 mA

----------------------------------------------------------------------------

Maximum expected V

(

)

2 mA

-------------------------------------------------------------------------------

OUT

MCP604X

MCP6041/2/3/4

DS21669B-page 12

2002 Microchip Technology Inc.

macro model and bench testing to adjust R

ISO

until the

frequency response peaking is reasonable. Use the
smallest reasonable value.

FIGURE 3-2:

Amplifier circuit for heavy

capacitive loads.

3.6

The MCP6043 Chip Select (CS)
Option

The MCP6043 is a single amplifier with a chip select
(CS) option. When CS is pulled high, the supply current
drops to 20 pA (typ) and goes through the CS pin to
V

. When this happens, the amplifier is put into a high

impedance state. By pulling CS low, the amplifier is
enabled. If the CS pin is left floating, the amplifier will
not operate properly. Figure 3-3 shows the output volt-
age and supply current response to a CS pulse.

FIGURE 3-3:

Timing Diagram for the CS

function on the MCP6043 op amp.

3.7

Layout Considerations

Good PC board layout techniques will help you achieve
the performance shown in the specs and Typical Per-
formance Curves. It will also assist in minimizing Elec-
tro-Magnetic Compatibility (EMC) issues.

3.7.1

SURFACE LEAKAGE

In applications where low input bias current is critical,
PC board surface leakage effects and signal coupling
from trace to trace need to be considered.

Surface leakage is caused by a difference in voltage
between traces, combined with high humidity, dust or
other contamination on the board. Under low humidity
conditions, a typical resistance between nearby traces
is 10

. A 5 V difference would cause 5 pA of current

to flow; this is greater than the input current of the
MCP6041/2/3/4 family at 25°C (1 pA, typ).

The simplest technique to reduce surface leakage is
using a guard ring around sensitive pins (or traces).
The guard ring is biased at the same voltage as the
sensitive pin or trace. Figure 3-4 shows an example of
a typical layout.

FIGURE 3-4:

Example of Guard Ring

layout.

Circuit schematics for different guard ring implementa-
tions are shown in Figure 3-5. Figure 3-5A biases the
guard ring to the input common mode voltage, which is
most effective for non-inverting gains, including unity
gain. Figure 3-5B biases the guard ring to a reference
voltage (V

REF

, which can be ground). This is useful for

inverting gains and precision photo sensing circuits.

FIGURE 3-5:

Two possible guard ring

connection strategies to reduce surface leakage
effects.

ISO

OUT

MCP604X

Hi-Z

OFF

OUT

VDD

20 pA, typ

Hi-Z

VSS

5 pA, typ

20 pA, typ

0.6 µA, typ

5 pA, typ

0.6 µA, typ

5 pA, typ

Guard Ring

IN-

IN+

REF

MCP604X

Figure 3-5A

Figure 3-5B

REF

MCP604X

2002 Microchip Technology Inc.

DS21669B-page 13

MCP6041/2/3/4

3.7.2

COMPONENT PLACEMENT

Separate digital from analog and low speed from high
speed. This helps prevent crosstalk.

Keep sensitive traces short and straight. Separate
them from interfering components and traces. This is
especially important for high frequency (low rise time)
signals.

Use a 0.1 µF supply bypass capacitor within 0.1"
(2.5 mm) of the V

pin. It must connect directly to the

ground plane.

3.7.3

SIGNAL COUPLING

The input pins of the MCP6041/2/3/4 family of op amps
are high impedance, which allows noise injection. This
noise can be capacitively or magnetically coupled. In
either case, using a ground plane helps reduce noise
injection.

When noise is coupled capacitively, the ground plane
provides shunt capacitance to ground for high fre-
quency signals. Figure 3-6 shows the equivalent cir-
cuit. The coupled current, I

, produces a lower voltage

TRACE 2

) on the victim trace when the trace to ground

plane capacitance (C

SH2

) is large and the terminating

resistor (R

) is small. Increasing the distance between

traces, and using wider traces, also helps.

FIGURE 3-6:

Equivalent circuit for

capacitive coupling between traces on a PC
board (with ground plane).

When noise is coupled magnetically, ground plane
reduces the mutual inductance between traces. This
occurs because the ground return current at high fre-
quencies will follow a path directly beneath the signal
trace. Increasing the separation between traces makes
a significant difference. Changing the direction of one
of the traces can also reduce magnetic coupling.

If these techniques are not enough, it may help to place
guard traces next to the victim trace. They should be on
both sides of the victim trace and be as close as possi-
ble. Connect the guard traces to ground plane at both
ends, and in the middle, for long traces.

3.8

Typical Applications

3.8.1

BATTERY CURRENT SENSING

The MCP6041/2/3/4 op amps' Common Mode Input
Range, which goes 300 mV beyond both supply rails,
supports their use in high side and low side battery
current sensing applications. The very low quiescent
current (0.6 µA, typ) help prolong battery life while the
rail-to-rail output allows you to detect low currents.

Figure 3-7 shows a high side battery current sensor cir-
cuit. The 10

resistors are sized to minimize power

losses. The battery current (I

) through the 10

resistor causes its top terminal to be more negative
than the bottom terminal. This keeps the common
mode input voltage of the op amp

, which is within

its allowed range. The output of the op amp can reach
V

- 0.1 mV (see Figure 2-32), which is a smaller

error than the offset voltage.

FIGURE 3-7:

High Side Battery Current

Sensor.

3.8.2

INSTRUMENTATION AMPLIFIER

The MCP6041/2/3/4 op amp is well suited for condition-
ing sensor signals in battery-powered applications.
Figure 3-8 shows a two op amp instrumentation
amplifier, using the MCP6042, that works well for appli-
cations requiring rejection of common mode noise at
higher gains. The reference voltage (V

REF

) is supplied

by a low impedance source. In single supply
applications, V

REF

is typically V

/2.

FIGURE 3-8:

Two Op Amp

Instrumentation Amplifier.

TRACE 1

SH2

SH1

TRACE 2

MCP604X

100 k

1 M

+2.5 V

5.5 V

REF

½ MCP6042

OUT

½ MCP6042

OUT

(

)

------

---------

REF

2002 Microchip Technology Inc.

DS21669B-page 15

MCP6041/2/3/4

Software License Agreement

The software supplied herewith by Microchip Technology Incorporated (the "Company") is intended and supplied to you, the Com-
pany's customer, for use solely and exclusively on Microchip products.
The software is owned by the Company and/or its supplier, and is protected under applicable copyright laws. All rights are reserved.
Any use in violation of the foregoing restrictions may subject the user to criminal sanctions under applicable laws, as well as to civil
liability for the breach of the terms and conditions of this license.
THIS SOFTWARE IS PROVIDED IN AN "AS IS" CONDITION. NO WARRANTIES, WHETHER EXPRESS, IMPLIED OR STATU-
TORY, INCLUDING, BUT NOT LIMITED TO, IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICU-
LAR PURPOSE APPLY TO THIS SOFTWARE. THE COMPANY SHALL NOT, IN ANY CIRCUMSTANCES, BE LIABLE FOR
SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES, FOR ANY REASON WHATSOEVER.

.SUBCKT MCP6041 1 2 3 4 5

* | | | | |

* | | | | Output

* | | | Negative Supply

* | | Positive Supply

* | Inverting Input

* Non-inverting Input

* Macromodel for the MCP6041/2/3/4 op amp

family:

* MCP6041 (single)

* MCP6042 (dual)

* MCP6043 (single w/ CS; chip select is not

modeled)

* MCP6044 (quad)

* Revision History:

* REV A: 7-9-01 created KEB

* Recommendations:

* Use PSPICE (other simulators may require

translation)

* For a quick, effective design, use a com-

bination of: data sheet

* specs, bench testing, and simulations

with this macromodel

* For high impedance circuits, set

GMIN=100F in the.OPTIONS

* statement

* Supported:

* Typical performance at room temperature

(25 degrees C)

* DC, AC, Transient, and Noise analyses.

* Most specs, including: offsets, PSRR,

CMRR, input impedance,

* open loop gain, voltage ranges, supply

current,..., etc.

* Not Supported:

* Chip Select (MCP6043)

* Variation in specs vs. Power Supply Volt-

age

* Distortion (detailed non-linear behavior)

* Temperature analysis

* Process variation

* Behavior outside normal operating region

* Input Stage

V10 3 10 -0.3

R10 10 11 78K

R11 10 12 78K

C11 11 12 4.9P

C12 1 0 6P

E12 1 14 POLY(4) 20 0 21 0 26 0 27 0 1M 1 1

1 1

G12 14 0 POLY(2) 22 0 23 0 1.5P 1U 1U

M12 11 14 15 15 NMI

C13 14 2 3P

M14 12 2 15 15 NMI

G14 2 0 POLY(2) 24 0 25 0 0.5P 1U 1U

C14 2 0 6P

I15 15 4 500N

V16 16 4 0.18

D16 16 15 DL

V13 3 13 0.00

D13 14 13 DL

* Noise Sources

I20 21 20 17.2N

D20 20 0 DN1

D21 0 21 DN1

I22 23 22 588U

D22 22 0 DN23

D23 0 23 DN23

I24 25 24 588U

D24 24 0 DN23

D25 0 25 DN23

* PSRR and CMRR

G26 0 26 POLY(1) 3 4 110U -20U

R26 26 0 1

G27 0 27 POLY(2) 1 3 2 4 -275U 50U 50U

R27 27 0 1

* Open Loop Gain, Slew Rate

G30 0 30 POLY(1) 12 11 0 1MEG

R30 30 0 1

C30 30 0 11.4

G31 0 31 POLY(1) 30 0 0 1

R31 31 0 1

C31 31 0 775N

* Output Stage

G40 0 40 POLY(1) 45 5 0 22.7M

D41 40 41 DL

R41 41 0 1K

D42 42 40 DL

R42 42 0 1K

G43 3 0 POLY(1) 41 0 100N 1M

G47 0 4 POLY(1) 42 0 100N -1M

E43 43 0 POLY(1) 3 0 0 1

2002 Microchip Technology Inc.

DS21669B-page 17

MCP6041/2/3/4

5.0

PACKAGING INFORMATION

5.1

Package Marking Information

XXXXXXXX
XXXXXNNN

YYWW

8-Lead PDIP (300 mil)

Example:

8-Lead SOIC (150 mil)

Example:

XXXXXXXX

XXXXYYWW

NNN

Legend: XX...X Customer specific information*

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week `01')

NNN

Alphanumeric traceability code

Note:

In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.

Standard marking consists of Microchip part number, year code, week code, traceability code (facility
code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please
check with your Microchip Sales Office.

MCP6041
I/PNNN

YYWW

MCP6041

I/SNYYWW

NNN

8-Lead MSOP

Example:

XXXXXX

YWWNNN

6041

YWWNNN

5-Lead SOT-23 (MCP6041 only)

Example:

XXNN

SBNN

MCP6041/2/3/4

DS21669B-page 18

2002 Microchip Technology Inc.

5.1

Package Marking Information (Continued)

14-Lead PDIP (300 mil) (MCP6044)

Example:

14-Lead TSSOP (MCP6044)

Example:

14-Lead SOIC (150 mil) (MCP6044)

Example:

XXXXXXXXXXXXXX
XXXXXXXXXXXXXX

YYWWNNN

XXXXXXXXXX

YYWWNNN

XXXXXX

YYWW

NNN

Legend: XX...X Customer specific information*

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week `01')

NNN

Alphanumeric traceability code

Note:

In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.

MCP6044-I/P
XXXXXXXXXXXXXX

YYWWNNN

6044ST

YYWW

NNN

XXXXXXXXXX

MCP6044ISL

YYWWNNN

XXXXXXXXXX

2002 Microchip Technology Inc.

DS21669B-page 19

MCP6041/2/3/4

8-Lead Plastic Dual In-line (P) 300 mil (PDIP)

Units

INCHES*

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

MIN

NOM

MAX

Number of Pins

Pitch

.100

2.54

Top to Seating Plane

.140

.155

.170

3.56

3.94

4.32

Molded Package Thickness

.115

.130

.145

2.92

3.30

3.68

Base to Seating Plane

.015

0.38

Shoulder to Shoulder Width

.300

.313

.325

7.62

7.94

8.26

Molded Package Width

.240

.250

.260

6.10

6.35

6.60

Overall Length

.360

.373

.385

9.14

9.46

9.78

Tip to Seating Plane

.125

.130

.135

3.18

3.30

3.43

Lead Thickness

.008

.012

.015

0.20

0.29

0.38

Upper Lead Width

.045

.058

.070

1.14

1.46

1.78

Lower Lead Width

.014

.018

.022

0.36

0.46

0.56

Overall Row Spacing

.310

.370

.430

7.87

9.40

10.92

Mold Draft Angle Top

Mold Draft Angle Bottom

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

JEDEC Equivalent: MS-001
Drawing No. C04-018

.010" (0.254mm) per side.

§ Significant Characteristic

MCP6041/2/3/4

DS21669B-page 20

2002 Microchip Technology Inc.

8-Lead Plastic Small Outline (SN) Narrow, 150 mil (SOIC)

Foot Angle

Mold Draft Angle Bottom

Mold Draft Angle Top

0.51

0.42

0.33

.020

.017

.013

Lead Width

0.25

0.23

0.20

.010

.009

.008

Lead Thickness

0.76

0.62

0.48

.030

.025

.019

Foot Length

0.51

0.38

0.25

.020

.015

.010

Chamfer Distance

5.00

4.90

4.80

.197

.193

.189

Overall Length

3.99

3.91

3.71

.157

.154

.146

Molded Package Width

6.20

6.02

5.79

.244

.237

.228

Overall Width

0.25

0.18

0.10

.010

.007

.004

Standoff §

1.55

1.42

1.32

.061

.056

.052

Molded Package Thickness

1.75

1.55

1.35

.069

.061

.053

Overall Height

1.27

.050

Pitch

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

* Controlling Parameter

Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010" (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057

§ Significant Characteristic

2002 Microchip Technology Inc.

DS21669B-page 21

MCP6041/2/3/4

8-Lead Plastic Micro Small Outline Package (MS) (MSOP)

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not

.037

.035

Footprint (Reference)

exceed .010" (0.254mm) per side.

Notes:

Drawing No. C04-111

*Controlling Parameter

Mold Draft Angle Top
Mold Draft Angle Bottom

Foot Angle

Lead Width

Lead Thickness

7
7

.004
.010

.006
.012

(F)

Dimension Limits

Overall Height
Molded Package Thickness

Molded Package Width
Overall Length
Foot Length

Standoff §
Overall Width

Number of Pins
Pitch

.016

.114
.114

.022

.118
.118

.002

.030

.193

.034

MIN

Units

.026

NOM

INCHES

1.00

0.95

0.90

.039

0.15
0.30

.008
.016

0.10
0.25

7
7

0.20
0.40

MILLIMETERS*

0.65

0.86

3.00
3.00
0.55

4.90

.044

.122

.028

.122

.038
.006

0.40

2.90
2.90

0.05

0.76

MIN

MAX

NOM

1.18

0.70

3.10
3.10

0.15

0.97

MAX

§ Significant Characteristic

.184

.200

4.67

.5.08

MCP6041/2/3/4

DS21669B-page 22

2002 Microchip Technology Inc.

5-Lead Plastic Small Outline Transistor (OT) (SOT23)

Mold Draft Angle Bottom

Mold Draft Angle Top

0.50

0.43

0.35

.020

.017

.014

Lead Width

0.20

0.15

0.09

.008

.006

.004

Lead Thickness

Foot Angle

0.55

0.45

0.35

.022

.018

.014

Foot Length

3.10

2.95

2.80

.122

.116

.110

Overall Length

1.75

1.63

1.50

.069

.064

.059

Molded Package Width

3.00

2.80

2.60

.118

.110

.102

Overall Width

0.15

0.08

0.00

.006

.003

.000

Standoff §

1.30

1.10

0.90

.051

.043

.035

Molded Package Thickness

1.45

1.18

0.90

.057

.046

.035

Overall Height

1.90

.075

Outside lead pitch (basic)

0.95

.038

Pitch

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

* Controlling Parameter

Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010" (0.254mm) per side.
JEDEC Equivalent: MO-178
Drawing No. C04-091

§ Significant Characteristic

2002 Microchip Technology Inc.

DS21669B-page 23

MCP6041/2/3/4

14-Lead Plastic Dual In-line (P) 300 mil (PDIP)

Units

INCHES*

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

MIN

NOM

MAX

Number of Pins

Pitch

.100

2.54

Top to Seating Plane

.140

.155

.170

3.56

3.94

4.32

Molded Package Thickness

.115

.130

.145

2.92

3.30

3.68

Base to Seating Plane

.015

0.38

Shoulder to Shoulder Width

.300

.313

.325

7.62

7.94

8.26

Molded Package Width

.240

.250

.260

6.10

6.35

6.60

Overall Length

.740

.750

.760

18.80

19.05

19.30

Tip to Seating Plane

.125

.130

.135

3.18

3.30

3.43

Lead Thickness

.008

.012

.015

0.20

0.29

0.38

Upper Lead Width

.045

.058

.070

1.14

1.46

1.78

Lower Lead Width

.014

.018

.022

0.36

0.46

0.56

Overall Row Spacing

.310

.370

.430

7.87

9.40

10.92

Mold Draft Angle Top

Mold Draft Angle Bottom
* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010" (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-005

§ Significant Characteristic

MCP6041/2/3/4

DS21669B-page 24

2002 Microchip Technology Inc.

14-Lead Plastic Small Outline (SL) Narrow, 150 mil (SOIC)

Foot Angle

Mold Draft Angle Bottom

Mold Draft Angle Top

0.51

0.42

0.36

.020

.017

.014

Lead Width

0.25

0.23

0.20

.010

.009

.008

Lead Thickness

1.27

0.84

0.41

.050

.033

.016

Foot Length

0.51

0.38

0.25

.020

.015

.010

Chamfer Distance

8.81

8.69

8.56

.347

.342

.337

Overall Length

3.99

3.90

3.81

.157

.154

.150

Molded Package Width

6.20

5.99

5.79

.244

.236

.228

Overall Width

0.25

0.18

0.10

.010

.007

.004

Standoff §

1.55

1.42

1.32

.061

.056

.052

Molded Package Thickness

1.75

1.55

1.35

.069

.061

.053

Overall Height

1.27

.050

Pitch

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

* Controlling Parameter

Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010" (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-065

§ Significant Characteristic

2002 Microchip Technology Inc.

DS21669B-page 25

MCP6041/2/3/4

14-Lead Plastic Thin Shrink Small Outline (ST) 4.4 mm (TSSOP)

Foot Angle

Mold Draft Angle Bottom

Mold Draft Angle Top

0.30

0.25

0.19

.012

.010

.007

Lead Width

0.20

0.15

0.09

.008

.006

.004

Lead Thickness

0.70

0.60

0.50

.028

.024

.020

Foot Length

5.10

5.00

4.90

.201

.197

.193

Molded Package Length

4.50

4.40

4.30

.177

.173

.169

Molded Package Width

6.50

6.38

6.25

.256

.251

.246

Overall Width

0.15

0.10

0.05

.006

.004

.002

Standoff §

0.95

0.90

0.85

.037

.035

.033

Molded Package Thickness

1.10

.043

Overall Height

0.65

.026

Pitch

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS*

INCHES

Units

* Controlling Parameter

Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005" (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-087

§ Significant Characteristic

2002 Microchip Technology Inc.

DS21669B-page 27

MCP6041/2/3/4

Systems Information and Upgrade Hot Line

The Systems Information and Upgrade Line provides
system users a listing of the latest versions of all of
Microchip's development systems software products.
Plus, this line provides information on how customers
can receive any currently available upgrade kits.The
Hot Line Numbers are:

1-800-755-2345 for U.S. and most of Canada, and

1-480-792-7302 for the rest of the world.

ON-LINE SUPPORT

Microchip provides on-line support on the Microchip
World Wide Web (WWW) site.

The web site is used by Microchip as a means to make
files and information easily available to customers. To
view the site, the user must have access to the Internet
and a web browser, such as Netscape or Microsoft
Explorer. Files are also available for FTP download
from our FTP site.

Connecting to the Microchip Internet Web Site

The Microchip web site is available by using your
favorite Internet browser to attach to:

www.microchip.com

The file transfer site is available by using an FTP ser-
vice to connect to:

ftp://ftp.microchip.com

The web site and file transfer site provide a variety of
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
User's Guides, Articles and Sample Programs. A vari-
ety of Microchip specific business information is also
available, including listings of Microchip sales offices,
distributors and factory representatives. Other data
available for consideration is:

· Latest Microchip Press Releases
· Technical Support Section with Frequently Asked

Questions

· Design Tips
· Device Errata
· Job Postings
· Microchip Consultant Program Member Listing
· Links to other useful web sites related to

Microchip Products

· Conferences for products, Development Systems,

technical information and more

· Listing of seminars and events

013001

MCP6041/2/3/4

DS21669B-page 28

2002 Microchip Technology Inc.

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this Data Sheet.

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this data sheet easy to follow? If not, why?

4. What additions to the data sheet do you think would enhance the structure and subject?

5. What deletions from the data sheet could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

8. How would you improve our software, systems, and silicon products?

To:

Technical Publications Manager

RE:

Reader Response

Total Pages Sent

From: Name

Company
Address
City / State / ZIP / Country

Telephone: (_______) _________ - _________

Application (optional):

Would you like a reply? Y N

Device:

Literature Number:

Questions:

FAX: (______) _________ - _________

DS21669B

MCP6041/2/3/4

2002 Microchip Technology Inc.

DS21669B-page 29

MCP6041/2/3/4

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Sales and Support

Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

Your local Microchip sales office

The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

PART NO.

/XX

Package

Temperature

Range

Device

Device:

MCP6041:

CMOS Single Op Amp

MCP6041T: CMOS Single Op Amp

(Tape and Reel for SOT-23, SOIC, MSOP)

MCP6042:

CMOS Dual Op Amp

MCP6042T: CMOS Dual Op Amp

(Tape and Reel for SOIC and TSSOP)

MCP6043:

CMOS Single Op Amp w/CS Function

MCP6043T: CMOS Single Op Amp w/CS Function

(Tape and Reel for SOIC and MSOP)

MCP6044:

CMOS Quad Op Amp

MCP6044T: CMOS Quad Op Amp

(Tape and Reel for SOIC and TSSOP)

Temperature Range:

-40°C to +85°C

Package:

Plastic MSOP, 8-lead

Plastic DIP (300 mil Body), 8-lead, 14-lead

Plastic SOIC (150 mil Body), 8-lead

Plastic Small Outline Transistor (SOT-23),
5-lead (Tape and Reel - MCP6041 only)

Plastic SOIC (150 mil Body), 14-lead

Plastic TSSOP (4.4mm Body), 14-lead

Examples:

MCP6041-I/P:

Industrial temperature,

PDIP package.

MCP6041T-I/OT: Tape and Reel, Indus-
trial temperature, SOT-23 package.

MCP6042-I/SN:

Industrial temperature,

SOIC package.

MCP6043-I/MS:

Industrial temperature,

MSOP package.

MCP6044-I/SL:

Industrial temperature,

SIOC package.

MCP6044-I/ST:

Industrial temperature,

TSSOP package.

2002 Microchip Technology Inc.

DS21669B - page 31

Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip's products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.

Trademarks

The Microchip name and logo, the Microchip logo, FilterLab,
K

, microID, MPLAB, PIC, PICmicro, PICMASTER,

PICSTART, PRO MATE, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip Tech-
nology Incorporated in the U.S.A. and other countries.

dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select
Mode and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A.

Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their
respective companies.

Printed on recycled paper.

Microchip received QS-9000 quality system

certification for its worldwide headquarters,

design and wafer fabrication facilities in

Chandler and Tempe, Arizona in July 1999

and Mountain View, California in March 2002.

The Company's quality system processes and

procedures are QS-9000 compliant for its

PICmicro

8-bit MCUs, K

code hopping

devices, Serial EEPROMs, microperipherals,

non-volatile memory and analog products. In

addition, Microchip's quality system for the

design and manufacture of development

systems is ISO 9001 certified.

DS21669B-page 32

2002 Microchip Technology Inc.

AMERICAS

Corporate Office

2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com

Rocky Mountain

2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966 Fax: 480-792-4338

Atlanta

500 Sugar Mill Road, Suite 200B
Atlanta, GA 30350
Tel: 770-640-0034 Fax: 770-640-0307

Boston

2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848 Fax: 978-692-3821

Chicago

333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: 630-285-0071 Fax: 630-285-0075

Dallas

4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423 Fax: 972-818-2924

Detroit

Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250 Fax: 248-538-2260

Kokomo

2767 S. Albright Road
Kokomo, Indiana 46902
Tel: 765-864-8360 Fax: 765-864-8387

Los Angeles

18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888 Fax: 949-263-1338

New York

150 Motor Parkway, Suite 202
Hauppauge, NY 11788
Tel: 631-273-5305 Fax: 631-273-5335

San Jose

Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950 Fax: 408-436-7955

Toronto

6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509

ASIA/PACIFIC

Australia

Microchip Technology Australia Pty Ltd
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755

China - Beijing

Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
Bei Hai Wan Tai Bldg.
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100 Fax: 86-10-85282104

China - Chengdu

Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-86766200 Fax: 86-28-86766599

China - Fuzhou

Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506 Fax: 86-591-7503521

China - Shanghai

Microchip Technology Consulting (Shanghai)
Co., Ltd.
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060

China - Shenzhen

Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Rm. 1315, 13/F, Shenzhen Kerry Centre,
Renminnan Lu
Shenzhen 518001, China
Tel: 86-755-2350361 Fax: 86-755-2366086

China - Hong Kong SAR

Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200 Fax: 852-2401-3431

India

Microchip Technology Inc.
India Liaison Office
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O'Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062

Japan

Microchip Technology Japan K.K.
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122

Korea

Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: 82-2-554-7200 Fax: 82-2-558-5934

Singapore

Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850

Taiwan

Microchip Technology (Barbados) Inc.,
Taiwan Branch
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139

EUROPE

Denmark

Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45 4420 9895 Fax: 45 4420 9910

France

Microchip Technology SARL
Parc d'Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79

Germany

Microchip Technology GmbH
Gustav-Heinemann Ring 125
D-81739 Munich, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44

Italy

Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
Tel: 39-039-65791-1 Fax: 39-039-6899883

United Kingdom

Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820

Austria

Microchip Technology Austria GmbH
Durisolstrasse 2
A-4600 Wels
Austria
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393

05/16/02

ORLDWIDE

ALES

AND

ERVICE

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: MCP6044-I/SL

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: MCP6044-I/SL