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Электронный компонент: PIC16C620A-20E/SS

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1998 Microchip Technology Inc.
Preliminary
DS30235G-page 1
Devices included in this data sheet:
Referred to collectively as PIC16C62X .
PIC16C620
PIC16C620A
PIC16C621
PIC16C621A
PIC16C622
PIC16C622A
PIC16CR620A
High Performance RISC CPU:
Only 35 instructions to learn
All single-cycle instructions (200 ns), except for
program branches which are two-cycle
Operating speed:
- DC - 20 MHz clock input
- DC - 200 ns instruction cycle
Interrupt capability
16 special function hardware registers
8-level deep hardware stack
Direct, Indirect and Relative addressing modes
Peripheral Features:
13 I/O pins with individual direction control
High current sink/source for direct LED drive
Analog comparator module with:
- Two analog comparators
- Programmable on-chip voltage reference
(V
REF
) module
- Programmable input multiplexing from device
inputs and internal voltage reference
- Comparator outputs can be output signals
Timer0: 8-bit timer/counter with 8-bit
programmable prescaler
Special Microcontroller Features:
Power-on Reset (POR)
Power-up Timer (PWRT) and Oscillator Start-up
Timer (OST)
Brown-out Reset
Watchdog Timer (WDT) with its own on-chip RC
oscillator for reliable operation
Device
Program
Memory
Data
Memory
PIC16C620
512
80
PIC16C620A
512
96
PIC16CR620A
512
96
PIC16C621
1K
80
PIC16C621A
1K
96
PIC16C622
2K
128
PIC16C622A
2K
128
Pin Diagrams
Special Microcontroller Features (cont'd)
Programmable code protection
Power saving SLEEP mode
Selectable oscillator options
Serial in-circuit programming (via two pins)
Four user programmable ID locations
CMOS Technology:
Low-power, high-speed CMOS EPROM technol-
ogy
Fully static design
Wide operating voltage range
- PIC16C62X - 2.5V to 6.0V
- PIC16C62XA - 2.5V to 5.5V
- PIC16CR620A - 2.0V to 5.5V
Commercial, industrial and extended tempera-
ture range
Low power consumption
- < 2.0 mA @ 5.0V, 4.0 MHz
- 15
A typical @ 3.0V, 32 kHz
- < 1.0
A typical standby current @ 3.0V
RA1/AN1
RA0/AN0
OSC2/CLKOUT
V
DD
RB7
RB6
RB5
RB4
OSC1/CLKIN
RA2/AN2/V
REF
RA3/AN3
MCLR/V
PP
V
SS
RB0/INT
RB1
RB2
RB3
RA4/T0CKI
PIC16C62X
RA1/AN1
RA0/AN0
OSC2/CLKOUT
V
DD
RB7
RB6
RB5
RB4
OSC1/CLKIN
RA2/AN2/V
REF
RA3/AN3
MCLR/V
PP
V
SS
V
SS
RB0/INT
RB1
RB2
RA4/T0CKI
RB3
RB3
V
DD
PDIP, SOIC, Windowed CERDIP
SSOP
2
3
4
5
6
7
8
9
10
1
2
3
4
5
6
7
8
9
1
19
18
16
15
14
13
12
11
17
18
17
15
14
13
12
11
10
16
20
PIC16C62X
EPROM-Based 8-Bit CMOS Microcontroller
PIC16C62X
PIC16C62X
DS30235G-page 2
Preliminary
1998 Microchip Technology Inc.
Device Differences
Note 1:
If you change from this device to another device, please verify oscillator characteristics in your application.
Device
Voltage
Range
Oscillator
Process
Technology
(Microns)
PIC16C620
2.5 - 6.0
See Note 1
0.9
PIC16C621
2.5 - 6.0
See Note 1
0.9
PIC16C622
2.5 - 6.0
See Note 1
0.9
PIC16C620A
2.5 - 5.5
See Note 1
0.7
PIC16CR620A
2.0 - 5.5
See Note 1
0.7
PIC16C621A
2.5 - 5.5
See Note 1
0.7
PIC16C622A
2.5 - 5.5
See Note 1
0.7
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 3
PIC16C62X
Table of Contents
1.0
General Description......................................................................................................................................................................5
2.0
PIC16C62X Device Varieties .......................................................................................................................................................7
3.0
Architectural Overview .................................................................................................................................................................9
4.0
Memory Organization ................................................................................................................................................................ 13
5.0
I/O Ports .................................................................................................................................................................................... 25
6.0
Timer0 Module .......................................................................................................................................................................... 31
7.0
Comparator Module................................................................................................................................................................... 37
8.0
Voltage Reference Module........................................................................................................................................................ 43
9.0
Special Features of the CPU..................................................................................................................................................... 45
10.0
Instruction Set Summary ........................................................................................................................................................... 61
11.0
Development Support................................................................................................................................................................ 73
12.0
Electrical Specifications............................................................................................................................................................. 79
13.0
Device Characterization Information ......................................................................................................................................... 93
14.0
Packaging Information............................................................................................................................................................... 95
Appendix A:
Enhancements.......................................................................................................................................................... 101
Appendix B:
Compatibility ............................................................................................................................................................. 101
Appendix C:
What's New............................................................................................................................................................... 102
Appendix D:
What's Changed ....................................................................................................................................................... 102
Index .................................................................................................................................................................................................. 103
PIC16C62X Product Identification System ........................................................................................................................................ 107
To Our Valued Customers
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please check our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number. e.g., DS30000A is version A of document DS30000.
Errata
An errata sheet may exist for current devices, describing minor operational differences (from the data sheet) and recommended
workarounds. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revi-
sion of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
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Your local Microchip sales office (see last page)
The Microchip Corporate Literature Center; U.S. FAX: (602) 786-7277
When contacting a sales office or the literature center, please specify which device, revision of silicon and data sheet (include lit-
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Corrections to this Data Sheet
We constantly strive to improve the quality of all our products and documentation. We have spent a great deal of time to ensure
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We appreciate your assistance in making this a better document.
PIC16C62X
DS30235G-page 4
Preliminary
1998 Microchip Technology Inc.
NOTES:
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 5
PIC16C62X
1.0
GENERAL DESCRIPTION
The
PIC16C62X are 18 and 20 Pin
ROM/EPROM-based members of the versatile PICmi-
croTM family of low-cost, high-performance, CMOS,
fully-static, 8-bit microcontrollers.
All PICmicroTM microcontrollers employ an advanced
RISC architecture. The PIC16C62X have enhanced
core features, eight-level deep stack, and multiple inter-
nal and external interrupt sources. The separate
instruction and data buses of the Harvard architecture
allow a 14-bit wide instruction word with the separate
8-bit wide data. The two-stage instruction pipeline
allows all instructions to execute in a single-cycle,
except for program branches (which require two
cycles). A total of 35 instructions (reduced instruction
set) are available. Additionally, a large register set gives
some of the architectural innovations used to achieve a
very high performance.
PIC16C62X microcontrollers typically achieve a 2:1
code compression and a 4:1 speed improvement over
other 8-bit microcontrollers in their class.
The PIC16C620A, PIC16C621A and PIC16CR620A
have 96 bytes of RAM. The PIC16C622(A) has 128
bytes of RAM. Each device has 13 I/O pins and an 8-bit
timer/counter with an 8-bit programmable prescaler. In
addition, the PIC16C62X adds two analog comparators
with a programmable on-chip voltage reference mod-
ule. The comparator module is ideally suited for appli-
cations requiring a low-cost analog interface (e.g.,
battery chargers, threshold detectors, white goods
controllers, etc).
PIC16C62X devices have special features to reduce
external components, thus reducing system cost,
enhancing system reliability and reducing power con-
sumption. There are four oscillator options, of which the
single pin RC oscillator provides a low-cost solution,
the LP oscillator minimizes power consumption, XT is a
standard crystal, and the HS is for High Speed crystals.
The SLEEP (power-down) mode offers power savings.
The user can wake up the chip from SLEEP through
several external and internal interrupts and reset.
A highly reliable Watchdog Timer with its own on-chip
RC oscillator provides protection against software
lock- up.
A UV-erasable CERDIP-packaged version is ideal for
code development while the cost-effective One-Time
Programmable (OTP) version is suitable for production
in any volume.
Table 1-1 shows the features of the PIC16C62X
mid-range microcontroller families.
A simplified block diagram of the PIC16C62X is shown
in Figure 3-1.
The PIC16C62X series fit perfectly in applications
ranging from battery chargers to low-power remote
sensors. The EPROM technology makes customization
of application programs (detection levels, pulse gener-
ation, timers, etc.) extremely fast and convenient. The
small footprint packages make this microcontroller
series perfect for all applications with space limitations.
Low-cost, low-power, high-performance, ease of use
and I/O flexibility make the PIC16C62X very versatile.
1.1
Family and Upward Compatibility
Those users familiar with the PIC16C5X family of
microcontrollers will realize that this is an enhanced
version of the PIC16C5X architecture. Please refer to
Appendix A for a detailed list of enhancements. Code
written for the PIC16C5X can be easily ported to
PIC16C62X family of devices (Appendix B). The
PIC16C62X family fills the niche for users wanting to
migrate up from the PIC16C5X family and not needing
various peripheral features of other members of the
PIC16XX mid-range microcontroller family.
1.2
Development Support
The PIC16C62X family is supported by a full-featured
macro assembler, a software simulator, an in-circuit
emulator, a low-cost development programmer and a
full-featured programmer. A "C" compiler and fuzzy
logic support tools are also available.
PIC16C62X
DS30235G-page 6
Preliminary
1998 Microchip Technology Inc.
TABLE 1-1:
PIC16C62X FAMILY OF DEVICES
PIC16C620
PIC16C620A
PIC16CR620A
PIC16C621
PIC16C621A
PIC16C622
PIC16C622A
Clock
Maximum Frequency
of Operation (MHz)
20
20
20
20
20
20
20
Memory
EPROM Program
Memory
(x14 words)
512
512
512
1K
1K
2K
2K
Data Memory (bytes)
80
96
96
80
96
128
128
Peripherals
Timer Module(s)
TMR0
TMR0
TMRO
TMR0
TMR0
TMR0
TMR0
Comparators(s)
2
2
2
2
2
2
2
Internal Reference
Voltage
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Features
Interrupt Sources
4
4
4
4
4
4
4
I/O Pins
13
13
13
13
13
13
13
Voltage Range (Volts) 2.5-6.0
3.0-5.5
2.5-5.5
2.5-6.0
3.0-5.5
2.5-6.0
3.0-5.5
Brown-out Reset
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Packages
18-pin DIP,
SOIC;
20-pin SSOP
18-pin DIP,
SOIC;
20-pin SSOP
18-pin DIP,
SOIC;
20-pin SSOP
18-pin DIP,
SOIC;
20-pin SSOP
18-pin DIP,
SOIC;
20-pin SSOP
18-pin DIP,
SOIC;
20-pin SSOP
18-pin DIP,
SOIC;
20-pin SSOP
All PICmicroTM Family devices have Power-on Reset, selectable Watchdog Timer, selectable code protect and high
I/O current capability. All PIC16C62X Family devices use serial programming with clock pin RB6 and data pin RB7.
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 7
PIC16C62X
2.0
PIC16C62X DEVICE VARIETIES
A variety of frequency ranges and packaging options are
available. Depending on application and production
requirements the proper device option can be selected
using the information in the PIC16C62X Product
Identification System section at the end of this data
sheet. When placing orders, please use this page of the
data sheet to specify the correct part number.
2.1
UV Erasable Devices
The UV erasable version, offered in CERDIP package
is optimal for prototype development and pilot
programs. This version can be erased and
reprogrammed to any of the oscillator modes.
Microchip's PICSTART
and PRO
MATE
programmers both support programming of the
PIC16C62X.
2.2
One-Time-Programmable (OTP)
Devices
The availability of OTP devices is especially useful for
customers who need the flexibility for frequent code
updates and small volume applications. In addition to
the program memory, the configuration bits must also
be programmed.
2.3
Quick-Turnaround-Production (QTP)
Devices
Microchip offers a QTP Programming Service for
factory production orders. This service is made
available for users who chose not to program a medium
to high quantity of units and whose code patterns have
stabilized. The devices are identical to the OTP devices
but with all EPROM locations and configuration options
already programmed by the factory. Certain code and
prototype verification procedures apply before
production shipments are available. Please contact
your Microchip Technology sales office for more details.
2.4
Serialized
Quick-Turnaround-Production
(SQTP
SM
) Devices
Microchip offers a unique programming service where
a few user-defined locations in each device are
programmed with different serial numbers. The serial
numbers may be random, pseudo-random or
sequential.
Serial programming allows each device to have a
unique number which can serve as an entry-code,
password or ID number.
PIC16C62X
DS30235G-page 8
Preliminary
1998 Microchip Technology Inc.
NOTES:
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 9
PIC16C62X
3.0
ARCHITECTURAL OVERVIEW
The high performance of the PIC16C62X family can be
attributed to a number of architectural features
commonly found in RISC microprocessors. To begin
with, the PIC16C62X uses a Harvard architecture, in
which, program and data are accessed from separate
memories using separate busses. This improves
bandwidth over traditional von Neumann architecture
where program and data are fetched from the same
memory. Separating program and data memory further
allows instructions to be sized differently than 8-bit
wide data word. Instruction opcodes are 14-bits wide
making it possible to have all single word instructions.
A 14-bit wide program memory access bus fetches a
14-bit instruction in a single cycle. A two-stage pipeline
overlaps fetch and execution of instructions.
Consequently, all instructions (35) execute in a sin-
gle-cycle (200 ns @ 20 MHz) except for program
branches.
The PIC16C620A and PIC16CR620A address 512 x
14 on-chip program memory. The PIC16C621(A)
addresses 1K x 14 program memory. The
PIC16C622(A) addresses 2K x 14 program memory.
All program memory is internal.
The PIC16C62X can directly or indirectly address its
register files or data memory. All special function
registers including the program counter are mapped in
the data memory. The PIC16C62X have an orthogonal
(symmetrical) instruction set that makes it possible to
carry out any operation on any register using any
addressing mode. This symmetrical nature and lack of
`special optimal situations' make programming with the
PIC16C62X simple yet efficient. In addition, the
learning curve is reduced significantly.
The PIC16C62X devices contain an 8-bit ALU and
working register. The ALU is a general purpose
arithmetic unit. It performs arithmetic and Boolean
functions between data in the working register and any
register file.
The ALU is 8-bit wide and capable of addition,
subtraction, shift and logical operations. Unless
otherwise mentioned, arithmetic operations are two's
complement in nature. In two-operand instructions,
typically one operand is the working register
(W
register).
The other operand is a file register or an
immediate constant. In single operand instructions, the
operand is either the W register or a file register.
The W register is an 8-bit working register used for ALU
operations. It is not an addressable register.
Depending on the instruction executed, the ALU may
affect the values of the Carry (C), Digit Carry (DC), and
Zero (Z) bits in the STATUS register. The C and DC bits
operate as a Borrow and Digit Borrow out bit,
respectively, bit in subtraction. See the
SUBLW
and
SUBWF
instructions for examples.
A simplified block diagram is shown in Figure 3-1, with
a description of the device pins in Table 3-1.
PIC16C62X
DS30235G-page 10
Preliminary
1998 Microchip Technology Inc.
FIGURE 3-1:
BLOCK DIAGRAM
EPROM
Program
Memory
13
Data Bus
8
14
Program
Bus
Instruction reg
Program Counter
8 Level Stack
(13-bit)
RAM
File
Registers
Direct Addr
7
RAM Addr
(1)
9
Addr MUX
Indirect
Addr
FSR reg
STATUS reg
MUX
ALU
W reg
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
Instruction
Decode &
Control
Timing
Generation
OSC1/CLKIN
OSC2/CLKOUT
MCLR
V
DD
, V
SS
Voltage
Brown-out
Reset
Note 1:
Higher order bits are from the STATUS register.
Device
Program Memory
Data Memory
(RAM)
PIC16C620
PIC16C620A
PIC16CR620A
PIC16C621
PIC16C621A
PIC16C622
PIC16C622A
512 x 14
512 x 14
512 x 14
1K x 14
1K x 14
2K x 14
2K x 14
80 x 8
96 x 8
96 x 8
80 x 8
96 x 8
128 x 8
128 x 8
8
3
TMR0
I/O Ports
PORTB
Comparator
RA3/AN3
RA2/AN2/V
REF
RA1/AN1
RA0/AN0
Reference
RA4/T0CKI
+
-
+
-
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 11
PIC16C62X
TABLE 3-1:
PIC16C62X PINOUT DESCRIPTION
Name
DIP/
SOIC
Pin #
SSOP
Pin #
I/O/P
Type
Buffer
Type
Description
OSC1/CLKIN
16
18
I
ST/CMOS Oscillator crystal input/external clock source input.
OSC2/CLKOUT
15
17
O
--
Oscillator crystal output. Connects to crystal or resonator
in crystal oscillator mode. In RC mode, OSC2 pin outputs
CLKOUT which has 1/4 the frequency of OSC1, and
denotes the instruction cycle rate.
MCLR/V
PP
4
4
I/P
ST
Master clear (reset) input/programming voltage input.
This pin is an active low reset to the device.
PORTA is a bi-directional I/O port.
RA0/AN0
17
19
I/O
ST
Analog comparator input
RA1/AN1
18
20
I/O
ST
Analog comparator input
RA2/AN2/V
REF
1
1
I/O
ST
Analog comparator input or V
REF
output
RA3/AN3
2
2
I/O
ST
Analog comparator input /output
RA4/T0CKI
3
3
I/O
ST
Can be selected to be the clock input to the Timer0
timer/counter or a comparator output. Output is open
drain type.
PORTB is a bi-directional I/O port. PORTB can be
software programmed for internal weak pull-up on all
inputs.
RB0/INT
6
7
I/O
TTL/ST
(1)
RB0/INT can also be selected as an external
interrupt pin.
RB1
7
8
I/O
TTL
RB2
8
9
I/O
TTL
RB3
9
10
I/O
TTL
RB4
10
11
I/O
TTL
Interrupt on change pin.
RB5
11
12
I/O
TTL
Interrupt on change pin.
RB6
12
13
I/O
TTL/ST
(2)
Interrupt on change pin. Serial programming clock.
RB7
13
14
I/O
TTL/ST
(2)
Interrupt on change pin. Serial programming data.
V
SS
5
5,6
P
--
Ground reference for logic and I/O pins.
V
DD
14
15,16
P
--
Positive supply for logic and I/O pins.
Legend:
O = output
I/O = input/output
P = power
-- = Not used
I = Input
ST = Schmitt Trigger input
TTL = TTL input
Note 1: This buffer is a Schmitt Trigger input when configured as the external interrupt.
Note 2: This buffer is a Schmitt Trigger input when used in serial programming mode.
PIC16C62X
DS30235G-page 12
Preliminary
1998 Microchip Technology Inc.
3.1
Clocking Scheme/Instruction Cycle
The clock input (OSC1/CLKIN pin) is internally divided
by four to generate four non-overlapping quadrature
clocks namely Q1, Q2, Q3 and Q4. Internally, the
program counter (PC) is incremented every Q1, the
instruction is fetched from the program memory and
latched into the instruction register in Q4. The
instruction is decoded and executed during the
following Q1 through Q4. The clocks and instruction
execution flow is shown in Figure 3-2.
3.2
Instruction Flow/Pipelining
An "Instruction Cycle" consists of four Q cycles (Q1,
Q2, Q3 and Q4). The instruction fetch and execute are
pipelined such that fetch takes one instruction cycle
while decode and execute takes another instruction
cycle. However, due to the pipelining, each instruction
effectively executes in one cycle. If an instruction
causes the program counter to change (e.g.,
GOTO
)
then two cycles are required to complete the instruction
(Example 3-1).
A fetch cycle begins with the program counter (PC)
incrementing in Q1.
In the execution cycle, the fetched instruction is latched
into the "Instruction Register (IR)" in cycle Q1. This
instruction is then decoded and executed during the
Q2, Q3, and Q4 cycles. Data memory is read during Q2
(operand read) and written during Q4 (destination
write).
FIGURE 3-2:
CLOCK/INSTRUCTION CYCLE
EXAMPLE 3-1:
INSTRUCTION PIPELINE FLOW
Q1
Q2
Q3
Q4
Q1
Q2
Q3
Q4
Q1
Q2
Q3
Q4
OSC1
Q1
Q2
Q3
Q4
PC
OSC2/CLKOUT
(RC mode)
PC
PC+1
PC+2
Fetch INST (PC)
Execute INST (PC-1)
Fetch INST (PC+1)
Execute INST (PC)
Fetch INST (PC+2)
Execute INST (PC+1)
Internal
phase
clock
All instructions are single cycle, except for any program branches. These take two cycles since the fetch
instruction is "flushed" from the pipeline while the new instruction is being fetched and then executed.
1. MOVLW 55h
Fetch 1
Execute 1
2. MOVWF PORTB
Fetch 2
Execute 2
3. CALL SUB_1
Fetch 3
Execute 3
4. BSF PORTA, BIT3
Fetch 4
Flush
Fetch SUB_1 Execute SUB_1
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 13
PIC16C62X
4.0
MEMORY ORGANIZATION
4.1
Program Memory Organization
The PIC16C62X has a 13-bit program counter capable
of addressing an 8K x 14 program memory space. Only
the first 512 x 14 (0000h - 01FFh) for the
PIC16C620(A) and PIC16CR620, 1K x 14 (0000h -
03FFh) for the PIC16C621(A) and 2K x 14 (0000h -
07FFh) for the PIC16C622(A) are physically imple-
mented. Accessing a location above these boundaries
will cause a wrap-around within the first 512 x 14 space
(PIC16C(R)620(A)) or 1K x 14 space (PIC16C621(A))
or 2K x 14 space (PIC16C622(A)). The reset vector is
at 0000h and the interrupt vector is at 0004h
(Figure
4-1,
Figure
4-2,
Figure
4-3).
FIGURE 4-1:
PROGRAM MEMORY MAP
AND STACK FOR THE
PIC16C620/PIC16C620A/
PIC16CR620A
PC<12:0>
13
000h
0004
0005
01FFh
0200h
1FFFh
Stack Level 1
Stack Level 8
Reset Vector
Interrupt Vector
On-chip Program
Memory
CALL, RETURN
RETFIE, RETLW
Stack Level 2
FIGURE 4-2:
PROGRAM MEMORY MAP
AND STACK FOR THE
PIC16C621/PIC16C621A
FIGURE 4-3:
PROGRAM MEMORY MAP
AND STACK FOR THE
PIC16C622/PIC16C622A
PC<12:0>
13
000h
0004
0005
03FFh
0400h
1FFFh
Stack Level 1
Stack Level 8
Reset Vector
Interrupt Vector
On-chip Program
Memory
CALL, RETURN
RETFIE, RETLW
Stack Level 2
PC<12:0>
13
000h
0004
0005
07FFh
0800h
1FFFh
Stack Level 1
Stack Level 8
Reset Vector
Interrupt Vector
On-chip Program
Memory
CALL, RETURN
RETFIE, RETLW
Stack Level 2
PIC16C62X
DS30235G-page 14
Preliminary
1998 Microchip Technology Inc.
4.2
Data Memory Organization
The data memory (Figure 4-4, Figure 4-5, Figure 4-6 and
Figure 4-7) is partitioned into two Banks which contain the
general purpose registers and the special function regis-
ters. Bank 0 is selected when the RP0 bit is cleared. Bank
1 is selected when the RP0 bit (STATUS <5>) is set. The
Special Function Registers are located in the first 32 loca-
tions of each Bank. Register locations 20-7Fh (Bank0) on
the PIC16C620A/CR620A/621A and 20-7Fh (Bank0) and
A0-BFh (Bank1) on the PIC16C622 and PIC16C622A are
general purpose registers implemented as static RAM.
Some special purpose registers are mapped in Bank 1.
Addresses F0h-FFh of bank1 are implemented as common
ram and mapped back to addresses 70h-7Fh in bank0 on
the PIC16C620A/CR620A/621A/622A.
4.2.1
GENERAL PURPOSE REGISTER FILE
The register file is organized as 80 x 8 in the
PIC16C620/621, 96 x 8 in the
PIC16C620A/621A/CR620A and 128 x 8 in the
PIC16C622(A). Each is accessed either directly or indi-
rectly through the File Select Register FSR
(Section
4.4).
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 15
PIC16C62X
FIGURE 4-4:
DATA MEMORY MAP FOR
THE PIC16C620/621
INDF
(1)
TMR0
PCL
STATUS
FSR
PORTA
PORTB
PCLATH
INTCON
PIR1
CMCON
INDF
(1)
OPTION
PCL
STATUS
FSR
TRISA
TRISB
PCLATH
INTCON
PIE1
PCON
VRCON
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
0Ah
0Bh
0Ch
0Dh
0Eh
0Fh
10h
11h
12h
13h
14h
15h
16h
17h
18h
19h
1Ah
1Bh
1Ch
1Dh
1Eh
1Fh
80h
81h
82h
83h
84h
85h
86h
87h
88h
89h
8Ah
8Bh
8Ch
8Dh
8Eh
8Fh
90h
91h
92h
93h
94h
95h
96h
97h
98h
99h
9Ah
9Bh
9Ch
9Dh
9Eh
9Fh
20h
A0h
General
Purpose
Register
7Fh
FFh
Bank 0
Bank 1
File
Address
6Fh
70h
Unimplemented data memory locations, read as '0'.
Note 1:
Not a physical register.
File
Address
FIGURE 4-5:
DATA MEMORY MAP FOR
THE PIC16C622
INDF
(1)
TMR0
PCL
STATUS
FSR
PORTA
PORTB
PCLATH
INTCON
PIR1
CMCON
INDF
(1)
OPTION
PCL
STATUS
FSR
TRISA
TRISB
PCLATH
INTCON
PIE1
PCON
VRCON
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
0Ah
0Bh
0Ch
0Dh
0Eh
0Fh
10h
11h
12h
13h
14h
15h
16h
17h
18h
19h
1Ah
1Bh
1Ch
1Dh
1Eh
1Fh
80h
81h
82h
83h
84h
85h
86h
87h
88h
89h
8Ah
8Bh
8Ch
8Dh
8Eh
8Fh
90h
91h
92h
93h
94h
95h
96h
97h
98h
99h
9Ah
9Bh
9Ch
9Dh
9Eh
9Fh
20h
A0h
General
Purpose
Register
7Fh
FFh
Bank 0
Bank 1
File
Address
BFh
C0h
Unimplemented data memory locations, read as '0'.
Note 1:
Not a physical register.
File
Address
General
Purpose
Register
PIC16C62X
DS30235G-page 16
Preliminary
1998 Microchip Technology Inc.
FIGURE 4-6:
DATA MEMORY MAP FOR THE
PIC16C620A/
CR620A/621A
INDF
(1)
TMR0
PCL
STATUS
FSR
PORTA
PORTB
PCLATH
INTCON
PIR1
CMCON
INDF
(1)
OPTION
PCL
STATUS
FSR
TRISA
TRISB
PCLATH
INTCON
PIE1
PCON
VRCON
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
0Ah
0Bh
0Ch
0Dh
0Eh
0Fh
10h
11h
12h
13h
14h
15h
16h
17h
18h
19h
1Ah
1Bh
1Ch
1Dh
1Eh
1Fh
80h
81h
82h
83h
84h
85h
86h
87h
88h
89h
8Ah
8Bh
8Ch
8Dh
8Eh
8Fh
90h
91h
92h
93h
94h
95h
96h
97h
98h
99h
9Ah
9Bh
9Ch
9Dh
9Eh
9Fh
20h
A0h
General
Purpose
Register
7Fh
FFh
Bank 0
Bank 1
File
Address
6Fh
70h
Unimplemented data memory locations, read as '0'.
Note 1:
Not a physical register.
File
Address
Accesses
70h-7Fh
F0h
FIGURE 4-7:
DATA MEMORY MAP FOR
THE PIC16C622A
INDF
(1)
TMR0
PCL
STATUS
FSR
PORTA
PORTB
PCLATH
INTCON
PIR1
CMCON
INDF
(1)
OPTION
PCL
STATUS
FSR
TRISA
TRISB
PCLATH
INTCON
PIE1
PCON
VRCON
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
0Ah
0Bh
0Ch
0Dh
0Eh
0Fh
10h
11h
12h
13h
14h
15h
16h
17h
18h
19h
1Ah
1Bh
1Ch
1Dh
1Eh
1Fh
80h
81h
82h
83h
84h
85h
86h
87h
88h
89h
8Ah
8Bh
8Ch
8Dh
8Eh
8Fh
90h
91h
92h
93h
94h
95h
96h
97h
98h
99h
9Ah
9Bh
9Ch
9Dh
9Eh
9Fh
20h
A0h
General
Purpose
Register
7Fh
FFh
Bank 0
Bank 1
File
Address
BFh
C0h
Unimplemented data memory locations, read as '0'.
Note 1:
Not a physical register.
File
Address
General
Purpose
Register
Accesses
70h-7Fh
F0h
6Fh
70h
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 17
PIC16C62X
4.2.2
SPECIAL FUNCTION REGISTERS
The special function registers are registers used by the
CPU and Peripheral functions for controlling the
desired operation of the device (Table 4-1). These
registers are static RAM.
The special registers can be classified into two sets
(core and peripheral). The special function registers
associated with the "core" functions are described in
this section. Those related to the operation of the
peripheral features are described in the section of that
peripheral feature.
TABLE 4-1:
SPECIAL REGISTERS FOR THE PIC16C62X
Address Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on
POR Reset
Value on all
other
resets
(1)
Bank 0
00h
INDF
Addressing this location uses contents of FSR to address data memory (not a physical
register)
xxxx xxxx
xxxx xxxx
01h
TMR0
Timer0 Module's Register
xxxx xxxx
uuuu uuuu
02h
PCL
Program Counter's (PC) Least Significant Byte
0000 0000
0000 0000
03h
STATUS
IRP
(2)
RP1
(2)
RP0
TO
PD
Z
DC
C
0001 1xxx
000q quuu
04h
FSR
Indirect data memory address pointer
xxxx xxxx
uuuu uuuu
05h
PORTA
--
--
--
RA4
RA3
RA2
RA1
RA0
---x 0000
---u 0000
06h
PORTB
RB7
RB6
RB5
RB4
RB3
RB2
RB1
RB0
xxxx xxxx
uuuu uuuu
07h
Unimplemented
--
--
08h
Unimplemented
--
--
09h
Unimplemented
--
--
0Ah
PCLATH
--
--
--
Write buffer for upper 5 bits of program counter
---0 0000
---0 0000
0Bh
INTCON
GIE
PEIE
T0IE
INTE
RBIE
T0IF
INTF
RBIF
0000 000x
0000 000u
0Ch
PIR1
--
CMIF
--
--
--
--
--
--
-0-- ----
-0-- ----
0Dh-1Eh
Unimplemented
--
--
1Fh
CMCON
C2OUT
C1OUT
--
--
CIS
CM2
CM1
CM0
00-- 0000
00-- 0000
Bank 1
80h
INDF
Addressing this location uses contents of FSR to address data memory (not a physical
register)
xxxx xxxx
xxxx xxxx
81h
OPTION
RBPU
INTEDG
T0CS
T0SE
PSA
PS2
PS1
PS0
1111 1111
1111 1111
82h
PCL
Program Counter's (PC) Least Significant Byte
0000 0000
0000 0000
83h
STATUS
IRP
(2)
RP1
(2)
RP0
TO
PD
Z
DC
C
0001 1xxx
000q quuu
84h
FSR
Indirect data memory address pointer
xxxx xxxx
uuuu uuuu
85h
TRISA
--
--
--
TRISA4
TRISA3
TRISA2
TRISA1
TRISA0
---1 1111
---1 1111
86h
TRISB
TRISB7
TRISB6
TRISB5
TRISB4
TRISB3
TRISB2
TRISB1
TRISB0
1111 1111
1111 1111
87h
Unimplemented
--
--
88h
Unimplemented
--
--
89h
Unimplemented
--
--
8Ah
PCLATH
--
--
--
Write buffer for upper 5 bits of program counter
---0 0000
---0 0000
8Bh
INTCON
GIE
PEIE
T0IE
INTE
RBIE
T0IF
INTF
RBIF
0000 000x
0000 000u
8Ch
PIE1
--
CMIE
--
--
--
--
--
--
-0-- ----
-0-- ----
8Dh
Unimplemented
--
--
8Eh
PCON
--
--
--
--
--
--
POR
BOR
---- --0x
---- --uq
8Fh-9Eh
Unimplemented
--
--
9Fh
VRCON
VREN
VROE
VRR
--
VR3
VR2
VR1
VR0
000- 0000
000- 0000
Legend:
--
= Unimplemented locations read as `0',
u
= unchanged,
x
= unknown,
q
= value depends on condition,
shaded = unimplemented
Note 1: Other (non power-up) resets include MCLR reset, Brown-out Reset and Watchdog Timer Reset during
normal operation.
Note 2: IRP & RPI bits are reserved, always maintain these bits clear.
PIC16C62X
DS30235G-page 18
Preliminary
1998 Microchip Technology Inc.
4.2.2.1
STATUS REGISTER
The STATUS register, shown in Figure 4-8, contains
the arithmetic status of the ALU, the RESET status and
the bank select bits for data memory.
The STATUS register can be the destination for any
instruction, like any other register. If the STATUS
register is the destination for an instruction that affects
the Z, DC or C bits, then the write to these three bits is
disabled. These bits are set or cleared according to the
device logic. Furthermore, the TO and PD bits are not
writable. Therefore, the result of an instruction with the
STATUS register as destination may be different than
intended.
For example,
CLRF STATUS
will clear the upper-three
bits and set the Z bit. This leaves the status register as
000uu1uu
(where
u
= unchanged).
It is recommended, therefore, that only
BCF, BSF,
SWAPF
and
MOVWF
instructions are used to alter the
STATUS register because these instructions do not
affect any status bit. For other instructions, not affecting
any status bits, see the "Instruction Set Summary".
Note 1:
The IRP and RP1 bits (STATUS<7:6>)
are not used by the PIC16C62X and
should be programmed as '0'. Use of
these bits as general purpose R/W bits
is NOT recommended, since this may
affect upward compatibility with future
products.
Note 2:
The C and DC bits operate as a Borrow
and Digit Borrow out bit, respectively, in
subtraction. See the
SUBLW
and
SUBWF
instructions for examples.
FIGURE 4-8:
STATUS REGISTER (ADDRESS 03H OR 83H)
Reserved Reserved
R/W-0
R-1
R-1
R/W-x
R/W-x
R/W-x
IRP
RP1
RP0
TO
PD
Z
DC
C
R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as `0'
- n = Value at POR reset
-x = Unknown at POR reset
bit7
bit0
bit 7:
IRP: Register Bank Select bit (used for indirect addressing)
1 = Bank 2, 3 (100h - 1FFh)
0 = Bank 0, 1 (00h - FFh)
The IRP bit is reserved on the PIC16C62X, always maintain this bit clear.
bit 6-5: RP1:RP0: Register Bank Select bits (used for direct addressing)
11
= Bank 3 (180h - 1FFh)
10
= Bank 2 (100h - 17Fh)
01
= Bank 1 (80h - FFh)
00
= Bank 0 (00h - 7Fh)
Each bank is 128 bytes. The RP1 bit is reserved on the PIC16C62X, always maintain this bit clear.
bit 4:
TO: Time-out bit
1 = After power-up,
CLRWDT
instruction, or
SLEEP
instruction
0 = A WDT time-out occurred
bit 3:
PD: Power-down bit
1 = After power-up or by the
CLRWDT
instruction
0 = By execution of the
SLEEP
instruction
bit 2:
Z: Zero bit
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
bit 1:
DC: Digit carry/borrow bit (
ADDWF
,
ADDLW,SUBLW,SUBWF
instructions)(for borrow the polarity is reversed)
1 = A carry-out from the 4th low order bit of the result occurred
0 = No carry-out from the 4th low order bit of the result
bit 0:
C: Carry/borrow bit (
ADDWF
,
ADDLW,SUBLW,SUBWF
instructions)
1 = A carry-out from the most significant bit of the result occurred
0 = No carry-out from the most significant bit of the result occurred
Note: For borrow the polarity is reversed. A subtraction is executed by adding the two's complement of the
second operand. For rotate (
RRF
,
RLF
) instructions, this bit is loaded with either the high or low order bit of
the source register.
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 19
PIC16C62X
4.2.2.2
OPTION REGISTER
The OPTION register is a readable and writable
register which contains various control bits to configure
the TMR0/WDT prescaler, the external RB0/INT
interrupt,
TMR0, and the weak pull-ups on PORTB.
Note: To achieve a 1:1 prescaler assignment for
TMR0, assign the prescaler to the WDT
(PSA = 1).
FIGURE 4-9:
OPTION REGISTER (ADDRESS 81H)
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
RBPU
INTEDG
T0CS
T0SE
PSA
PS2
PS1
PS0
R
= Readable bit
W = Writable bit
- n = Value at POR reset
bit7
bit0
bit 7:
RBPU: PORTB Pull-up Enable bit
1 = PORTB pull-ups are disabled
0 = PORTB pull-ups are enabled by individual port latch values
bit 6:
INTEDG: Interrupt Edge Select bit
1 = Interrupt on rising edge of RB0/INT pin
0 = Interrupt on falling edge of RB0/INT pin
bit 5:
T0CS: TMR0 Clock Source Select bit
1 = Transition on RA4/T0CKI pin
0 = Internal instruction cycle clock (CLKOUT)
bit 4:
T0SE: TMR0 Source Edge Select bit
1 = Increment on high-to-low transition on RA4/T0CKI pin
0 = Increment on low-to-high transition on RA4/T0CKI pin
bit 3:
PSA: Prescaler Assignment bit
1 = Prescaler is assigned to the WDT
0 = Prescaler is assigned to the Timer0 module
bit 2-0: PS2:PS0: Prescaler Rate Select bits
000
001
010
011
100
101
110
111
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
1 : 256
1 : 1
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
Bit Value
TMR0 Rate
WDT Rate
PIC16C62X
DS30235G-page 20
Preliminary
1998 Microchip Technology Inc.
4.2.2.3
INTCON REGISTER
The INTCON register is a readable and writable
register which contains the various enable and flag bits
for all interrupt sources except the comparator module.
See Section 4.2.2.4 and Section
4.2.2.5 for a
description of the comparator enable and flag bits.
Note:
Interrupt flag bits get set when an interrupt
condition occurs regardless of the state of
its corresponding enable bit or the global
enable bit, GIE (INTCON<7>).
FIGURE 4-10: INTCON REGISTER (ADDRESS 0BH OR 8BH)
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-x
GIE
PEIE
T0IE
INTE
RBIE
T0IF
INTF
RBIF
R
= Readable bit
W = Writable bit
U
= Unimplemented bit,
read as `0'
- n = Value at POR reset
-x = Unknown at POR reset
bit7
bit0
bit 7:
GIE: Global Interrupt Enable bit
1 = Enables all un-masked interrupts
0 = Disables all interrupts
bit 6:
PEIE: Peripheral Interrupt Enable bit
1 = Enables all un-masked peripheral interrupts
0 = Disables all peripheral interrupts
bit 5:
T0IE: TMR0 Overflow Interrupt Enable bit
1 = Enables the TMR0 interrupt
0 = Disables the TMR0 interrupt
bit 4:
INTE: RB0/INT External Interrupt Enable bit
1 = Enables the RB0/INT external interrupt
0 = Disables the RB0/INT external interrupt
bit 3:
RBIE: RB Port Change Interrupt Enable bit
1 = Enables the RB port change interrupt
0 = Disables the RB port change interrupt
bit 2:
T0IF: TMR0 Overflow Interrupt Flag bit
1 = TMR0 register has overflowed (must be cleared in software)
0 = TMR0 register did not overflow
bit 1:
INTF: RB0/INT External Interrupt Flag bit
1 = The RB0/INT external interrupt occurred (must be cleared in software)
0 = The RB0/INT external interrupt did not occur
bit 0:
RBIF: RB Port Change Interrupt Flag bit
1 = When at least one of the RB7:RB4 pins changed state (must be cleared in software)
0 = None of the RB7:RB4 pins have changed state
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 21
PIC16C62X
4.2.2.4
PIE1 REGISTER
This register contains the individual enable bit for the
comparator interrupt.
FIGURE 4-11: PIE1 REGISTER (ADDRESS 8CH)
4.2.2.5
PIR1 REGISTER
This register contains the individual flag bit for the
comparator interrupt.
FIGURE 4-12: PIR1 REGISTER (ADDRESS 0CH)
U-0
R/W-0
U-0
U-0
U-0
U-0
U-0
U-0
--
CMIE
--
--
--
--
--
--
R
= Readable bit
W = Writable bit
U
= Unimplemented bit,
read as `0'
- n = Value at POR reset
bit7
bit0
bit 7:
Unimplemented: Read as '0'
bit 6:
CMIE: Comparator Interrupt Enable bit
1 = Enables the Comparator interrupt
0 = Disables the Comparator interrupt
bit 5-0: Unimplemented: Read as '0'
Note:
Interrupt flag bits get set when an interrupt
condition occurs regardless of the state of
its corresponding enable bit or the global
enable bit, GIE (INTCON<7>). User
software should ensure the appropriate
interrupt flag bits are clear prior to enabling
an interrupt.
U-0
R/W-0
U-0
U-0
U-0
U-0
U-0
U-0
--
CMIF
--
--
--
--
--
--
R
= Readable bit
W = Writable bit
U
= Unimplemented bit,
read as `0'
- n = Value at POR reset
bit7
bit0
bit 7:
Unimplemented: Read as'0'
bit 6:
CMIF: Comparator Interrupt Flag bit
1 = Comparator input has changed
0 = Comparator input has not changed
bit 5-0: Unimplemented: Read as '0'
PIC16C62X
DS30235G-page 22
Preliminary
1998 Microchip Technology Inc.
4.2.2.6
PCON REGISTER
The PCON register contains flag bits to differentiate
between a Power-on Reset, an external MCLR reset,
WDT reset or a Brown-out Reset.
Note: BOR is unknown on Power-on Reset. It
must then be set by the user and checked
on subsequent resets to see if BOR is
cleared, indicating a brown-out has
occurred.
The
BOR status bit is a "don't
care" and is not necessarily predictable if
the brown-out circuit is disabled (by
programming BOREN bit in the
Configuration word).
FIGURE 4-13: PCON REGISTER (ADDRESS 8Eh)
U-0
U-0
U-0
U-0
U-0
U-0
R/W-0
R/W-0
--
--
--
--
--
--
POR
BOR
R
= Readable bit
W = Writable bit
U
= Unimplemented bit,
read as `0'
- n = Value at POR reset
bit7
bit0
bit 7-2:
Unimplemented: Read as '0'
bit 1:
POR: Power-on Reset Status bit
1 = No Power-on Reset occurred
0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)
bit 0:
BOR: Brown-out Reset Status bit
1 = No Brown-out Reset occurred
0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs)
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 23
PIC16C62X
4.3
PCL and PCLATH
The program counter (PC) is 13-bits wide. The low byte
comes from the PCL register, which is a readable and
writable register. The high byte (PC<12:8>) is not directly
readable or writable and comes from PCLATH. On any
reset, the PC is cleared. Figure 4-14 shows the two
situations for the loading of the PC. The upper example in
the figure shows how the PC is loaded on a write to PCL
(PCLATH<4:0>
PCH). The lower example in the figure
shows how the PC is loaded during a
CALL
or
GOTO
instruction (PCLATH<4:3>
PCH).
FIGURE 4-14: LOADING OF PC IN
DIFFERENT SITUATIONS
4.3.1
COMPUTED GOTO
A computed GOTO is accomplished by adding an
offset to the program counter (
ADDWF PCL
). When doing
a table read using a computed GOTO method, care
should be exercised if the table location crosses a PCL
memory boundary (each 256 byte block). Refer to the
application note
"Implementing a Table Read" (AN556).
PC
12
8
7
0
5
PCLATH<4:0>
PCLATH
Instruction with
ALU result
GOTO, CALL
Opcode <10:0>
8
PC
12
11 10
0
11
PCLATH<4:3>
PCH
PCL
8
7
2
PCLATH
PCH
PCL
PCL as
Destination
4.3.2
STACK
The PIC16C62X family has an 8 level deep x 13-bit
wide hardware stack (Figure 4-2 and Figure 4-3). The
stack space is not part of either program or data space
and the stack pointer is not readable or writable. The
PC is PUSHed onto the stack when a
CALL
instruction
is executed or an interrupt causes a branch. The stack
is POPed in the event of a
RETURN, RETLW
or a
RETFIE
instruction execution. PCLATH is not affected by a
PUSH or POP operation.
The stack operates as a circular buffer. This means that
after the stack has been PUSHed eight times, the ninth
push overwrites the value that was stored from the first
push. The tenth push overwrites the second push (and
so on).
Note 1:
There are no STATUS bits to indicate
stack overflow or stack underflow
conditions.
Note 2:
There are no instructions/mnemonics
called PUSH or POP. These are actions
that occur from the execution of the
CALL, RETURN, RETLW
and
RETFIE
instructions, or the vectoring to an
interrupt address.
PIC16C62X
DS30235G-page 24
Preliminary
1998 Microchip Technology Inc.
4.4
Indirect Addressing, INDF and FSR
Registers
The INDF register is not a physical register. Addressing
the INDF register will cause indirect addressing.
Indirect addressing is possible by using the INDF reg-
ister. Any instruction using the INDF register actually
accesses data pointed to by the file select register
(FSR). Reading INDF itself indirectly will produce 00h.
Writing to the INDF register indirectly results in a
no-operation (although status bits may be affected). An
effective 9-bit address is obtained by concatenating the
8-bit FSR register and the IRP bit (STATUS<7>), as
shown in Figure 4-15. However, IRP is not used in the
PIC16C62X.
A simple program to clear RAM location 20h-2Fh using
indirect addressing is shown in Example 4-1.
EXAMPLE 4-1:
INDIRECT ADDRESSING
movlw
0x20
;initialize pointer
movwf
FSR
;to RAM
NEXT
clrf
INDF
;clear INDF register
incf
FSR
;inc pointer
btfss
FSR,4
;all done?
goto
NEXT
;no clear next
;yes continue
CONTINUE:
FIGURE 4-15: DIRECT/INDIRECT ADDRESSING PIC16C62X
For memory map detail see (Figure 4-4, Figure 4-5, Figure 4-6 and Figure 4-7).
Note 1: The RP1 and IRP bits are reserved, always maintain these bits clear.
Data
Memory
Indirect Addressing
Direct Addressing
bank select
location select
(1)
RP1 RP0
6
0
from opcode
IRP
(1)
FSR register
7
0
bank select
location select
00
01
10
11
180h
1FFh
00h
7Fh
Bank 0
Bank 1
Bank 2
Bank 3
not used
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 25
PIC16C62X
5.0
I/O PORTS
The PIC16C62X have two ports, PORTA and PORTB.
Some pins for these I/O ports are multiplexed with an
alternate function for the peripheral features on the
device. In general, when a peripheral is enabled, that
pin may not be used as a general purpose I/O pin.
5.1
PORTA and TRISA Registers
PORTA is a 5-bit wide latch. RA4 is a Schmitt Trigger input
and an open drain output. Port RA4 is multiplexed with the
T0CKI clock input. All other RA port pins have Schmitt
Trigger input levels and full CMOS output drivers. All pins
have data direction bits (TRIS registers) which can config-
ure these pins as input or output.
A '1' in the TRISA register puts the corresponding output
driver in a hi- impedance mode. A '0' in the TRISA register
puts the contents of the output latch on the selected pin(s).
Reading the PORTA register reads the status of the pins
whereas writing to it will write to the port latch. All write
operations are read-modify-write operations. So a write
to a port implies that the port pins are first read, then this
value is modified and written to the port data latch.
The PORTA pins are multiplexed with comparator and
voltage reference functions. The operation of these
pins are selected by control bits in the CMCON
(comparator control register) register and the VRCON
(voltage reference control register) register. When
selected as a comparator input, these pins will read
as '0's.
FIGURE 5-1:
BLOCK DIAGRAM OF
RA1:RA0 PINS
Note: I/O pins have protection diodes to V
DD
and V
SS
.
Data
bus
Q
D
Q
CK
P
N
WR
PortA
WR
TRISA
Data Latch
TRIS Latch
RD TRISA
RD PORTA
Analog
V
SS
V
DD
I/O Pin
Q
D
Q
CK
Input Mode
D
Q
EN
To Comparator
Schmitt Trigger
Input Buffer
TRISA controls the direction of the RA pins, even when
they are being used as comparator inputs. The user
must make sure to keep the pins configured as inputs
when using them as comparator inputs.
The RA2 pin will also function as the output for the
voltage reference. When in this mode, the V
REF
pin is a
very high impedance output. The user must configure
TRISA<2> bit as an input and use high impedance
loads.
In one of the comparator modes defined by the
CMCON register, pins RA3 and RA4 become outputs
of the comparators. The TRISA<4:3> bits must be
cleared to enable outputs to use this function.
EXAMPLE 5-1:
INITIALIZING PORTA
FIGURE 5-2:
BLOCK DIAGRAM OF RA2 PIN
Note:
On reset, the TRISA register is set to all
inputs. The digital inputs are disabled and
the comparator inputs are forced to ground
to reduce excess current consumption.
CLRF
PORTA
;Initialize PORTA by setting
;output data latches
MOVLW 0X07
;Turn comparators off and
MOVWF CMCON
;enable pins for I/O
;functions
BSF
STATUS, RP0 ;Select Bank1
MOVLW 0x1F
;Value used to initialize
;data direction
MOVWF TRISA
;Set RA<4:0> as inputs
;TRISA<7:5> are always
;read as '0'.
Note: I/O pins have protection diodes to V
DD
and V
SS
.
Data
bus
Q
D
Q
CK
P
N
WR
PortA
WR
TRISA
Data Latch
TRIS Latch
RD TRISA
RD PORTA
Analog
V
SS
V
DD
RA2 Pin
Q
D
Q
CK
Input Mode
D
Q
EN
To Comparator
Schmitt Trigger
Input Buffer
V
ROE
V
REF
PIC16C62X
DS30235G-page 26
Preliminary
1998 Microchip Technology Inc.
FIGURE 5-3:
BLOCK DIAGRAM OF RA3 PIN
FIGURE 5-4:
BLOCK DIAGRAM OF RA4 PIN
Data
bus
Q
D
Q
CK
P
N
WR
PortA
WR
TRISA
Data Latch
TRIS Latch
RD TRISA
RD PORTA
Analog
V
SS
V
DD
RA3 Pin
Q
D
Q
CK
D
Q
EN
To Comparator
Schmitt Trigger
Input Buffer
Input Mode
Comparator Output
Comparator Mode = 110
Note:
I/O pins have protection diodes to VDD and VSS
Data
bus
Q
D
Q
CK
N
WR
PortA
WR
TRISA
Data Latch
TRIS Latch
RD TRISA
RD PORTA
V
SS
RA4 Pin
Q
D
Q
CK
D
Q
EN
TMR0 Clock Input
Schmitt Trigger
Input Buffer
Comparator Output
Comparator Mode = 110
Note:
RA4 has protection diodes to VSS only
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 27
PIC16C62X
TABLE 5-1:
PORTA FUNCTIONS
TABLE 5-2:
SUMMARY OF REGISTERS ASSOCIATED WITH PORTA
Name
Bit #
Buffer
Type
Function
RA0/AN0
bit0
ST
Input/output or comparator input
RA1/AN1
bit1
ST
Input/output or comparator input
RA2/AN2/V
REF
bit2
ST
Input/output or comparator input or V
REF
output
RA3/AN3
bit3
ST
Input/output or comparator input/output
RA4/T0CKI
bit4
ST
Input/output or external clock input for TMR0 or comparator output.
Output is open drain type.
Legend: ST = Schmitt Trigger input
Address Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on
POR
Value on
All Other
Resets
05h
PORTA
--
--
--
RA4
RA3
RA2
RA1
RA0
---x 0000
---u 0000
85h
TRISA
--
--
--
TRISA4
TRISA3
TRISA2
TRISA1
TRISA0
---1 1111
---1 1111
1Fh
CMCON
C2OUT
C1OUT
--
--
CIS
CM2
CM1
CM0
00-- 0000
00-- 0000
9Fh
VRCON
VREN
VROE
VRR
--
VR3
VR2
VR1
VR0
000- 0000
000- 0000
Legend: -- = Unimplemented locations, read as `0', u = unchanged, x = unknown
Note:
Note: Shaded bits are not used by PORTA.
PIC16C62X
DS30235G-page 28
Preliminary
1998 Microchip Technology Inc.
5.2
PORTB and TRISB Registers
PORTB is an 8-bit wide bi-directional port. The
corresponding data direction register is TRISB. A '1' in
the TRISB register puts the corresponding output driver
in a high impedance mode. A '0' in the TRISB register
puts the contents of the output latch on the selected
pin(s).
Reading PORTB register reads the status of the pins,
whereas writing to it will write to the port latch. All write
operations are read-modify-write operations. So a write
to a port implies that the port pins are first read, then
this value is modified and written to the port data latch.
Each of the PORTB pins has a weak internal pull-up
(
200
A typical). A single control bit can turn on all the
pull-ups. This is done by clearing the RBPU
(OPTION<7>) bit. The weak pull-up is automatically
turned off when the port pin is configured as an output.
The pull-ups are disabled on Power-on Reset.
Four of PORTB's pins, RB7:RB4, have an interrupt on
change feature. Only pins configured as inputs can
cause this interrupt to occur (i.e., any RB7:RB4 pin
configured as an output is excluded from the interrupt
on change comparison). The input pins (of RB7:RB4)
are compared with the old value latched on the last
read of PORTB. The "mismatch" outputs of RB7:RB4
are OR'ed together to generate the RBIF interrupt (flag
latched in INTCON<0>).
FIGURE 5-5:
BLOCK DIAGRAM OF
RB7:RB4 PINS
Data Latch
From other
RBPU
(2)
P
V
DD
I/O
Q
D
CK
Q
D
CK
Q
D
EN
Q
D
EN
Data bus
WR PortB
WR TRISB
Set RBIF
TRIS Latch
RD TRISB
RD PortB
RB7:RB4 pins
weak
pull-up
RD Port
Latch
TTL
Input
Buffer
pin
(1)
Note 1: I/O pins have diode protection to V
DD
and V
SS
.
Note 2: TRISB = 1 enables weak pull-up if RBPU = '0'
(OPTION<7>).
ST
Buffer
RB7:RB6 in serial programming mode
Q
Q
This interrupt can wake the device from SLEEP. The
user, in the interrupt service routine, can clear the
interrupt in the following manner:
a)
Any read or write of PORTB. This will end the
mismatch condition.
b)
Clear flag bit RBIF.
A mismatch condition will continue to set flag bit RBIF.
Reading PORTB will end the mismatch condition, and
allow flag bit RBIF to be cleared.
This interrupt on mismatch feature, together with
software configurable pull-ups on these four pins allow
easy interface to a key pad and make it possible for
wake-up on key-depression. (See AN552 in the
Microchip
Embedded Control Handbook.)
The interrupt on change feature is recommended for
wake-up on key depression operation and operations
where PORTB is only used for the interrupt on change
feature. Polling of PORTB is not recommended while
using the interrupt on change feature.
FIGURE 5-6:
BLOCK DIAGRAM OF
RB3:RB0 PINS
Note:
If a change on the I/O pin should occur
when the read operation is being executed
(start of the Q2 cycle), then the RBIF inter-
rupt flag may not get set.
Data Latch
RBPU
(2)
P
V
DD
Q
D
CK
D
CK
Q
D
EN
Data bus
WR PortB
WR TRISB
RD TRISB
RD PortB
weak
pull-up
RD Port
RB0/INT
I/O
pin
(1)
TTL
Input
Buffer
Note 1: I/O pins have diode protection to V
DD
and V
SS
.
Note 2: TRISB = 1 enables weak pull-up if RBPU = '0'
(OPTION<7>).
ST
Buffer
Q
Q
Q
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 29
PIC16C62X
TABLE 5-3:
PORTB FUNCTIONS
TABLE 5-4:
SUMMARY OF REGISTERS ASSOCIATED WITH PORTB
Name
Bit #
Buffer Type
Function
RB0/INT
bit0
TTL/ST
(1)
Input/output or external interrupt input. Internal software programmable
weak pull-up.
RB1
bit1
TTL
Input/output pin. Internal software programmable weak pull-up.
RB2
bit2
TTL
Input/output pin. Internal software programmable weak pull-up.
RB3
bit3
TTL
Input/output pin. Internal software programmable weak pull-up.
RB4
bit4
TTL
Input/output pin (with interrupt on change). Internal software
programmable weak pull-up.
RB5
bit5
TTL
Input/output pin (with interrupt on change). Internal software
programmable weak pull-up.
RB6
bit6
TTL/ST
(2)
Input/output pin (with interrupt on change). Internal software
programmable weak pull-up. Serial programming clock pin.
RB7
bit7
TTL/ST
(2)
Input/output pin (with interrupt on change). Internal software
programmable weak pull-up. Serial programming data pin.
Legend: ST = Schmitt Trigger, TTL = TTL input
Note 1: This buffer is a Schmitt Trigger input when configured as the external interrupt.
Note 2: This buffer is a Schmitt Trigger input when used in serial programming mode.
Address Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on
POR
Value on
All Other
Resets
06h
PORTB
RB7
RB6
RB5
RB4
RB3
RB2
RB1
RB0
xxxx xxxx
uuuu uuuu
86h
TRISB
TRISB7
TRISB6
TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0
1111 1111
1111 1111
81h
OPTION
RBPU
INTEDG
T0CS
T0SE
PSA
PS2
PS1
PS0
1111 1111
1111 1111
Note:
Shaded bits are not used by PORTB.
u = unchanged
x = unknown
PIC16C62X
DS30235G-page 30
Preliminary
1998 Microchip Technology Inc.
5.3
I/O Programming Considerations
5.3.1
BI-DIRECTIONAL I/O PORTS
Any instruction which writes, operates internally as a
read followed by a write operation. The
BCF
and
BSF
instructions, for example, read the register into the
CPU, execute the bit operation and write the result back
to the register. Caution must be used when these
instructions are applied to a port with both inputs and
outputs defined. For example, a
BSF
operation on bit5
of PORTB will cause all eight bits of PORTB to be read
into the CPU. Then the
BSF
operation takes place on
bit5 and PORTB is written to the output latches. If
another bit of PORTB is used as a bidirectional I/O pin
(e.g., bit0) and it is defined as an input at this time, the
input signal present on the pin itself would be read into
the CPU and re-written to the data latch of this
particular pin, overwriting the previous content. As long
as the pin stays in the input mode, no problem occurs.
However, if bit0 is switched into output mode later on,
the content of the data latch may now be unknown.
Reading the port register, reads the values of the port
pins. Writing to the port register writes the value to the
port latch. When using read modify write instructions
(ex.
BCF, BSF
, etc.) on a port, the value of the port pins
is read, the desired operation is done to this value, and
this value is then written to the port latch.
Example 5-2 shows the effect of two sequential
read-modify-write instructions (ex.,
BCF, BSF
, etc.) on
an I/O port.
A pin actively outputting a Low or High should not be
driven from external devices at the same time in order
to change the level on this pin ("wired-or", "wired-and").
The resulting high output currents may damage
the chip.
EXAMPLE 5-2:
READ-MODIFY-WRITE
INSTRUCTIONS ON AN
I/O PORT
5.3.2
SUCCESSIVE OPERATIONS ON I/O PORTS
The actual write to an I/O port happens at the end of an
instruction cycle, whereas for reading, the data must be
valid at the beginning of the instruction cycle
(Figure
5-7). Therefore, care must be exercised if a
write followed by a read operation is carried out on the
same I/O port. The sequence of instructions should be
such to allow the pin voltage to stabilize (load
dependent) before the next instruction which causes
that file to be read into the CPU is executed. Otherwise,
the previous state of that pin may be read into the CPU
rather than the new state. When in doubt, it is better to
separate these instructions with a NOP or another
instruction not accessing this I/O port.
;
;
Initial PORT settings:
PORTB<7:4> Inputs
;
PORTB<3:0> Outputs
;
;
PORTB<7:6> have external pull-up and are not
connected to other circuitry
;
;
PORT latch
PORT pins
;
----------
----------
BCF PORTB, 7
; 01pp pppp
11pp pppp
BCF PORTB, 6
; 10pp pppp
11pp pppp
BSF STATUS,RP0
;
BCF TRISB, 7
; 10pp pppp
11pp pppp
BCF TRISB, 6
; 10pp pppp
10pp pppp
;
; Note that the user may have expected the pin
; values to be 00pp pppp. The 2nd BCF caused
; RB7 to be latched as the pin value (High).
FIGURE 5-7:
SUCCESSIVE I/O OPERATION
Note:
This example shows write to PORTB
followed by a read from PORTB.
Note that:
data setup time = (0.25 T
CY
- T
PD
)
where T
CY
= instruction cycle and
T
PD
= propagation delay of Q1 cycle
to output valid.
Therefore, at higher clock frequencies,
a write followed by a read may be
problematic.
Q1 Q2 Q3 Q4
Q1 Q2 Q3 Q4
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
RB <7:0>
Port pin
sampled here
PC
PC + 1
PC + 2
PC + 3
NOP
NOP
MOVF PORTB, W
Read PORTB
MOVWF PORTB
Write to
PORTB
PC
Instruction
fetched
T
PD
Execute
MOVWF
PORTB
Execute
MOVF
PORTB, W
Execute
NOP
RB7:RB0
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 31
PIC16C62X
6.0
TIMER0 MODULE
The Timer0 module timer/counter has the following
features:
8-bit timer/counter
Readable and writable
8-bit software programmable prescaler
Internal or external clock select
Interrupt on overflow from FFh to 00h
Edge select for external clock
Figure 6-1 is a simplified block diagram of the Timer0
module.
Timer mode is selected by clearing the T0CS bit
(OPTION<5>). In timer mode, the TMR0 will increment
every instruction cycle (without prescaler). If Timer0 is
written, the increment is inhibited for the following two
cycles (Figure 6-2 and Figure 6-3). The user can work
around this by writing an adjusted value to TMR0.
Counter mode is selected by setting the T0CS bit. In
this mode Timer0 will increment either on every rising
or falling edge of pin RA4/T0CKI. The incrementing
edge is determined by the source edge (T0SE) control
bit (OPTION<4>). Clearing the T0SE bit selects the
rising edge. Restrictions on the external clock input are
discussed in detail in Section 6.2.
The prescaler is shared between the Timer0 module
and the Watchdog Timer. The prescaler assignment is
controlled in software by the control bit PSA
(OPTION<3>). Clearing the PSA bit will assign the
prescaler to Timer0. The prescaler is not readable or
writable. When the prescaler is assigned to the Timer0
module, prescale value of 1:2, 1:4, ..., 1:256 are
selectable. Section 6.3 details the operation of the
prescaler.
6.1
TIMER0 Interrupt
Timer0 interrupt is generated when the TMR0 register
timer/counter overflows from FFh to 00h. This overflow
sets the T0IF bit. The interrupt can be masked by
clearing the T0IE bit (INTCON<5>). The T0IF bit
(INTCON<2>) must be cleared in software by the
Timer0 module interrupt service routine before
re-enabling this interrupt. The Timer0 interrupt cannot
wake the processor from SLEEP since the timer is shut
off during SLEEP. See Figure 6-4 for Timer0 interrupt
timing.
FIGURE 6-1:
TIMER0 BLOCK DIAGRAM
FIGURE 6-2:
TIMER0 (TMR0) TIMING: INTERNAL CLOCK/NO PRESCALER
Note 1:
Bits T0SE, T0CS, PS2, PS1, PS0 and PSA are located in the OPTION register.
2:
The prescaler is shared with Watchdog Timer (Figure 6-6)
RA4/T0CKI
T0SE
0
1
1
0
pin
T0CS
F
OSC
/4
Programmable
Prescaler
Sync with
Internal
clocks
TMR0
PSout
(2 T
CY
delay)
PSout
Data bus
8
Set Flag bit T0IF
on Overflow
PSA
PS2:PS0
PC-1
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
PC
(Program
Counter)
Instruction
Fetch
TMR0
PC
PC+1
PC+2
PC+3
PC+4
PC+5
PC+6
T0
T0+1
T0+2
NT0
NT0+1
NT0+2
T0
MOVWF TMR0
MOVF TMR0,W
MOVF TMR0,W
MOVF TMR0,W
MOVF TMR0,W
MOVF TMR0,W
Write TMR0
executed
Read TMR0
reads NT0
Read TMR0
reads NT0
Read TMR0
reads NT0
Read TMR0
reads NT0 + 1
Read TMR0
reads NT0 + 2
Instruction
Executed
PIC16C62X
DS30235G-page 32
Preliminary
1998 Microchip Technology Inc.
FIGURE 6-3:
TIMER0 TIMING: INTERNAL CLOCK/PRESCALE 1:2
FIGURE 6-4:
TIMER0 INTERRUPT TIMING
PC-1
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
PC
(Program
Counter)
Instruction
Fetch
TMR0
PC
PC+1
PC+2
PC+3
PC+4
PC+5
PC+6
T0
NT0+1
MOVWF TMR0
MOVF TMR0,W
MOVF TMR0,W
MOVF TMR0,W
MOVF TMR0,W
MOVF TMR0,W
Write TMR0
executed
Read TMR0
reads NT0
Read TMR0
reads NT0
Read TMR0
reads NT0
Read TMR0
reads NT0
Read TMR0
reads NT0 + 1
T0+1
NT0
Instruction
Execute
Q2
Q1
Q3
Q4
Q2
Q1
Q3
Q4
Q2
Q1
Q3
Q4
Q2
Q1
Q3
Q4
Q2
Q1
Q3
Q4
1
1
OSC1
CLKOUT(3)
TMR0 timer
T0IF bit
(INTCON<2>)
FEh
GIE bit
(INTCON<7>)
INSTRUCTION FLOW
PC
Instruction
fetched
PC
PC +1
PC +1
0004h
0005h
Instruction
executed
Inst (PC)
Inst (PC-1)
Inst (PC+1)
Inst (PC)
Inst (0004h)
Inst (0005h)
Inst (0004h)
Dummy cycle
Dummy cycle
FFh
00h
01h
02h
Note 1: T0IF interrupt flag is sampled here (every Q1).
2: Interrupt latency = 3T
CY
, where T
CY
= instruction cycle time.
3: CLKOUT is available only in RC oscillator mode.
Interrupt Latency Time
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 33
PIC16C62X
6.2
Using Timer0 with External Clock
When an external clock input is used for Timer0, it must
meet certain requirements. The external clock
requirement is due to internal phase clock (T
OSC
)
synchronization. Also, there is a delay in the actual
incrementing of Timer0 after synchronization.
6.2.1
EXTERNAL CLOCK SYNCHRONIZATION
When no prescaler is used, the external clock input is
the same as the prescaler output. The synchronization
of T0CKI with the internal phase clocks is
accomplished by sampling the prescaler output on the
Q2 and Q4 cycles of the internal phase clocks
(Figure 6-5).
Therefore, it is necessary for T0CKI to be
high for at least 2T
OSC
(and a small RC delay of 20 ns)
and low for at least 2T
OSC
(and a small RC delay of
20 ns). Refer to the electrical specification of the
desired device.
When a prescaler is used, the external clock input is
divided by the asynchronous ripple-counter type
prescaler so that the prescaler output is symmetrical.
For the external clock to meet the sampling
requirement, the ripple-counter must be taken into
account. Therefore, it is necessary for T0CKI to have a
period of at least 4T
OSC
(and a small RC delay of
40 ns) divided by the prescaler value. The only
requirement on T0CKI high and low time is that they do
not violate the minimum pulse width requirement of
10 ns. Refer to parameters 40, 41 and 42 in the
electrical specification of the desired device.
6.2.2
TIMER0 INCREMENT DELAY
Since the prescaler output is synchronized with the
internal clocks, there is a small delay from the time the
external clock edge occurs to the time the TMR0 is
actually incremented. Figure 6-5 shows the delay from
the external clock edge to the timer incrementing.
FIGURE 6-5:
TIMER0 TIMING WITH EXTERNAL CLOCK
Q1
Q2 Q3 Q4
Q1 Q2 Q3 Q4
Q1 Q2 Q3 Q4
Q1 Q2 Q3 Q4
External Clock Input or
Prescaler output
(2)
External Clock/Prescaler
Output after sampling
Increment Timer0 (Q4)
Timer0
T0
T0 + 1
T0 + 2
Small pulse
misses sampling
Note 1: Delay from clock input change to Timer0 increment is 3Tosc to 7Tosc. (Duration of Q = Tosc).
Therefore, the error in measuring the interval between two edges on Timer0 input =
4Tosc max.
2: External clock if no prescaler selected, Prescaler output otherwise.
3: The arrows indicate the points in time where sampling occurs.
(3)
(1)
PIC16C62X
DS30235G-page 34
Preliminary
1998 Microchip Technology Inc.
6.3
Prescaler
An 8-bit counter is available as a prescaler for the
Timer0 module, or as a postscaler for the Watchdog
Timer, respectively (Figure 6-6). For simplicity, this
counter is being referred to as "prescaler" throughout
this data sheet. Note that there is only one prescaler
available which is mutually exclusive between the
Timer0 module and the Watchdog Timer. Thus, a
prescaler assignment for the Timer0 module means
that there is no prescaler for the Watchdog Timer, and
vice-versa.
The PSA and PS2:PS0 bits (OPTION<3:0>) determine
the prescaler assignment and prescale ratio.
When assigned to the Timer0 module, all instructions
writing to the TMR0 register (e.g.,
CLRF 1, MOVWF 1,
BSF 1,x
....etc.) will clear the prescaler. When
assigned to WDT, a
CLRWDT
instruction will clear the
prescaler along with the Watchdog Timer. The
prescaler is not readable or writable.
FIGURE 6-6:
BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER
T0CKI
T0SE
pin
M
U
X
CLKOUT (=Fosc/4)
SYNC
2
Cycles
TMR0 reg
8-bit Prescaler
8-to-1MUX
M
U
X
M U X
Watchdog
Timer
PSA
0
1
0
1
WDT
Time-out
PS0 - PS2
8
Note: T0SE, T0CS, PSA, PS0-PS2 are bits in the OPTION register.
PSA
WDT Enable bit
M
U
X
0
1
0
1
Data Bus
Set flag bit T0IF
on Overflow
8
PSA
T0CS
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 35
PIC16C62X
6.3.1
SWITCHING PRESCALER ASSIGNMENT
The prescaler assignment is fully under software
control (i.e., it can be changed "on the fly" during
program execution). To avoid an unintended device
RESET, the following instruction sequence
(Example
6-1) must be executed when changing the
prescaler assignment from Timer0 to WDT.
EXAMPLE 6-1:
CHANGING PRESCALER
(TIMER0
WDT)
1.BCF
STATUS, RP0
;Skip if already in
; Bank 0
2.CLRWDT
;Clear WDT
3.CLRF
TMR0
;Clear TMR0 & Prescaler
4.BSF
STATUS, RP0
;Bank 1
5.MOVLW
'00101111'b; ;These 3 lines (5, 6, 7)
6.MOVWF
OPTION
; are required only if
; desired PS<2:0> are
7.CLRWDT
; 000 or 001
8.MOVLW
'00101xxx'b
;Set Postscaler to
9.MOVWF
OPTION
; desired WDT rate
10.BCF
STATUS, RP0 ;Return to Bank 0
To change prescaler from the WDT to the TMR0
module use the sequence shown in Example 6-2. This
precaution must be taken even if the WDT is disabled.
EXAMPLE 6-2:
CHANGING PRESCALER
(WDT
TIMER0)
CLRWDT
;Clear WDT and
;prescaler
BSF
STATUS, RP0
MOVLW
b'xxxx0xxx'
;Select TMR0, new
;prescale value and
;clock source
MOVWF
OPTION_REG
BCF
STATUS, RP0
TABLE 6-1:
REGISTERS ASSOCIATED WITH TIMER0
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on
POR
Value on
All Other
Resets
01h
TMR0
Timer0 module register
xxxx xxxx
uuuu uuuu
0Bh/8Bh
INTCON
GIE
PEIE
T0IE
INTE
RBIE
T0IF
INTF
RBIF
0000 000x
0000 000u
81h
OPTION
RBPU
INTEDG
T0CS
T0SE
PSA
PS2
PS1
PS0
1111 1111
1111 1111
85h
TRISA
--
--
--
TRISA4
TRISA3
TRISA2
TRISA1
TRISA0
---1 1111
---1 1111
Legend: -- = Unimplemented locations, read as `0'.
Note:
Shaded bits are not used by TMR0 module.
u = unchanged
x = unknown
PIC16C62X
DS30235G-page 36
Preliminary
1998 Microchip Technology Inc.
NOTES:
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 37
PIC16C62X
7.0
COMPARATOR MODULE
The comparator module contains two analog
comparators. The inputs to the comparators are
multiplexed with the RA0 through RA3 pins. The
on-chip
Voltage Reference (Section 8.0) can also be an
input to the comparators.
The CMCON register, shown in Figure 7-1, controls the
comparator input and output multiplexers. A block
diagram of the comparator is shown in Figure 7-2.
FIGURE 7-1:
CMCON REGISTER
(ADDRESS 1Fh)
R-0
R-0
U-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
C2OUT
C1OUT
CIS
CM2
CM1
CM0
R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as `0'
- n =Value at POR reset
bit7
bit0
bit 7:
C2OUT: Comparator 2 output
1 = C2 V
IN
+ > C2 V
IN
0 = C2 V
IN
+ < C2 V
IN
bit 6:
C1OUT: Comparator 1 output
1 = C1 V
IN
+ > C1 V
IN
0 = C1 V
IN
+ < C1 V
IN
bit 5-4:
Unimplemented: Read as '0'
bit 3:
CIS: Comparator Input Switch
When CM<2:0>: = 001:
1 = C1 V
IN
connects to RA3
0 = C1 V
IN
connects to RA0
When CM<2:0> = 010:
1 = C1 V
IN
connects to RA3
C2 V
IN
connects to RA2
0 = C1 V
IN
connects to RA0
C2 V
IN
connects to RA1
bit 2-0:
CM<2:0>: Comparator mode
Figure 7-2.
PIC16C62X
DS30235G-page 38
Preliminary
1998 Microchip Technology Inc.
7.1
Comparator Configuration
There are eight modes of operation for the
comparators.
The CMCON register is used to select the
mode. Figure 7-2 shows the eight possible modes. The
TRISA register controls the data direction of the com-
parator pins for each mode. If the comparator mode is
changed, the comparator output level may not be valid
for the specified mode change delay shown in
Table 12-2.
Note:
Comparator interrupts should be disabled
during a comparator mode change other-
wise a false interrupt may occur.
FIGURE 7-2:
COMPARATOR I/O OPERATING MODES
-
+
C1
V
IN
-
V
IN
+
Off
(Read as '0')
RA0/AN0
RA3/AN3
A
A
CM<2:0> = 000
-
+
C2
V
IN
-
V
IN
+
Off
(Read as '0')
RA1/AN1
RA2/AN2
A
A
-
+
C1
V
IN
-
V
IN
+
Off
(Read as '0')
RA0/AN0
RA3/AN3
D
D
CM<2:0> = 111
-
+
C2
V
IN
-
V
IN
+
Off
(Read as '0')
RA1/AN1
RA2/AN2
D
D
-
+
C1
V
IN
-
V
IN
+
C1OUT
RA0/AN0
RA3/AN3
A
A
-
+
C2
V
IN
-
V
IN
+
C2OUT
RA1/AN1
RA2/AN2
A
A
CM<2:0> = 100
-
+
C1
V
IN
-
V
IN
+
C1OUT
RA0/AN0
RA3/AN3
A
A
-
+
C2
V
IN
-
V
IN
+
C2OUT
RA1/AN1
RA2/AN2
A
A
From V
REF
Module
-
+
C1
V
IN
-
V
IN
+
C1OUT
RA0/AN0
RA3/AN3
A
D
-
+
C2
V
IN
-
V
IN
+
C2OUT
RA1/AN1
RA2/AN2
A
A
CM<2:0> = 011
RA4 Open Drain
-
+
C1
V
IN
-
V
IN
+
C1OUT
RA0/AN0
RA3/AN3
A
D
-
+
C2
V
IN
-
V
IN
+
C2OUT
RA1/AN1
RA2/AN2
A
A
CM<2:0> = 110
-
+
C1
V
IN
-
V
IN
+
Off
(Read as '0')
RA0/AN0
RA3/AN3
D
D
CM<2:0> = 101
-
+
C2
V
IN
-
V
IN
+
C2OUT
RA1/AN1
RA2/AN2
A
A
-
+
C1
V
IN
-
V
IN
+
C1OUT
RA0/AN0
RA3/AN3
A
A
-
+
C2
V
IN
-
V
IN
+
C2OUT
RA1/AN1
RA2/AN2
A
A
CM<2:0> = 001
CIS=0
CIS=1
Comparators Reset
Two Independent Comparators
Two Common Reference Comparators
One Independent Comparator
Three Inputs Multiplexed to
Two Common Reference Comparators with Outputs
Four Inputs Multiplexed to
Comparators Off
Two Comparators
Two Comparators
CM<2:0> = 010
CIS=0
CIS=1
CIS=0
CIS=1
A = Analog Input, Port Reads Zeros Always
D = Digital Input
CIS = CMCON<3>, Comparator Input Switch
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 39
PIC16C62X
The code example in Example 7-1 depicts the steps
required to configure the comparator module. RA3 and
RA4 are configured as digital output. RA0 and RA1 are
configured as the V- inputs and RA2 as the V+ input to
both comparators.
EXAMPLE 7-1:
INITIALIZING
COMPARATOR MODULE
7.2
Comparator Operation
A single comparator is shown in Figure 7-3 along with
the relationship between the analog input levels and
the digital output. When the analog input at V
IN
+ is less
than the analog input V
IN
, the output of the
comparator is a digital low level. When the analog input
at V
IN
+ is greater than the analog input V
IN
, the output
of the comparator is a digital high level. The shaded
areas of the output of the comparator in Figure 7-3
represent the uncertainty due to input offsets and
response time.
FLAG_REG
EQU
0X20
CLRF
FLAG_REG
;Init flag register
CLRF
PORTA
;Init PORTA
MOVF
CMCON, W
;Load comparator bits
ANDLW
0xC0
;Mask comparator bits
IORWF
FLAG_REG,F
;Store bits in flag register
MOVLW
0x03
;Init comparator mode
MOVWF
CMCON
;CM<2:0> = 011
BSF
STATUS,RP0
;Select Bank1
MOVLW
0x07
;Initialize data direction
MOVWF
TRISA
;Set RA<2:0> as inputs
;RA<4:3> as outputs
;TRISA<7:5> always read `0'
BCF
STATUS,RP0
;Select Bank 0
CALL
DELAY 10
;10
s delay
MOVF
CMCON,F
;Read
CMCON
to
end
change
condition
BCF
PIR1,CMIF
;Clear pending interrupts
BSF
STATUS,RP0
;Select Bank 1
BSF
PIE1,CMIE
;Enable comparator interrupts
BCF
STATUS,RP0
;Select Bank 0
BSF
INTCON,PEIE
;Enable peripheral interrupts
BSF
INTCON,GIE
;Global interrupt enable
7.3
Comparator Reference
An external or internal reference signal may be used
depending on the comparator operating mode. The
analog signal that is present at V
IN
is compared to the
signal at V
IN
+, and the digital output of the comparator
is adjusted accordingly (Figure 7-3).
FIGURE 7-3:
SINGLE COMPARATOR
7.3.1
EXTERNAL REFERENCE SIGNAL
When external voltage references are used, the
comparator module can be configured to have the com-
parators operate from the same or different reference
sources. However, threshold detector applications may
require the same reference. The reference signal must
be between V
SS
and V
DD
, and can be applied to either
pin of the comparator(s).
7.3.2
INTERNAL REFERENCE SIGNAL
The comparator module also allows the selection of an
internally generated voltage reference for the
comparators.
Section 13, Instruction Sets, contains a
detailed description of the Voltage Reference Module
that provides this signal. The internal reference signal
is used when the comparators are in mode
CM<2:0>=010 (Figure 7-2). In this mode, the internal
voltage reference is applied to the V
IN
+ pin of both com-
parators.
+
V
IN
+
V
IN
Output
V
IN
V
IN+
Output
PIC16C62X
DS30235G-page 40
Preliminary
1998 Microchip Technology Inc.
7.4
Comparator Response Time
Response time is the minimum time, after selecting a
new reference voltage or input source, before the
comparator output is guaranteed to have a valid level.
If the internal reference is changed, the maximum
delay of the internal voltage reference must be
considered when using the comparator outputs.
Otherwise the maximum delay of the comparators
should be used (Table 12-2 ).
7.5
Comparator Outputs
The comparator outputs are read through the CMCON
register. These bits are read only. The comparator
outputs may also be directly output to the RA3 and RA4
I/O pins. When the CM<2:0> = 110, multiplexors in the
output path of the RA3 and RA4 pins will switch and the
output of each pin will be the unsynchronized output of
the comparator. The uncertainty of each of the
comparators is related to the input offset voltage and
the response time given in the specifications.
Figure
7-4 shows the comparator output block
diagram.
The TRISA bits will still function as an output
enable/disable for the RA3 and RA4 pins while in this
mode.
Note 1: When reading the PORT register, all pins
configured as analog inputs will read as
a `0'. Pins configured as digital inputs will
convert an analog input according to the
Schmitt Trigger input specification.
2: Analog levels on any pin that is defined
as a digital input may cause the input
buffer to consume more current than is
specified.
FIGURE 7-4:
COMPARATOR OUTPUT BLOCK DIAGRAM
D
Q
EN
To RA3 or
RA4 Pin
Bus
Data
RD CMCON
Set
MULTIPLEX
CMIF
Bit
-
+
D
Q
EN
CL
Port Pins
RD CMCON
NRESET
From
Other
Comparator
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 41
PIC16C62X
7.6
Comparator Interrupts
The comparator interrupt flag is set whenever there is
a change in the output value of either comparator.
Software will need to maintain information about the
status of the output bits, as read from CMCON<7:6>, to
determine the actual change that has occurred. The
CMIF bit, PIR1<6>, is the comparator interrupt flag.
The CMIF bit must be reset by clearing `0'. Since it is
also possible to write a '1' to this register, a simulated
interrupt may be initiated.
The CMIE bit (PIE1<6>) and the PEIE bit
(INTCON<6>)
must be set to enable the interrupt. In
addition, the GIE bit must also be set. If any of these
bits are clear, the interrupt is not enabled, though the
CMIF bit will still be set if an interrupt condition occurs.
The user, in the interrupt service routine, can clear the
interrupt in the following manner:
a)
Any read or write of CMCON. This will end the
mismatch condition.
b)
Clear flag bit CMIF.
A mismatch condition will continue to set flag bit CMIF.
Reading CMCON will end the mismatch condition, and
allow flag bit CMIF to be cleared.
7.7
Comparator Operation During SLEEP
When a comparator is active and the device is placed
in SLEEP mode, the comparator remains active and
the interrupt is functional if enabled. This interrupt will
Note:
If a change in the CMCON register
(C1OUT or C2OUT) should occur when a
read operation is being executed (start of
the Q2 cycle), then the CMIF (PIR1<6>)
interrupt flag may not get set.
wake up the device from SLEEP mode when enabled.
While the comparator is powered-up, higher sleep
currents than shown in the power down current
specification will occur. Each comparator that is
operational will consume additional current as shown in
the comparator specifications. To minimize power
consumption while in SLEEP mode, turn off the
comparators, CM<2:0> = 111, before entering sleep. If
the device wakes-up from sleep, the contents of the
CMCON register are not affected.
7.8
Effects of a RESET
A device reset forces the CMCON register to its reset
state. This forces the comparator module to be in the
comparator reset mode, CM2:CM0
=
000. This
ensures that all potential inputs are analog inputs.
Device current is minimized when analog inputs are
present at reset time. The comparators will be
powered-down
during the reset interval.
7.9
Analog Input Connection
Considerations
A simplified circuit for an analog input is shown in
Figure 7-5. Since the analog pins are connected to a
digital output, they have reverse biased diodes to V
DD
and V
SS
. The analog input therefore, must be between
V
SS
and V
DD
. If the input voltage deviates from this
range by more than 0.6V in either direction, one of the
diodes is forward biased and a latch-up may occur. A
maximum source impedance of 10
k
is
recommended for the analog sources. Any external
component connected to an analog input pin, such as
a capacitor or a Zener diode, should have very little
leakage current.
FIGURE 7-5:
ANALOG INPUT MODEL
VA
R
S
< 10K
A
IN
C
PIN
5 pF
V
DD
V
T
= 0.6V
V
T
= 0.6V
R
IC
I
LEAKAGE
500 nA
V
SS
Legend
C
PIN
= Input Capacitance
V
T
= Threshold Voltage
I
LEAKAGE
= Leakage Current At The Pin Due To Various Junctions
R
IC
= Interconnect Resistance
R
S
= Source Impedance
VA
= Analog Voltage
PIC16C62X
DS30235G-page 42
Preliminary
1998 Microchip Technology Inc.
TABLE 7-1:
REGISTERS ASSOCIATED WITH COMPARATOR MODULE
Legend: x = unknown
u = unchanged
- = unimplemented, read as "0"
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on
POR
Value on
All Other
Resets
1Fh
CMCON
C2OUT
C1OUT
--
--
CIS
CM2
CM1
CM0
00-- 0000
00-- 0000
9Fh
VRCON
VREN
VROE
VRR
--
VR3
VR2
VR1
VR0
000- 0000
000- 0000
0Bh
INTCON
GIE
PEIE
T0IE
INTE
RBIE
T0IF
INTF
RBIF
0000 000x
0000 000u
0Ch
PIR1
--
CMIF
--
--
--
--
--
--
-0-- ----
-0-- ----
8Ch
PIE1
--
CMIE
--
--
--
--
--
--
-0-- ----
-0-- ----
85h
TRISA
--
--
--
TRISA4
TRISA3
TRISA2
TRISA1
TRISA0
---1 1111
---1 1111
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 43
PIC16C62X
8.0
VOLTAGE REFERENCE
MODULE
The Voltage Reference is a 16-tap resistor ladder
network that provides a selectable voltage reference.
The resistor ladder is segmented to provide two ranges
of V
REF
values and has a power-down function to
conserve power when the reference is not being used.
The VRCON register controls the operation of the
reference as shown in Figure 8-1. The block diagram is
given in Figure 8-2.
8.1
Configuring the Voltage Reference
The Voltage Reference can output 16 distinct voltage
levels for each range.
The equations used to calculate the output of the
Voltage Reference are as follows:
if V
RR
= 1: V
REF
= (V
R
<3:0>/24) x V
DD
if V
RR
= 0: V
REF
= (V
DD
x 1/4) + (V
R
<3:0>/32) x V
DD
The setting time of the Voltage Reference must be
considered when changing the V
REF
output
(Table
12-2).
Example
8-1 shows an example of how to
configure the Voltage Reference for an output voltage
of 1.25V with V
DD
= 5.0V.
FIGURE 8-1:
VRCON REGISTER(ADDRESS 9Fh)
FIGURE 8-2:
VOLTAGE REFERENCE BLOCK DIAGRAM
R/W-0
R/W-0
R/W-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
V
REN
V
ROE
V
RR
--
V
R3
V
R2
V
R1
V
R0
R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as `0'
- n =Value at POR reset
bit7
bit0
bit 7:
V
REN
: V
REF
Enable
1 = V
REF
circuit powered on
0 = V
REF
circuit powered down, no I
DD
drain
bit 6:
V
ROE
: V
REF
Output Enable
1 = V
REF
is output on RA2 pin
0 = V
REF
is disconnected from RA2 pin
bit 5:
V
RR
: V
REF
Range selection
1 = Low Range
0 = High Range
bit 4:
Unimplemented: Read as '0'
bit 3-0: V
R
<3:0>: V
REF
value selection 0
V
R
[3:0]
15
when V
RR
= 1: V
REF
= (V
R
<3:0>/ 24) * V
DD
when V
RR
= 0: V
REF
= 1/4 * V
DD
+ (V
R
<3:0>/ 32) * V
DD
Note:
R is defined in Table 12-3.
V
RR
8R
V
R
3
V
R
0
(From VRCON<3:0>)
16-1 Analog Mux
8R
R
R
R
R
V
REN
V
REF
16 Stages
PIC16C62X
DS30235G-page 44
Preliminary
1998 Microchip Technology Inc.
EXAMPLE 8-1:
VOLTAGE REFERENCE
CONFIGURATION
8.2
Voltage Reference Accuracy/Error
The full range of V
SS
to V
DD
cannot be realized due to
the construction of the module. The transistors on the
top and bottom of the resistor ladder network
(Figure
8-2) keep V
REF
from approaching V
SS
or V
DD
.
The Voltage Reference is V
DD
derived and therefore,
the V
REF
output changes with fluctuations in V
DD
. The
tested absolute accuracy of the Voltage Reference can
be found in Table 12-3.
8.3
Operation During Sleep
When the device wakes up from sleep through an
interrupt or a Watchdog Timer time-out, the contents of
the VRCON register are not affected. To minimize
current consumption in SLEEP mode, the Voltage
Reference should be disabled.
MOVLW
0x02
; 4 Inputs Muxed
MOVWF
CMCON
; to 2 comps.
BSF
STATUS,RP0
; go to Bank 1
MOVLW
0x07
; RA3-RA0 are
MOVWF
TRISA
; outputs
MOVLW
0xA6
; enable V
REF
MOVWF
VRCON
; low range
; set V
R
<3:0>=6
BCF
STATUS,RP0
; go to Bank 0
CALL
DELAY10
; 10
s delay
8.4
Effects of a Reset
A device reset disables the Voltage Reference by clear-
ing bit V
REN
(VRCON<7>). This reset also disconnects
the reference from the RA2 pin by clearing bit V
ROE
(VRCON<6>) and selects the high voltage range by
clearing bit V
RR
(VRCON<5>). The V
REF
value select
bits, VRCON<3:0>, are also cleared.
8.5
Connection Considerations
The Voltage Reference Module operates independently
of the comparator module. The output of the reference
generator may be connected to the RA2 pin if the
TRISA<2> bit is set and the V
ROE
bit, VRCON<6>, is
set. Enabling the Voltage Reference output onto the
RA2 pin with an input signal present will increase cur-
rent consumption. Connecting RA2 as a digital output
with V
REF
enabled will also increase current consump-
tion.
The RA2 pin can be used as a simple D/A output with
limited drive capability. Due to the limited drive
capability, a buffer must be used in conjunction with the
Voltage Reference output for external connections to
V
REF
. Figure 8-3 shows an example buffering
technique.
FIGURE 8-3:
VOLTAGE REFERENCE OUTPUT BUFFER EXAMPLE
TABLE 8-1:
REGISTERS ASSOCIATED WITH VOLTAGE REFERENCE
Note:
- = Unimplemented, read as "0"
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value On
POR
Value On
All Other
Resets
9Fh
VRCON
VREN
VROE
VRR
--
VR3
VR2
VR1
VR0
000- 0000
000- 0000
1Fh
CMCON
C2OUT
C1OUT
--
--
CIS
CM2
CM1
CM0
00-- 0000
00-- 0000
85h
TRISA
--
--
--
TRISA4
TRISA3
TRISA2
TRISA1
TRISA0
---1 1111
---1 1111
V
REF
Output
+
V
REF
Module
Voltage
Reference
Output
Impedance
R
(1)
RA2
Note 1: R is dependent upon the Voltage Reference Configuration VRCON<3:0> and VRCON<5>.
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 45
PIC16C62X
9.0
SPECIAL FEATURES OF THE
CPU
Special circuits to deal with the needs of real time appli-
cations are what sets a microcontroller apart from other
processors. The PIC16C62X family has a host of such
features intended to maximize system reliability, mini-
mize cost through elimination of external components,
provide power saving operating modes and offer code
protection.
These are:
1.
OSC selection
2.
Reset
Power-on Reset (POR)
Power-up Timer (PWRT)
Oscillator Start-Up Timer (OST)
Brown-out Reset (BOR)
3.
Interrupts
4.
Watchdog Timer (WDT)
5.
SLEEP
6.
Code protection
7.
ID Locations
8.
In-circuit serial programming
The PIC16C62X has a Watchdog Timer which is
controlled by configuration bits. It runs off its own RC
oscillator for added reliability. There are two timers that
offer necessary delays on power-up. One is the
Oscillator Start-up Timer (OST), intended to keep the
chip in reset until the crystal oscillator is stable. The
other is the Power-up Timer (PWRT), which provides a
fixed delay of 72 ms (nominal) on power-up only,
designed to keep the part in reset while the power
supply stabilizes. There is also circuitry to reset the
device if a brown-out occurs which provides at least a
72 ms reset. With these three functions on-chip, most
applications need no external reset circuitry.
The SLEEP mode is designed to offer a very low
current power-down mode. The user can wake-up from
SLEEP through external reset, Watchdog Timer
wake-up or through an interrupt. Several oscillator
options are also made available to allow the part to fit
the application. The RC oscillator option saves system
cost while the LP crystal option saves power. A set of
configuration bits are used to select various options.
PIC16C62X
DS30235G-page 46
Preliminary
1998 Microchip Technology Inc.
9.1
Configuration Bits
The configuration bits can be programmed (read as '0')
or left unprogrammed (read as '1') to select various
device configurations. These bits are mapped in
program memory location 2007h.
The user will note that address 2007h is beyond
the user program memory space. In fact, it belongs
to the special test/configuration memory space
(2000h 3FFFh), which can be accessed only during
programming.
FIGURE 9-1:
CONFIGURATION WORD
CP1
CP0
(2)
CP1
CP0
(2)
CP1
CP0
(2)
--
BOREN
(1)
CP1
CP0
(2)
PWRTE
(1)
WDTE F0SC1
F0SC0
CONFIG
Address
REGISTER:
2007h
bit13
bit0
bit 13-8,
CP<1:0>: Code protection bit pairs
(2)
5-4:
Code protection for 2K program memory
11
= Program memory code protection off
10
= 0400h-07FFh code protected
01
= 0200h-07FFh code protected
00
= 0000h-07FFh code protected
Code protection for 1K program memory
11
= Program memory code protection off
10
=Program memory code protection on
01
= 0200h-03FFh code protected
00
= 0000h-03FFh code protected
Code protection for 0.5K program memory
11
= Program memory code protection off
10
= Program memory code protection off
01
= Program memory code protection off
00
= 0000h-01FFh code protected
bit 7:
Unimplemented: Read as '1'
bit 6:
BOREN: Brown-out Reset Enable bit
(1)
1 = BOR enabled
0 = BOR disabled
bit 3:
PWRTE: Power-up Timer Enable bit
(1, 3)
1 = PWRT disabled
0 = PWRT enabled
bit 2:
WDTE: Watchdog Timer Enable bit
1 = WDT enabled
0 = WDT disabled
bit 1-0:
FOSC1:FOSC0: Oscillator Selection bits
11
= RC oscillator
10
= HS oscillator
01
= XT oscillator
00
= LP oscillator
Note 1:
Enabling Brown-out Reset automatically enables Power-up Timer (PWRT) regardless of the value of bit PWRTE. We
recommend that whenever Brown-out Reset is enabled, the Power-up Timer is also enabled.
2:
All of the CP1:CP0 pairs have to be given the same value to enable the code protection scheme listed.
3:
Unprogrammed parts default the Power-up Timer disabled.
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 47
PIC16C62X
9.2
Oscillator Configurations
9.2.1
OSCILLATOR TYPES
The PIC16C62X can be operated in four different
oscillator options. The user can program two
configuration bits (FOSC1 and FOSC0) to select one of
these four modes:
LP
Low Power Crystal
XT
Crystal/Resonator
HS
High Speed Crystal/Resonator
RC
Resistor/Capacitor
9.2.2
CRYSTAL OSCILLATOR / CERAMIC
RESONATORS
In XT, LP or HS modes a crystal or ceramic resonator
is connected to the OSC1 and OSC2 pins to establish
oscillation (Figure
9-2). The PIC16C62X oscillator
design requires the use of a parallel cut crystal. Use of
a series cut crystal may give a frequency out of the
crystal manufacturers specifications. When in XT, LP or
HS modes, the device can have an external clock
source to drive the OSC1 pin (Figure 9-3).
FIGURE 9-2:
CRYSTAL OPERATION
(OR CERAMIC RESONATOR)
(HS, XT OR LP OSC
CONFIGURATION)
FIGURE 9-3:
EXTERNAL CLOCK INPUT
OPERATION (HS, XT OR LP
OSC CONFIGURATION)
See Table 9-1 and Table 9-2 for recommended
values of C1 and C2.
Note:
A series resistor may be required for
AT strip cut crystals.
C1
C2
XTAL
OSC2
RS
OSC1
RF
SLEEP
To internal logic
PIC16C62X
see Note
Clock from
ext. system
PIC16C62X
OSC1
OSC2
Open
TABLE 9-1:
CAPACITOR SELECTION
FOR CERAMIC RESONATORS
TABLE 9-2:
CAPACITOR SELECTION
FOR CRYSTAL OSCILLATOR
Ranges Characterized:
Mode
Freq
OSC1(C1)
OSC2(C2)
XT
455 kHz
2.0 MHz
4.0 MHz
22 - 100 pF
15 - 68 pF
15 - 68 pF
22 - 100 pF
15 - 68 pF
15 - 68 pF
HS
8.0 MHz
16.0 MHz
10 - 68 pF
10 - 22 pF
10 - 68 pF
10 - 22 pF
Higher capacitance increases the stability of the oscillator
but also increases the start-up time. These values are for
design guidance only. Since each resonator has its own
characteristics, the user should consult the resonator man-
ufacturer for appropriate values of external components.
Mode
Freq
OSC1(C1)
OSC2(C2)
LP
32 kHz
200 kHz
68 - 100 pF
15 - 30 pF
68 - 100 pF
15 - 30 pF
XT
100 kHz
2 MHz
4 MHz
68 - 150 pF
15 - 30 pF
15 - 30 pF
150 - 200 pF
15 - 30 pF
15 - 30 pF
HS
8 MHz
10 MHz
20 MHz
15 - 30 pF
15 - 30 pF
15 - 30 pF
15 - 30 pF
15 - 30 pF
15 - 30 pF
Higher capacitance increases the stability of the oscillator
but also increases the start-up time. These values are for
design guidance only. Rs may be required in HS mode as
well as XT mode to avoid overdriving crystals with low drive
level specification. Since each crystal has its own
characteristics, the user should consult the crystal manu-
facturer for appropriate values of external components.
PIC16C62X
DS30235G-page 48
Preliminary
1998 Microchip Technology Inc.
9.2.3
EXTERNAL CRYSTAL OSCILLATOR
CIRCUIT
Either a prepackaged oscillator can be used or a simple
oscillator circuit with TTL gates can be built.
Prepackaged oscillators provide a wide operating
range and better stability. A well-designed crystal
oscillator will provide good performance with TTL
gates. Two types of crystal oscillator circuits can be
used; one with series resonance, or one with parallel
resonance.
Figure 9-4 shows implementation of a parallel resonant
oscillator circuit. The circuit is designed to use the
fundamental frequency of the crystal. The 74AS04
inverter performs the 180
phase shift that a parallel
oscillator requires. The 4.7 k
resistor provides the
negative feedback for stability. The 10
k
potentiometers bias the 74AS04 in the linear region.
This could be used for external oscillator designs.
FIGURE 9-4:
EXTERNAL PARALLEL
RESONANT CRYSTAL
OSCILLATOR CIRCUIT
Figure 9-5 shows a series resonant oscillator circuit.
This circuit is also designed to use the fundamental
frequency of the crystal. The inverter performs a 180
phase shift in a series resonant oscillator circuit. The
330 k
resistors provide the negative feedback to bias
the inverters in their linear region.
FIGURE 9-5:
EXTERNAL SERIES
RESONANT CRYSTAL
OSCILLATOR CIRCUIT
20 pF
+5V
20 pF
10k
4.7k
10k
74AS04
XTAL
10k
74AS04
PIC16C62X
CLK
IN
To other
Devices
330 k
74AS04
74AS04
PIC16C62X
CLK
IN
To other
Devices
XTAL
330 k
74AS04
0.1
F
9.2.4
RC OSCILLATOR
For timing insensitive applications the "RC" device
option offers additional cost savings. The RC oscillator
frequency is a function of the supply voltage, the
resistor (Rext) and capacitor (Cext) values, and the
operating temperature. In addition to this, the oscillator
frequency will vary from unit to unit due to normal
process parameter variation. Furthermore, the
difference in lead frame capacitance between package
types will also affect the oscillation frequency,
especially for low Cext values. The user also needs to
take into account variation due to tolerance of external
R and C components used. Figure 9-6 shows how the
R/C combination is connected to the PIC16C62X. For
Rext values below 2.2 k
, the oscillator operation may
become unstable, or stop completely. For very high
Rext values (e.g., 1 M
), the oscillator becomes
sensitive to noise, humidity and leakage. Thus, we
recommend to keep Rext between 3 k
and 100 k
.
Although the oscillator will operate with no external
capacitor (Cext = 0 pF), we recommend using values
above 20 pF for noise and stability reasons. With no or
small external capacitance, the oscillation frequency
can vary dramatically due to changes in external
capacitances, such as PCB trace capacitance or
package lead frame capacitance.
See Section 13.0 for RC frequency variation from part
to part due to normal process variation. The variation is
larger for larger R (since leakage current variation will
affect RC frequency more for large R) and for smaller C
(since variation of input capacitance will affect RC fre-
quency more).
See Section 13.0 for variation of oscillator frequency
due to V
DD
for given Rext/Cext values as well as
frequency variation due to operating temperature for
given R, C, and V
DD
values.
The oscillator frequency, divided by 4, is available on
the OSC2/CLKOUT pin, and can be used for test
purposes or to synchronize other logic (Figure 3-2 for
waveform).
FIGURE 9-6:
RC OSCILLATOR MODE
OSC2/CLKOUT
Cext
Rext
V
DD
PIC16C62X
OSC1
Fosc/4
Internal Clock
V
DD
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 49
PIC16C62X
9.3
Reset
The PIC16C62X differentiates between various kinds
of reset:
a)
Power-on reset (POR)
b)
MCLR reset during normal operation
c)
MCLR reset during SLEEP
d)
WDT reset (normal operation)
e)
WDT wake-up (SLEEP)
f)
Brown-out Reset (BOR)
Some registers are not affected in any reset condition;
their status is unknown on POR and unchanged in any
other reset. Most other registers are reset to a "reset
state" on Power-on reset, MCLR reset, WDT reset and
MCLR reset during SLEEP. They are not affected by a
WDT wake-up, since this is viewed as the resumption
of normal operation. TO and PD bits are set or cleared
differently in different reset situations as indicated in
Table 9-4. These bits are used in software to determine
the nature of the reset. See Table 9-7 for a full descrip-
tion of reset states of all registers.
A simplified block diagram of the on-chip reset circuit is
shown in Figure 9-7.
The MCLR reset path has a noise filter to detect and
ignore small pulses. See Table 12-6 for pulse width
specification.
FIGURE 9-7:
SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
S
R
Q
External
Reset
MCLR/
V
DD
OSC1/
WDT
Module
V
DD
rise
detect
OST/PWRT
On-chip
(1)
RC OSC
WDT
Time-out
Power-on Reset
OST
PWRT
Chip_Reset
10-bit Ripple-counter
Reset
Enable OST
Enable PWRT
SLEEP
See Table 9-3 for time-out situations.
Note 1:
This is a separate oscillator from the RC oscillator of the CLKIN pin.
Brown-out
Reset
BOREN
CLKIN
Pin
V
PP
Pin
10-bit Ripple-counter
Q
PIC16C62X
DS30235G-page 50
Preliminary
1998 Microchip Technology Inc.
9.4
Power-on Reset (POR), Power-up
Timer (PWRT), Oscillator Start-up
Timer (OST) and Brown-out Reset
(BOR)
9.4.1
POWER-ON RESET (POR)
The on-chip POR circuit holds the chip in reset until
V
DD
has reached a high enough level for proper opera-
tion. To take advantage of the POR, just tie the MCLR
pin through a resistor to V
DD
. This will eliminate exter-
nal RC components usually needed to create Power-on
Reset. A maximum rise time for V
DD
is required. See
Electrical Specifications for details.
The POR circuit does not produce an internal reset
when V
DD
declines.
When the device starts normal operation (exits the
reset condition), device operating parameters (voltage,
frequency, temperature, etc.) must be met to ensure
operation. If these conditions are not met, the device
must be held in reset until the operating conditions are
met.
For additional information, refer to Application Note
AN607 "Power-up Trouble Shooting".
9.4.2
POWER-UP TIMER (PWRT)
The Power-up Timer provides a fixed 72 ms (nominal)
time-out on power-up only, from POR or Brown-out
Reset. The Power-up Timer operates on an internal RC
oscillator. The chip is kept in reset as long as PWRT is
active. The PWRT delay allows the V
DD
to rise to an
acceptable level. A configuration bit, PWRTE can
disable (if set) or enable (if cleared or programmed) the
Power-up Timer. The Power-up Timer should always be
enabled when Brown-out Reset is enabled.
The Power-Up Time delay will vary from chip to chip
and due to V
DD
, temperature and process variation.
See DC parameters for details.
9.4.3
OSCILLATOR START-UP TIMER (OST)
The Oscillator Start-Up Timer (OST) provides a 1024
oscillator cycle (from OSC1 input) delay after the
PWRT delay is over. This ensures that the crystal
oscillator or resonator has started and stabilized.
The OST time-out is invoked only for XT, LP and HS
modes and only on power-on reset or wake-up from
SLEEP.
9.4.4
BROWN-OUT RESET (BOR)
The PIC16C62X members have on-chip Brown-out
Reset circuitry. A configuration bit, BOREN, can dis-
able (if clear/programmed) or enable (if set) the
Brown-out Reset circuitry. If V
DD
falls below 4.0V refer
to V
BOR
parameter D005(V
BOR
) for greater than
parameter (TBOR) in Table 12-6, the brown-out situa-
tion will reset the chip. A reset is not guaranteed to
occur if V
DD
falls below 4.0V for less than parameter
(TBOR).
On any reset (Power-on, Brown-out, Watchdog, etc.)
the chip will remain in Reset until V
DD
rises above
BV
DD
. The Power-up Timer will now be invoked and will
keep the chip in reset an additional 72 ms.
If V
DD
drops below BV
DD
while the Power-up Timer is
running, the chip will go back into a Brown-out Reset
and the Power-up Timer will be re-initialized. Once V
DD
rises above BV
DD
, the Power-Up Timer will execute a
72 ms reset. The Power-up Timer should always be
enabled when Brown-out Reset is enabled. Figure 9-8
shows typical Brown-out situations.
FIGURE 9-8:
BROWN-OUT SITUATIONS
72 ms
BV
DD
Max.
BV
DD
Min.
V
DD
Internal
Reset
BV
DD
Max.
BV
DD
Min.
V
DD
Internal
Reset
72 ms
<72 ms
72 ms
BV
DD
Max.
BV
DD
Min.
V
DD
Internal
Reset
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 51
PIC16C62X
9.4.5
TIME-OUT SEQUENCE
On power-up the time-out sequence is as follows: First
PWRT time-out is invoked after POR has expired. Then
OST is activated. The total time-out will vary based on
oscillator configuration and PWRTE bit status. For
example, in RC mode with PWRTE bit erased (PWRT
disabled), there will be no time-out at all. Figure 9-9,
Figure 9-10 and Figure
9-11 depict time-out
sequences.
Since the time-outs occur from the POR pulse, if MCLR
is kept low long enough, the time-outs will expire. Then
bringing MCLR high will begin execution immediately
(see Figure 9-10). This is useful for testing purposes or
to synchronize more than one PIC16C62X device oper-
ating in parallel.
Table 9-6 shows the reset conditions for some special
registers, while Table 9-7 shows the reset conditions for
all the registers.
9.4.6
POWER CONTROL (PCON)/
STATUS REGISTER
The power control/status register, PCON (address
8Eh) has two bits.
Bit0 is BOR (Brown-out). BOR is unknown on
power-on-reset. It must then be set by the user and
checked on subsequent resets to see if BOR = 0
indicating that a brown-out has occurred. The BOR
status bit is a don't care and is not necessarily
predictable if the brown-out circuit is disabled (by
setting BOREN bit = 0 in the Configuration word).
Bit1 is POR (Power-on-reset). It is a `0' on
power-on-reset and unaffected otherwise. The user
must write a `1' to this bit following a power-on-reset.
On a subsequent reset if POR is `0', it will indicate that
a power-on-reset must have occurred (V
DD
may have
gone too low).
TABLE 9-3:
TIME-OUT IN VARIOUS SITUATIONS
TABLE 9-4:
STATUS/PCON BITS AND THEIR SIGNIFICANCE
Legend: u = unchanged, x = unknown
Oscillator Configuration
Power-up
Brown-out Reset
Wake-up
from SLEEP
PWRTE = 0
PWRTE = 1
XT, HS, LP
72 ms + 1024 T
OSC
1024 T
OSC
72 ms + 1024 T
OSC
1024 T
OSC
RC
72 ms
--
72 ms
--
POR
BOR
TO
PD
0
X
1
1
Power-on-reset
0
X
0
X
Illegal, TO is set on POR
0
X
X
0
Illegal, PD is set on POR
1
0
X
X
Brown-out Reset
1
1
0
u
WDT Reset
1
1
0
0
WDT Wake-up
1
1
u
u
MCLR reset during normal operation
1
1
1
0
MCLR reset during SLEEP
TABLE 9-5:
SUMMARY OF REGISTERS ASSOCIATED WITH BROWN-OUT
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on POR
Reset
Value on all
other resets
(1)
83h
STATUS
TO
PD
0001 1xxx
000q quuu
8Eh
PCON
--
--
--
--
--
--
POR
BOR
---- --0x
---- --uq
Note1: Other (non power-up) resets include MCLR reset, Brown-out Reset and Watchdog Timer Reset during normal operation.
PIC16C62X
DS30235G-page 52
Preliminary
1998 Microchip Technology Inc.
TABLE 9-6:
INITIALIZATION CONDITION FOR SPECIAL REGISTERS
TABLE 9-7:
INITIALIZATION CONDITION FOR REGISTERS
Condition
Program
Counter
STATUS
Register
PCON
Register
Power-on Reset
000h
0001 1xxx
---- --0x
MCLR reset during normal operation
000h
000u uuuu
---- --uu
MCLR reset during SLEEP
000h
0001 0uuu
---- --uu
WDT reset
000h
0000 uuuu
---- --uu
WDT Wake-up
PC + 1
uuu0 0uuu
---- --uu
Brown-out Reset
000h
000x xuuu
---- --u0
Interrupt Wake-up from SLEEP
PC + 1
(1)
uuu1 0uuu
---- --uu
Legend:
u
= unchanged,
x
= unknown,
-
= unimplemented bit, reads as `0'.
Note 1:
When the wake-up is due to an interrupt and global enable bit, GIE is set, the PC is loaded with the interrupt vector
(0004h) after execution of PC+1.
Register
Address
Power-on Reset
MCLR Reset during
normal operation
MCLR Reset during
SLEEP
WDT Reset
Brown-out Reset
(1)
Wake up from SLEEP
through interrupt
Wake up from SLEEP
through WDT time-out
W
-
xxxx xxxx
uuuu uuuu
uuuu uuuu
INDF
00h
-
-
-
TMR0
01h
xxxx xxxx
uuuu uuuu
uuuu uuuu
PCL
02h
0000 0000
0000 0000
PC + 1
(3)
STATUS
03h
0001 1xxx
000q quuu
(4)
uuuq quuu
(4)
FSR
04h
xxxx xxxx
uuuu uuuu
uuuu uuuu
PORTA
05h
---x xxxx
---u uuuu
---u uuuu
PORTB
06h
xxxx xxxx
uuuu uuuu
uuuu uuuu
CMCON
1Fh
00-- 0000
00-- 0000
uu-- uuuu
PCLATH
0Ah
---0 0000
---0 0000
---u uuuu
INTCON
0Bh
0000 000x
0000 000u
uuuu uqqq
(2)
PIR1
0Ch
-0-- ----
-0-- ----
-q-- ----
(2,5)
OPTION
81h
1111 1111
1111 1111
uuuu uuuu
TRISA
85h
---1 1111
---1 1111
---u uuuu
TRISB
86h
1111 1111
1111 1111
uuuu uuuu
PIE1
8Ch
-0-- ----
-0-- ----
-u-- ----
PCON
8Eh
---- --0x
---- --uq
(1,6)
---- --uu
VRCON
9Fh
000- 0000
000- 0000
uuu- uuuu
Legend:
u
= unchanged,
x
= unknown,
-
= unimplemented bit, reads as `0',
q
= value depends on condition.
Note 1:
If V
DD
goes too low, Power-on Reset will be activated and registers will be affected differently.
2:
One or more bits in INTCON, PIR1 and/or PIR2 will be affected (to cause wake-up).
3:
When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h).
4:
See Table 9-6 for reset value for specific condition.
5:
If wake-up was due to comparator input changing, then bit 6 = 1. All other interrupts generating a wake-up will cause bit 6 = u.
6:
If reset was due to brown-out, then bit 0 = 0. All other resets will cause bit 0 = u.
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 53
PIC16C62X
FIGURE 9-9:
TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO V
DD
): CASE 1
FIGURE 9-10: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO V
DD
): CASE 2
FIGURE 9-11: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO V
DD
)
T
PWRT
T
OST
V
DD
MCLR
INTERNAL POR
PWRT TIME-OUT
OST TIME-OUT
INTERNAL RESET
V
DD
MCLR
INTERNAL POR
PWRT TIME-OUT
OST TIME-OUT
INTERNAL RESET
T
PWRT
T
OST
T
PWRT
T
OST
V
DD
MCLR
INTERNAL POR
PWRT TIME-OUT
OST TIME-OUT
INTERNAL RESET
PIC16C62X
DS30235G-page 54
Preliminary
1998 Microchip Technology Inc.
FIGURE 9-12: EXTERNAL POWER-ON
RESET CIRCUIT (FOR SLOW
V
DD
POWER-UP)
Note 1: External power-on reset circuit is required
only if V
DD
power-up slope is too slow.
The diode D helps discharge the capaci-
tor quickly when V
DD
powers down.
2: < 40 k
is recommended to make sure
that voltage drop across R does not vio-
late the device's electrical specification.
3: R1 = 100
to 1 k
will limit any current
flowing into MCLR from external capaci-
tor C in the event of MCLR/V
PP
pin break-
down due to Electrostatic Discharge
(ESD) or Electrical Overstress (EOS).
C
R1
R
D
V
DD
MCLR
PIC16C62X
V
DD
FIGURE 9-13: EXTERNAL BROWN-OUT
PROTECTION CIRCUIT 1
FIGURE 9-14: EXTERNAL BROWN-OUT
PROTECTION CIRCUIT 2
Note 1: This circuit will activate reset when V
DD
goes below (Vz + 0.7V) where
Vz = Zener voltage.
2: Internal Brown-out Reset circuitry
should be disabled when using this cir-
cuit.
V
DD
33k
10k
40k
V
DD
MCLR
PIC16C62X
Note 1: This brown-out circuit is less expensive,
albeit less accurate. Transistor Q1 turns
off when V
DD
is below a certain level
such that:
2: Internal brown-out reset should be dis-
abled when using this circuit.
3: Resistors should be adjusted for the
characteristics of the transistor.
V
DD
x
R1
R1 + R2
= 0.7 V
V
DD
R2
40k
V
DD
MCLR
PIC16C62X
R1
Q1
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 55
PIC16C62X
9.5
Interrupts
The PIC16C62X has 4 sources of interrupt:
External interrupt RB0/INT
TMR0 overflow interrupt
PortB change interrupts (pins RB7:RB4)
Comparator interrupt
The interrupt control register (INTCON) records
individual interrupt requests in flag bits. It also has
individual and global interrupt enable bits.
A global interrupt enable bit, GIE (INTCON<7>)
enables (if set) all un-masked interrupts or disables (if
cleared) all interrupts. Individual interrupts can be
disabled through their corresponding enable bits in
INTCON register. GIE is cleared on reset.
The "return from interrupt" instruction,
RETFIE
, exits
interrupt routine as well as sets the GIE bit, which
re-enable RB0/INT interrupts.
The INT pin interrupt, the RB port change interrupt and
the TMR0 overflow interrupt flags are contained in the
INTCON register.
The peripheral interrupt flag is contained in the special
register PIR1. The corresponding interrupt enable bit is
contained in special registers PIE1.
When an interrupt is responded to, the GIE is cleared
to disable any further interrupt, the return address is
pushed into the stack and the PC is loaded with 0004h.
Once in the interrupt service routine the source(s) of
the interrupt can be determined by polling the interrupt
flag bits. The interrupt flag bit(s) must be cleared in soft-
ware before re-enabling interrupts to avoid RB0/INT
recursive interrupts.
For external interrupt events, such as the INT pin or
PORTB change interrupt, the interrupt latency will be
three or four instruction cycles. The exact latency
depends when the interrupt event occurs (Figure 9-16).
The latency is the same for one or two cycle
instructions. Once in the interrupt service routine the
source(s) of the interrupt can be determined by polling
the interrupt flag bits. The interrupt flag bit(s) must be
cleared in software before re-enabling interrupts to
avoid multiple interrupt requests. Individual interrupt
flag bits are set regardless of the status of their
corresponding mask bit or the GIE bit.
Note 1:
Individual interrupt flag bits are set
regardless of the status of their
corresponding
mask bit or the GIE bit.
2:
When an instruction that clears the GIE
bit is executed, any interrupts that were
pending for execution in the next cycle
are ignored. The CPU will execute a
NOP in the cycle immediately following
the instruction which clears the GIE bit.
The interrupts which were ignored are
still pending to be serviced when the GIE
bit is set again.
FIGURE 9-15: INTERRUPT LOGIC
RBIF
RBIE
T0IF
T0IE
INTF
INTE
GIE
PEIE
Wake-up
(If in SLEEP mode)
Interrupt
to CPU
CMIE
CMIF
PIC16C62X
DS30235G-page 56
Preliminary
1998 Microchip Technology Inc.
9.5.1
RB0/INT INTERRUPT
External interrupt on RB0/INT pin is edge triggered:
either rising if INTEDG bit (OPTION<6>) is set, or fall-
ing, if INTEDG bit is clear. When a valid edge appears
on the RB0/INT pin, the INTF bit (INTCON<1>) is set.
This interrupt can be disabled by clearing the INTE
control bit (INTCON<4>). The INTF bit must be cleared
in software in the interrupt service routine before
re-enabling this interrupt. The RB0/INT interrupt can
wake-up the processor from SLEEP, if the INTE bit was
set prior to going into SLEEP. The status of the GIE bit
decides whether or not the processor branches to the
interrupt vector following wake-up. See Section 9.8 for
details on SLEEP and Figure
9-18 for timing of
wake-up from SLEEP through RB0/INT interrupt.
9.5.2
TMR0 INTERRUPT
An overflow (FFh
00h) in the TMR0 register will
set the T0IF (INTCON<2>) bit. The interrupt can
be enabled/disabled by setting/clearing T0IE
(INTCON<5>)
bit.
For operation of the Timer0 module,
see Section 6.0.
9.5.3
PORTB INTERRUPT
An input change on PORTB <7:4> sets the RBIF
(INTCON<0>) bit. The interrupt can be enabled/dis-
abled by setting/clearing the RBIE (INTCON<4>) bit.
For operation of PORTB (Section 5.2).
9.5.4
COMPARATOR INTERRUPT
See Section 7.6 for complete description of comparator
interrupts.
Note:
If a change on the I/O pin should occur
when the read operation is being executed
(start of the Q2 cycle), then the RBIF inter-
rupt flag may not get set.
FIGURE 9-16: INT PIN INTERRUPT TIMING
TABLE 9-8:
SUMMARY OF INTERRUPT REGISTERS
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on POR
Reset
Value on all
other resets
(1)
0Bh
INTCON
GIE
PEIE
T0IE
INTE
RBIE
T0IF
INTF
RBIF
0000 000x
0000 000u
0Ch
PIR1
--
CMIF
--
--
--
--
--
--
-0-- ----
-0-- ----
8Ch
PIE1
--
CMIE
--
--
--
--
--
--
-0-- ----
-0-- ----
Note1: Other (non power-up) resets include MCLR reset, Brown-out Reset and Watchdog Timer Reset during normal operation.
Q2
Q1
Q3
Q4
Q2
Q1
Q3
Q4
Q2
Q1
Q3
Q4
Q2
Q1
Q3
Q4
Q2
Q1
Q3
Q4
OSC1
CLKOUT
INT pin
INTF flag
(INTCON<1>)
GIE bit
(INTCON<7>)
INSTRUCTION FLOW
PC
Instruction
fetched
Instruction
executed
Interrupt Latency
PC
PC+1
PC+1
0004h
0005h
Inst (0004h)
Inst (0005h)
Dummy Cycle
Inst (PC)
Inst (PC+1)
Inst (PC-1)
Inst (0004h)
Dummy Cycle
Inst (PC)
--
1
4
5
1
Note 1: INTF flag is sampled here (every Q1).
2: Asynchronous interrupt latency = 3-4 Tcy. Synchronous latency = 3 Tcy, where Tcy = instruction cycle time.
Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction.
3: CLKOUT is available only in RC oscillator mode.
4: For minimum width of INT pulse, refer to AC specs.
5: INTF is enabled to be set anytime during the Q4-Q1 cycles.
2
3
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 57
PIC16C62X
9.6
Context Saving During Interrupts
During an interrupt, only the return PC value is saved
on the stack. Typically, users may wish to save key reg-
isters during an interrupt e.g. W register and STATUS
register. This will have to be implemented in software.
Example 9-1 stores and restores the STATUS and W
registers. The user register, W_TEMP, must be defined
in both banks and must be defined at the same offset
from the bank base address (i.e., W_TEMP is defined
at 0x20 in Bank 0 and it must also be defined at 0xA0
in Bank 1). The user register, STATUS_TEMP, must be
defined in Bank 0. The Example 9-1:
Stores the W register
Stores the STATUS register in Bank 0
Executes the ISR code
Restores the STATUS (and bank select bit
register)
Restores the W register
EXAMPLE 9-1:
SAVING THE STATUS AND
W REGISTERS IN RAM
MOVWF
W_TEMP
;copy W to temp register,
;could be in either bank
SWAPF
STATUS,W
;swap status to be saved into W
BCF
STATUS,RP0
;change to bank 0 regardless
;of current bank
MOVWF
STATUS_TEMP
;save status to bank 0
;register
:
:
(ISR)
:
SWAPF
STATUS_TEMP,W
;swap STATUS_TEMP register
;into W, sets bank to original
;state
MOVWF
STATUS
;move W into STATUS register
SWAPF
W_TEMP,F
;swap W_TEMP
SWAPF
W_TEMP,W
;swap W_TEMP into W
9.7
Watchdog Timer (WDT)
The watchdog timer is a free running on-chip RC oscil-
lator which does not require any external components.
This RC oscillator is separate from the RC oscillator of
the CLKIN pin. That means that the WDT will run, even
if the clock on the OSC1 and OSC2 pins of the device
has been stopped, for example, by execution of a
SLEEP
instruction. During normal operation, a WDT
time-out generates a device RESET. If the device is in
SLEEP mode, a WDT time-out causes the device to
wake-up and continue with normal operation. The WDT
can be permanently disabled by programming the con-
figuration bit WDTE as clear (Section 9.1).
9.7.1
WDT PERIOD
The WDT has a nominal time-out period of 18 ms, (with
no prescaler). The time-out periods vary with tempera-
ture, V
DD
and process variations from part to part (see
DC specs). If longer time-out periods are desired, a
prescaler with a division ratio of up to 1:128 can be
assigned to the WDT under software control by writing
to the OPTION register. Thus, time-out periods up to
2.3 seconds can be realized.
The
CLRWDT
and
SLEEP
instructions clear the WDT
and the postscaler, if assigned to the WDT, and prevent
it from timing out and generating a device RESET.
The TO bit in the STATUS register will be cleared upon
a Watchdog Timer time-out.
9.7.2
WDT PROGRAMMING CONSIDERATIONS
It should also be taken in account that under worst case
conditions (V
DD
= Min., Temperature = Max., max.
WDT prescaler) it may take several seconds before a
WDT time-out occurs.
PIC16C62X
DS30235G-page 58
Preliminary
1998 Microchip Technology Inc.
FIGURE 9-17: WATCHDOG TIMER BLOCK DIAGRAM
TABLE 9-9:
SUMMARY OF WATCHDOG TIMER REGISTERS
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
2007h
Config. bits
---
BOREN
CP1
CP0
PWRTE
WDTE
FOSC1
FOSC0
81h
OPTION
RBPU
INTEDG
T0CS
T0SE
PSA
PS2
PS1
PS0
Legend: Shaded cells are not used by the Watchdog Timer.
Note:
_
= Unimplemented location, read as "0"
+ = Reserved for future use
From TMR0 Clock Source
(Figure 6-6)
To TMR0 (Figure 6-6)
Postscaler
Watchdog
Timer
M
U
X
PSA
8 - to -1 MUX
PSA
WDT
Time-out
1
0
0
1
WDT
Enable Bit
PS<2:0>
Note: T0SE, T0CS, PSA, PS0-PS2 are bits in the OPTION register.
8
MUX
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 59
PIC16C62X
9.8
Power-Down Mode (SLEEP)
The Power-down mode is entered by executing a
SLEEP
instruction.
If enabled, the Watchdog Timer will be cleared but
keeps running, the PD bit in the STATUS register is
cleared, the TO bit is set, and the oscillator driver is
turned off. The I/O ports maintain the status they had,
before
SLEEP
was executed (driving high, low, or
hi-impedance).
For lowest current consumption in this mode, all I/O
pins should be either at V
DD
, or V
SS
, with no external
circuitry drawing current from the I/O pin and the com-
parators and V
REF
should be disabled. I/O pins that are
hi-impedance inputs should be pulled high or low exter-
nally to avoid switching currents caused by floating
inputs. The T0CKI input should also be at V
DD
or V
SS
for lowest current consumption. The contribution from
on chip pull-ups on PORTB should be considered.
The MCLR pin must be at a logic high level (V
IHMC
).
9.8.1
WAKE-UP FROM SLEEP
The device can wake-up from SLEEP through one of
the following events:
1.
External reset input on MCLR pin
2.
Watchdog Timer Wake-up (if WDT was enabled)
3.
Interrupt from RB0/INT pin, RB Port change, or
the Peripheral Interrupt (Comparator).
The first event will cause a device reset. The two latter
events are considered a continuation of program exe-
cution. The TO and PD bits in the STATUS register can
be used to determine the cause of device reset. PD
bit, which is set on power-up is cleared when SLEEP is
invoked. TO bit is cleared if WDT Wake-up occurred.
When the
SLEEP
instruction is being executed, the
next instruction (PC + 1) is pre-fetched. For the device
to wake-up through an interrupt event, the correspond-
ing interrupt enable bit must be set (enabled). Wake-up
is regardless of the state of the GIE bit. If the GIE bit is
clear (disabled), the device continues execution at the
instruction after the
SLEEP
instruction. If the GIE bit is
set (enabled), the device executes the instruction after
the
SLEEP
instruction and then branches to the inter-
rupt address (0004h). In cases where the execution of
the instruction following
SLEEP
is not desirable, the
user should have an
NOP
after the
SLEEP
instruction.
The WDT is cleared when the device wakes-up from
sleep, regardless of the source of wake-up.
Note:
It should be noted that a RESET generated
by a WDT time-out does not drive MCLR
pin low.
Note:
If the global interrupts are disabled (GIE is
cleared), but any interrupt source has both
its interrupt enable bit and the correspond-
ing interrupt flag bits set, the device will
immediately wakeup from sleep. The sleep
instruction is completely executed.
FIGURE 9-18: WAKE-UP FROM SLEEP THROUGH INTERRUPT
Q1
Q2
Q3 Q4
Q1 Q2
Q3
Q4
Q1
Q1
Q2 Q3 Q4
Q1 Q2 Q3 Q4
Q1
Q2 Q3
Q4
Q1 Q2
Q3
Q4
OSC1
CLKOUT(4)
INT pin
INTF flag
(INTCON<1>)
GIE bit
(INTCON<7>)
INSTRUCTION FLOW
PC
Instruction
fetched
Instruction
executed
PC
PC+1
PC+2
Inst(PC) = SLEEP
Inst(PC - 1)
Inst(PC + 1)
SLEEP
Processor in
SLEEP
Interrupt Latency
(Note 2)
Inst(PC + 2)
Inst(PC + 1)
Inst(0004h)
Inst(0005h)
Inst(0004h)
Dummy cycle
PC + 2
0004h
0005h
Dummy cycle
T
OST
(2)
PC+2
Note
1:
XT, HS or LP oscillator mode assumed.
2:
T
OST
= 1024T
OSC
(drawing not to scale) This delay will not be there for RC osc mode.
3:
GIE = '1' assumed. In this case after wake- up, the processor jumps to the interrupt routine. If GIE = '0', execution will continue in-line.
4:
CLKOUT is not available in these osc modes, but shown here for timing reference.
PIC16C62X
DS30235G-page 60
Preliminary
1998 Microchip Technology Inc.
9.9
Code Protection
If the code protection bit(s) have not been
programmed, the on-chip program memory can be
read out for verification purposes.
9.10
ID Locations
Four memory locations (2000h-2003h) are designated
as ID locations where the user can store checksum or
other code-identification numbers. These locations are
not accessible during normal execution but are
readable and writable during program/verify. Only the
least significant 4 bits of the ID locations are used.
Note:
Microchip does not recommend code
protecting windowed devices.
9.11
In-Circuit Serial Programming
The PIC16C62X microcontrollers can be serially
programmed while in the end application circuit. This is
simply done with two lines for clock and data, and three
other lines for power, ground, and the programming
voltage. This allows customers to manufacture boards
with unprogrammed devices, and then program the
microcontroller just before shipping the product. This
also allows the most recent firmware or a custom
firmware to be programmed.
The device is placed into a program/verify mode by
holding the RB6 and RB7 pins low while raising the
MCLR (V
PP
) pin from V
IL
to V
IHH
(see programming
specification). RB6 becomes the programming clock
and RB7 becomes the programming data. Both RB6
and RB7 are Schmitt Trigger inputs in this mode.
After reset, to place the device into programming/verify
mode, the program counter (PC) is at location 00h. A
6-bit command is then supplied to the device.
Depending on the command, 14-bits of program data
are then supplied to or from the device, depending if the
command was a load or a read. For complete details of
serial programming, please refer to the
PIC16C6X/7X/9XX Programming Specifications
(#DS30228).
A typical in-circuit serial programming connection is
shown in Figure 9-19.
FIGURE 9-19: TYPICAL IN-CIRCUIT SERIAL
PROGRAMMING
CONNECTION
External
Connector
Signals
To Normal
Connections
To Normal
Connections
PIC16C62X
V
DD
V
SS
MCLR/V
PP
RB6
RB7
+5V
0V
V
PP
CLK
Data I/O
V
DD
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 61
PIC16C62X
10.0
INSTRUCTION SET SUMMARY
Each PIC16C62X instruction is a 14-bit word divided
into an OPCODE which specifies the instruction type
and one or more operands which further specify the
operation of the instruction. The PIC16C62X instruc-
tion set summary in Table 10-2 lists byte-oriented,
bit-oriented, and literal and control operations.
Table
10-1 shows the opcode field descriptions.
For byte-oriented instructions, 'f' represents a file
register designator and 'd' represents a destination
designator. The file register designator specifies which
file register is to be used by the instruction.
The destination designator specifies where the result of
the operation is to be placed. If 'd' is zero, the result is
placed in the W register. If 'd' is one, the result is placed
in the file register specified in the instruction.
For bit-oriented instructions, 'b' represents a bit field
designator which selects the number of the bit affected
by the operation, while 'f' represents the number of the
file in which the bit is located.
For literal and control operations, 'k' represents an
eight or eleven bit constant or literal value.
TABLE 10-1:
OPCODE FIELD
DESCRIPTIONS
Field
Description
f
Register file address (0x00 to 0x7F)
W
Working register (accumulator)
b
Bit address within an 8-bit file register
k
Literal field, constant data or label
x
Don't care location (= 0 or 1)
The assembler will generate code with x = 0. It is the
recommended form of use for compatibility with all
Microchip software tools.
d
Destination select; d = 0: store result in W,
d = 1: store result in file register f.
Default is d = 1
label
Label name
TOS
Top of Stack
PC
Program Counter
PCLATH
Program Counter High Latch
GIE
Global Interrupt Enable bit
WDT
Watchdog Timer/Counter
TO
Time-out bit
PD
Power-down bit
dest
Destination either the W register or the specified
register file location
[ ]
Options
( )
Contents
Assigned to
< >
Register bit field
In the set of
i
talics User defined term (font is courier)
The instruction set is highly orthogonal and is grouped
into three basic categories:
Byte-oriented operations
Bit-oriented operations
Literal and control operations
All instructions are executed within one single
instruction cycle, unless a conditional test is true or the
program counter is changed as a result of an
instruction. In this case, the execution takes two
instruction cycles with the second cycle executed as a
NOP. One instruction cycle consists of four oscillator
periods. Thus, for an oscillator frequency of 4 MHz, the
normal instruction execution time is 1
s. If a
conditional test is true or the program counter is
changed as a result of an instruction, the instruction
execution time is 2
s.
Table 10-1 lists the instructions recognized by the
MPASM assembler.
Figure 10-1 shows the three general formats that the
instructions can have.
All examples use the following format to represent a
hexadecimal number:
0xhh
where h signifies a hexadecimal digit.
FIGURE 10-1: GENERAL FORMAT FOR
INSTRUCTIONS
Note:
To maintain upward compatibility with
future PICmicroTM products, do not use the
OPTION
and
TRIS
instructions.
Byte-oriented file register operations
13 8 7 6 0
d = 0 for destination W
OPCODE d f (FILE #)
d = 1 for destination f
f = 7-bit file register address
Bit-oriented file register operations
13 10 9 7 6 0
OPCODE b (BIT #) f (FILE #)
b = 3-bit bit address
f = 7-bit file register address
Literal and control operations
13 8 7 0
OPCODE k (literal)
k = 8-bit immediate value
13 11 10 0
OPCODE k (literal)
k = 11-bit immediate value
General
CALL
and
GOTO
instructions only
PIC16C62X
DS30235G-page 62
Preliminary
1998 Microchip Technology Inc.
TABLE 10-2:
PIC16C62X INSTRUCTION SET
Mnemonic,
Operands
Description
Cycles
14-Bit Opcode
Status
Affected
Notes
MSb
LSb
BYTE-ORIENTED FILE REGISTER OPERATIONS
ADDWF
ANDWF
CLRF
CLRW
COMF
DECF
DECFSZ
INCF
INCFSZ
IORWF
MOVF
MOVWF
NOP
RLF
RRF
SUBWF
SWAPF
XORWF
f, d
f, d
f
-
f, d
f, d
f, d
f, d
f, d
f, d
f, d
f
-
f, d
f, d
f, d
f, d
f, d
Add W and f
AND W with f
Clear f
Clear W
Complement f
Decrement f
Decrement f, Skip if 0
Increment f
Increment f, Skip if 0
Inclusive OR W with f
Move f
Move W to f
No Operation
Rotate Left f through Carry
Rotate Right f through Carry
Subtract W from f
Swap nibbles in f
Exclusive OR W with f
1
1
1
1
1
1
1(2)
1
1(2)
1
1
1
1
1
1
1
1
1
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
0111
0101
0001
0001
1001
0011
1011
1010
1111
0100
1000
0000
0000
1101
1100
0010
1110
0110
dfff
dfff
lfff
0000
dfff
dfff
dfff
dfff
dfff
dfff
dfff
lfff
0xx0
dfff
dfff
dfff
dfff
dfff
ffff
ffff
ffff
0011
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
0000
ffff
ffff
ffff
ffff
ffff
C,DC,Z
Z
Z
Z
Z
Z
Z
Z
Z
C
C
C,DC,Z
Z
1,2
1,2
2
1,2
1,2
1,2,3
1,2
1,2,3
1,2
1,2
1,2
1,2
1,2
1,2
1,2
BIT-ORIENTED FILE REGISTER OPERATIONS
BCF
BSF
BTFSC
BTFSS
f, b
f, b
f, b
f, b
Bit Clear f
Bit Set f
Bit Test f, Skip if Clear
Bit Test f, Skip if Set
1
1
1 (2)
1 (2)
01
01
01
01
00bb
01bb
10bb
11bb
bfff
bfff
bfff
bfff
ffff
ffff
ffff
ffff
1,2
1,2
3
3
LITERAL AND CONTROL OPERATIONS
ADDLW
ANDLW
CALL
CLRWDT
GOTO
IORLW
MOVLW
RETFIE
RETLW
RETURN
SLEEP
SUBLW
XORLW
k
k
k
-
k
k
k
-
k
-
-
k
k
Add literal and W
AND literal with W
Call subroutine
Clear Watchdog Timer
Go to address
Inclusive OR literal with W
Move literal to W
Return from interrupt
Return with literal in W
Return from Subroutine
Go into standby mode
Subtract W from literal
Exclusive OR literal with W
1
1
2
1
2
1
1
2
2
2
1
1
1
11
11
10
00
10
11
11
00
11
00
00
11
11
111x
1001
0kkk
0000
1kkk
1000
00xx
0000
01xx
0000
0000
110x
1010
kkkk
kkkk
kkkk
0110
kkkk
kkkk
kkkk
0000
kkkk
0000
0110
kkkk
kkkk
kkkk
kkkk
kkkk
0100
kkkk
kkkk
kkkk
1001
kkkk
1000
0011
kkkk
kkkk
C,DC,Z
Z
TO
,
PD
Z
TO
,
PD
C,DC,Z
Z
Note 1:
When an I/O register is modified as a function of itself ( e.g.,
MOVF PORTB, 1
), the value used will be that value present
on the pins themselves. For example, if the data latch is '1' for a pin configured as input and is driven low by an external
device, the data will be written back with a '0'.
2:
If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared if assigned
to the Timer0 Module.
3:
If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is
executed as a NOP.
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 63
PIC16C62X
10.1
Instruction Descriptions
ADDLW
Add Literal and W
Syntax:
[
label ] ADDLW k
Operands:
0
k
255
Operation:
(W) + k
(W)
Status Affected:
C, DC, Z
Encoding:
11
111x
kkkk
kkkk
Description:
The contents of the W register are
added to the eight bit literal 'k' and the
result is placed in the W register
.
Words:
1
Cycles:
1
Example
ADDLW
0x15
Before Instruction
W
=
0x10
After Instruction
W
=
0x25
ADDWF
Add W and f
Syntax:
[
label ] ADDWF f,d
Operands:
0
f
127
d
[0,1]
Operation:
(W) + (f)
(dest)
Status Affected:
C, DC, Z
Encoding:
00
0111
dfff
ffff
Description:
Add the contents of the W register
with register 'f'. If 'd' is 0 the result is
stored in the W register. If 'd' is 1 the
result is stored back in register 'f'
.
Words:
1
Cycles:
1
Example
ADDWF
FSR,
0
Before Instruction
W
=
0x17
FSR =
0xC2
After Instruction
W
=
0xD9
FSR =
0xC2
ANDLW
AND Literal with W
Syntax:
[
label ] ANDLW k
Operands:
0
k
255
Operation:
(W) .AND. (k)
(W)
Status Affected:
Z
Encoding:
11
1001
kkkk
kkkk
Description:
The contents of W register are
AND'ed with the eight bit literal 'k'. The
result is placed in the W register
.
Words:
1
Cycles:
1
Example
ANDLW
0x5F
Before Instruction
W
=
0xA3
After Instruction
W
=
0x03
ANDWF
AND W with f
Syntax:
[
label ] ANDWF f,d
Operands:
0
f
127
d
[0,1]
Operation:
(W) .AND. (f)
(dest)
Status Affected:
Z
Encoding:
00
0101
dfff
ffff
Description:
AND the W register with register 'f'. If
'd' is 0 the result is stored in the W
register. If 'd' is 1 the result is stored
back in register 'f'
.
Words:
1
Cycles:
1
Example
ANDWF
FSR,
1
Before Instruction
W
=
0x17
FSR =
0xC2
After Instruction
W
=
0x17
FSR =
0x02
PIC16C62X
DS30235G-page 64
Preliminary
1998 Microchip Technology Inc.
BCF
Bit Clear f
Syntax:
[
label ] BCF f,b
Operands:
0
f
127
0
b
7
Operation:
0
(f<b>)
Status Affected:
None
Encoding:
01
00bb
bfff
ffff
Description:
Bit 'b' in register 'f' is cleared
.
Words:
1
Cycles:
1
Example
BCF
FLAG_REG, 7
Before Instruction
FLAG_REG = 0xC7
After Instruction
FLAG_REG = 0x47
BSF
Bit Set f
Syntax:
[
label ] BSF f,b
Operands:
0
f
127
0
b
7
Operation:
1
(f<b>)
Status Affected:
None
Encoding:
01
01bb
bfff
ffff
Description:
Bit 'b' in register 'f' is set.
Words:
1
Cycles:
1
Example
BSF
FLAG_REG, 7
Before Instruction
FLAG_REG = 0x0A
After Instruction
FLAG_REG = 0x8A
BTFSC
Bit Test, Skip if Clear
Syntax:
[
label ] BTFSC f,b
Operands:
0
f
127
0
b
7
Operation:
skip if (f<b>) = 0
Status Affected:
None
Encoding:
01
10bb
bfff
ffff
Description:
If bit 'b' in register 'f' is '0' then the next
instruction is skipped.
If bit 'b' is '0' then the next instruction
fetched during the current instruction
execution is discarded, and a NOP is
executed instead, making this a
two-cycle instruction
.
Words:
1
Cycles:
1(2)
Example
HERE
FALSE
TRUE
BTFSC
GOTO


FLAG,1
PROCESS_CODE
Before Instruction
PC =
address
HERE
After Instruction
if FLAG<1> = 0,
PC = address
TRUE
if FLAG<1>=1,
PC = address
FALSE
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 65
PIC16C62X
BTFSS
Bit Test f, Skip if Set
Syntax:
[
label ] BTFSS f,b
Operands:
0
f
127
0
b < 7
Operation:
skip if (f<b>) = 1
Status Affected:
None
Encoding:
01
11bb
bfff
ffff
Description:
If bit 'b' in register 'f' is '1' then the next
instruction is skipped.
If bit 'b' is '1', then the next instruction
fetched during the current instruction
execution, is discarded and a NOP is
executed instead, making this a
two-cycle instruction.
Words:
1
Cycles:
1(2)
Example
HERE
FALSE
TRUE
BTFSS
GOTO
FLAG,1
PROCESS_CODE
Before Instruction
PC =
address
HERE
After Instruction
if FLAG<1> = 0,
PC = address
FALSE
if FLAG<1> = 1,
PC = address
TRUE
CALL
Call Subroutine
Syntax:
[
label ] CALL k
Operands:
0
k
2047
Operation:
(PC)+ 1
TOS,
k
PC<10:0>,
(PCLATH<4:3>)
PC<12:11>
Status Affected:
None
Encoding:
10
0kkk
kkkk
kkkk
Description:
Call Subroutine. First, return address
(PC+1) is pushed onto the stack. The
eleven bit immediate address is loaded
into PC bits <10:0>. The upper bits of
the PC are loaded from PCLATH.
CALL
is a two-cycle instruction.
Words:
1
Cycles:
2
Example
HERE
CALL THERE
Before Instruction
PC = Address
HERE
After Instruction
PC = Address
THERE
TOS = Address
HERE+1
CLRF
Clear f
Syntax:
[
label ] CLRF f
Operands:
0
f
127
Operation:
00h
(f)
1
Z
Status Affected:
Z
Encoding:
00
0001
1fff
ffff
Description:
The contents of register 'f' are cleared
and the Z bit is set.
Words:
1
Cycles:
1
Example
CLRF
FLAG_REG
Before Instruction
FLAG_REG
=
0x5A
After Instruction
FLAG_REG
=
0x00
Z
=
1
CLRW
Clear W
Syntax:
[
label ] CLRW
Operands:
None
Operation:
00h
(W)
1
Z
Status Affected:
Z
Encoding:
00
0001
0000
0011
Description:
W register is cleared. Zero bit (Z) is
set.
Words:
1
Cycles:
1
Example
CLRW
Before Instruction
W
=
0x5A
After Instruction
W
=
0x00
Z
=
1
PIC16C62X
DS30235G-page 66
Preliminary
1998 Microchip Technology Inc.
CLRWDT
Clear Watchdog Timer
Syntax:
[
label ] CLRWDT
Operands:
None
Operation:
00h
WDT
0
WDT prescaler,
1
TO
1
PD
Status Affected:
TO, PD
Encoding:
00
0000
0110
0100
Description:
CLRWDT
instruction resets the
Watchdog Timer. It also resets the
prescaler of the WDT. Status bits TO
and PD are set.
Words:
1
Cycles:
1
Example
CLRWDT
Before Instruction
WDT counter =
?
After Instruction
WDT counter =
0x00
WDT prescaler=
0
TO
=
1
PD
=
1
COMF
Complement f
Syntax:
[
label ] COMF f,d
Operands:
0
f
127
d
[0,1]
Operation:
(f)
(dest)
Status Affected:
Z
Encoding:
00
1001
dfff
ffff
Description:
The contents of register 'f' are
complemented. If 'd' is 0 the result is
stored in W. If 'd' is 1 the result is
stored back in register 'f'.
Words:
1
Cycles:
1
Example
COMF
REG1,0
Before Instruction
REG1
=
0x13
After Instruction
REG1
=
0x13
W
=
0xEC
DECF
Decrement f
Syntax:
[
label ] DECF f,d
Operands:
0
f
127
d
[0,1]
Operation:
(f) - 1
(dest)
Status Affected:
Z
Encoding:
00
0011
dfff
ffff
Description:
Decrement register 'f'. If 'd' is 0 the
result is stored in the W register. If 'd'
is 1 the result is stored back in register
'f'
.
Words:
1
Cycles:
1
Example
DECF CNT, 1
Before Instruction
CNT
=
0x01
Z
=
0
After Instruction
CNT
=
0x00
Z
=
1
DECFSZ
Decrement f, Skip if 0
Syntax:
[
label ] DECFSZ f,d
Operands:
0
f
127
d
[0,1]
Operation:
(f) - 1
(dest); skip if result = 0
Status Affected:
None
Encoding:
00
1011
dfff
ffff
Description:
The contents of register 'f' are
decremented. If 'd' is 0 the result is
placed in the W register. If 'd' is 1 the
result is placed back in register 'f'.
If the result is 0, the next instruction,
which is already fetched, is discarded. A
NOP is executed instead making it a
two-cycle instruction.
Words:
1
Cycles:
1(2)
Example
HERE DECFSZ CNT, 1
GOTO LOOP
CONTINUE

Before Instruction
PC
=
address
HERE
After Instruction
CNT
=
CNT - 1
if CNT =
0,
PC
=
address
CONTINUE
if CNT
0,
PC
=
address
HERE+1
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 67
PIC16C62X
GOTO
Unconditional Branch
Syntax:
[
label ] GOTO k
Operands:
0
k
2047
Operation:
k
PC<10:0>
PCLATH<4:3>
PC<12:11>
Status Affected:
None
Encoding:
10
1kkk
kkkk
kkkk
Description:
GOTO
is an unconditional branch. The
eleven bit immediate value is loaded
into PC bits <10:0>. The upper bits of
PC are loaded from PCLATH<4:3>.
GOTO
is a two-cycle instruction.
Words:
1
Cycles:
2
Example
GOTO THERE
After Instruction
PC =
Address
THERE
INCF
Increment f
Syntax:
[
label ] INCF f,d
Operands:
0
f
127
d
[0,1]
Operation:
(f) + 1
(dest)
Status Affected:
Z
Encoding:
00
1010
dfff
ffff
Description:
The contents of register 'f' are
incremented. If 'd' is 0 the result is
placed in the W register. If 'd' is 1 the
result is placed back in register 'f'.
Words:
1
Cycles:
1
Example
INCF
CNT,
1
Before Instruction
CNT
=
0xFF
Z
=
0
After Instruction
CNT
=
0x00
Z
=
1
INCFSZ
Increment f, Skip if 0
Syntax:
[
label ] INCFSZ f,d
Operands:
0
f
127
d
[0,1]
Operation:
(f) + 1
(dest), skip if result = 0
Status Affected:
None
Encoding:
00
1111
dfff
ffff
Description:
The contents of register 'f' are
incremented. If 'd' is 0 the result is
placed in the W register. If 'd' is 1 the
result is placed back in register 'f'.
If the result is 0, the next instruction,
which is already fetched, is discarded.
A NOP is executed instead making it
a two-cycle instruction
.
Words:
1
Cycles:
1(2)
Example
HERE INCFSZ CNT, 1
GOTO LOOP
CONTINUE

Before Instruction
PC
=
address
HERE
After Instruction
CNT
=
CNT + 1
if CNT=
0,
PC
=
address
CONTINUE
if CNT
0,
PC
=
address
HERE +1
IORLW
Inclusive OR Literal with W
Syntax:
[
label ] IORLW k
Operands:
0
k
255
Operation:
(W) .OR. k
(W)
Status Affected:
Z
Encoding:
11
1000
kkkk
kkkk
Description:
The contents of the W register is
OR'ed with the eight bit literal 'k'. The
result is placed in the W register
.
Words:
1
Cycles:
1
Example
IORLW
0x35
Before Instruction
W
=
0x9A
After Instruction
W
=
0xBF
Z
=
1
PIC16C62X
DS30235G-page 68
Preliminary
1998 Microchip Technology Inc.
IORWF
Inclusive OR W with f
Syntax:
[
label ] IORWF f,d
Operands:
0
f
127
d
[0,1]
Operation:
(W) .OR. (f)
(dest)
Status Affected:
Z
Encoding:
00
0100
dfff
ffff
Description:
Inclusive OR the W register with
register 'f'. If 'd' is 0 the result is placed
in the W register. If 'd' is 1 the result is
placed back in register 'f'.
Words:
1
Cycles:
1
Example
IORWF
RESULT, 0
Before Instruction
RESULT =
0x13
W
=
0x91
After Instruction
RESULT =
0x13
W
=
0x93
Z
=
1
MOVLW
Move Literal to W
Syntax:
[
label ] MOVLW k
Operands:
0
k
255
Operation:
k
(W)
Status Affected:
None
Encoding:
11
00xx
kkkk
kkkk
Description:
The eight bit literal 'k' is loaded into W
register
.
The don't cares will assemble
as 0's.
Words:
1
Cycles:
1
Example
MOVLW
0x5A
After Instruction
W
=
0x5A
MOVF
Move f
Syntax:
[
label ] MOVF f,d
Operands:
0
f
127
d
[0,1]
Operation:
(f)
(dest)
Status Affected:
Z
Encoding:
00
1000
dfff
ffff
Description:
The contents of register f is moved to
a destination dependent upon the
status of d. If d = 0, destination is W
register. If d = 1, the destination is file
register f itself. d = 1 is useful to test a
file register since status flag Z is
affected.
Words:
1
Cycles:
1
Example
MOVF
FSR,
0
After Instruction
W = value in FSR register
Z
= 1
MOVWF
Move W to f
Syntax:
[
label ] MOVWF f
Operands:
0
f
127
Operation:
(W)
(f)
Status Affected:
None
Encoding:
00
0000
1fff
ffff
Description:
Move data from W register to register
'f'
.
Words:
1
Cycles:
1
Example
MOVWF
OPTION
Before Instruction
OPTION =
0xFF
W
=
0x4F
After Instruction
OPTION =
0x4F
W
=
0x4F
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 69
PIC16C62X
NOP
No Operation
Syntax:
[
label ] NOP
Operands:
None
Operation:
No operation
Status Affected:
None
Encoding:
00
0000
0xx0
0000
Description:
No operation.
Words:
1
Cycles:
1
Example
NOP
OPTION
Load Option Register
Syntax:
[
label ] OPTION
Operands:
None
Operation:
(W)
OPTION
Status Affected: None
Encoding:
00
0000
0110
0010
Description:
The contents of the W register are
loaded in the OPTION register. This
instruction is supported for code
compatibility with PIC16C5X products.
Since OPTION is a readable/writable
register, the user can directly
address it.
Words:
1
Cycles:
1
Example
To maintain upward compatibility
with future PICmicroTM products,
do not use this instruction.
RETFIE
Return from Interrupt
Syntax:
[
label ] RETFIE
Operands:
None
Operation:
TOS
PC,
1
GIE
Status Affected:
None
Encoding:
00
0000
0000
1001
Description:
Return from Interrupt. Stack is POPed
and Top of Stack (TOS) is loaded in
the PC. Interrupts are enabled by
setting Global Interrupt Enable bit,
GIE (INTCON<7>). This is a two-cycle
instruction.
Words:
1
Cycles:
2
Example
RETFIE
After Interrupt
PC =
TOS
GIE =
1
RETLW
Return with Literal in W
Syntax:
[
label ] RETLW k
Operands:
0
k
255
Operation:
k
(W);
TOS
PC
Status Affected:
None
Encoding:
11
01xx
kkkk
kkkk
Description:
The W register is loaded with the eight
bit literal 'k'. The program counter is
loaded from the top of the stack (the
return address). This is a two-cycle
instruction.
Words:
1
Cycles:
2
Example
TABLE
CALL TABLE
;W contains table
;offset value
;W now has table
value


ADDWF PC
;W = offset
RETLW k1
;Begin table
RETLW k2
;



RETLW kn
; End of table
Before Instruction
W
=
0x07
After Instruction
W
=
value of k8
PIC16C62X
DS30235G-page 70
Preliminary
1998 Microchip Technology Inc.
RETURN
Return from Subroutine
Syntax:
[
label ] RETURN
Operands:
None
Operation:
TOS
PC
Status Affected:
None
Encoding:
00
0000
0000
1000
Description:
Return from subroutine. The stack is
POPed and the top of the stack (TOS)
is loaded into the program counter.
This is a two cycle instruction.
Words:
1
Cycles:
2
Example
RETURN
After Interrupt
PC =
TOS
RLF
Rotate Left f through Carry
Syntax:
[
label ]
RLF f,d
Operands:
0
f
127
d
[0,1]
Operation:
See description below
Status Affected:
C
Encoding:
00
1101
dfff
ffff
Description:
The contents of register 'f' are rotated
one bit to the left through the Carry
Flag. If 'd' is 0 the result is placed in
the W register. If 'd' is 1 the result is
stored back in register 'f'.
Words:
1
Cycles:
1
Example
RLF
REG1,0
Before Instruction
REG1
=
1110 0110
C
=
0
After Instruction
REG1
=
1110 0110
W
=
1100 1100
C
=
1
Register f
C
RRF
Rotate Right f through Carry
Syntax:
[
label ] RRF f,d
Operands:
0
f
127
d
[0,1]
Operation:
See description below
Status Affected:
C
Encoding:
00
1100
dfff
ffff
Description:
The contents of register 'f' are rotated
one bit to the right through the Carry
Flag. If 'd' is 0 the result is placed in
the W register. If 'd' is 1 the result is
placed back in register 'f'.
Words:
1
Cycles:
1
Example
RRF
REG1,0
Before Instruction
REG1
=
1110 0110
C
=
0
After Instruction
REG1
=
1110 0110
W
=
0111 0011
C
=
0
SLEEP
Syntax:
[
label ]
SLEEP
Operands:
None
Operation:
00h
WDT,
0
WDT prescaler,
1
TO,
0
PD
Status Affected:
TO, PD
Encoding:
00
0000
0110
0011
Description:
The power-down status bit, PD is
cleared. Time-out status bit, TO is
set. Watchdog Timer and its
prescaler are cleared.
The processor is put into SLEEP
mode with the oscillator stopped.
See Section 9.8 for more details.
Words:
1
Cycles:
1
Example:
SLEEP
Register f
C
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 71
PIC16C62X
SUBLW
Subtract W from Literal
Syntax:
[
label ]
SUBLW k
Operands:
0
k
255
Operation:
k - (W)
(
W)
Status
Affected:
C, DC, Z
Encoding:
11
110x
kkkk
kkkk
Description:
The W register is subtracted (2's com-
plement method) from the eight bit literal
'k'. The result is placed in the W register.
Words:
1
Cycles:
1
Example 1:
SUBLW
0x02
Before Instruction
W
=
1
C
=
?
After Instruction
W
=
1
C
=
1; result is posi-
tive
Example 2:
Before Instruction
W
=
2
C
=
?
After Instruction
W
=
0
C
=
1; result is zero
Example 3:
Before Instruction
W
=
3
C
=
?
After Instruction
W
=
0xFF
C
=
0; result is nega-
tive
SUBWF
Subtract W from f
Syntax:
[
label ]
SUBWF f,d
Operands:
0
f
127
d
[0,1]
Operation:
(f) - (W)
(
dest)
Status
Affected:
C, DC, Z
Encoding:
00
0010
dfff
ffff
Description:
Subtract (2's complement method)
W register from register 'f'. If 'd' is 0 the
result is stored in the W register. If 'd' is 1
the result is stored back in register 'f'.
Words:
1
Cycles:
1
Example 1:
SUBWF
REG1,1
Before Instruction
REG1
=
3
W
=
2
C
=
?
After Instruction
REG1
=
1
W
=
2
C
=
1; result is positive
Example 2:
Before Instruction
REG1
=
2
W
=
2
C
=
?
After Instruction
REG1
=
0
W
=
2
C
=
1; result is zero
Example 3:
Before Instruction
REG1
=
1
W
=
2
C
=
?
After Instruction
REG1
=
0xFF
W
=
2
C
=
0; result is negative
PIC16C62X
DS30235G-page 72
Preliminary
1998 Microchip Technology Inc.
SWAPF
Swap Nibbles in f
Syntax:
[
label ] SWAPF f,d
Operands:
0
f
127
d
[0,1]
Operation:
(f<3:0>)
(dest<7:4>),
(f<7:4>)
(dest<3:0>)
Status Affected:
None
Encoding:
00
1110
dfff
ffff
Description:
The upper and lower nibbles of
register 'f' are exchanged. If 'd' is 0
the result is placed in W register. If 'd'
is 1 the result is placed in register 'f'.
Words:
1
Cycles:
1
Example
SWAPF
REG,
0
Before Instruction
REG1
=
0xA5
After Instruction
REG1
=
0xA5
W
=
0x5A
TRIS
Load TRIS Register
Syntax:
[
label ] TRIS
f
Operands:
5
f
7
Operation:
(W)
TRIS register f;
Status Affected: None
Encoding:
00
0000
0110
0fff
Description:
The instruction is supported for code
compatibility with the PIC16C5X
products. Since TRIS registers are
readable and writable, the user can
directly address them.
Words:
1
Cycles:
1
Example
To maintain upward compatibility
with future PICmicroTM products,
do not use this instruction.
XORLW
Exclusive OR Literal with W
Syntax:
[
label ]
XORLW k
Operands:
0
k
255
Operation:
(W) .XOR. k
(
W)
Status Affected:
Z
Encoding:
11
1010
kkkk
kkkk
Description:
The contents of the W register are
XOR'ed with the eight bit literal 'k'.
The result is placed in the
W register.
Words:
1
Cycles:
1
Example:
XORLW
0xAF
Before Instruction
W
=
0xB5
After Instruction
W
=
0x1A
XORWF
Exclusive OR W with f
Syntax:
[
label ] XORWF f,d
Operands:
0
f
127
d
[0,1]
Operation:
(W) .XOR. (f)
(
dest)
Status Affected:
Z
Encoding:
00
0110
dfff
ffff
Description:
Exclusive OR the contents of the
W register with register 'f'. If 'd' is 0 the
result is stored in the W register. If 'd'
is 1 the result is stored back in register
'f'.
Words:
1
Cycles:
1
Example
XORWF
REG
1
Before Instruction
REG
=
0xAF
W
=
0xB5
After Instruction
REG
=
0x1A
W
=
0xB5
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 73
PIC16C62X
11.0
DEVELOPMENT SUPPORT
11.1
Development Tools
The PICmicr
TM
microcontrollers are supported with a
full range of hardware and software development tools:
MPLABTM-ICE
Real-Time In-Circuit Emulator
ICEPIC
TM
Low-Cost PIC16C5X and PIC16CXXX
In-Circuit Emulator
PRO MATE
II Universal Programmer
PICSTART
Plus Entry-Level Prototype
Programmer
SIMICE
PICDEM-1 Low-Cost Demonstration Board
PICDEM-2 Low-Cost Demonstration Board
PICDEM-3 Low-Cost Demonstration Board
MPASM Assembler
MPLAB
TM
SIM Software Simulator
MPLAB-C17 (C Compiler)
Fuzzy Logic Development System
(
fuzzyTECH
-
MP)
K
EE
L
OQ
Evaluation Kits and Programmer
11.2
MPLAB-ICE: High Performance
Universal In-Circuit Emulator with
MPLAB IDE
The MPLAB-ICE Universal In-Circuit Emulator is
intended to provide the product development engineer
with a complete microcontroller design tool set for
PICmicro microcontrollers (MCUs). MPLAB-ICE is sup-
plied with the MPLAB Integrated Development Environ-
ment (IDE), which allows editing, "make" and
download, and source debugging from a single envi-
ronment.
Interchangeable processor modules allow the system
to be easily reconfigured for emulation of different pro-
cessors. The universal architecture of the MPLAB-ICE
allows expansion to support all new Microchip micro-
controllers.
The MPLAB-ICE Emulator System has been designed
as a real-time emulation system with advanced fea-
tures that are generally found on more expensive
development tools. The PC compatible 386 (and higher)
machine platform and Microsoft Windows
3.x or
Windows 95 environment were chosen to best make
these features available to you, the end user.
MPLAB-ICE is available in two versions.
MPLAB-ICE
1000 is a basic, low-cost emulator system
with simple trace capabilities. It shares processor mod-
ules with the MPLAB-ICE 2000. This is a full-featured
emulator system with enhanced trace, trigger, and data
monitoring features. Both systems will operate across
the entire operating speed reange of the PICmicro
MCU.
11.3
ICEPIC: Low-Cost PICmicroTM
In-Circuit Emulator
ICEPIC is a low-cost in-circuit emulator solution for the
Microchip PIC12CXXX, PIC16C5X and PIC16CXXX
families of 8-bit OTP microcontrollers.
ICEPIC is designed to operate on PC-compatible
machines ranging from 386 through Pentium
TM
based
machines under Windows 3.x, Windows 95, or Win-
dows NT environment. ICEPIC features real time, non-
intrusive emulation.
11.4
PRO MATE II: Universal Programmer
The PRO MATE II Universal Programmer is a full-fea-
tured programmer capable of operating in stand-alone
mode as well as PC-hosted mode. PRO MATE II is CE
compliant.
The PRO MATE II has programmable V
DD
and V
PP
supplies which allows it to verify programmed memory
at V
DD
min and V
DD
max for maximum reliability. It has
an LCD display for displaying error messages, keys to
enter commands and a modular detachable socket
assembly to support various package types. In stand-
alone mode the PRO MATE II can read, verify or pro-
gram PIC12CXXX, PIC14C000, PIC16C5X,
PIC16CXXX and PIC17CXX devices. It can also set
configuration and code-protect bits in this mode.
11.5
PICSTART Plus Entry Level
Development System
The PICSTART programmer is an easy-to-use, low-
cost prototype programmer. It connects to the PC via
one of the COM (RS-232) ports. MPLAB Integrated
Development Environment software makes using the
programmer simple and efficient. PICSTART Plus is
not recommended for production programming.
PICSTART Plus supports all PIC12CXXX, PIC14C000,
PIC16C5X, PIC16CXXX and PIC17CXX devices with
up to 40 pins. Larger pin count devices such as the
PIC16C923, PIC16C924 and PIC17C756 may be sup-
ported with an adapter socket. PICSTART Plus is CE
compliant.
PIC16C62X
DS30235G-page 74
Preliminary
1998 Microchip Technology Inc.
11.6
SIMICE Entry-Level Hardware
Simulator
SIMICE is an entry-level hardware development sys-
tem designed to operate in a PC-based environment
with Microchip's simulator MPLABTM-SIM. Both SIM-
ICE and MPLAB-SIM run under Microchip Technol-
ogy's MPLAB Integrated Development Environment
(IDE) software. Specifically, SIMICE provides hardware
simulation for Microchip's PIC12C5XX, PIC12CE5XX,
and PIC16C5X families of PICmicroTM 8-bit microcon-
trollers. SIMICE works in conjunction with MPLAB-SIM
to provide non-real-time I/O port emulation. SIMICE
enables a developer to run simulator code for driving
the target system. In addition, the target system can
provide input to the simulator code. This capability
allows for simple and interactive debugging without
having to manually generate MPLAB-SIM stimulus
files. SIMICE is a valuable debugging tool for entry-
level system development.
11.7
PICDEM-1 Low-Cost PICmicro
Demonstration Board
The PICDEM-1 is a simple board which demonstrates
the capabilities of several of Microchip's microcontrol-
lers. The microcontrollers supported are: PIC16C5X
(PIC16C54 to PIC16C58A), PIC16C61, PIC16C62X,
PIC16C71, PIC16C8X, PIC17C42, PIC17C43 and
PIC17C44. All necessary hardware and software is
included to run basic demo programs. The users can
program the sample microcontrollers provided with
the PICDEM-1 board, on a PRO
MATE II or
PICSTART-Plus programmer, and easily test firm-
ware. The user can also connect the PICDEM-1
board to the MPLAB-ICE emulator and download the
firmware to the emulator for testing. Additional proto-
type area is available for the user to build some addi-
tional hardware and connect it to the microcontroller
socket(s). Some of the features include an RS-232
interface, a potentiometer for simulated analog input,
push-button switches and eight LEDs connected to
PORTB.
11.8
PICDEM-2 Low-Cost PIC16CXX
Demonstration Board
The PICDEM-2 is a simple demonstration board that
supports the PIC16C62, PIC16C64, PIC16C65,
PIC16C73 and PIC16C74 microcontrollers. All the
necessary hardware and software is included to
run the basic demonstration programs. The user
can program the sample microcontrollers provided
with the PICDEM-2 board, on a PRO MATE II pro-
grammer or PICSTART-Plus, and easily test firmware.
The MPLAB-ICE emulator may also be used with the
PICDEM-2 board to test firmware. Additional prototype
area has been provided to the user for adding addi-
tional hardware and connecting it to the microcontroller
socket(s). Some of the features include a RS-232 inter-
face, push-button switches, a potentiometer for simu-
lated analog input, a Serial EEPROM to demonstrate
usage of the I
2
C bus and separate headers for connec-
tion to an LCD module and a keypad.
11.9
PICDEM-3 Low-Cost PIC16CXXX
Demonstration Board
The PICDEM-3 is a simple demonstration board that
supports the PIC16C923 and PIC16C924 in the PLCC
package. It will also support future 44-pin PLCC
microcontrollers with a LCD Module. All the neces-
sary hardware and software is included to run the
basic demonstration programs. The user can pro-
gram the sample microcontrollers provided with
the PICDEM-3 board, on a PRO MATE II program-
mer or PICSTART Plus with an adapter socket, and
easily test firmware. The MPLAB-ICE emulator may
also be used with the PICDEM-3 board to test firm-
ware. Additional prototype area has been provided to
the user for adding hardware and connecting it to the
microcontroller socket(s). Some of the features include
an RS-232 interface, push-button switches, a potenti-
ometer for simulated analog input, a thermistor and
separate headers for connection to an external LCD
module and a keypad. Also provided on the PICDEM-3
board is an LCD panel, with 4 commons and 12 seg-
ments, that is capable of displaying time, temperature
and day of the week. The PICDEM-3 provides an addi-
tional RS-232 interface and Windows 3.1 software for
showing the demultiplexed LCD signals on a PC. A sim-
ple serial interface allows the user to construct a hard-
ware demultiplexer for the LCD signals.
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 75
PIC16C62X
11.10
MPLAB Integrated Development
Environment Software
The MPLAB IDE Software brings an ease of software
development previously unseen in the 8-bit microcon-
troller market. MPLAB is a windows based application
which contains:
A full featured editor
Three operating modes
- editor
- emulator
- simulator
A project manager
Customizable tool bar and key mapping
A status bar with project information
Extensive on-line help
MPLAB allows you to:
Edit your source files (either assembly or `C')
One touch assemble (or compile) and download
to PICmicro tools (automatically updates all
project information)
Debug using:
- source files
- absolute listing file
The ability to use MPLAB with Microchip's simulator
allows a consistent platform and the ability to easily
switch from the low cost simulator to the full featured
emulator with minimal retraining due to development
tools.
11.11
Assembler (MPASM)
The MPASM Universal Macro Assembler is a PC-
hosted symbolic assembler. It supports all microcon-
troller series including the PIC12C5XX, PIC14000,
PIC16C5X, PIC16CXXX, and PIC17CXX families.
MPASM offers full featured Macro capabilities, condi-
tional assembly, and several source and listing formats.
It generates various object code formats to support
Microchip's development tools as well as third party
programmers.
MPASM allows full symbolic debugging from MPLAB-
ICE, Microchip's Universal Emulator System.
MPASM has the following features to assist in develop-
ing software for specific use applications.
Provides translation of Assembler source code to
object code for all Microchip microcontrollers.
Macro assembly capability.
Produces all the files (Object, Listing, Symbol, and
special) required for symbolic debug with
Microchip's emulator systems.
Supports Hex (default), Decimal and Octal source
and listing formats.
MPASM provides a rich directive language to support
programming of the PICmicro. Directives are helpful in
making the development of your assemble source code
shorter and more maintainable.
11.12
Software Simulator (MPLAB-SIM)
The MPLAB-SIM Software Simulator allows code
development in a PC host environment. It allows the
user to simulate the PICmicro series microcontrollers
on an instruction level. On any given instruction, the
user may examine or modify any of the data areas or
provide external stimulus to any of the pins. The input/
output radix can be set by the user and the execution
can be performed in; single step, execute until break, or
in a trace mode.
MPLAB-SIM fully supports symbolic debugging using
MPLAB-C17 and MPASM. The Software Simulator
offers the low cost flexibility to develop and debug code
outside of the laboratory environment making it an
excellent multi-project software development tool.
11.13
MPLAB-C17 Compiler
The MPLAB-C17 Code Development System is a
complete ANSI `C' compiler and integrated develop-
ment environment for Microchip's PIC17CXXX family of
microcontrollers. The compiler provides powerful inte-
gration capabilities and ease of use not found with
other compilers.
For easier source level debugging, the compiler pro-
vides symbol information that is compatible with the
MPLAB IDE memory display.
11.14
Fuzzy Logic Development System
(
fuzzyTECH-MP)
fuzzyTECH-MP fuzzy logic development tool is avail-
able in two versions - a low cost introductory version,
MP Explorer, for designers to gain a comprehensive
working knowledge of fuzzy logic system design; and a
full-featured version,
fuzzyTECH-MP, Edition for imple-
menting more complex systems.
Both versions include Microchip's
fuzzyLAB
TM
demon-
stration board for hands-on experience with fuzzy logic
systems implementation.
11.15
SEEVAL
Evaluation and
Programming System
The SEEVAL SEEPROM Designer's Kit supports all
Microchip 2-wire and 3-wire Serial EEPROMs. The kit
includes everything necessary to read, write, erase or
program special features of any Microchip SEEPROM
product including Smart Serials
TM
and secure serials.
The Total Endurance
TM
Disk is included to aid in trade-
off analysis and reliability calculations. The total kit can
significantly reduce time-to-market and result in an
optimized system.
PIC16C62X
DS30235G-page 76
Preliminary
1998 Microchip Technology Inc.
11.16
K
EE
L
OQ
Evaluation and
Programming Tools
K
EE
L
OQ
evaluation and programming tools support
Microchips HCS Secure Data Products. The HCS eval-
uation kit includes an LCD display to show changing
codes, a decoder to decode transmissions, and a pro-
gramming interface to program test transmitters.

1998
Microchip Technology Inc.
Preliminary
DS30235G
-page
77
PIC16C62X
T
AB
LE 11-1:
DE
VELOPMENT
T
OOLS FR
OM MICR
OC
HIP
PIC12C5XX
PIC14000
PIC16C5X PIC16CXXX PIC16C6X
PIC16C7XX
PIC16C8X
PIC16C9XX
PIC17C4X
PIC17C7XX
24CXX
25CXX
93CXX
HCS200
HCS300
HCS301
Emulator Products
MPLABTM-ICE
ICEPIC
TM
Low-Cost
In-Circuit Emulator
Software Tools
MPLAB
TM
Integrated
Development
Environment
MPLAB
TM
C17*
Compiler
fuzzyTECH
-MP
Explorer/Edition
Fuzzy Logic
Dev. Tool
Total Endurance
TM
Software Model
Pr
ogrammer
s
PICSTART
Plus
Low-Cost
Universal Dev. Kit
PRO MATE
II
Universal
Programmer
KEELOQ
Programmer
Demo Boards
SEEVAL
Designers Kit
SIMICE
PICDEM-14A
PICDEM-1
PICDEM-2
PICDEM-3
K
EE
L
OQ
Evaluation Kit
K
EE
L
OQ
Transponder Kit
PIC16C62X
DS30235G-page 78
Preliminary
1998 Microchip Technology Inc.
NOTES:
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 79
PIC16C62X
12.0
89ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings
Ambient Temperature under bias .............................................................................................................. -40
to +125
C
Storage Temperature................................................................................................................................. -65
to +150
C
Voltage on any pin with respect to V
SS
(except V
DD
and MCLR)....................................................... -0.6V to V
DD
+0.6V
Voltage on V
DD
with respect to V
SS
................................................................................................................ 0 to +7.5V
Voltage on MCLR with respect to V
SS
(Note 2)..................................................................................................0 to +14V
Total power Dissipation (Note 1) ...............................................................................................................................1.0W
Maximum Current out of V
SS
pin...........................................................................................................................300 mA
Maximum Current into V
DD
pin .............................................................................................................................250 mA
Input Clamp Current, I
IK
(V
I
<0 or V
I
> V
DD
)
......................................................................................................................
20 mA
Output Clamp Current, I
OK
(V
O
<0 or V
O
>V
DD
)
...............................................................................................................
20 mA
Maximum Output Current sunk by any I/O pin ........................................................................................................25 mA
Maximum Output Current sourced by any I/O pin ...................................................................................................25 mA
Maximum Current sunk by
PORTA and PORTB ...................................................................................................200 mA
Maximum Current sourced by PORTA and PORTB ..............................................................................................200 mA
Note 1: Power dissipation is calculated as follows: P
DIS
= V
DD
x {I
DD
-
I
OH
} +
{(V
DD
-V
OH
) x I
OH
} +
(V
O
l x I
OL
)
NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above
those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions
for extended periods may affect device reliability.
Note:
Voltage spikes below V
SS
at the MCLR pin, inducing currents greater than 80 mA, may cause latch-up.
Thus, a series resistor of 50-100
should be used when applying a "low" level to the MCLR pin rather
than pulling this pin directly to V
SS
.
Note:
Voltage spikes below V
SS
at the MCLR pin, inducing currents greater than 80 mA, may cause latch-up.
Thus, a series resistor of 50-100
should be used when applying a "low" level to the MCLR pin rather
than pulling this pin directly to V
SS
.
PIC16C62X
DS30235G-page 80
Preliminary
1998 Microchip Technology Inc.
TABLE 12-1:
CROSS REFERENCE OF DEVICE SPECS FOR OSCILLATOR CONFIGURATIONS
AND FREQUENCIES OF OPERATION (COMMERCIAL DEVICES)
OSC
PIC16C62X-04
PIC16C62XA-04
PIC16C62X-20
PIC16C62XA-20
PIC16LC62X-04
PIC16C62X/JW
PIC16C62XA/JW
RC
V
DD
: 3.0V to 6.0V
I
DD
: 3.3 mA max.
@5.5V
I
PD
: 20
A max.
@4.0V
Freq: 4.0 MHz
max.
V
DD
: 3.0V to 5.5V
I
DD
: 3.3 mA max.
@5.5V
I
PD
: 20
A max.
@4.0V
Freq: 4.0 MHz
max.
V
DD
: 3.0V to 6.0V
I
DD
: 1.8 mA typ.
@5.5V
I
PD
: 1.0
A typ.
@4.5V
Freq: 4.0 MHz
max.
V
DD
: 3.0V to 5.5V
I
DD
: 1.8 mA typ.
@5.5V
I
PD
: 1.0
A typ.
@4.5V
Freq: 4.0 MHz
max.
V
DD
: 3.0V to 6.0V
I
DD
: 1.4 mA typ.
@3.0V
I
PD
: 0.7
A typ.
@3.0V
Freq: 4.0 MHz
max.
V
DD
: 3.0V to 6.0V
I
DD
: 3.3 mA max.
@5.5V
I
PD
: 20
A max.
@4.0V
Freq: 4.0 MHz
max.
V
DD
: 3.0V to 5.5V
I
DD
: 3.3 mA max.
@5.5V
I
PD
: 20
A max.
@4.0V
Freq: 4.0 MHz
max.
XT
V
DD
: 3.0V to 6.0V
I
DD
: 3.3 mA max.
@5.5V
I
PD
: 20
A max.
@4.0V
Freq: 4.0 MHz
max.
V
DD
: 3.0V to 5.5V
I
DD
: 3.3 mA max.
@5.5V
I
PD
: 20
A max.
@4.0V
Freq: 4.0 MHz
max.
V
DD
: 3.0V to 6.0V
I
DD
: 1.8 mA typ.
@5.5V
I
PD
: 1.0
A typ.
@4.5V
Freq: 4.0 MHz
max.
V
DD
: 3.0V to 5.5V
I
DD
: 1.8 mA typ.
@5.5V
I
PD
: 1.0
A typ.
@4.5V
Freq: 4.0 MHz
max.
V
DD
: 3.0V to 6.0V
I
DD
: 1.4 mA typ.
@3.0V
I
PD
: 0.7
A typ.
@3.0V
Freq: 4.0 MHz
max.
V
DD
: 3.0V to 6.0V
I
DD
: 3.3 mA max.
@5.5V
I
PD
: 20
A max.
@4.0V
Freq: 4.0 MHz
max.
V
DD
: 3.0V to 5.5V
I
DD
: 3.3 mA max.
@5.5V
I
PD
: 20
A max.
@4.0V
Freq: 4.0 MHz
max.
HS
V
DD
: 4.5V to 5.5V
I
DD
: 9.0 mA typ.
@5.5V
I
PD
: 1.0
A typ.
@4.0V
Freq: 4.0 MHz
max.
V
DD
: 4.5V to 5.5V
I
DD
: 3.5 mA typ.
@5.5V
I
PD
: 1.0
A typ.
@4.0V
Freq: 4.0 MHz
max.
V
DD
: 4.5V to 5.5V
I
DD
: 20 mA max.
@5.5V
I
PD
: 1.0
A typ.
@4.5V
Freq: 20 MHz
max.
V
DD
: 4.5V to 5.5V
I
DD
: 7.5 mA max.
@5.5V
I
PD
: 1.0
A typ.
@4.5V
Freq: 20 MHz
max.
N/A
V
DD
: 4.5V to 5.5V
I
DD
: 20 mA max.
@5.5V
I
PD
: 1.0
A typ.
@4.5V
Freq: 20 MHz
max.
V
DD
: 4.5V to 5.5V
I
DD
: 20 mA max.
@5.5V
I
PD
: 1.0
A typ.
@4.5V
Freq: 20 MHz
max.
LP
V
DD
: 3.0V to 6.0V
I
DD
: 35
A typ.
@32 kHz,
3.0V
I
PD
: 1.0
A typ.
@4.0 V
Freq: 200 kHz
max.
V
DD
: 3.0V to 5.5V
I
DD
: 35
A typ.
@32 kHz,
3.0V
I
PD
: 1.0
A typ.
@4.0 V
Freq: 200 kHz
max.
N/A
N/A
V
DD
: 2.5V to 6.0V
I
DD
: 32
A max.
@32 kHz,
3.0V
I
PD
: 9.0
A max.
@3.0V
Freq: 200 kHz
max.
V
DD
: 2.5V to 6.0V
I
DD
: 32
A max.
@32 kHz,
3.0V
I
PD
: 9.0
A Max.
@3.0V
Freq: 200 kHz
max.
V
DD
: 3.0V to 5.5V
I
DD
: 32
A max.
@32 kHz, 3.0V
I
PD
: 9.0
A Max.
@3.0V
Freq: 200 kHz
max.
The shaded sections indicate oscillator selections which are tested for functionality, but not for MIN/MAX specifications. It is recom-
mended that the user select the device type that the specifications required.
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 81
PIC16C62X
12.1
DC CHARACTERISTICS:
PIC16C62X-04 (Commercial, Industrial, Extended)
PIC16C62X-20 (Commercial, Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
40
C
T
A
+85
C for industrial and
0
C
T
A
+70
C for commercial and
40
C
T
A
+125
C for extended
Param
No.
Sym
Characteristic
Min
Typ Max Units
Conditions
D001
D001A
Vdd
Supply Voltage
3.0
4.5
-
-
6.0
5.5
V
V
XT, RC and LP osc configuration
HS osc configuration
D002
Vdr
RAM Data Retention
Voltage (Note 1)
1.5*
V
Device in SLEEP mode
D003
Vpor
V
DD
start voltage to
ensure Power-on Reset
Vss
V
See section on power-on reset for details
D004
Svdd
V
DD
rise rate to ensure
Power-on Reset
0.05*
V/ms
See section on power-on reset for details
D005
V
BOR
Brown-out Detect Voltage
3.7
3.7
4.0
4.0
4.3
4.4
V
BOREN configuration bit is cleared
(Extended)
D010
D010A
D013
Idd
Supply Current (Note 2)
1.8
35
9.0
3.3
70
20
mA
A
mA
XT and RC osc configuration
F
OSC
= 4 MHz, V
DD
= 5.5V, WDT dis-
abled (Note 4)
LP osc configuration, PIC16C62X-04
only
F
OSC
= 32 kHz, V
DD
= 4.0V, WDT dis-
abled
HS osc configuration
F
OSC
= 20 MHz, V
DD
= 5.5V, WDT dis-
abled
D020
Ipd
Power Down Current (Note 3)
1.0
2.5
15
A
A
V
DD
=4.0V, WDT disabled
(125
C)
D023
I
WDT
I
BOR
I
COMP
I
VREF
WDT Current (Note 5)
Brown-out Reset Current (Note 5)
Comparator Current for each Com-
parator (Note 5)
V
REF
Current (Note 5)
6.0
350
20
25
425
100
300
A
A
A
A
A
V
DD
=4.0V
(125
C)
BOR enabled, V
DD
= 5.0V
V
DD
= 4.0V
V
DD
= 4.0V
*
These parameters are characterized but not tested.
Data in "Typ" column is at 5.0V, 25
C, unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1:
This is the limit to which V
DD
can be lowered in SLEEP mode without losing RAM data.
2:
The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and
switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current con-
sumption.
The test conditions for all I
DD
measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to V
DD
,
MCLR = V
DD
; WDT enabled/disabled as specified.
3:
The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with
the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
DD
or V
SS
.
4:
For RC osc configuration, current through Rext is not included. The current through the resistor can be estimated by the
formula Ir = V
DD
/2Rext (mA) with Rext in k
.
5:
The
current is the additional current consumed when this peripheral is enabled. This current should be added to the
base I
DD
or I
PD
measurement.
PIC16C62X
DS30235G-page 82
Preliminary
1998 Microchip Technology Inc.
12.2
DC CHARACTERISTICS:
PIC16LC62X-04 (Commercial, Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
40C
TA
+85C for industrial and
0C
TA
+70C for commercial and
40C
TA
+125C for extended
Operating voltage V
DD
range as described in DC spec Table 12-1 and Table 12-2
Param
No.
Sym
Characteristic
Min
Typ Max Units
Conditions
D001
V
DD
Supply Voltage
3.0
2.5
-
6.0
6.0
V
XT and RC osc configuration
LP osc configuration
D002
V
DR
RAM Data Retention
Voltage (Note 1)
1.5*
V
Device in SLEEP mode
D003
V
POR
V
DD
start voltage to
ensure Power-on Reset
V
SS
V
See section on Power-on Reset for
details
D004
S
VDD
V
DD
rise rate to ensure
Power-on Reset
0.05*
V/ms
See section on Power-on Reset for
details
D005
V
BOR
Brown-out Detect Voltage
3.7
4.0
4.3
V
BOREN configuration bit is cleared
D010
D010A
I
DD
Supply Current (Note 2)
1.4
26
2.5
53
mA
A
XT and RC osc configuration
F
OSC
= 2.0 MHz, V
DD
= 3.0V, WDT dis-
abled (Note 4)
LP osc configuration
F
OSC
= 32 kHz, V
DD
= 3.0V, WDT dis-
abled
D020
I
PD
Power Down Current (Note 3)
0.7
2
A
V
DD
=3.0V, WDT disabled
D023
I
WDT
I
BOR
I
COMP
I
VREF
WDT Current (Note 5)
Brown-out Reset Current
(Note 5)
Comparator Current for each
Comparator (Note 5)
V
REF
Current (Note 5)

6.0
350
15
425
100
300
A
A
A
A
V
DD
=3.0V
BOR enabled, V
DD
= 5.0V
V
DD
= 3.0V
V
DD
= 3.0V
*
These parameters are characterized but not tested.
Data in "Typ" column is at 5.0V, 25
C, unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1:
This is the limit to which V
DD
can be lowered in SLEEP mode without losing RAM data.
2:
The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and
switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current con-
sumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1=external square wave, from rail to rail; all I/O pins tristated, pulled to V
DD
,
MCLR = V
DD
; WDT enabled/disabled as specified.
3:
The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the
part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
DD
to V
SS
.
4:
For RC osc configuration, current through Rext is not included. The current through the resistor can be estimated by the
formula Ir = V
DD
/2Rext (mA) with Rext in k
.
5:
The
current is the additional current consumed when this peripheral is enabled. This current should be added to the
base I
DD
or I
PD
measurement.
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 83
PIC16C62X
12.3 DC CHARACTERISTICS: PIC16C62XA/CR62XA-04 (Commercial, Industrial, Extended)
PIC16C62XA/CR62XA-20 (Commercial, Industrial, Extended)
PIC16LC62XA/LCR62XA-04 (Commercial, Industrial)
PIC16LC62XA/LCR62XA-20 (Commercial, Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
40
C
T
A
+85
C for industrial and
0
C
T
A
+70
C for commercial and
40
C
T
A
+125
C for extended
Param
No.
Sym
Characteristic
Min
Typ Max Units
Conditions
D001
D001A
V
DD
Supply Voltage
3.0
4.5
-
-
5.5
5.5
V
V
XT, RC and LP osc configuration
HS osc configuration
D002
V
DR
RAM Data Retention
Voltage (Note 1)
1.5*
V
Device in SLEEP mode
D003
V
POR
V
DD
start voltage to
ensure Power-on Reset
V
SS
V
See section on power-on reset for details
D004
S
VDD
V
DD
rise rate to ensure
Power-on Reset
0.05*
V/ms
See section on power-on reset for details
D005
V
BOR
Brown-out Detect Voltage
3.7
3.7
4.0
4.0
4.3
4.4
V
BOREN configuration bit is cleared
(Extended)
D010
D010A
D013
I
DD
Supply Current (Note 2)
1.2
35
3.0
2.0
70
7.5
mA
A
mA
XT and RC osc configuration
F
OSC
= 4 MHz, V
DD
= 5.5V, WDT disabled
(Note 4)
LP osc configuration, PIC16C62XA-04
only
F
OSC
= 32 kHz, V
DD
= 4.0V, WDT disabled
HS osc configuration
F
OSC
= 20 MHz, V
DD
= 5.5V, WDT disabled
D020
I
PD
Power Down Current (Note 3)
1.0
2.5
15
A
A
V
DD
=4.0V, WDT disabled
(125
C)
D023
I
WDT
I
BOR
I
COMP
I
VREF
WDT Current (Note 5)
Brown-out Reset Current
(Note 5)
Comparator Current for each
Comparator (Note 5)
V
REF
Current (Note 5)
6.0
75
60
90
10
12
150
75
200
A
A
A
A
A
V
DD
=4.0V
(125
C)
BOR enabled, V
DD
= 5.0V
V
DD
= 4.0V
V
DD
= 4.0V
*
These parameters are characterized but not tested.
Data in "Typ" column is at 5.0V, 25
C, unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1:
This is the limit to which V
DD
can be lowered in SLEEP mode without losing RAM data.
2:
The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and
switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current con-
sumption.
The test conditions for all I
DD
measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to V
DD
,
MCLR = V
DD
; WDT enabled/disabled as specified.
3:
The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with
the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
DD
or V
SS
.
4:
For RC osc configuration, current through Rext is not included. The current through the resistor can be estimated by the
formula Ir = V
DD
/2Rext (mA) with Rext in k
.
5:
The
current is the additional current consumed when this peripheral is enabled. This current should be added to the
base I
DD
or I
PD
measurement.
PIC16C62X
DS30235G-page 84
Preliminary
1998 Microchip Technology Inc.
12.4 DC CHARACTERISTICS: PIC16C62X/C62XA/CR62XA (Commercial, Industrial, Extended)
PIC16LC62X/LC62XA/LCR62XA (Commercial, Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
40C
TA
+85C for industrial and
0C
TA
+70C for commercial and
40C
TA
+125C for extended
Operating voltage V
DD
range as described in DC spec Table 12-1 and Table 12-2
Param.
No.
Sym
Characteristic
Min
Typ
Max
Unit
Conditions
V
IL
Input Low Voltage
I/O ports
D030
with TTL buffer
V
SS
-
0.8V
0.15V
DD
V
V
DD
= 4.5V to 5.5V
otherwise
D031
with Schmitt Trigger input
V
SS
0.2V
DD
V
D032
MCLR, RA4/T0CKI,OSC1 (in RC
mode)
Vss
-
0.2V
DD
V
Note1
D033
OSC1 (in XT and HS)
Vss
-
0.3V
DD
V
OSC1 (in LP)
Vss
-
0.6V
DD
-1.0
V
V
IH
Input High Voltage
I/O ports
-
D040
with TTL buffer
2.0V
.25V
DD
+ 0.8V
-
V
DD
V
DD
V
V
DD
= 4.5V to 5.5V
otherwise
D041
with Schmitt Trigger input
0.8V
DD
V
DD
D042
MCLR RA4/T0CKI
0.8V
DD
-
V
DD
V
D043
D043A
OSC1 (XT, HS and LP)
OSC1 (in RC mode)
0.7V
DD
0.9V
DD
-
V
DD
V
Note1
D070
I
PURB
PORTB weak pull-up current
50
200
400
A V
DD
= 5.0V, V
PIN
= V
SS
I
IL
Input Leakage Current
(Notes 2, 3)
I/O ports (Except PORTA)
1.0
A V
SS
V
PIN
V
DD
, pin at hi-impedance
D060
PORTA
-
-
0.5
A Vss
V
PIN
V
DD
, pin at hi-impedance
D061
RA4/T0CKI
-
-
1.0
A Vss
V
PIN
V
DD
D063
OSC1, MCLR
-
-
5.0
A Vss
V
PIN
V
DD
, XT, HS and LP osc
configuration
V
OL
Output Low Voltage
D080
I/O ports
-
-
0.6
V
I
OL
=8.5 mA, V
DD
=4.5V, -40
to +85
C
-
-
0.6
V
I
OL
=7.0 mA, V
DD
=4.5V, +125
C
D083
OSC2/CLKOUT (RC only)
-
-
0.6
V
I
OL
=1.6 mA, V
DD
=4.5V, -40
to +85
C
-
-
0.6
V
I
OL
=1.2 mA, V
DD
=4.5V, +125
C
V
OH
Output High Voltage (Note 3)
D090
I/O ports (Except RA4)
V
DD
-0.7
-
-
V
I
OH
=-3.0 mA, V
DD
=4.5V, -40
to +85
C
V
DD
-0.7
-
-
V
I
OH
=-2.5 mA, V
DD
=4.5V, +125
C
D092
OSC2/CLKOUT (RC only)
V
DD
-0.7
-
-
V
I
OH
=-1.3 mA, V
DD
=4.5V, -40
to +85
C
V
DD
-0.7
-
-
V
I
OH
=-1.0 mA, V
DD
=4.5V, +125
C
*
V
OD
Open-Drain High Voltage
10*
10*
V
RA4 pin PIC16C62X, PIC16LC62X
RA4 pin PIC16C62XA, PICLC62XA,
CR62XA, LCR62XA
Capacitive Loading Specs on
Output Pins
D100
C
OSC2
OSC2 pin
15
pF In XT, HS and LP modes when external
clock used to drive OSC1.
D101
Cio
All I/O pins/OSC2 (in RC mode)
50
pF
*
These parameters are characterized but not tested.
Data in "Typ" column is at 5.0V, 25
C unless otherwise stated. These parameters are for design guidance only and are not tested.
Note 1:
In RC oscillator configuration, the OSC1 pin is a Schmitt Trigger input. It is not recommended that the PIC16C62X(A) be driven
with external clock in RC mode.
2:
The leakage current on the MCLR pin is strongly dependent on applied voltage level. The specified levels represent normal operat-
ing conditions. Higher leakage current may be measured at different input voltages.
3:
Negative current is defined as coming out of the pin.
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 85
PIC16C62X
TABLE 12-2:
COMPARATOR SPECIFICATIONS
Operating Conditions: Vdd range as described in Table 12-1, -40
C<TA<+125
C. Current consumption is specified in
Table 12-1.
TABLE 12-3:
VOLTAGE REFERENCE SPECIFICATIONS
Operating Conditions:Vdd range as described in Table 12-1, -40
C<TA<+125
C. Current consumption is specified in
Table 12-1.
Characteristics
Sym
Min
Typ
Max
Units
Comments
Input offset voltage
5.0
10
mV
Input common mode voltage
0
V
DD
- 1.5
V
CMRR
+55*
db
Response Time
(1)
150*
400*
600*
ns
ns
PIC16C62X(A)
PIC16LC62X
Comparator Mode Change to
Output Valid
10*
s
* These parameters are characterized but not tested.
Note 1: Response time measured with one comparator input at (V
DD
-
1.5)/2 while the other input transitions from
V
SS
to V
DD
.
Characteristics
Sym
Min
Typ
Max
Units
Comments
Resolution
V
DD
/24
V
DD
/32
LSB
Absolute Accuracy
+1/4
+1/2
LSB
LSB
Low Range (V
RR
=1)
High Range (V
RR
=0)
Unit Resistor Value (R)
2K*
Figure 8-2
Settling Time
(1)
10*
s
* These parameters are characterized but not tested.
Note 1: Settling time measured while V
RR
= 1 and V
R
<3:0> transitions from
0000
to
1111
.
PIC16C62X
DS30235G-page 86
Preliminary
1998 Microchip Technology Inc.
12.5
Timing Parameter Symbology
The timing parameter symbols have been created with one of the following formats:
FIGURE 12-1: LOAD CONDITIONS
1. TppS2ppS
2. TppS
T
F
Frequency
T
Time
Lowercase subscripts (pp) and their meanings:
pp
ck
CLKOUT
osc
OSC1
io
I/O port
t0
T0CKI
mc
MCLR
Uppercase letters and their meanings:
S
F
Fall
P
Period
H
High
R
Rise
I
Invalid (Hi-impedance)
V
Valid
L
Low
Z
Hi-Impedance
V
DD
/2
C
L
R
L
Pin
Pin
V
SS
V
SS
C
L
R
L
= 464
C
L
= 50 pF
for all pins except OSC2
15 pF
for OSC2 output
Load condition 1
Load condition 2
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 87
PIC16C62X
12.6
Timing Diagrams and Specifications
FIGURE 12-2: EXTERNAL CLOCK TIMING
TABLE 12-4:
EXTERNAL CLOCK TIMING REQUIREMENTS
Parameter
No.
Sym
Characteristic
Min
Typ
Max
Units Conditions
Fos
External CLKIN Frequency
(Note 1)
DC
--
4
MHz
XT and RC osc mode, V
DD
=5.0V
DC
--
20
MHz
HS osc mode
DC
--
200
kHz
LP osc mode
Oscillator Frequency
(Note 1)
DC
--
4
MHz
RC osc mode, V
DD
=5.0V
0.1
--
4
MHz
XT osc mode
1
--
20
MHz
HS osc mode
DC
200
kHz
LP osc mode
1
Tosc
External CLKIN Period
(Note 1)
250
--
--
ns
XT and RC osc mode
50
--
--
ns
HS osc mode
5
--
--
s
LP osc mode
Oscillator Period
(Note 1)
250
--
--
ns
RC osc mode
250
--
10,000
ns
XT osc mode
50
--
1,000
ns
HS osc mode
5
--
--
s
LP osc mode
2
T
CY
Instruction Cycle Time (Note 1)
1.0
Fosc/4
DC
s
T
CYS
=F
OSC
/4
3*
TosL,
TosH
External Clock in (OSC1) High or
Low Time
100*
--
--
ns
XT oscillator, T
OSC
L/H duty cycle
2*
--
--
s
LP oscillator, T
OSC
L/H duty cycle
20*
--
--
ns
HS oscillator, T
OSC
L/H duty
cycle
4*
TosR,
TosF
External Clock in (OSC1) Rise or
Fall Time
25*
--
--
ns
XT oscillator
50*
--
--
ns
LP oscillator
15*
--
--
ns
HS oscillator
*
These parameters are characterized but not tested.
Data in "Typ" column is at 5.0V, 25
C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: Instruction cycle period (T
CY
) equals four times the input oscillator time-base period. All specified values are
based on characterization data for that particular oscillator type under standard operating conditions with the
device executing code. Exceeding these specified limits may result in an unstable oscillator operation
and/or higher than expected current consumption. All devices are tested to operate at "min." values with an
external clock applied to the OSC1 pin.
When an external clock input is used, the "Max." cycle time limit is "DC" (no clock) for all devices.
OSC1
CLKOUT
Q4
Q1
Q2
Q3
Q4
Q1
1
3
3
4
4
2
PIC16C62X
DS30235G-page 88
Preliminary
1998 Microchip Technology Inc.
FIGURE 12-3: CLKOUT AND I/O TIMING
22
23
Note: All tests must be do with specified capacitance loads (Figure 12-1) 50 pF on I/O pins and CLKOUT
OSC1
CLKOUT
I/O Pin
(input)
I/O Pin
(output)
Q4
Q1
Q2
Q3
10
13
14
17
20, 21
19
18
15
11
12
16
old value
new value
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 89
PIC16C62X
TABLE 12-5:
CLKOUT AND I/O TIMING REQUIREMENTS
Parameter # Sym
Characteristic
Min
Typ
Max
Units
Conditions
10*
TosH2ckL
OSC1
to CLKOUT
(1)
--
--
75
--
200
400
ns
ns
PIC16C62X(A)
PIC16LC62X(A)
PIC16CR62XA
PIC16LCR62XA
11*
TosH2ckH
OSC1
to CLKOUT
(1)
--
--
75
--
200
400
ns
ns
PIC16C62X(A)
PIC16LC62X(A)
PIC16CR62XA
PIC16LCR62XA
12*
TckR
CLKOUT rise time
(1)
--
--
35
--
100
200
ns
ns
PIC16C62X(A)
PIC16LC62X(A)
PIC16CR62XA
PIC16LCR62XA
13*
TckF
CLKOUT fall time
(1)
--
--
35
--
100
200
ns
ns
PIC16C62X(A)
PIC16LC62X(A)
PIC16CR62XA
PIC16LCR62XA
14*
TckL2ioV
CLKOUT
to Port out valid
(1)
--
--
20
ns
15*
TioV2ckH
Port in valid before CLKOUT
(1)
Tosc +200 ns
Tosc +400 ns
--
--
--
--
ns
ns
PIC16C62X(A)
PIC16LC62X(A)
PIC16CR62XA
PIC16LCR62XA
16*
TckH2ioI
Port in hold after CLKOUT
(1)
0
--
--
ns
17*
TosH2ioV
OSC1
(Q1 cycle) to Port out valid
--
--
50
150
300
ns
ns
PIC16C62X(A)
PIC16LC62X(A)
PIC16CR62XA
PIC16LCR62XA
18*
TosH2ioI
OSC1
(Q2 cycle) to Port input invalid
(I/O in hold time)
100
200
--
--
--
--
ns
ns
PIC16C62X(A)
PIC16LC62X(A)
PIC16CR62XA
PIC16LCR62XA
19*
TioV2osH
Port input valid to OSC1
(I/O in setup
time)
0
--
--
ns
20*
TioR
Port output rise time
--
--
10
--
40
80
ns
ns
PIC16C62X(A)
PIC16LC62X(A)
PIC16CR62XA
PIC16LCR62XA
21*
TioF
Port output fall time
--
--
10
--
40
80
ns
ns
PIC16C62X(A)
PIC16LC62X(A)
PIC16CR62XA
PIC16LCR62XA
22*
Tinp
RB0/INT pin high or low time
25
40
--
--
--
--
ns
ns
PIC16C62X(A)
PIC16LC62X(A)
PIC16CR62XA
PIC16LCR62XA
23
Trbp
RB<7:4> change interrupt high or low time
T
CY
--
--
ns
* These parameters are characterized but not tested
Data in "Typ" column is at 5.0V, 25
C unless otherwise stated. These parameters are for design guidance only and are not tested.
Note 1: Measurements are taken in RC Mode where CLKOUT output is 4 x T
OSC
PIC16C62X
DS30235G-page 90
Preliminary
1998 Microchip Technology Inc.
FIGURE 12-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMING
FIGURE 12-5: BROWN-OUT RESET TIMING
TABLE 12-6:
RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER REQUIREMENTS
Parameter
No.
Sym
Characteristic
Min
Typ
Max
Units
Conditions
30
TmcL
MCLR Pulse Width (low)
2000
--
--
ns
-40
to +85
C
31
Twdt
Watchdog Timer Time-out Period
(No Prescaler)
7*
18
33*
ms
V
DD
= 5.0V, -40
to +85
C
32
Tost
Oscillation Start-up Timer Period
--
1024 T
OSC
--
--
T
OSC
= OSC1 period
33
Tpwrt
Power-up Timer Period
28*
72
132*
ms
V
DD
= 5.0V, -40
to +85
C
34
T
IOZ
I/O hi-impedance from MCLR low
--
2.0
s
35
T
BOR
Brown-out Reset Pulse Width
100*
--
--
s
3.7V
V
DD
4.3V
*
These parameters are characterized but not tested.
Data in "Typ" column is at 5.0V, 25
C unless otherwise stated. These parameters are for design guidance
only and are not tested.
V
DD
MCLR
Internal
POR
PWRT
Timeout
OSC
Timeout
Internal
RESET
Watchdog
Timer
RESET
33
32
30
31
34
I/O Pins
34
V
DD
BV
DD
35
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 91
PIC16C62X
FIGURE 12-6: TIMER0 CLOCK TIMING
TABLE 12-7:
TIMER0 CLOCK REQUIREMENTS
FIGURE 12-7: LOAD CONDITIONS
Parameter
No.
Sym Characteristic
Min
Typ
Max
Units Conditions
40
Tt0H T0CKI High Pulse Width
No Prescaler
0.5 T
CY
+ 20*
--
--
ns
With Prescaler
10*
--
--
ns
41
Tt0L
T0CKI Low Pulse Width
No Prescaler
0.5 T
CY
+ 20*
--
--
ns
With Prescaler
10*
--
--
ns
42
Tt0P T0CKI Period
T
CY
+ 40*
N
--
--
ns
N = prescale value
(1, 2, 4, ..., 256)
*
These parameters are characterized but not tested.
Data in "Typ" column is at 5.0V, 25
C unless otherwise stated. These parameters are for design guidance
only and are not tested.
41
42
40
RA4/T0CKI
TMR0
V
DD
/2
C
L
R
L
Pin
Pin
V
SS
V
SS
C
L
R
L
= 464
C
L
= 50 pF
for all pins except OSC2
15 pF
for OSC2 output
Load condition 1
Load condition 2
PIC16C62X
DS30235G-page 92
Preliminary
1998 Microchip Technology Inc.
NOTES:
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 93
PIC16C62X
13.0
DEVICE CHARACTERIZATION
INFORMATION
Not Available at this time.
PIC16C62X
DS30235G-page 94
Preliminary
1998 Microchip Technology Inc.
NOTES:
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 95
PIC16C62X
14.0
PACKAGING INFORMATION
Package Type:
K04-010 18-Lead Ceramic Dual In-line with Window (JW) 300 mil
*
Controlling Parameter.
n
2
1
R
MIN
Window Length
Window Width
Overall Row Spacing
Radius to Radius Width
Package Width
Package Length
Tip to Seating Plane
Base to Seating Plane
Top of Lead to Seating Plane
Top to Seating Plane
Lead Thickness
Shoulder Radius
Upper Lead Width
Lower Lead Width
Number of Pins
PCB Row Spacing
Dimension Limits
Pitch
Units
eB
W2
W1
L
E
E1
D
A1
A2
A
B
c
R
B1
n
p
0.15
7.24
7.87
0.76
3.33
4.83
0.30
0.38
1.52
0.53
2.59
0.200
0.140
0.385
0.270
0.298
0.900
0.138
0.023
0.111
0.183
0.190
0.130
0.345
0.125
0.255
0.285
0.880
0.015
0.091
0.175
0.210
0.150
0.425
0.150
0.285
0.310
0.920
0.030
0.131
0.190
0.010
0.013
0.055
0.019
0.100
0.300
NOM
0.016
0.008
0.010
0.050
0.098
INCHES*
MAX
18
0.021
0.012
0.015
0.060
0.102
22.86
0.19
0.13
8.76
6.48
7.24
22.35
3.18
0.00
2.31
4.45
0.2
0.14
9.78
10.80
0.21
3.49
6.86
7.56
0.57
2.82
4.64
3.81
23.37
NOM
MILLIMETERS
MIN
0.20
0.25
1.27
0.41
2.49
MAX
0.47
0.25
0.32
1.40
2.54
18
7.62
D
W2
E
W1
c
eB
E1
p
L
A1
B
B1
A
A2
PIC16C62X
DS30235G-page 96
Preliminary
1998 Microchip Technology Inc.
Package Type:
K04-007 18-Lead Plastic Dual In-line (P) 300 mil
*
Controlling Parameter.
Dimension "B1" does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003"
(0.076 mm) per side or 0.006" (0.152 mm) more than dimension "B1."
Dimensions "D" and "E" do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010" (0.254 mm) per side or 0.020" (0.508 mm) more than dimensions "D" or "E."
Units
INCHES*
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
PCB Row Spacing
0.300
7.62
Number of Pins
n
18
18
Pitch
p
0.100
2.54
Lower Lead Width
B
0.013
0.018
0.023
0.33
0.46
0.58
Upper Lead Width
B1
0.055
0.060
0.065
1.40
1.52
1.65
Shoulder Radius
R
0.000
0.005
0.010
0.00
0.13
0.25
Lead Thickness
c
0.005
0.010
0.015
0.13
0.25
0.38
Top to Seating Plane
A
0.110
0.155
0.155
2.79
3.94
3.94
Top of Lead to Seating Plane
A1
0.075
0.095
0.115
1.91
2.41
2.92
Base to Seating Plane
A2
0.000
0.020
0.020
0.00
0.51
0.51
Tip to Seating Plane
L
0.125
0.130
0.135
3.18
3.30
3.43
Package Length
D
0.890
0.895
0.900
22.61
22.73
22.86
Molded Package Width
E
0.245
0.255
0.265
6.22
6.48
6.73
Radius to Radius Width
E1
0.230
0.250
0.270
5.84
6.35
6.86
Overall Row Spacing
eB
0.310
0.349
0.387
7.87
8.85
9.83
Mold Draft Angle Top
5
10
15
5
10
15
Mold Draft Angle Bottom
5
10
15
5
10
15
R
n
2
1
D
E
c
eB
E1
p
A1
L
B1
B
A
A2
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 97
PIC16C62X
Package Type:
K04-051 18-Lead Plastic Small Outline (SO) Wide, 300 mil
0.014
0.009
0.010
0.011
0.005
0.005
0.010
0.394
0.292
0.450
0.004
0.048
0.093
MIN
n
Number of Pins
Mold Draft Angle Bottom
Mold Draft Angle Top
Lower Lead Width
Chamfer Distance
Outside Dimension
Molded Package Width
Molded Package Length
Overall Pack. Height
Lead Thickness
Radius Centerline
Foot Angle
Foot Length
Gull Wing Radius
Shoulder Radius
Standoff
Shoulder Height
R2
R1
E1
A2
A1
X
B
c
L1
L
E
D
A
Dimension Limits
Pitch
Units
p
18
18
0
0
12
12
15
15
4
0.020
0
0.017
0.011
0.015
0.016
0.005
0.005
0.407
0.296
0.456
0.008
0.058
0.099
0.029
0.019
0.012
0.020
0.021
0.010
0.010
8
0.419
0.299
0.462
0.011
0.068
0.104
0
0
12
12
15
15
0.42
0.27
0.38
0.41
0.13
0.13
0.50
10.33
7.51
11.58
0.19
1.47
2.50
0.25
0
0.36
0.23
0.25
0.28
0.13
0.13
10.01
7.42
11.43
0.10
1.22
2.36
0.74
4
8
0.48
0.30
0.51
0.53
0.25
0.25
10.64
7.59
11.73
0.28
1.73
2.64
INCHES*
0.050
NOM
MAX
1.27
MILLIMETERS
MIN
NOM
MAX
n
2
1
R2
R1
L1
L
c
X
45
D
p
B
E
E1
A1
A2
A
*
Controlling Parameter.
Dimension "B" does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003"
(0.076 mm) per side or 0.006" (0.152 mm) more than dimension "B."
Dimensions "D" and "E" do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010" (0.254 mm) per side or 0.020" (0.508 mm) more than dimensions "D" or "E."
PIC16C62X
DS30235G-page 98
Preliminary
1998 Microchip Technology Inc.
Package Type:
K04-072 20-Lead Plastic Shrink Small Outine (SS) 5.30 mm
MIN
p
Pitch
Mold Draft Angle Bottom
Mold Draft Angle Top
Lower Lead Width
Radius Centerline
Gull Wing Radius
Shoulder Radius
Outside Dimension
Molded Package Width
Molded Package Length
Shoulder Height
Overall Pack. Height
Lead Thickness
Foot Angle
Foot Length
Standoff
Number of Pins
c
A2
A1
A
n
E1
B
L1
R2
L
R1
E
D
Dimension Limits
Units
0.65
0.026
8
0
0
5
5
10
10
0.012
0.007
0.005
0.020
0.005
0.005
0.306
0.208
0.283
0.005
0.036
0.073
20
0.301
0
0.010
0.005
0.000
0.015
0.005
0.005
0.205
0.278
0.002
0.026
0.068
0.311
0.015
0.009
0.010
0.025
0.010
0.010
4
8
0.212
0.289
0.008
0.046
0.078
0
0
5
5
10
10
7.65
0.25
0.13
0.00
0.38
0.13
0.13
0
5.20
7.07
0.05
0.66
1.73
7.90
7.78
4
0.32
0.18
0.13
0.13
0.51
0.13
0.38
0.22
0.25
0.25
0.64
0.25
5.29
7.20
0.13
20
1.86
0.91
5.38
7.33
0.21
1.99
1.17
NOM
INCHES
MAX
NOM
MILLIMETERS*
MIN
MAX
n
1
2
R1
R2
D
p
B
E1
E
L1
L
c
A1
A
A2
*
Controlling Parameter.
Dimension "B" does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003"
(0.076 mm) per side or 0.006" (0.152 mm) more than dimension "B."
Dimensions "D" and "E" do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010" (0.254 mm) per side or 0.020" (0.508 mm) more than dimensions "D" or "E."
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 99
PIC16C62X
14.1
Package Marking Information
20-Lead SSOP
XXXXXXXXXX
AABBCDE
XXXXXXXXXX
XXXXXXXX
XXXXXXXX
AABBCDE
18-Lead CERDIP Windowed
18-Lead SOIC (.300")
XXXXXXXXXXXX
AABBCDE
XXXXXXXXXXXX
XXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
AABBCDE
18-Lead PDIP
Example
-04I / 218
9851 CBP
PIC16C622A
16C622
/JW
9801 CBA
Example
Example
-04I / S0218
9818 CDK
PIC16C622
PIC16C622A
-04I / P456
9823 CBA
Example
Legend: MM...M
Microchip part number information
XX...X
Customer specific information*
AA
Year code (last 2 digits of calendar year)
BB
Week code (week of January 1 is week `01')
C
Facility code of the plant at which wafer is manufactured
O = Outside Vendor
C = 5" Line
S = 6" Line
H = 8" Line
D
Mask revision number
E
Assembly code of the plant or country of origin in which
part was assembled
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
*
Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask
rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with
your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.
PIC16C62X
DS30235G-page 100
Preliminary
1998 Microchip Technology Inc.
NOTES:
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 101
PIC16C62X
APPENDIX A: ENHANCEMENTS
The following are the list of enhancements over the
PIC16C5X microcontroller family:
1.
Instruction word length is increased to 14 bits.
This allows larger page sizes both in program
memory (4K now as opposed to 512 before) and
register file (up to 128 bytes now versus 32
bytes before).
2.
A PC high latch register (PCLATH) is added to
handle program memory paging. PA2, PA1, PA0
bits are removed from STATUS register.
3.
Data memory paging is slightly redefined.
STATUS register is modified.
4.
Four new instructions have been added:
RETURN
,
RETFIE
,
ADDLW
, and
SUBLW
.
Two instructions
TRIS
and
OPTION
are being
phased out although they are kept for
compatibility with PIC16C5X.
5.
OPTION and TRIS registers are made
addressable.
6.
Interrupt capability is added. Interrupt vector is
at 0004h.
7.
Stack size is increased to 8 deep.
8.
Reset vector is changed to 0000h.
9.
Reset of all registers is revisited. Five different
reset (and wake-up) types are recognized.
Registers are reset differently.
10. Wake up from SLEEP through interrupt is
added.
11. Two separate timers, Oscillator Start-up Timer
(OST) and Power-up Timer (PWRT) are
included for more reliable power-up. These
timers are invoked selectively to avoid
unnecessary delays on power-up and wake-up.
12. PORTB has weak pull-ups and interrupt on
change feature.
13. Timer0 clock input, T0CKI pin is also a port pin
(RA4/T0CKI) and has a TRIS bit.
14. FSR is made a full 8-bit register.
15. "In-circuit programming" is made possible. The
user can program PIC16CXX devices using only
five pins: V
DD
, V
SS
, /V
PP
, RB6 (clock) and RB7
(data in/out).
16. PCON status register is added with a
Power-on-Reset (POR) status bit and a
Brown-out Reset status bit (BOR).
17. Code protection scheme is enhanced such that
portions of the program memory can be
protected, while the remainder is unprotected.
18. PORTA inputs are now Schmitt Trigger inputs.
19. Brown-out Reset reset has been added.
20. Common RAM registers F0h-FFh implemented
in bank1.
APPENDIX B: COMPATIBILITY
To convert code written for PIC16C5X to PIC16CXX,
the user should take the following steps:
1.
Remove any program memory page select
operations (PA2, PA1, PA0 bits) for
CALL
,
GOTO
.
2.
Revisit any computed jump operations (write to
PC or add to PC, etc.) to make sure page bits
are set properly under the new scheme.
3.
Eliminate any data memory page switching.
Redefine data variables to reallocate them.
4.
Verify all writes to STATUS, OPTION, and FSR
registers since these have changed.
5.
Change reset vector to 0000h.
PIC16C62X
DS30235G-page 102
Preliminary
1998 Microchip Technology Inc.
APPENDIX C: WHAT'S NEW
The format of certain sections of this data sheet have
been changed to be consistent with other product
families.
1.
PORTB input buffers have changed to TTL from
Schmitt Trigger.
APPENDIX D: WHAT'S CHANGED
1.
Table 3-1 was changed to reflect the TTL input
buffers on PORTB.
2.
Figure 5-5 and Figure 5-6 were updated to
reflect the TTL input buffers on PORTB.
3.
Figure 9-7 was updated.
4.
The orientation of the diode in Figure 9-19 was
changed.
5.
A device specification for JW devices was added
to Table 12-1.
6.
Max spec for Brown-out Reset current was
changed to 15
A in Section
12.1 and
Section
12.2.
7.
Information added to support the 2.5V "LC"
devices.
8.
Information added to support the "A" version of
the devices.
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 103
PIC16C62X
INDEX
A
ADDLW Instruction ............................................................. 63
ADDWF Instruction ............................................................. 63
ANDLW Instruction ............................................................. 63
ANDWF Instruction ............................................................. 63
Architectural Overview .......................................................... 9
Assembler
MPASM Assembler..................................................... 75
B
BCF Instruction ................................................................... 64
Block Diagram
TIMER0....................................................................... 31
TMR0/WDT PRESCALER .......................................... 34
Brown-Out Detect (BOD) .................................................... 50
BSF Instruction ................................................................... 64
BTFSC Instruction............................................................... 64
BTFSS Instruction ............................................................... 65
C
CALL Instruction ................................................................. 65
Clocking Scheme/Instruction Cycle .................................... 12
CLRF Instruction ................................................................. 65
CLRW Instruction ................................................................ 65
CLRWDT Instruction ........................................................... 66
CMCON Register ................................................................ 37
Code Protection .................................................................. 60
COMF Instruction ................................................................ 66
Comparator Configuration................................................... 38
Comparator Interrupts ......................................................... 41
Comparator Module ............................................................ 37
Comparator Operation ........................................................ 39
Comparator Reference ....................................................... 39
Configuration Bits................................................................ 46
Configuring the Voltage Reference..................................... 43
Crystal Operation ................................................................ 47
D
Data Memory Organization ................................................. 14
DECF Instruction................................................................. 66
DECFSZ Instruction ............................................................ 66
Development Support ......................................................... 73
Development Tools ............................................................. 73
E
Errata .................................................................................... 3
External Crystal Oscillator Circuit ....................................... 48
F
Fuzzy Logic Dev. System (
fuzzyTECH
-MP) .................... 75
G
General purpose Register File ............................................ 14
GOTO Instruction ................................................................ 67
I
I/O Ports .............................................................................. 25
I/O Programming Considerations........................................ 30
ICEPIC Low-Cost PIC16CXXX In-Circuit Emulator ............ 73
ID Locations ........................................................................ 60
INCF Instruction .................................................................. 67
INCFSZ Instruction ............................................................. 67
In-Circuit Serial Programming ............................................. 60
Indirect Addressing, INDF and FSR Registers ................... 24
Instruction Flow/Pipelining .................................................. 12
Instruction Set
ADDLW....................................................................... 63
ADDWF ...................................................................... 63
ANDLW....................................................................... 63
ANDWF ...................................................................... 63
BCF ............................................................................ 64
BSF............................................................................. 64
BTFSC........................................................................ 64
BTFSS ........................................................................ 65
CALL........................................................................... 65
CLRF .......................................................................... 65
CLRW ......................................................................... 65
CLRWDT .................................................................... 66
COMF ......................................................................... 66
DECF.......................................................................... 66
DECFSZ ..................................................................... 66
GOTO ......................................................................... 67
INCF ........................................................................... 67
INCFSZ....................................................................... 67
IORLW........................................................................ 67
IORWF........................................................................ 68
MOVF ......................................................................... 68
MOVLW ...................................................................... 68
MOVWF...................................................................... 68
NOP............................................................................ 69
OPTION...................................................................... 69
RETFIE....................................................................... 69
RETLW ....................................................................... 69
RETURN..................................................................... 70
RLF............................................................................. 70
RRF ............................................................................ 70
SLEEP ........................................................................ 70
SUBLW....................................................................... 71
SUBWF....................................................................... 71
SWAPF....................................................................... 72
TRIS ........................................................................... 72
XORLW ...................................................................... 72
XORWF ...................................................................... 72
Instruction Set Summary .................................................... 61
INT Interrupt ....................................................................... 56
INTCON Register ............................................................... 20
Interrupts ............................................................................ 55
IORLW Instruction .............................................................. 67
IORWF Instruction .............................................................. 68
K
KeeLoq
Evaluation and Programming Tools ................... 76
M
MOVF Instruction................................................................ 68
MOVLW Instruction ............................................................ 68
MOVWF Instruction ............................................................ 68
MPLAB Integrated Development Environment
Software ............................................................................. 75
N
NOP Instruction .................................................................. 69
O
One-Time-Programmable (OTP) Devices .............................7
OPTION Instruction ............................................................ 69
OPTION Register ............................................................... 19
Oscillator Configurations .................................................... 47
Oscillator Start-up Timer (OST) .......................................... 50
PIC16C62X
DS30235G-page 104
Preliminary
1998 Microchip Technology Inc.
P
Package Marking Information ............................................. 99
Packaging Information ........................................................ 95
PCL and PCLATH ............................................................... 23
PCON Register ................................................................... 22
PICDEM-1 Low-Cost PICmicro Demo Board...................... 74
PICDEM-2 Low-Cost PIC16CXX Demo Board ................... 74
PICDEM-3 Low-Cost PIC16CXXX Demo Board................. 74
PICSTART
Plus Entry Level Development System ......... 73
PIE1 Register ...................................................................... 21
Pinout Description ............................................................... 11
PIR1 Register...................................................................... 21
Port RB Interrupt ................................................................. 56
PORTA................................................................................ 25
PORTB................................................................................ 28
Power Control/Status Register (PCON) .............................. 51
Power-Down Mode (SLEEP)............................................... 59
Power-On Reset (POR) ...................................................... 50
Power-up Timer (PWRT)..................................................... 50
Prescaler ............................................................................. 34
PRO MATE
II Universal Programmer............................... 73
Program Memory Organization ........................................... 13
Q
Quick-Turnaround-Production (QTP) Devices ...................... 7
R
RC Oscillator ....................................................................... 48
Reset................................................................................... 49
RETFIE Instruction.............................................................. 69
RETLW Instruction .............................................................. 69
RETURN Instruction............................................................ 70
RLF Instruction.................................................................... 70
RRF Instruction ................................................................... 70
S
SEEVAL
Evaluation and Programming System ............... 75
Serialized Quick-Turnaround-Production
(SQTP) Devices .................................................................... 7
SLEEP Instruction ............................................................... 70
Software Simulator (MPLAB-SIM)....................................... 75
Special Features of the CPU............................................... 45
Special Function Registers ................................................. 17
Stack ................................................................................... 23
Status Register.................................................................... 18
SUBLW Instruction.............................................................. 71
SUBWF Instruction.............................................................. 71
SWAPF Instruction.............................................................. 72
T
Timer0
TIMER0 ....................................................................... 31
TIMER0 (TMR0) Interrupt ........................................... 31
TIMER0 (TMR0) Module ............................................. 31
TMR0 with External Clock........................................... 33
Timer1
Switching Prescaler Assignment................................. 35
Timing Diagrams and Specifications................................... 87
TMR0 Interrupt .................................................................... 56
TRIS Instruction .................................................................. 72
TRISA.................................................................................. 25
TRISB.................................................................................. 28
V
Voltage Reference Module ................................................. 43
VRCON Register ................................................................ 43
W
Watchdog Timer (WDT)...................................................... 57
WWW, On-Line Support ....................................................... 3
X
XORLW Instruction ............................................................. 72
XORWF Instruction............................................................. 72
1998 Microchip Technology Inc.
DS30235G-page 105
PIC16C62X
Systems Information and Upgrade Hot Line
The Systems Information and Upgrade Line provides
system users a listing of the latest versions of all of
Microchip's development systems software products.
Plus, this line provides information on how customers
can receive any currently available upgrade kits.The
Hot Line Numbers are:
1-800-755-2345 for U.S. and most of Canada, and
1-602-786-7302 for the rest of the world.
Trademarks: The Microchip name, logo, PIC, PICSTART,
PICMASTER and PRO MATE are registered trademarks
of Microchip Technology Incorporated in the U.S.A. and
other countries. PICmicro,
FlexROM, MPLAB and fuzzy-
LAB are trademarks and SQTP is a service mark of Micro-
chip in the U.S.A.
All other trademarks mentioned herein are the property of
their respective companies.
ON-LINE SUPPORT
Microchip provides on-line support on the Microchip
World Wide Web (WWW) site.
The web site is used by Microchip as a means to make
files and information easily available to customers. To
view the site, the user must have access to the Internet
and a web browser, such as Netscape or Microsoft
Explorer. Files are also available for FTP download
from our FTP site.
Connecting to the Microchip Internet Web Site
The Microchip web site is available by using your
favorite Internet browser to attach to:
www.microchip.com
The file transfer site is available by using an FTP ser-
vice to connect to:
ftp://ftp.futureone.com/pub/microchip
The web site and file transfer site provide a variety of
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
User's Guides, Articles and Sample Programs. A vari-
ety of Microchip specific business information is also
available, including listings of Microchip sales offices,
distributors and factory representatives. Other data
available for consideration is:
Latest Microchip Press Releases
Technical Support Section with Frequently Asked
Questions
Design Tips
Device Errata
Job Postings
Microchip Consultant Program Member Listing
Links to other useful web sites related to
Microchip Products
Conferences for products, Development Systems,
technical information and more
Listing of seminars and events
980106
PIC16C62X
DS30235G-page 106
1998 Microchip Technology Inc.
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (602) 786-7578.
Please list the following information, and use this outline to provide us with your comments about this Data Sheet.
1.
What are the best features of this document?
2.
How does this document meet your hardware and software development needs?
3.
Do you find the organization of this data sheet easy to follow? If not, why?
4.
What additions to the data sheet do you think would enhance the structure and subject?
5.
What deletions from the data sheet could be made without affecting the overall usefulness?
6.
Is there any incorrect or misleading information (what and where)?
7.
How would you improve this document?
8.
How would you improve our software, systems, and silicon products?
To:
Technical Publications Manager
RE:
Reader Response
Total Pages Sent
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
Application (optional):
Would you like a reply? Y N
Device:
Literature Number:
Questions:
FAX: (______) _________ - _________
DS30235G
PIC16C62X
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 107
PIC16C62X
PIC16C62X PRODUCT IDENTIFICATION SYSTEM
To order or to obtain information, e.g., on pricing or delivery, please use the listed part numbers, and refer to the factory or the listed
sales offices.
* JW Devices are UV erasable and can be programmed to any device configuration. JW Devices meet the electrical requirement of
each oscillator type (including LC devices).
Sales and Support
Products supported by a preliminary Data Sheet may possibly have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
Your local Microchip sales office.
2.
The Microchip Corporate Literature Center U.S. FAX: (602) 786-7277
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
For latest version information and upgrade kits for Microchip Development Tools, please call 1-800-755-2345 or 1-602-786-7302.
Pattern:
3-Digit Pattern Code for QTP (blank otherwise)
Package:
P
=
PDIP
SO
=
SOIC (Gull Wing, 300 mil body)
SS
=
SSOP (209 mil)
JW*
=
Windowed CERDIP
Temperature -
=
0C to +70C
Range:
I
=
40C to +85C
E
=
40C to +125C
Frequency
04
=
200kHz (LP osc)
Range:
04
=
4 MHz (XT and RC osc)
20
=
20 MHz (HS osc)
Device:
PIC16C62X :V
DD
range 3.0V to 6.0V
PIC16C62XT:V
DD
range 3.0V to 6.0V (Tape and Reel)
PIC16C62XA: V
DD
range 3.0V to 5.5V
PIC16C62XAT: V
DD
range 3.0V to 5.5V (Tape and Reel)
PIC16LC62X:V
DD
range 2.5V to 6.0V
PIC16LC62XT:V
DD
range 2.5V to 6.0V (Tape and Reel)
PIC16LC62XA:V
DD
range 2.5V to 5.5V
PIC16LC62XAT:V
DD
range 2.5V to 5.5V (Tape and Reel)
PIC16CR620A: V
DD
range 2.5V to 5.5V
PIC16CR620AT: V
DD
range 2.5V to 5.5V (Tape and Reel)
PIC16LCR620A: V
DD
range 2.0V to 5.5V
PIC16LCR620AT: Vdd range 2.0V to 5.5V (Tape and Reel)
PIC16CR620T: V
DD
range 3.0V to 5.5V (Tape and Reel)
Examples:
g) PIC16C621A - 04/P 301 =
Commercial temp., PDIP pack-
age, 4 MHz, normal V
DD
limits,
QTP pattern #301.
h) PIC16LC622- 04I/SO =
Industrial temp., SOIC pack-
age, 200kHz, extended V
DD
limits.
PART NO. -XX X /XX XXX
Information contained in this publication regarding device applications and the like is intended for suggestion only and may be superseded by updates. No representation or warranty is given and no
liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use
or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or
otherwise, under any intellectual property rights. The Microchip logo and name are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. All rights reserved. All other
trademarks mentioned herein are the property of their respective companies.
DS30235G-page 108
1998 Microchip Technology Inc.
All rights reserved. 1998, Microchip Technology Incorporated, USA. 8/98
Printed on recycled paper.
M
AMERICAS
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AMERICAS
(continued)
Toronto
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Tel: 905-405-6279 Fax: 905-405-6253
ASIA/PACIFIC
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Tel: 86-21-6275-5700 Fax: 86 21-6275-5060
ASIA/PACIFIC
(continued)
Singapore
Microchip Technology Singapore Pte Ltd.
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#07-02 Prime Centre
Singapore 188980
Tel: 65-334-8870 Fax: 65-334-8850
Taiwan, R.O.C
Microchip Technology Taiwan
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Taipei, Taiwan, ROC
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
United Kingdom
Arizona Microchip Technology Ltd.
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Berkshire, England RG41 5TU
Tel: 44-1189-21-5858 Fax: 44-1189-21-5835
France
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Germany
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Italy
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Milan, Italy
Tel: 39-39-689 9939 Fax: 39-39-6899883
7/7/98
W
ORLDWIDE
S
ALES
AND
S
ERVICE
Microchip received ISO 9001 Quality
System certification for its worldwide
headquarters, design, and wafer
fabrication facilities in January, 1997.
Our field-programmable PICmicroTM
8-bit MCUs, Serial EEPROMs,
related specialty memory products
and development systems conform
to the stringent quality standards of
the International Standard
Organization (ISO).