2003 Microchip Technology Inc.
DS21219H-page 1
MCRF200
Features
Factory programming and memory serialization
(SQTP
SM
)
One-time contactless programmable (developer
kit only)
Read-only data transmission after programming
96 or 128 bits of One-Time Programmable (OTP)
user memory (also supports 48 and 64-bit
protocols)
Typical operation frequency: 100 kHz-400 kHz
Ultra low-power operation (5
A @ V
CC
= 2V)
Modulation options:
- ASK, FSK, PSK
Data Encoding options:
- NRZ Direct, Differential Biphase, Manchester
Biphase
Die, wafer, COB, PDIP or SOIC package options
Factory programming options
Application
Low-cost alternative for existing low-frequency
RFID devices
Access control and time attendance
Security systems
Animal tagging
Product identification
Industrial tagging
Inventory control
Package Type
Description
The MCRF200 is a passive Radio Frequency Identifi-
cation (RFID) device for low-frequency applications
(100 kHz-400 kHz). The device is powered by
rectifying an incoming RF signal from the reader. The
device requires an external LC resonant circuit to
receive the incoming RF signal and to send data. The
device develops a sufficient DC voltage for operation
when its external coil voltage reaches approximately 10
V
PP
.
This device has a total of 128 bits of user programmable
memory and an additional 12 bits in its configuration
register. The user can manually program the 128 bits of
user memory by using a contactless programmer in a
microID developer kit such as DV103001 or PG103001.
However, in production volume the MCRF200 is
programmed at the factory (Microchip SQTP see
Technical Bulletin TB023). The device is a One-Time
Programmable (OTP) integrated circuit and operates as
a read-only device after programming.
MCRF200
Reader
RF
Signal
Data
PDIP/SOIC
V
A
V
B
1
2
3
4
8
7
6
5
NC
I/O
RESET
NC
V
SS
V
CC
Note: Pins 3, 4, 5 and 6 are for device test purposes only.
Pins 1 and 8 are for antenna connections.
DO NOT ground pin 5.
125 kHz microIDTM Passive RFID Device
MCRF200
DS21219H-page 2
2003 Microchip Technology Inc.
Block Diagram
The configuration register includes options for commu-
nication protocol (ASK, FSK, PSK), data encoding
method, data rate, and data length.These options are
specified by customer and factory programmed during
assembly. Because of its many choices of configuration
options, the device can be easily used as an alternative
or second source for most of the existing low frequency
passive RFID devices available today.
The device has a modulation transistor between the
two antenna connections (V
A
and V
B
). The modulation
transistor damps or undamps the coil voltage when it
sends data. The variation of coil voltage controlled by
the modulation transistor results in a perturbation of
voltage in reader antenna coil. By monitoring the
changes in reader coil voltage, the data transmitted
from the device can be reconstructed.
The device is available in die, wafer, Chip-on-Board
(COB) modules, PDIP, or SOIC packages. Factory
programming and memory serialization (SQTP) are
also available upon request. See TB023 for more
information on contact programming support.
The DV103001 developer's kit includes Contactless
Programmer, ASK, FSK, PSK reference readers, and
reference design guide. The reference design guide
includes schematics for readers and contactless
programmer as well as in-depth document for antenna
circuit designs.
Column
Memory
Array
V
CC
V
SS
Rectifier
Clock
Generator
Coil
Connections
Decode
Row
Decode
Modulation
Control
Counter
Data
Modulat
i
o
n
Circ
u
i
t
2003 Microchip Technology Inc.
DS21219H-page 3
MCRF200
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
()
Storage temperature .............................................................................................................................. - 65C to +150C
Ambient temperature with power applied................................................................................................-40C to +125C
Maximum current into coil pads .............................................................................................................................. 50 mA
TABLE 1-1:
AC AND DC CHARACTERISTICS
NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at those or any other conditions
above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
All parameters apply across the
specified operating ranges unless
otherwise noted.
Industrial (I): T
A
= -40C to +85C
Parameter
Sym
Min
Typ
Max
Units
Conditions
Clock frequency
F
CLK
100
--
400
kHz
Contactless programming time
T
WC
--
2
--
sec
For all 128-bit array
Data retention
200
--
--
Years
at 25C
Coil current (Dynamic)
I
CD
--
50
A
Operating current
I
DD
--
5
A
V
CC
= 2V
Turn-on-voltage (Dynamic) for
modulation
V
A
V
B
10
--
--
V
PP
V
CC
2
--
--
V
DC
Input Capacitance
C
IN
--
2
--
pF
Between V
A
and V
B
MCRF200
DS21219H-page 4
2003 Microchip Technology Inc.
2.0
FUNCTION DESCRIPTION
The device contains three major building blocks. They
are RF front-end, configuration and control logic, and
memory sections. The Block Diagram is shown on
page 1.
2.1
RF Front-End
The RF front-end of the device includes circuits for
rectification of the carrier, V
DD
(operating voltage) and
high-voltage clamping. This section also includes a
clock generator and modulation circuit.
2.1.1
RECTIFIER AC CLAMP
The rectifier circuit rectifies RF voltage on the external
LC antenna circuit. Any excessive voltage on the tuned
circuit is clamped by the internal circuitry to a safe level
to prevent damage to the IC.
2.1.2
POWER-ON RESET
This circuit generates a Power-on Reset when the tag
first enters the reader field. The Reset releases when
sufficient power has developed on the V
DD
regulator to
allow correct operation.
2.1.3
CLOCK GENERATOR
This circuit generates a clock based on the carrier
frequency from the reader. This clock is used to derive
all timing in the device, including the baud rate and
modulation rate.
2.1.4
MODULATION CIRCUIT
The device sends the encoded data to the reader by
AM-modulating the coil voltage across the tuned LC
circuit. A modulation transistor is placed between the
two antenna coil pads (V
A
and V
B
). The transistor turns
on and off based on the modulation signal. As a result,
the amplitude of the antenna coil voltage varies with the
modulation signal. See Figure 2-1 for details.
FIGURE 2-1:
MODULATION SIGNAL AND MODULATED SIGNAL
MCRF200
Modulation
Signal
V
A
V
B
Modulation
Modulation Signal
Modulated RF Signal
(across V
A
and V
B
)
L
C
Amplitude
t
Transistor
2003 Microchip Technology Inc.
DS21219H-page 5
MCRF200
2.2
Configuration Register and
Control Logic
The configuration register determines the operational
parameters of the device. The configuration register
can not be programmed contactlessly; it is
programmed during wafer probe at the Microchip
factory. CB11 is always a zero; CB12 is set when
successful contact or contactless programming of the
data array has been completed. Once CB12 is set,
device programming and erasing is disabled. Table 2-4
contains a description of the bit functions of the control
register.
2.2.1
BAUD RATE TIMING OPTION
The chip will access data at a baud rate determined by
bits CB2, CB3 and CB4 of the configuration register.
For example, MOD32 (CB2 =
0
, CB3 =
1
, CB4 =
1
) has
32 RF cycles per bit. This gives the data rate of 4 kHz
for the RF carrier frequency of 128 kHz.
The default timing is MOD128 (F
CLK
/128), and this
mode is used for contact and contactless program-
ming. Once the array is successfully programmed, the
lock bit CB12 is set. When the lock bit is set, program-
ming and erasing the device becomes permanently
disabled. The configuration register has no effect on
device timing until the EEPROM data array is
programmed (CB12 =
1
).
2.2.2
DATA ENCODING OPTION
This logic acts upon the serial data being read from the
EEPROM. The logic encodes the data according to the
configuration bits CB6 and CB7. CB6 and CB7
determine the data encoding method. The available
choices are:
Non-return to zero-level (NRZ_L)
Biphase Differential, Biphase Manchester
Inverted Manchester
2.2.3
MODULATION OPTION
CB8 and CB9 determine the modulation protocol of the
encoded data. The available choices are:
ASK
FSK
PSK_1
PSK_2
When ASK (direct) option is chosen, the encoded data
is fed into the modulation transistor without change.
When FSK option is chosen, the encoded data is
represented by:
a)
Sets of 10 RF carrier cycles (first 5 cycles
higher amplitude, the last 5 cycles
lower
amplitude) for logic "high" level.
b)
Sets of 8 RF carrier cycles (first 4 cycles
higher amplitude, the last 4 cycles
lower
amplitude) for logic "low" level.
For example, FSK signal for MOD40 is represented:
a)
4 sets of 10 RF carrier cycles for data `
1
'.
b)
5 sets of 8 RF carrier cycles for data `
0
'.
Refer to Figure 2-2 for the FSK signal with MOD40
option.
The PSK_1 represents change in the phase of the
modulation signal at the change of the encoded data.
For example, the phase changes when the encoded
data is changed from `
1
' to `
0
', or from `
0
' to `
1
'.
The PSK_2 represents change in the phase at the
change on `
1
'. For example, the phase changes when
the encoded data is changed from `
0
' to `
1
', or from `
1
'
to `
1
'.
FIGURE 2-2:
ENCODED DATA AND FSK OUTPUT SIGNAL FOR MOD40 OPTION
Encoded Data `
1
'
Encoded Data `
0
'
40 RF cycles
40 RF cycles
5 cycles (HI)
5 cycles (LO)
4 cycles (HI)
4 cycles (LO)
MCRF200
DS21219H-page 6
2003 Microchip Technology Inc.
FIGURE 2-3:
PSK DATA MODULATION
2.2.4
MEMORY ARRAY LOCK BIT (CB12)
The CB12 must be `
0
' for contactless programming
(Blank). The bit (CB12) is automatically set to `
1
' as
soon as the device is programmed contactlessly.
2.3
Memory Section
The device has 128 bits of one-time programmable
(OTP) memory. The user can choose 96 or 128 bits by
selecting the CB1 bit in the configuration register. See
Table 2-4 for more details.
2.3.1
COLUMN AND ROW DECODER
LOGIC AND BIT COUNTER
The column and row decoders address the EEPROM
array at the clock rate and generate a serial data
stream for modulation. This data stream can be up to
128 bits in length. The size of the data stream is user
programmable with CB1 and can be set to 96 or 128
bits. Data lengths of 48 and 64 bits are available by
programming the data twice in the array, end-to-end.
The column and row decoders route the proper voltage
to the array for programming and reading. In the
programming modes, each individual bit is addressed
serially from bit 1 to bit 128.
2.4
Examples of Configuration
Settings
EXAMPLE 2-1:
"08D" CONFIGURATION
EXAMPLE 2-2:
"00A" CONFIGURATION
EXAMPLE 2-3:
MCRF200
CONFIGURATION FOR
FDX-B ISO ANIMAL
STANDARD PROTOCOL
(ASP)
P
P
P P
P P
P P
P P
P P
`
0
'
`
0
'
`
1
'
`
1
'
Encoded Data
PSK_ 1
Change on Data
PSK _2
Change on `
1
'
(NRZ_L)
`
1
'
The "08D" (hex) configuration is interpreted as
follows:
"08D"
0000-1000-1101
Referring to Table 2-4, the "08D" configuration
represents:
Modulation = PSK_1
PSK rate = rf/2
Data encoding = NRZ_L (direct)
Baud rate = rf/32 = MOD32
Memory size 128 bits
CB12
CB1
The "00A" (hex) configuration is interpreted as
follows:
"00A"
0000-0000-1010
The MSB corresponds to CB12 and the LSB
corresponds to CB1 of the configuration register.
Therefore, we have:
Referring to Table 2-4, the "00A" configuration
represents:
Not programmed device (blank), anticollision:
disabled, FSK protocol, NRZ_L (direct) encod-
ing, MOD50 (baud rate = rf/50), 96 bits.
CB12=
0
CB11=
0
CB10=
0
CB9=
0
CB8=
0
CB7=
0
CB6=
0
CB5=
0
CB4=
1
CB3=
0
CB2=
1
CB1=
0
CB12
CB1
The FDX-B ISO Specification is:
Modulation = ASK
Data encoding = Differential biphase
Baud rate = rf/32 = 4 Kbits/sec for 128 kHz
Memory size = 128 bits
Referring to Table 2-4, the equivalent MCRF200
configuration is: "14D".
2003 Microchip Technology Inc.
DS21219H-page 7
MCRF200
TABLE 2-4:
CONFIGURATION REGISTER
CB12 CB11 CB10 CB9 CB8 CB7
CB6 CB5 CB4
CB3
CB2 CB1
MEMORY SIZE
CB1 = 1 128-bit user memory array
CB1 = 0 96-bit user memory array
BAUD RATE
SYNC WORD
CB5 =
0
(Always)
DATA ENCODING
CB6 =
0
; CB7 =
0
NRZ_L (Direct)
CB6 =
0
; CB7 =
1
Biphase_S (Differential)
CB6 =
1
; CB7 =
0
Biphase_L (Manchester)
CB6 =
1
; CB7 =
1
(Inverted Manchester)
MODULATION OPTIONS
CB8 =
0
; CB9 =
0
FSK 0 = Fc/8, 1 = Fc/10
CB8 =
0
; CB9 =
1
Direct (ASK)
CB8 =
1
; CB9 =
0
PSK_1
(phase change on change of data)
CB8 =
1
; CB9 =
1
PSK_2
(phase change at beginning of a one)
PSK RATE OPTION
CB10 =
1
Carrier/4
CB10 =
0
Carrier/2
(ANTICOLLISION OPTION (Read-only)
CB11 =
0
Disabled (Always)
MEMORY ARRAY LOCK BIT (Read-only)
CB12 =
0
User memory array not locked (Blank)
CB12 =
1
User memory array is locked
(Programmed)
CB2
CB3
CB4
Rate
0
0
0
MOD128
0
0
1
MOD100
0
1
0
MOD80
0
1
1
MOD32
1
0
0
MOD64
1
0
1
MOD50
1
1
0
MOD40
1
1
1
MOD16
MCRF200
DS21219H-page 8
2003 Microchip Technology Inc.
3.0
MODES OF OPERATION
The device has two basic modes of operation: Native
mode and Read mode.
3.1
Native Mode
Every unprogrammed blank device (CB12=
0
) operates
in Native mode, regardless of configuration register
settings:
F
CLK
/128, FSK, NRZ_L (direct)
Once the user memory is programmed, the lock bit is
set (CB12=
1
) which causes the MCRF200 to switch
from Native mode to the Communication mode defined
by the configuration register.
Refer to Figure 4-1 for contactless programming
sequence. Also see the microID
TM
125 kHz RFID
System Design Guide (DS51115) for more information.
3.2
Read Mode
After the device is programmed (CB12=
1
), the device
is operated in the Read-only mode. The device
transmits its data according to the protocol in the
configuration register.
FIGURE 3-1:
TYPICAL APPLICATION CIRCUIT
Pad V
B
Pad V
A
Input capacitance: 2 pF
RF Signal
Data
C
To Reader
amplifier/filter
From
Reader
I
AC
L
2.5 mH
648 pF
f
res
1
2
LC
-------------------
125 kHz
=
=
125 kHz
MCRF200
L
C
2003 Microchip Technology Inc.
DS21219H-page 9
MCRF200
4.0
CONTACTLESS
PROGRAMMING
The contactless programming of the device is possible
for blank devices (CB12=
0
) only and is recommended
for only low-volume, manual operation during develop-
ment. In volume production, the MCRF200 is normally
used as a factory programmed device only. The
contactless programming timing sequence consists of:
a)
RF power-up signal.
b)
Short gap (absence of RF field).
c)
Verify signal (continuous RF signal).
d)
Programming signal.
e)
Device response with programmed data.
The blank device (CB12=
0
) understands the RF
power-up followed by a gap as a blank checking
command, and outputs 128 bits of FSK data with all `
1
's
after the short gap. To see this blank data (verify), the
reader/programmer must provide a continuous RF
signal for 128 bit-time. (The blank (unprogrammed)
device has all `F's in its memory array. Therefore, the
blank data should be all `
1
's in FSK format). Since the
blank device operates at Default mode (MOD128),
there are 128 RF cycles for each bit. Therefore, the
time requirement to complete this verify is 128 bits x
128 RF cycles/bit x 8 use/cycles = 131.1 msec for
125 kHz signal.
As soon as the device completes the verify, it enters the
programming mode. The reader/programmer must
provide RF programming data right after the verify. In
this programming mode, each bit lasts for 128 RF
cycles. Refer to Figure 4-1 for the contactless program-
ming sequence.
Customer must provide the following specific voltage
for the programming:
1.
Power-up and verify signal = 13.5V 1 V
PP
2.
Programming voltage:
- To program bit to `
1
': 13.5V 1 V
PP
- To program bit to `
0
': 30V 2 V
PP
After the programming cycle, the device outputs
programmed data (response). The reader/programmer
can send the programming data repeatedly after the
device response until the programming is successfully
completed. The device locks the CB12 as soon as the
programming mode (out of field) is exited and becomes
a read-only device.
Once the device is programmed (CB12=
1
), the device
outputs its data according to the configuration register.
The PG103001 (Contactless Programmer) is used for
the programming of the device. The voltage level
shown in Figure 4-1 is adjusted by R5 and R7 in the
contactless programmer. Refer to the MicroID
TM
125 kHz RFID System Design Guide (DS51115) for
more information.
MCRF200
DS21219H-page 10
2003 Microchip Technology Inc.
FIGURE 4-1:
CONTACTLESS PROGRAMMING SEQUENCE
P
o
wer-up
G
ap
~ 50
- 10
0
s
13.
5
1
V
PP
High-P
o
wer
30
2
V
PP
Bi
t
1
B
i
t
2
128
bit
s
x 128
c
ycles/
b
it
x 8
s
/
c
ycle
= 131.
1 m
s
13.
5
1 V
PP
Cont
act
l
es
s P
r
ogram
ming
Pro
t
ocol
f
=
125 kHz
t =
8
s
Bi
t
3...
P
r
ogr
a
m
1 bit
=
128 cyc
les
x
8
s
/
cy
cle =
1.
024
m
s
80 -
180
s
Ve
r
i
f
y
FSK S
i
g
n
a
l
(R
5
)
1
28 bit
s
t
=
G
uar
d B
and
0V
13.
5
1
V
PP
(R5)
Low-P
ower
S
i
gna
l
Signal
(R7)
No
t
e
:
Low
-p
ow
er s
i
g
nal
:
l
ea
ve
s b
i
t =
1
H
i
gh
-pow
e
r
si
gna
l:
pro
g
ram
s
bi
t =
0
Def
a
ul
t
pr
ogramm
i
ng pr
ot
oc
ol
= F
S
K,
F
c
/
8
/
10,
128
bit
s
F
o
r 96-
bi
t
pr
ogramm
i
ng,
bit
s
33-6
4
are
`don't
care',
but
all
128-bit
cy
cles must
be
in t
he sequenc
e.
2003 Microchip Technology Inc.
DS21219H-page 11
MCRF200
5.0
MECHANICAL
SPECIFICATIONS FOR DIE
AND WAFER
FIGURE 5-1:
DIE PLOT
TABLE 5-1:
PAD COORDINATES (
m)
TABLE 5-2:
PAD FUNCTION TABLE
V
B
V
A
V
SS
V
CC
RESET
I/O
Device Test Only
Passivation
Openings
Pad
Name
Pad
Width
Pad
Height
Pad
Center X
Pad
Center Y
V
A
90.0
90.0
427.50
-734.17
V
B
90.0
90.0
-408.60
-734.17
Note 1: All coordinates are referenced from the
center of the die.
2: Die size: 1.1215 mm x 1.7384 mm
44.15 mils x 68.44 mils
Name
Function
V
A
Antenna Coil connection
V
B
V
SS
For device test only
Do Not Connect to Antenna
V
CC
RESET
I/O
MCRF200
DS21219H-page 12
2003 Microchip Technology Inc.
TABLE 5-3:
DIE MECHANICAL DIMENSIONS
TABLE 5-4:
WAFER MECHANICAL SPECIFICATIONS
Specifications
Min
Typ
Max
Unit
Comments
Bond pad opening
--
--
3.5 x 3.5
89 x 89
--
--
mil
m
Note 1, Note 2
Die backgrind thickness
--
--
7
177.8
--
--
mil
m
Sawed 6" wafer on frame
(option = WF) Note 3
--
--
11
279.4
--
--
mil
m
Unsawed wafer
(option = W) Note 3
Die backgrind thickness tolerance
--
--
--
--
1
25.4
mil
m
Die passivation thickness (multilayer)
--
0.9050
--
m
Note 4
Die Size:
Die size X*Y before saw (step size)
Die size X*Y after saw
--
--
44.15 x 68.44
42.58 x 66.87
--
--
mil
mil
--
--
Note 1:
The bond pad size is that of the passivation opening. The metal overlaps the bond pad passivation by at
least 0.1 mil.
2:
Metal Pad Composition is 98.5% Aluminum with 1% Si and 0.5% Cu.
3:
As the die thickness decreases, susceptibility to cracking increases. It is recommended that the die be as
thick as the application will allow.
4:
The Die Passivation thickness (0.905
m) can vary by device depending on the mask set used. The
passivation is formed by:
-Layer 1: Oxide (undoped oxide 0.135
m)
-Layer 2: PSG (doped oxide, 0.43
m)
-Layer 3: Oxynitride (top layer, 0.34
m)
5:
The conversion rate is 25.4
m/mil.
Notice:
Extreme care is urged in the handling and assembly of die products since they are susceptible to
mechanical and electrostatic damage.
Specifications
Min
Typ
Max
Unit
Comments
Wafer Diameter
--
8
--
inch
150 mm
Die separation line width
--
80
--
m
Dice per wafer
--
14,000
--
die
Batch size
--
24
--
wafer
2003 Microchip Technology Inc.
DS21219H-page 13
MCRF200
6.0
FAILED DIE IDENTIFICATION
Every die on the wafer is electrically tested according
to the data sheet specifications and visually inspected
to detect any mechanical damage such as mechanical
cracks and scratches.
Any failed die in the test or visual inspection is identified
by black colored ink. Therefore, any die covered with
black ink should not be used.
The ink dot specification:
Ink dot size: minimum 20
m x 20
m
Position: central third of die
Color: black
7.0
WAFER DELIVERY
DOCUMENTATION
Each wafer container is marked with the following
information:
Microchip Technology Inc. MP Code
Lot Number
Total number of wafers in the container
Total number of good dice in the container
Average die per wafer (DPW)
Scribe number of wafers with number of good
dice
8.0
NOTICE ON DIE AND WAFER
HANDLING
The device is very susceptible to Electrostatic
Discharge (ESD). ESD can cause critical damage to
the device. Special attention is needed during the
handling process.
Any untraviolet (UV) light can erase the memory cell
contents of an unpackaged device. Flourescent lights
and sun light can also erase the memory cell although
it takes more time than UV lamps. Therefore, keep any
unpackaged devices out of UV light and also avoid
direct exposure from strong flourescent lights and sun
light.
Certain integrated circuit (IC) manufacturing, chip-on-
board (COB) and tag assembly operations may use UV
light. Operations such as backgrind, de-tape, certain
cleaning operations, epoxy or glue cure should be done
without exposing the die surface to UV light.
Using x-ray for die inspection will not harm the die, nor
erase memory cell contents.
MCRF200
DS21219H-page 14
2003 Microchip Technology Inc.
9.0
PACKAGING INFORMATION
9.1
Package Marking Information
XXXXXXXX
XXXXXNNN
YYWW
8-Lead PDIP (300 mil)
Example:
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
XXXXYYWW
NNN
MCRF200
XXXXXNNN
0025
Legend: XX...X
Customer specific information*
Y
Year code (last digit of calendar year)
YY
Year code (last 2 digits of calendar year)
WW
Week code (week of January 1 is week `01')
NNN
Alphanumeric traceability code
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
*
Standard device marking consists of Microchip part number, year code, week code, and traceability
code.
MCRF200
XXX0025
NNN
2003 Microchip Technology Inc.
DS21219H-page 15
MCRF200
8-Lead Plastic Dual In-line (P) 300 mil (PDIP)
B1
B
A1
A
L
A2
p
E
eB
c
E1
n
D
1
2
UNITS
INCHES*
MILLIMETERS
DIMENSION LIMITS
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
n
8
8
Pitch
p
.100
2.54
Top to Seating Plane
A
.140
.155
.170
3.56
3.94
4.32
Molded Package Thickness
A2
.115
.130
.145
2.92
3.30
3.68
Base to Seating Plane
A1
.015
0.38
Shoulder to Shoulder Width
E
.300
.313
.325
7.62
7.94
8.26
Molded Package Width
E1
.240
.250
.260
6.10
6.35
6.60
Overall Length
D
.360
.373
.385
9.14
9.46
9.78
Tip to Seating Plane
L
.125
.130
.135
3.18
3.30
3.43
Lead Thickness
c
.008
.012
.015
0.20
0.29
0.38
Upper Lead Width
B1
.045
.058
.070
1.14
1.46
1.78
Lower Lead Width
B
.014
.018
.022
0.36
0.46
0.56
Overall Row Spacing
eB
.310
.370
.430
7.87
9.40
10.92
Mold Draft Angle Top
5
10
15
5
10
15
Mold Draft Angle Bottom
5
10
15
5
10
15
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
JEDEC Equivalent: MS-001
Drawing No. C04-018
.010" (0.254mm) per side.
Significant Characteristic
MIN
MCRF200
DS21219H-page 16
2003 Microchip Technology Inc.
8-Lead Plastic Small Outline (SN) Narrow, 150 mil (SOIC)
Foot Angle
0
4
8
0
4
8
15
12
0
15
12
0
Mold Draft Angle Bottom
15
12
0
15
12
0
Mold Draft Angle Top
.51
.42
.33
.020
.017
.013
B
Lead Width
.25
.23
.20
.010
.009
.008
c
Lead Thickness
.76
.62
.48
.030
.025
.019
L
Foot Length
.51
.38
.25
.020
.015
.010
h
Chamfer Distance
5.00
4.90
4.80
.197
.193
.189
D
Overall Length
3.99
3.91
3.71
.157
.154
.146
E1
Molded Package Width
6.20
6.02
5.79
.244
.237
.228
E
Overall Width
.25
.18
.10
.010
.007
.004
A1
Standoff
1.55
1.42
1.32
.061
.056
.052
A2
Molded Package Thickness
1.75
1.55
1.35
.069
.061
.053
A
Overall Height
1.27
.050
p
Pitch
8
8
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
DIMENSION LIMITS
MILLIMETERS
INCHES*
UNITS
2
1
D
n
p
B
E
E1
h
L
c
45
A2
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010" (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
Significant Characteristic
2003 Microchip Technology Inc.
DS21219H-page 17
MCRF200
1M/3M COB (IOA2)
5 mm
8m
m
Thickness = 0.4 mm
A
n
t
e
nn
a C
o
i
l
C
o
nn
e
c
t
i
on
MCRF200 COB
MCRF200
DS21219H-page 18
2003 Microchip Technology Inc.
NOTES:
2003 Microchip Technology Inc.
DS21219H-page 19
MCRF200
ON-LINE SUPPORT
Microchip provides on-line support on the Microchip
World Wide Web site.
The web site is used by Microchip as a means to make
files and information easily available to customers. To
view the site, the user must have access to the Internet
and a web browser, such as Netscape
or Microsoft
Internet Explorer. Files are also available for FTP
download from our FTP site.
Connecting to the Microchip Internet
Web Site
The Microchip web site is available at the following
URL:
www.microchip.com
The file transfer site is available by using an FTP
service to connect to:
ftp://ftp.microchip.com
The web site and file transfer site provide a variety of
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
User's Guides, Articles and Sample Programs. A vari-
ety of Microchip specific business information is also
available, including listings of Microchip sales offices,
distributors and factory representatives. Other data
available for consideration is:
Latest Microchip Press Releases
Technical Support Section with Frequently Asked
Questions
Design Tips
Device Errata
Job Postings
Microchip Consultant Program Member Listing
Links to other useful web sites related to
Microchip Products
Conferences for products, Development Systems,
technical information and more
Listing of seminars and events
SYSTEMS INFORMATION AND
UPGRADE HOT LINE
The Systems Information and Upgrade Line provides
system users a listing of the latest versions of all of
Microchip's development systems software products.
Plus, this line provides information on how customers
can receive the most current upgrade kits. The Hot Line
Numbers are:
1-800-755-2345 for U.S. and most of Canada, and
1-480-792-7302 for the rest of the world.
042003
MCRF200
DS21219H-page 20
2003 Microchip Technology Inc.
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To:
Technical Publications Manager
RE:
Reader Response
Total Pages Sent ________
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
Application (optional):
Would you like a reply? Y N
Device: Literature
Number:
Questions:
FAX: (______) _________ - _________
DS21219H
MCRF200
1.
What are the best features of this document?
2.
How does this document meet your hardware and software development needs?
3.
Do you find the organization of this document easy to follow? If not, why?
4.
What additions to the document do you think would enhance the structure and subject?
5.
What deletions from the document could be made without affecting the overall usefulness?
6.
Is there any incorrect or misleading information (what and where)?
7.
How would you improve this document?
2003 Microchip Technology Inc.
DS21219H-page 21
MCRF200
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
.
Sales and Support
PART NO.
X
/XX
XXX
Configuration/SQTP code
Package
Temperature
Range
Device
Device
MCRF200 = 125 kHz Contactless Programmable MicroIDTM
tag, 96/128-bit
Temperature Range
I
= -40
C to
+85
C
(Industrial)
Package
WF
=
Sawed wafer on frame (7 mil backgrind)
W
=
Wafer (11 mil backgrind)
S
=
Dice in waffle pack
P
=
Plastic PDIP (300 mil Body) 8-lead
SN
=
Plastic SOIC (150 mil Body) 8-lead
1M
=
0.40 mm (I0A2 package) COB Module w/1000 pF
capacitor
3M
=
0.40 mm (I0A2 package) COB Module with 330
pF capacitor
Configuration
Three-digit HEX value to be programmed into the configura-
tion register. Three HEX characters correspond to 12 binary
bits. These bits are programmed into the configuration
register MSB first (CB12, CB11...CB1). Refer to example.
SQTP Code
An assigned custom, 3-digit code used for tracking and
controlling production and customer data files for factory
programming. In this case the configuration code is not
shown in the part number, but is captured in the SQTP
documentation.
Examples:
a)
MCRF200-I/W00A = 125 kHz, industrial
temperature, wafer package, contactlessly
programmable, 96 bit, FSK Fc/8 Fc/10, direct
encoded, Fc/50 data return rate tag.
b)
MCRF200-I/WFQ23 = 125 kHz, industrial
temperature, wafer sawn and mounted on
frame, factory programmed.
The configuration register is:
CB12 CB11 CB10 CB9 CB8 CB7 CB6 CB5 CB4 CB3 CB2 CB1
0
0
0
0
0
0
0
0
1
0
1
0
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
Your local Microchip sales office
2.
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3.
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
MCRF200
DS21219H-page 22
2003 Microchip Technology Inc.
NOTES:
2003 Microchip Technology Inc.
DS21219H-page 23
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip's products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, K
EE
L
OQ
, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE and PowerSmart are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
AmpLab, FilterLab, micro
ID
, MXDEV, MXLAB, PICMASTER,
SEEVAL, SmartShunt and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Application Maestro, dsPICDEM, dsPICDEM.net,
dsPICworks, ECAN, ECONOMONITOR, FanSense,
FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP,
ICEPIC, microPort, Migratable Memory, MPASM, MPLIB,
MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICtail,
PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC,
Select Mode, SmartSensor, SmartTel and Total Endurance
are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
2003, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as "unbreakable."
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in October
2003 . The Company's quality system processes and procedures are
for its PICmicro
8-bit MCUs, K
EE
L
OQ
code hopping devices, Serial
EEPROMs, microperipherals, non-volatile memory and analog
products. In addition, Microchip's quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.
DS21219H-page 24
2003 Microchip Technology Inc.
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Atlanta
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Alpharetta, GA 30022
Tel: 770-640-0034
Fax: 770-640-0307
Boston
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Detroit
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Toronto
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82-2-558-5934
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Taiwan Branch
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EUROPE
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Denmark
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Tel: 44-118-921-5869
Fax: 44-118-921-5820
11/24/03
W
ORLDWIDE
S
ALES
AND
S
ERVICE
PDF 
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