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Электронный компонент: MT2LD132H-6

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1
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
FEATURES
JEDEC pinout in a 100-pin, dual in-line memory
module (DIMM)
4MB (1 Meg x 32) and 8MB (2 Meg x 32)
High-performance CMOS silicon-gate process
Single +3.3V
0.3V power supply
All inputs, outputs and clocks are TTL-compatible
Refresh modes: RAS#-ONLY, CAS#-BEFORE-RAS#
(CBR) and HIDDEN
1,024-cycle refresh distributed across 16ms
FAST-PAGE-MODE (FPM) or Extended Data-Out
(EDO) PAGE MODE access cycles
Serial presence-detect (SPD)
OPTIONS
MARKING
Package
100-pin DIMM (gold)
G
Timing
50ns access
-5*
60ns access
-6
Access Cycles
FAST PAGE MODE
None
EDO PAGE MODE
X
*EDO version only
PIN ASSIGNMENT (Front View)
100-Pin DIMM
PIN
FRONT
PIN
FRONT
PIN
BACK
PIN
BACK
1
V
SS
26
V
SS
51
V
SS
76
V
SS
2
DQ0
27
DNU
52
DQ8
77
DNU
3
DQ1
28
WE#
53
DQ9
78
OE#
4
DQ2
29
RAS0#
54
DQ10
79
RAS1#
5
DQ3
30
RAS2#
55
DQ11
80
RAS3#
6
V
DD
31
V
DD
56
V
DD
81
V
DD
7
DQ4
32
NC
57
DQ12
82
NC
8
DQ5
33
NC
58
DQ13
83
NC
9
DQ6
34
NC
59
DQ14
84
NC
10
DQ7
35
NC
60
DQ15
85
NC
11
CAS0#
36
V
SS
61
CAS1#
86
V
SS
12
V
SS
37
CAS2#
62
V
SS
87
CAS3#
13
A0
38
DQ16
63
A1
88
DQ24
14
A2
39
DQ17
64
A3
89
DQ25
15
A4
40
DQ18
65
A5
90
DQ26
16
A6
41
DQ19
66
A7
91
DQ27
17
A8
42
V
DD
67
A9
92
V
DD
18
NC (A10)
43
DQ20
68
NC (A11)
93
DQ28
19
NC (A12)
44
DQ21
69
NC (A13)
94
DQ29
20
NC
45
DQ22
70
NC
95
DQ30
21
V
DD
46
DQ23
71
V
DD
96
DQ31
22
DNU
47
V
SS
72
DNU
97
V
SS
23
RFU
48
SDA
73
DNU
98
SA0
24
RFU
49
SCL
74
RFU
99
SA1
25
DNU
50
V
DD
75
DNU
100
SA2
KEY TIMING PARAMETERS
EDO Operating Mode
SPEED
t
RC
t
RAC
t
PC
t
AA
t
CAC
t
CAS
-5
84ns
50ns
20ns
25ns
15ns
8ns
-6
104ns
60ns
25ns
30ns
15ns
10ns
FPM Operating Mode
SPEED
t
RC
t
RAC
t
PC
t
AA
t
CAC
t
RP
-6
110ns
60ns
35ns
30ns
15ns
40ns
NOTE: Symbols in parentheses are not used on these modules but may be used
for other modules in this product family. They are for reference only.
DRAM
MODULE
MT2LD132U(X), MT4LD232U(X)
For the latest data sheet revisions, please refer to the Micron
Web site: www.micron.com/mti/msp/html/datasheet.html
2
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
EDO PAGE MODE
EDO PAGE MODE, designated by the "X" option, is an
accelerated FAST-PAGE-MODE cycle. The primary advan-
tage of EDO is the availability of data-out even after CAS#
goes back HIGH. EDO provides for CAS# precharge time
(
t
CP) to occur without the output data going invalid. This
elimination of CAS# output control provides for pipelined
READs.
FAST-PAGE-MODE modules have traditionally turned
the output buffers off (High-Z) with the rising edge of
CAS#. EDO operates as any DRAM READ or FAST-PAGE-
MODE READ, except data will be held valid after CAS#
goes HIGH, as long as RAS# and OE# are held LOW and
WE# is held HIGH. (Refer to the 1 Meg x 16 [MT4LC1M16E5]
DRAM data sheet for additional information on EDO
functionality.)
REFRESH
Memory cell data is retained in its correct state by main-
taining power and executing any RAS# cycle (READ,
WRITE) or RAS# REFRESH cycle (RAS#-ONLY, CBR or
HIDDEN) so that all combinations of RAS# addresses are
executed at least every
t
REF, regardless of sequence. The
CBR REFRESH cycle will invoke the internal refresh counter
for automatic RAS# addressing.
STANDBY
Returning RAS# and CAS# HIGH terminates a memory
cycle and decreases chip current to a reduced standby level.
Also, the chip is preconditioned for the next cycle during
the RAS# HIGH time.
SERIAL PRESENCE-DETECT OPERATION
This module family incorporates serial presence-detect
(SPD). The SPD function is implemented using a 2,048-bit
EEPROM. This nonvolatile storage device contains 256
bytes. The first 128 bytes can be programmed by Micron to
identify the module type and various DRAM organizations
and timing parameters. The remaining 128 bytes of storage
are available for use by the customer. System READ/
WRITE operations between the master (system logic) and
the slave EEPROM device (DIMM) occur via a standard IIC
bus using the DIMM's SCL (clock) and SDA (data) signals,
together with SA(2:0), which provide eight unique DIMM/
EEPROM addresses.
PART NUMBERS
EDO Operating Mode
PART NUMBER
CONFIGURATION
SPEED
MT2LD132UG-5 X
1 Meg x 32
50ns
MT2LD132UG-6 X
1 Meg x 32
60ns
MT4LD232UG-5 X
2 Meg x 32
50ns
MT4LD232UG-6 X
2 Meg x 32
60ns
FPM Operating Mode
PART NUMBER
CONFIGURATION
SPEED
MT2LD132UG-6
1 Meg x 32
60ns
MT4LD232UG-6
2 Meg x 32
60ns
GENERAL DESCRIPTION
The MT2LD132U(X) and MT4LD232U(X) are randomly
accessed 4MB and 8MB memories organized in a x32 con-
figuration. They are specially processed to operate from 3V
to 3.6V for low-voltage memory systems.
During READ or WRITE cycles, each bit is uniquely
addressed through the 20 address bits which are entered
ten bits (A0 -A9) at a time. RAS# is used to latch the first ten
bits and CAS# the latter ten bits.
READ and WRITE cycles are selected with the WE#
input. A logic HIGH on WE# dictates read mode, while a
logic LOW on WE# dictates write mode. During a WRITE
cycle, data-in (D) is latched by the falling edge of WE# or
CAS#, whichever occurs last. If WE# goes LOW prior to
CAS# going LOW, the output pin(s) remain open (High-Z)
until the next CAS# cycle.
FAST PAGE MODE
FAST-PAGE-MODE operations allow faster data opera-
tions (READ or WRITE) within a row-address-defined
page boundary. The FAST-PAGE-MODE cycle is always
initiated with a row address strobed in by RAS#, followed
by a column address strobed in by CAS#. Additional col-
umns may be accessed by providing valid column
addresses, strobing CAS# and holding RAS# LOW , thus
executing faster memory cycles. Returning RAS# HIGH
terminates the FAST-PAGE-MODE operation.
3
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
SPD CLOCK AND DATA CONVENTIONS
Data states on the SDA line can change only during SCL
LOW. SDA state changes during SCL HIGH are reserved
for indicating start and stop conditions (Figures 1 and 2).
SPD START CONDITION
All commands are preceded by the start condition, which
is a HIGH-to-LOW transition of SDA when SCL is HIGH.
The SPD device continuously monitors the SDA and SCL
lines for the start condition and will not respond to any
command until this condition has been met.
SPD STOP CONDITION
All communications are terminated by a stop condition,
which is a LOW-to-HIGH transition of SDA when SCL is
HIGH. The stop condition is also used to place the SPD
device into standby power mode.
SPD ACKNOWLEDGE
Acknowledge is a software convention used to indicate
successful data transfers. The transmitting device, either
master or slave, will release the bus after transmitting eight
bits. During the ninth clock cycle, the receiver will pull the
SDA line LOW to acknowledge that it received the eight bits
of data (Figure 3).
The SPD device will always respond with an acknowl-
edge after recognition of a start condition and its slave
address. If both the device and a WRITE operation have
been selected, the SPD device will respond with an ac-
knowledge after the receipt of each subsequent eight-bit
word. In the read mode the SPD device will transmit eight
bits of data, release the SDA line and monitor the line for an
acknowledge. If an acknowledge is detected and no stop
condition is generated by the master, the slave will continue
to transmit data. If an acknowledge is not detected, the slave
will terminate further data transmissions and await the
stop condition to return to standby power mode.
Figure 3
ACKNOWLEDGE RESPONSE FROM RECEIVER
SCL from Master
Data Output
from Transmitter
Data Output
from Receiver
9
8
Acknowledge
Figure 2
DEFINITION OF START AND STOP
SCL
SDA
START
BIT
STOP
BIT
Figure 1
DATA VALIDITY
SCL
SDA
DATA STABLE
DATA STABLE
DATA
CHANGE
4
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
FUNCTIONAL BLOCK DIAGRAM
MT2LD132U (4MB)
WE#
CASL#
CASH#
RAS#
OE#
A0-A9
U1
WE#
CASL#
CASH#
RAS#
OE#
DQ16-
DQ31
U2
CAS0#
CAS1#
RAS0#
OE#
CAS2#
CAS3#
RAS2#
WE#
A0-A9
10
10
10
16
16
32
DQ0-
DQ15
A0-A9
DQ0-DQ31
V
DD
V
SS
U1-U2
U1-U2
SPD
SCL
SDA
SA0 SA1 SA2
A0
A1
A2
U1-U2 = MT4LC1M16C3 FAST PAGE MODE
U1-U2 = MT4LC1M16E5 EDO PAGE MODE
DQn
Every DRAM DQ pin
10 ohms
5
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
FUNCTIONAL BLOCK DIAGRAM
MT4LD232U (8MB)
V
DD
V
SS
U1-U4
U1-U4
SPD
SCL
SDA
SA0 SA1 SA2
A0
A1
A2
U1-U4 = MT4LC1M16C3 FAST PAGE MODE
U1-U4 = MT4LC1M16E5 EDO PAGE MODE
DQn
Every DRAM DQ pin
10 ohms
A0-A9
U3
DQ16-
DQ31
U4
RAS1#
RAS3#
10
10
16
16
32
DQ0-
DQ15
A0-A9
DQ0-DQ31
WE#
CASL#
CASH#
RAS#
OE#
A0-A9
U1
DQ16-
DQ31
U2
CAS0#
CAS1#
RAS0#
OE#
CAS2#
CAS3#
RAS2#
10
10
16
16
32
DQ0-
DQ15
A0-A9
DQ0-DQ31
A0-A9
10
WE#
WE#
CASL#
CASH#
RAS#
OE#
WE#
CASL#
CASH#
RAS#
OE#
WE#
CASL#
CASH#
RAS#
OE#
6
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
SERIAL PRESENCE-DETECT MATRIX
BYTE
DESCRIPTION
ENTRY (VERSION)
BIT7
BIT6
BIT5
BIT4
BIT3
BIT2
BIT1
BIT0
HEX
0
NUMBER OF BYTES USED BY MICRON
128
1
0
0
0
0
0
0
0
80
1
TOTAL NUMBER OF SPD MEMORY BYTES
256
0
0
0
0
1
0
0
0
08
2
MEMORY TYPE
FAST PAGE MODE
0
0
0
0
0
0
0
1
01
EDO PAGE MODE
0
0
0
0
0
0
1
0
02
3
NUMBER OF ROW ADDRESSES
10
0
0
0
0
1
0
1
0
0A
4
NUMBER OF COLUMN ADDRESSES
10
0
0
0
0
1
0
1
0
0A
5
NUMBER OF BANKS
1 (4MB)
0
0
0
0
0
0
0
1
01
2 (8MB)
0
0
0
0
0
0
1
0
02
6
MODULE DATA WIDTH
x32
0
0
1
0
0
0
0
0
20
7
MODULE DATA WIDTH (continued)
0
0
0
0
0
0
0
0
0
00
8
MODULE VOLTAGE INTERFACE LEVELS
LVTTL
0
0
0
0
0
0
0
1
01
9
RAS# ACCESS TIME (
t
RAC)
50ns (-5)
0
0
1
1
0
0
1
0
32
60ns (-6)
0
0
1
1
1
1
0
0
3C
10
CAS# ACCESS TIME (
t
CAC)
15ns
0
0
0
0
1
1
1
1
0F
11
MODULE CONFIGURATION TYPE
NONPARITY
0
0
0
0
0
0
0
0
00
12
REFRESH RATE/TYPE 15.6
s
NORMAL
0
0
0
0
0
0
0
0
00
13
DRAM WIDTH (PRIMARY DRAM)
x16
0
0
0
1
0
0
0
0
10
14
ERROR CHECKING DRAM DATA WIDTH
NONE
0
0
0
0
0
0
0
0
00
15-61
RESERVED
0
0
0
0
0
0
0
0
00
62
SPD REVISION
REV. 0
0
0
0
0
0
0
0
0
00
63
CHECKSUM FOR BYTES 0-62
4MB -5 (EDO)
0
0
0
1
0
0
0
1
11
4MB -6 (EDO)
0
0
0
1
1
0
1
1
1B
4MB -6 (FPM)
0
0
1
1
1
1
0
0
1C
8MB -5 (EDO)
0
0
0
1
0
0
1
0
12
8MB -6 (EDO)
0
0
0
1
1
1
0
0
1C
8MB -6 (FPM)
0
0
0
1
1
1
0
1
1D
64
MANUFACTURER'S JEDEC ID CODE
MICRON
0
0
1
0
1
1
0
0
2C
65-71
MANUFACTURER'S JEDEC CODE (CONT.)
1
1
1
1
1
1
1
1
FF
72
MANUFACTURING LOCATION
0
0
0
0
0
0
0
1
01
0
0
0
0
0
0
1
0
02
0
0
0
0
0
0
1
1
03
0
0
0
0
0
1
0
0
04
73-90
MODULE PART NUMBER (ASCII)
x
x
x
x
x
x
x
x
xx
91
PCB IDENTIFICATION CODE
1
0
0
0
0
0
0
0
1
01
2
0
0
0
0
0
0
1
0
02
3
0
0
0
0
0
0
1
1
03
4
0
0
0
0
0
1
0
0
04
92
IDENTIFICATION CODE (CONT.)
0
0
0
0
0
0
0
0
0
00
93
YEAR OF MANUFACTURE IN BCD
x
x
x
x
x
x
x
x
xx
94
WEEK OF MANUFACTURE IN BCD
x
x
x
x
x
x
x
x
xx
95-98
MODULE SERIAL NUMBER
x
x
x
x
x
x
x
x
xx
99-125
MANUFACTURE SPECIFIC DATA (RSVD)
NOTE:
1. "1"/"0": Serial Data, "driven to HIGH"/"driven to LOW."
2. x = Variable Data.
7
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
DC ELECTRICAL CHARACTERISTICS AND OPERATING CONDITIONS
(Notes: 1) (V
DD
= +3.3V
0.3V)
PARAMETER/CONDITION
SYMBOL
MIN
MAX
UNITS NOTES
SUPPLY VOLTAGE
V
DD
3
3.6
V
INPUT HIGH VOLTAGE: Logic 1; All inputs
V
IH
2
V
DD
+ 0.3
V
30
INPUT LOW VOLTAGE: Logic 0; All inputs
V
IL
-0.5
0.8
V
30
INPUT LEAKAGE CURRENT:
RAS0#-RAS3#
I
I
1
-2
2
A
Any input 0V
V
IN
V
DD
+ 0.3V
A0-A9, WE#, OE#
I
I
2
-8
8
A
23
(All other pins not under test = 0V)
CAS0#-CAS3#
I
I
3
-4
4
A
23
OUTPUT LEAKAGE CURRENT:
DQ0-DQ31
I
OZ
-10
10
A
23
DQ is disabled; 0V
V
OUT
V
DD
+ 0.3V
OUTPUT LEVELS:
V
OH
2.4
V
Output High Voltage (I
OUT
= -2mA)
Output Low Voltage (I
OUT
= 2mA)
V
OL
0.4
V
ABSOLUTE MAXIMUM RATINGS*
Voltage on V
DD
Supply Relative to V
SS
.......... -1V to +4.6V
Voltage on Inputs or I/O Pins
Relative to V
SS
................................................ -1V to +4.6V
Operating Temperature, T
A
(ambient) .......... 0
C to +70
C
Storage Temperature (plastic) .................... -55
C to +125
C
Power Dissipation ............................................................. 4W
*Stresses greater than those listed under "Absolute Maxi-
mum Ratings" may cause permanent damage to the device.
This is a stress rating only, and functional operation of the
device at these or any other conditions above those indi-
cated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions
for extended periods may affect reliability.
8
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
MAX
CAPACITANCE
PARAMETER
SYMBOL
4MB
8MB
UNITS
NOTES
Input Capacitance: A0-A9
C
I
1
14
24
pF
2
Input Capacitance: WE#, OE#
C
I
2
18
32
pF
2
Input Capacitance: CAS0#-CAS3#
C
I
3
10
18
pF
2
Input Capacitance: RAS0#-RAS3#, SCL, SA0-SA2
C
I
4
10
10
pF
2
Input/Output Capacitance: DQ0-DQ31, SDA
C
IO
10
18
pF
2
I
CC
OPERATING CONDITIONS AND MAXIMUM LIMITS
(Notes: 1, 5, 6) (V
DD
= +3.3V
0.3V)
PARAMETER/CONDITION
SYMBOL
SIZE
-5*
-6
UNITS
NOTES
STANDBY CURRENT: TTL
I
CC
1
4MB
2
2
mA
(RAS# = CAS# = V
IH
)
8MB
4
4
STANDBY CURRENT: CMOS
I
CC
2
4MB
1
1
mA
26
(RAS# = CAS# = V
DD
- 0.2V)
8MB
2
2
OPERATING CURRENT: Random READ/WRITE;
4MB
360
340
mA
3, 22
Average power supply current;
I
CC
3
(RAS#, CAS#, address cycling:
t
RC =
t
RC [MIN])
8MB
362
342
OPERATING CURRENT: FAST PAGE MODE;
Average power supply current;
I
CC
4
4MB
180
mA
3, 22
(RAS# = V
IL
, CAS#, address cycling:
t
PC =
t
PC [MIN];
8MB
182
t
CP,
t
ASC = 10ns)
OPERATING CURRENT: EDO PAGE MODE;
4MB
280
260
mA
3, 22
Average power supply current;
I
CC
5
(RAS# = V
IL
, CAS#, address cycling:
t
PC =
t
PC [MIN])
(X only)
8MB
282
262
REFRESH CURRENT: RAS#-ONLY;
4MB
360
340
Average power supply current;
I
CC
6
mA
3, 22
(RAS# cycling, CAS# = V
IH
:
t
RC =
t
RC [MIN])
8MB
362
342
REFRESH CURRENT: CBR;
4MB
360
340
Average power supply current;
I
CC
7
mA
3, 4
(RAS#, CAS#, address cycling:
t
RC =
t
RC [MIN])
8MB
362
342
* EDO version only
MAX
9
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
FAST PAGE MODE
AC ELECTRICAL CHARACTERISTICS
(Notes: 5, 6, 7, 8, 9, 12, 19) (V
DD
= +3.3V
0.3V)
AC CHARACTERISTICS - FAST PAGE MODE OPTION
-6
PARAMETER
SYMBOL
MIN
MAX
UNITS
NOTES
Access time from column address
t
AA
30
ns
Column-address hold time (referenced to RAS#)
t
AR
45
ns
Column-address setup time
t
ASC
0
ns
Row-address setup time
t
ASR
0
ns
Column address to WE# delay time
t
AWD
55
ns
27
Access time from CAS#
t
CAC
15
ns
Column-address hold time
t
CAH
10
ns
CAS# pulse width
t
CAS
15
10,000
ns
CAS# hold time (CBR Refresh)
t
CHR
10
ns
4
CAS# to output in Low-Z
t
CLZ
3
ns
21
CAS# precharge time
t
CP
10
ns
13
Access time from CAS# precharge
t
CPA
35
ns
CAS# to RAS# precharge time
t
CRP
5
ns
CAS# hold time
t
CSH
60
ns
CAS# setup time (CBR Refresh)
t
CSR
5
ns
CAS# to WE# delay time
t
CWD
40
ns
27
WRITE command to CAS# lead time
t
CWL
15
ns
Data-in hold time
t
DH
10
ns
18
Data-in setup time
t
DS
0
ns
18
Output disable
t
OD
3
15
ns
Output enable
t
OE
15
ns
OE# hold time from WE# during READ-MODIFY-WRITE cycle
t
OEH
15
ns
28
Output buffer turn-off delay
t
OFF
3
15
ns
17, 24
OE# setup prior to RAS# during HIDDEN REFRESH cycle
t
ORD
0
ns
FAST-PAGE-MODE READ or WRITE cycle time
t
PC
35
ns
FAST-PAGE-MODE READ or WRITE cycle time
t
PRWC
85
ns
Access time from RAS#
t
RAC
60
ns
RAS# to column-address delay time
t
RAD
15
ns
15
Row-address hold time
t
RAH
10
ns
RAS# pulse width
t
RAS
60
10,000
ns
RAS# pulse width
(
FAST PAGE MODE
)
t
RASP
60
125,000
ns
Random READ or WRITE cycle time
t
RC
110
ns
10
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
FAST PAGE MODE
AC ELECTRICAL CHARACTERISTICS
(Notes: 5, 6, 7, 8, 9, 12, 19) (V
DD
= +3.3V
0.3V)
AC CHARACTERISTICS - FAST PAGE MODE OPTION
-6
PARAMETER
SYMBOL
MIN
MAX
UNITS
NOTES
RAS# to CAS# delay time
t
RCD
20
ns
14
READ command hold time (referenced to CAS#)
t
RCH
0
ns
16
READ command setup time
t
RCS
0
ns
Refresh period (1,024 cycles)
t
REF
16
ms
RAS# precharge time
t
RP
40
ns
RAS# to CAS# precharge time
t
RPC
0
ns
READ command hold time (referenced to RAS#)
t
RRH
0
ns
16
RAS# hold time
t
RSH
15
ns
READ-WRITE cycle time
t
RWC
155
ns
RAS# to WE# delay time
t
RWD
85
ns
27
WRITE command to RAS# lead time
t
RWL
15
ns
Transition time (rise or fall)
t
T
2
50
ns
WRITE command hold time
t
WCH
10
ns
WRITE command hold time (referenced to RAS#)
t
WCR
45
ns
WE# command setup time
t
WCS
0
ns
27
WRITE command pulse width
t
WP
10
ns
WE# hold time (CBR Refresh)
t
WRH
10
ns
WE# setup time (CBR Refresh)
t
WRP
10
ns
11
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
EDO PAGE MODE
AC ELECTRICAL CHARACTERISTICS
(Notes: 5, 6, 7, 8, 9, 12, 19) (V
DD
= +3.3V
0.3V)
AC CHARACTERISTICS - EDO PAGE MODE OPTION
-5
-6
PARAMETER
SYMBOL
MIN
MAX
MIN
MAX
UNITS
NOTES
Access time from column address
t
AA
25
30
ns
Column-address setup to CAS# precharge
t
ACH
12
15
ns
Column-address hold time (referenced to RAS#)
t
AR
38
45
ns
Column-address setup time
t
ASC
0
0
ns
Row-address setup time
t
ASR
0
0
ns
Column address to WE# delay time
t
AWD
42
49
ns
27
Access time from CAS#
t
CAC
15
15
ns
Column-address hold time
t
CAH
8
10
ns
CAS# pulse width
t
CAS
8
10,000
10
10,000
ns
CAS# hold time (CBR Refresh)
t
CHR
8
10
ns
4
CAS# to output in Low-Z
t
CLZ
0
0
ns
Data output hold after next CAS# LOW
t
COH
3
3
ns
CAS# precharge time
t
CP
8
10
ns
13
Access time from CAS# precharge
t
CPA
28
35
ns
CAS# to RAS# precharge time
t
CRP
5
5
ns
CAS# hold time
t
CSH
38
45
ns
CAS# setup time (CBR Refresh)
t
CSR
5
5
ns
CAS# to WE# delay time
t
CWD
28
35
ns
27
WRITE command to CAS# lead time
t
CWL
8
10
ns
Data-in hold time
t
DH
8
10
ns
18
Data-in setup time
t
DS
0
0
ns
18
Output disable
t
OD
0
12
0
15
ns
Output enable
t
OE
12
15
ns
OE# hold time from WE# during
t
OEH
8
10
ns
28
READ-MODIFY-WRITE cycle
OE# HIGH hold from CAS# HIGH
t
OEHC
5
10
ns
28
OE# HIGH pulse width
t
OEP
5
5
ns
OE# LOW to CAS# HIGH setup time
t
OES
4
5
ns
Output buffer turn-off delay
t
OFF
0
12
0
15
ns
17, 24
12
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
EDO PAGE MODE
AC ELECTRICAL CHARACTERISTICS
(Notes: 5, 6, 7, 8, 9, 12, 19) (V
DD
= +3.3V
0.3V)
AC CHARACTERISTICS - EDO PAGE MODE OPTION
-5
-6
PARAMETER
SYMBOL
MIN
MAX
MIN
MAX
UNITS
NOTES
OE# setup prior to RAS#
t
ORD
0
0
ns
during HIDDEN REFRESH cycle
EDO-PAGE-MODE READ or WRITE cycle time
t
PC
20
25
ns
EDO-PAGE-MODE READ-WRITE cycle time
t
PRWC
47
56
ns
Access time from RAS#
t
RAC
50
60
ns
RAS# to column-address delay time
t
RAD
9
12
ns
15
Row-address hold time
t
RAH
9
10
ns
RAS# pulse width
t
RAS
50
10,000
60
10,000
ns
RAS# pulse width (EDO PAGE MODE)
t
RASP
50
125,000
60
125,000
ns
Random READ or WRITE cycle time
t
RC
84
104
ns
RAS# to CAS# delay time
t
RCD
11
14
ns
14
READ command hold time (referenced to CAS#)
t
RCH
0
0
ns
16
READ command setup time
t
RCS
0
0
ns
Refresh period (1,024 cycles)
t
REF
16
16
ms
RAS# precharge time
t
RP
30
40
ns
RAS# to CAS# precharge time
t
RPC
5
5
ns
READ command hold time (referenced to RAS#)
t
RRH
0
0
ns
16
RAS# hold time
t
RSH
13
15
ns
READ-WRITE cycle time
t
RWC
116
140
ns
RAS# to WE# delay time
t
RWD
67
79
ns
27
WRITE command to RAS# lead time
t
RWL
13
15
ns
Transition time (rise or fall)
t
T
2
50
2
50
ns
WRITE command hold time
t
WCH
8
10
ns
WRITE command hold time (referenced to RAS#)
t
WCR
38
45
ns
WE# command setup time
t
WCS
0
0
ns
27
Output disable delay from WE#
t
WHZ
0
12
0
15
ns
WRITE command pulse width
t
WP
5
5
ns
WE# pulse to disable at CAS# HIGH
t
WPZ
10
10
ns
WE# hold time (CBR Refresh)
t
WRH
8
10
ns
WE# setup time (CBR Refresh)
t
WRP
8
10
ns
13
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
SERIAL PRESENCE-DETECT EEPROM AC ELECTRICAL CHARACTERISTICS
(Notes: 1) (V
DD
= +3.3V
0.3V)
PARAMETER/CONDITION
SYMBOL
MIN
MAX
UNITS
NOTES
SCL LOW to SDA data-out valid
t
AA
0.3
3.5
s
Time the bus must be free before a new transition can start
t
BUF
4.7
s
Data-out hold time
t
DH
300
ns
SDA and SCL fall time
t
F
300
ns
Data-in hold time
t
HD:DAT
0
s
Start condition hold time
t
HD:STA
4
s
Clock HIGH period
t
HIGH
4
s
Noise suppression time constant at SCL, SDA inputs
t
I
100
ns
Clock LOW period
t
LOW
4.7
s
SDA and SCL rise time
t
R
1
s
SCL clock frequency
t
SCL
100
KHz
Data-in setup time
t
SU:DAT
250
ns
Start condition setup time
t
SU:STA
4.7
s
Stop condition setup time
t
SU:STO
4.7
s
WRITE cycle time
t
WRC
10
ms
29
SERIAL PRESENCE-DETECT EEPROM DC OPERATING CONDITIONS
(Notes: 1) (V
DD
= +3.3V
0.3V)
PARAMETER/CONDITION
SYMBOL
MIN
MAX
UNITS
NOTES
SUPPLY VOLTAGE
V
DD
3
3.6
V
INPUT HIGH VOLTAGE: Logic 1; All inputs
V
IH
V
DD
0.7 V
DD
+
0.5
V
INPUT LOW VOLTAGE: Logic 0; All inputs
V
IL
-1
V
DD
0.3
V
OUTPUT LOW VOLTAGE: I
OUT
= 3mA
V
OL
0.4
V
INPUT LEAKAGE CURRENT: V
IN
= GND to V
DD
I
LI
10
A
OUTPUT LEAKAGE CURRENT: V
OUT
= GND to V
DD
I
LO
10
A
STANDBY CURRENT:
I
SB
30
A
SCL = SDA = V
DD
- 0.3V; All other inputs = GND or 3.3V +10%
POWER SUPPLY CURRENT:
I
CC
2
mA
SCL clock frequency = 100 KHz
14
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
NOTES
1. All voltages referenced to V
SS
.
2. This parameter is sampled. V
DD
= +3.3V; f = 1 MHz.
3. I
CC
is dependent on output loading and cycle rates.
Specified values are obtained with minimum cycle
time and the outputs open.
4. Enables on-chip refresh and address counters.
5. The minimum specifications are used only to indicate
cycle time at which proper operation over the full
temperature range is ensured.
6. An initial pause of 100
s is required after power-up,
followed by eight RAS# REFRESH cycles (RAS#-
ONLY or CBR with WE# HIGH), before proper device
operation is ensured. The eight RAS# cycle wake-ups
should be repeated any time the
t
REF refresh
requirement is exceeded.
7. AC characteristics assume
t
T = 5ns for FPM and
t
T = 2.5ns for EDO.
8. V
IH
(MIN) and V
IL
(MAX) are reference levels for
measuring timing of input signals. Transition times
are measured between V
IH
and V
IL
(or between V
IL
and V
IH
).
9. In addition to meeting the transition rate specifica-
tion, all input signals must transit between V
IH
and
V
IL
(or between V
IL
and V
IH
) in a monotonic manner.
10. If CAS# = V
IH
, data output is High-Z.
11. If CAS# = V
IL
, data output may contain data from the
last valid READ cycle.
12. Measured with a load equivalent to two TTL gates
and 100pF and V
OL
= 0.8V and V
OH
= 2V.
13. If CAS# is LOW at the falling edge of RAS#, Q will be
maintained from the previous cycle. To initiate a new
cycle and clear the data-out buffer, CAS# must be
pulsed HIGH for
t
CP.
14. The
t
RCD (MAX) limit is no longer specified.
t
RCD
(MAX) was specified as a reference point only. If
t
RCD was greater than the specified
t
RCD (MAX)
limit, then access time was controlled exclusively by
t
CAC (
t
RAC [MIN] no longer applied). With or
without the
t
RCD (MAX) limit,
t
AA and
t
CAC must
always be met.
15. The
t
RAD (MAX) limit is no longer specified.
t
RAD
(MAX) was specified as a reference point only. If
t
RAD was greater than the specified
t
RAD (MAX)
limit, then access time was controlled exclusively by
t
AA (
t
RAC and
t
CAC no longer applied). With or
without the
t
RAD (MAX) limit,
t
AA,
t
RAC and
t
CAC
must always be met.
16. Either
t
RCH or
t
RRH must be satisfied for a READ
cycle.
17.
t
OFF (MAX) defines the time at which the output
achieves the open circuit condition and is not
referenced to V
OH
or V
OL
.
18. These parameters are referenced to CAS# leading
edge in EARLY WRITE cycles and WE# leading edge
in LATE WRITE or READ-MODIFY-WRITE cycles.
19. If OE# is tied permanently LOW, LATE WRITE or
READ-MODIFY-WRITE operations are not permis-
sible and should not be attempted. Additionally, with
EDO, WE# must be pulsed during CAS# HIGH time
in order to place I/O buffers in High-Z.
20. A HIDDEN REFRESH may also be performed after
a WRITE cycle. In this case, WE# = LOW and
OE# = HIGH.
21. The 3ns minimum is a parameter guaranteed by
design.
22. Column address changed once each cycle.
23. 4MB module values will be half of those shown.
24. With the FPM option,
t
OFF is determined by the first
RAS# or CAS# signal to transition HIGH. In compari-
son,
t
OFF on an EDO option is determined by the
latter of the RAS# and CAS# signals to transition
HIGH.
25. Applies to both FPM and EDO operating modes.
26. All other inputs at 0.2V or V
DD
- 0.2V.
27.
t
WCS,
t
RWD,
t
AWD and
t
CWD are not restrictive
operating parameters.
t
WCS applies to EARLY
WRITE cycles.
t
RWD,
t
AWD and
t
CWD apply to
READ-MODIFY-WRITE cycles. If
t
WCS
t
WCS
(MIN), the cycle is an EARLY WRITE cycle and the
data output will remain an open circuit throughout
the entire cycle. If
t
WCS <
t
WCS (MIN) and
t
RWD
t
RWD (MIN),
t
AWD
t
AWD (MIN) and
t
CWD
t
CWD (MIN), the cycle is a READ-MODIFY-WRITE
and the data output will contain data read from the
selected cell. If neither of the above conditions is met,
the state of data-out is indeterminate. OE# held HIGH
and WE# taken LOW after CAS# goes LOW result in
a LATE WRITE (OE#-controlled) cycle.
t
WCS,
t
RWD,
t
CWD and
t
AWD are not applicable in a LATE
WRITE cycle.
28. LATE WRITE and READ-MODIFY-WRITE cycles
must have both
t
OD and
t
OEH met (OE# HIGH
during WRITE cycle) in order to ensure that the
output buffers will be open during the WRITE cycle.
The DQs will provide the previously read data if
CAS# remains LOW and OE# is taken back LOW
after
t
OEH is met. If CAS# goes HIGH prior to OE#
going back LOW, the DQs will remain open.
15
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
NOTES (continued)
29. The SPD EEPROM WRITE cycle time (
t
WRC) is the
time from a valid stop condition of a write sequence
to the end of the EEPROM internal erase/program
cycle. During the WRITE cycle, the EEPROM bus
interface circuit is disabled, SDA remains HIGH due
to pull-up resistor, and the EEPROM does not
respond to its slave address.
30. V
IH
overshoot: V
IH
(MAX) = V
DD
+ 2V for a pulse
width
10ns, and the pulse width cannot be greater
than one third of the cycle rate. V
IL
undershoot: V
IL
(MIN) = -2V for a pulse width
10ns, and the pulse
width cannot be greater than one third of the cycle
rate.
16
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
READ CYCLE
25
,,
,,
,,
,,
,
,,,
,,
,
,,
tRRH
,,
,,,,
,
tCLZ
tCAC
tRAC
tAA
VALID DATA
OPEN
tOFF
tRCH
ROW
tRCS
tASC
tRAH
tRAD
tAR
tCAH
tRCD
tCAS
tRSH
tCSH
tRP
tRC
tRAS
tCRP
tASR
ROW
OPEN
RAS#
V
V
IH
IL
V
V
IH
IL
ADDR
V
V
IH
IL
DQ
V
V
OH
OL
V
V
IH
IL
,,
,,,
,,,
,,,
,
t OD
t OE
OE#
V
V
IH
IL
COLUMN
,,
,,,
,,,
,
WE#
CASL#/CASH#
NOTE 1
tACH
DON'T CARE
UNDEFINED
,,
,
,,,
,,,,
,,
NOTE: 1. For EDO,
t
OFF is referenced from rising edge of RAS# or CAS#, whichever occurs last. For FPM,
t
OFF is referenced from rising edge of RAS# or
CAS#, whichever occurs first.
FAST PAGE MODE AND EDO PAGE MODE
TIMING PARAMETERS
-5*
-6
SYMBOL
MIN
MAX
MIN
MAX
UNITS
t
AA
25
30
ns
t
ACH (EDO)
12
15
ns
t
AR
38
45
ns
t
ASC
0
0
ns
t
ASR
0
0
ns
t
CAC
15
15
ns
t
CAH
8
10
ns
t
CAS (EDO)
8
10,000
10
10,000
ns
t
CAS (FPM)
15
10,000
ns
t
CLZ (EDO)
0
0
ns
t
CLZ (FPM)
3
ns
t
CRP
5
5
ns
t
CSH (EDO)
38
45
ns
t
CSH (FPM)
60
ns
t
OD (EDO)
0
12
0
15
ns
t
OD (FPM)
3
15
ns
t
OE
12
15
ns
-5*
-6
SYMBOL
MIN
MAX
MIN
MAX
UNITS
t
OFF (EDO)
0
12
0
15
ns
t
OFF (FPM)
3
15
ns
t
RAC
50
60
ns
t
RAD (EDO)
9
12
ns
t
RAD (FPM)
15
ns
t
RAH
9
10
ns
t
RAS
50
10,000
60
10,000
ns
t
RC (EDO)
84
104
ns
t
RC (FPM)
110
ns
t
RCD (EDO)
11
14
ns
t
RCD (FPM)
20
ns
t
RCH
0
0
ns
t
RCS
0
0
ns
t
RP
30
40
ns
t
RRH
0
0
ns
t
RSH
13
15
ns
*EDO version only
17
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
EARLY WRITE CYCLE
25
DON'T CARE
UNDEFINED
,,
,
,,
,,,
,,
,,
,,
,,
V
V
IH
IL
,
,
,,
,,,
,,
,,
,,,
,,,
,,
VALID DATA
ROW
COLUMN
ROW
tDS
tWP
tWCH
tWCS
tWCR
tRWL
tCWL
tCAH
tASC
tRAH
tASR
tRAD
tAR
tCAS
tRSH
tCSH
tRCD
tCRP
tRAS
tRC
tRP
V
V
IH
IL
ADDR
V
V
IH
IL
V
V
IH
IL
DQ
V
V
IOH
IOL
V
V
IH
IL
RAS#
OE#
,,
,,,
,,,
,,,
,,,
,,,
,,,
,,,
,,
,
,,
,,,
,,
tDH
WE#
CASL#/CASH#
tACH
,,
,,,
,,
-5*
-6
SYMBOL
MIN
MAX
MIN
MAX
UNITS
t
RAD (EDO)
9
12
ns
t
RAH
9
10
ns
t
RAS
50
10,000
60
10,000
ns
t
RC (FPM)
110
ns
t
RC (EDO)
84
104
ns
t
RCD (FPM)
20
ns
t
RCD (EDO)
11
14
ns
t
RP
30
40
ns
t
RSH
13
15
ns
t
RWL
13
15
ns
t
WCH
8
10
ns
t
WCR
38
45
ns
t
WCS
0
0
ns
t
WP (FPM)
10
ns
t
WP (EDO)
5
5
ns
FAST PAGE MODE AND EDO PAGE MODE
TIMING PARAMETERS
-5*
-6
SYMBOL
MIN
MAX
MIN
MAX
UNITS
t
ACH (EDO)
12
15
ns
t
AR
38
45
ns
t
ASC
0
0
ns
t
ASR
0
0
ns
t
CAH
8
10
ns
t
CAS (FPM)
15
10,000
ns
t
CAS (EDO)
8
10,000
10
10,000
ns
t
CRP
5
5
ns
t
CSH (FPM)
60
ns
t
CSH (EDO)
38
45
ns
t
CWL (FPM)
15
ns
t
CWL (EDO)
8
10
ns
t
DH
8
10
ns
t
DS
0
0
ns
t
RAD (FPM)
15
ns
*EDO version only
18
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
FAST PAGE MODE
TIMING PARAMETERS
-6
SYMBOL
MIN
MAX
UNITS
t
AA
30
ns
t
AR
45
ns
t
ASC
0
ns
t
ASR
0
ns
t
CAC
15
ns
t
CAH
10
ns
t
CAS
15
10,000
ns
t
CLZ
3
ns
t
CP
10
ns
t
CPA
35
ns
t
CRP
5
ns
t
CSH
60
ns
t
OD
3
15
ns
,
,,
,,
,
,
,,,
,,
,,
,,
,,
,,
,,
,,,
,,
,,,,
,,,
,
,
,,,
,,
,
,
VALID
DATA
,,
,,
VALID
DATA
,
,
VALID
DATA
,,
,
,
,,
,
,
,,
,,,
,,
COLUMN
COLUMN
COLUMN
ROW
ROW
DON'T CARE
UNDEFINED
,
,
,
tRCS
tCAH
tASC
tCP
tRSH
tCP
tCP
tCAS
tRCD
tCRP
tPC
tCSH
tRASP
tRP
tCAH
tASC
tCAH
tASC
tAR
tRAH
tRAD
tASR
tRCS
tRCH
tRCH
tRCS
tRRH
tRCH
tOFF
tCAC
tCPA
tAA
tCLZ
tOFF
tCAC
tCPA
tAA
tCLZ
tOFF
tCAC
tRAC
tAA
tCLZ
tOE
tOD
tOE
tOD
tOE
tOD
OPEN
OPEN
V
V
IH
IL
V
V
IH
IL
ADDR
V
V
IH
IL
V
V
IH
IL
DQ
V
V
IOH
IOL
V
V
IH
IL
RAS#
OE#
tCAS
tCAS
WE#
CASL#/CASH#
FAST-PAGE-MODE READ CYCLE
-6
SYMBOL
MIN
MAX
UNITS
t
OE
15
ns
t
OFF
3
15
ns
t
PC
35
ns
t
RAC
60
ns
t
RAD
15
ns
t
RAH
10
ns
t
RASP
60
125,000
ns
t
RCD
20
ns
t
RCH
0
ns
t
RCS
0
ns
t
RP
40
ns
t
RRH
0
ns
t
RSH
15
ns
19
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
EDO-PAGE-MODE READ CYCLE
WE#
ACH
,,
,
,,,
,,,
,,
,,
,,
,
,
VALID
DATA
,,
,,
VALID
DATA
,
,
VALID
DATA
,,
,,
,,
,
,
,,
,,
,,
,,
,,,
,
COLUMN
COLUMN
COLUMN
ROW
ROW
DON'T CARE
UNDEFINED
,
,
,
tOD
tCAH
tASC
tCP
tRSH
tCP
tCP
tCAS
tRCD
tCRP
tPC
tCSH
tRASP
tRP
tCAH
tASC
tCAH
tASC
tRAD
t
AR
tRAH
tRAD
tASR
tRCS
tRRH
tRCH
tOFF
tCAC
tCPA
tAA
tCLZ
tCAC
tCPA
tAA
tCAC
tRAC
tAA
tCLZ
tOE
tOD
tOE
tOD
OPEN
OPEN
V
V
IH
IL
V
V
IH
IL
ADDR
V
V
IH
IL
V
V
IH
IL
DQ
V
V
OH
OL
V
V
IH
IL
RAS#
OE#
CASL#/CASH#
tCOH
tOEP
tOEHC
tOES
tOES
tCAS
tCAS
t
ACH
t
ACH
t
,
,,,
,,
EDO PAGE MODE
TIMING PARAMETERS
-5
-6
SYMBOL
MIN
MAX
MIN
MAX
UNITS
t
AA
25
30
ns
t
ACH
12
15
ns
t
AR
38
45
ns
t
ASC
0
0
ns
t
ASR
0
0
ns
t
CAC
15
15
ns
t
CAH
8
10
ns
t
CAS
8
10,000
10
10,000
ns
t
CLZ
0
0
ns
t
COH
3
3
ns
t
CP
8
10
ns
t
CPA
28
35
ns
t
CRP
5
5
ns
t
CSH
38
45
ns
t
OD
0
12
0
15
ns
t
OE
12
15
ns
t
OEHC
5
10
ns
t
OEP
5
5
ns
t
OES
4
5
ns
t
OFF
0
12
0
15
ns
t
PC
20
25
ns
t
RAC
50
60
ns
t
RAD
9
12
ns
t
RAH
9
10
ns
t
RASP
50
125,000
60
125,000
ns
t
RCD
11
14
ns
t
RCH
0
0
ns
t
RCS
0
0
ns
t
RP
30
40
ns
t
RRH
0
0
ns
t
RSH
13
15
ns
-5
-6
SYMBOL
MIN
MAX
MIN
MAX
UNITS
20
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
FAST/EDO-PAGE-MODE EARLY WRITE CYCLE
25
,,
,,,
,,
,
,,
,,
,,
,,,
,,
,
,
,,
,
,,
,,,
,,,
,
,,
,
,
,,,
,,,
tDS
tDH
tDS
tDH
tDS
tDH
tWCR
VALID DATA
VALID DATA
VALID DATA
tRWL
tWP
tCWL
tWCH
tWCS
tWP
tCWL
tWCH
tWCS
tWP
tCWL
tWCH
tWCS
tCAH
tASC
tCAH
tASC
tCAH
tASC
tRAH
tASR
tRAD
tAR
COLUMN
COLUMN
COLUMN
ROW
ROW
tCP
tRSH
tCP
tCP
tCAS
tRCD
tCRP
tPC
tCSH
tRASP
tRP
V
V
IH
IL
CASL#/CASH#
V
V
IH
IL
ADDR
V
V
IH
IL
WE#
V
V
IH
IL
DQ
V
V
IOH
IOL
RAS#
OE#
V
V
IH
IL
,
,,,
,,,,
,,,
,,,
,,,,
,,,,
,,,
,
DON'T CARE
UNDEFINED
,
,
t
tACH
tACH
tCAS
tCAS
,,
,,,
,,
ACH
-5*
-6
SYMBOL
MIN
MAX
MIN
MAX
UNITS
t
PC (FPM)
35
ns
t
RAD (EDO)
9
12
ns
t
RAD (FPM)
15
ns
t
RAH
9
10
ns
t
RASP
50
125,000
60
125,000
ns
t
RCD (EDO)
11
14
ns
t
RCD (FPM)
20
ns
t
RP
30
40
ns
t
RSH
13
15
ns
t
RWL
13
15
ns
t
WCH
8
10
ns
t
WCR
38
45
ns
t
WCS
0
0
ns
t
WP (EDO)
5
5
ns
t
WP (FPM)
10
ns
FAST PAGE MODE AND EDO PAGE MODE
TIMING PARAMETERS
-5*
-6
SYMBOL
MIN
MAX
MIN
MAX
UNITS
t
ACH (EDO)
12
15
ns
t
AR
38
45
ns
t
ASC
0
0
ns
t
ASR
0
0
ns
t
CAH
8
10
ns
t
CAS (EDO)
8
10,000
10
10,000
ns
t
CAS (FPM)
15
10,000
ns
t
CP
8
10
ns
t
CRP
5
5
ns
t
CSH (EDO)
38
45
ns
t
CSH (FPM)
60
ns
t
CWL (EDO)
8
10
ns
t
CWL (FPM)
15
ns
t
DH
8
10
ns
t
DS
0
0
ns
t
PC (EDO)
20
25
ns
*EDO version only
21
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
READ-WRITE CYCLE
25
(LATE WRITE and READ-MODIFY-WRITE cycles)
,,,
,,,
,
,
,
VALID D
OUT
VALID D
IN
,,
,,
,,
,,
ROW
,,,
,,,
,,
COLUMN
ROW
,,
,,,
,,,
,,,,
,
V
V
IH
IL
V
V
IH
IL
ADDR
V
V
IH
IL
V
V
IH
IL
DQ
V
V
IOH
IOL
V
V
IH
IL
RAS#
OPEN
OPEN
tOE
tOD
tCAC
tRAC
tAA
tCLZ
tDS
tDH
tAWD
tWP
tRWL
tCWL
tCWD
tRWD
tRCS
tASC
tCAH
tAR
tASR
tRAD
tCRP
tRCD
tCAS
tRSH
tCSH
tRAS
tRWC
tRP
tRAH
OE#
tOEH
,
,,,
,,,
WE#
tACH
CAS#
,,
,
,
DON'T CARE
UNDEFINED
,,
,,,,
,,
t
OD (FPM)
3
15
ns
t
OE
12
15
ns
t
OEH (EDO)
8
10
ns
t
OEH (FPM)
15
ns
t
RAC
50
60
ns
t
RAD (EDO)
9
12
ns
t
RAD (FPM)
15
ns
t
RAH
9
10
ns
t
RAS
50
10,000
60
10,000
ns
t
RCD (EDO)
11
14
ns
t
RCD (FPM)
20
ns
t
RCS
0
0
ns
t
RP
30
40
ns
t
RSH
13
15
ns
t
RWC (EDO)
116
140
ns
t
RWC (FPM)
155
ns
t
RWD (EDO)
67
79
ns
t
RWD (FPM)
85
ns
t
RWL
13
15
ns
t
WP (EDO)
5
5
ns
t
WP (FPM)
10
ns
FAST PAGE MODE AND EDO PAGE MODE
TIMING PARAMETERS
-5*
-6
SYMBOL
MIN
MAX
MIN
MAX
UNITS
t
AA
25
30
ns
t
ACH (EDO)
12
15
ns
t
AR
38
45
ns
t
ASC
0
0
ns
t
ASR
0
0
ns
t
AWD
42
49
ns
t
CAC
15
15
ns
t
CAH
8
10
ns
t
CAS (EDO)
8
10,000
10
10,000
ns
t
CAS (FPM)
15
10,000
ns
t
CLZ (EDO)
0
0
ns
t
CLZ (FPM)
3
ns
t
CRP
5
5
ns
t
CSH (EDO)
38
45
ns
t
CSH (FPM)
60
ns
t
CWD (EDO)
28
35
ns
t
CWD (FPM)
40
ns
t
CWL (EDO)
8
10
ns
t
CWL (FPM)
15
ns
t
DH
8
10
ns
t
DS
0
0
ns
t
OD (EDO)
0
12
0
15
ns
-5*
-6
SYMBOL
MIN
MAX
MIN
MAX
UNITS
*EDO version only
22
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
FAST/EDO-PAGE-MODE READ-WRITE CYCLE
25
(LATE WRITE and READ-MODIFY-WRITE cycles)
,,,
,,,
,,
,,
,,
,
,
,,
,
,,
,,,
,,
,
,,
,,
,,
DON'T CARE
UNDEFINED
,
,
,
,,,
,
t
t
OD
tOE
tOD
tOE
tOD
tOE
OPEN
D OUT
VALID
D IN
VALID
D OUT
VALID
D IN
VALID
D OUT
VALID
D IN
VALID
OPEN
tDH
tDS
tAA
tCPA
tCLZ
tCAC
tDH
tDS
tAA
tCPA
tCLZ
tCAC
tDH
tDS
tAA
tCLZ
tCAC
tRAC
tWP
tCWL
tRWL
tCWD
tAWD
tWP
tCWL
tCWD
tAWD
tWP
tCWL
tCWD
tAWD
tRCS
tRWD
tASR
tRAH
tASC
tRAD
tAR
tCAH
tASC
tCAH
tASC
tCAH
tCP
tRSH
tCP
tRP
tRASP
tCP
tRCD
tCSH
t PC
tCRP
ROW
COLUMN
COLUMN
COLUMN
ROW
V
V
IH
IL
V
V
IH
IL
ADDR
V
V
IH
IL
V
V
IH
IL
DQ
V
V
IOH
IOL
V
V
IH
IL
RAS#
OE#
tPRWC
OEH
,,,
,
tCAS
tCAS
tCAS
WE#
CASL#/CASH#
NOTE 1
,
,,,
,,,
NOTE: 1.
t
PC is for LATE WRITE cycles only.
*EDO version only
t
OD (FPM)
3
15
ns
t
OE
12
15
ns
t
OEH (EDO)
8
10
ns
t
OEH (FPM)
15
ns
t
PC (EDO)
20
25
ns
t
PC (FPM)
35
ns
t
PRWC (EDO)
47
56
ns
t
PRWC (FPM)
85
ns
t
RAC
50
60
ns
t
RAD (EDO)
9
12
ns
t
RAD (FPM)
15
ns
t
RAH
9
10
ns
t
RASP
50
125,000
60
125,000
ns
t
RCD (EDO)
11
14
ns
t
RCD (FPM)
20
ns
t
RCS
0
0
ns
t
RP
30
40
ns
t
RSH
13
15
ns
t
RWD (EDO)
67
79
ns
t
RWD (FPM)
85
ns
t
RWL
13
15
ns
t
WP (EDO)
5
5
ns
t
WP (FPM)
10
ns
FAST PAGE MODE AND EDO PAGE MODE
TIMING PARAMETERS
-5*
-6
SYMBOL
MIN
MAX
MIN
MAX
UNITS
t
AA
25
30
ns
t
AR
38
45
ns
t
ASC
0
0
ns
t
ASR
0
0
ns
t
AWD
42
49
ns
t
CAC
15
15
ns
t
CAH
8
10
ns
t
CAS (EDO)
8
10,000
10
10,000
ns
t
CAS (FPM)
15
10,000
ns
t
CLZ (EDO)
0
0
ns
t
CLZ (FPM)
3
ns
t
CP
8
10
ns
t
CPA
28
35
ns
t
CRP
5
5
ns
t
CSH (EDO)
38
45
ns
t
CSH (FPM)
60
ns
t
CWD (EDO)
28
35
ns
t
CWD (FPM)
40
ns
t
CWL (EDO)
8
10
ns
t
CWL (FPM)
15
ns
t
DH
8
10
ns
t
DS
0
0
ns
t
OD (EDO)
0
12
0
15
ns
-5*
-6
SYMBOL
MIN
MAX
MIN
MAX
UNITS
23
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
V
V
IH
IL
V
V
IH
IL
RAS#
V
V
IH
IL
ADDR
V
V
IH
IL
WE#
,,
t RASP
t RP
ROW
,,
COLUMN (A)
,,
,,
COLUMN (N)
,
,,
ROW
V
V
IH
IL
OE#
V
V
IOH
IOL
tCRP
t CSH
t CAS
t RCD
tASR
t RAH
tRAD
t ASC
tAR
t CAH
t ASC
t CAH
t ASC
t CAH
t CP
t RSH
VALID D
IN
,,,
,,,
,,
,
,,
,
t RCS
t RCH
t WCS
tOE
VALID
D
OUT
VALID D
OUT
t WHZ
tCAC
tCPA
tAA
tCAC
tAA
OPEN
DQ
tPC
RAC
t
tCOH
t WCH
t DS
t DH
tPC
COLUMN (B)
t ACH
CASL#/CASH#
t CAS
t CAS
t CP
t CP
DON'T CARE
UNDEFINED
,,
,
,,
,,,
,
EDO-PAGE-MODE READ EARLY WRITE CYCLE
(Pseudo READ-MODIFY-WRITE)
t
OE
12
15
ns
t
PC
20
25
ns
t
RAC
50
60
ns
t
RAD
9
12
ns
t
RAH
9
10
ns
t
RASP
50
125,000
60
125,000
ns
t
RCD
11
14
ns
t
RCH
0
0
ns
t
RCS
0
0
ns
t
RP
30
40
ns
t
RSH
13
15
ns
t
WCH
8
10
ns
t
WCS
0
0
ns
t
WHZ
0
12
0
15
ns
-5
-6
SYMBOL
MIN
MAX
MIN
MAX
UNITS
EDO PAGE MODE
TIMING PARAMETERS
-5
-6
SYMBOL
MIN
MAX
MIN
MAX
UNITS
t
AA
25
30
ns
t
ACH
12
15
ns
t
AR
38
45
ns
t
ASC
0
0
ns
t
ASR
0
0
ns
t
CAC
15
15
ns
t
CAH
8
10
ns
t
CAS
8
10,000
10
10,000
ns
t
COH
3
3
ns
t
CP
8
10
ns
t
CPA
28
35
ns
t
CRP
5
5
ns
t
CSH
38
45
ns
t
DH
8
10
ns
t
DS
0
0
ns
24
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
,,
,,
ROW
VALID
DATA
,
,
VALID DATA
,
,,,
,,
OPEN
tCRP
tRCD
tCAS
tRSH
tRASP
tRP
tPC
tASC
tCAH
tAR
tASR
tRAD
tRAH
tWCS
tWP
tRWL
tRCS
tDH
tDS
tCAC
t OFF
V
V
IH
IL
CASL#/CASH#
V
V
IH
IL
ADDR
V
V
IH
IL
RAS#
Q
V
V
OH
OL
WE#
V
V
IH
IL
,
,,,
,,,
tCSH
,
,,
,,,
,,
COLUMN
tCP
tCP
tASC
tCAH
tCWL
tWCH
t CLZ
tAA
RAC
DON'T CARE
UNDEFINED
,
,
,
t
NOTE 1
,,
,,
OE#
V
V
IH
IL
ROW
COLUMN
tCAS
FAST-PAGE-MODE READ EARLY WRITE CYCLE
(Pseudo READ-MODIFY-WRITE)
NOTE: 1. Do not drive data prior to tristate.
-6
SYMBOL
MIN
MAX
UNITS
t
OFF
3
15
ns
t
PC
35
ns
t
RAC
60
ns
t
RAD
15
ns
t
RAH
10
ns
t
RASP
60
125,000
ns
t
RCD
20
ns
t
RCS
0
ns
t
RP
40
ns
t
RSH
15
ns
t
RWL
15
ns
t
WCH
10
ns
t
WCS
0
ns
t
WP
10
ns
FAST PAGE MODE
TIMING PARAMETERS
-6
SYMBOL
MIN
MAX
UNITS
t
AA
30
ns
t
AR
45
ns
t
ASC
0
ns
t
ASR
0
ns
t
CAC
15
ns
t
CAH
10
ns
t
CAS
15
10,000
ns
t
CLZ
3
ns
t
CP
10
ns
t
CRP
5
ns
t
CSH
60
ns
t
CWL
15
ns
t
DH
10
ns
t
DS
0
ns
25
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
EDO READ CYCLE
(with WE#-controlled disable)
-5
-6
SYMBOL
MIN
MAX
MIN
MAX
UNITS
t
OD
0
12
0
15
ns
t
OE
12
15
ns
t
RAC
50
60
ns
t
RAD
9
12
ns
t
RAH
9
10
ns
t
RCD
11
14
ns
t
RCH
0
0
ns
t
RCS
0
0
ns
t
WHZ
0
12
0
15
ns
t
WPZ
10
10
ns
EDO PAGE MODE
TIMING PARAMETERS
-5
-6
SYMBOL
MIN
MAX
MIN
MAX
UNITS
t
AA
25
30
ns
t
AR
38
45
ns
t
ASC
0
0
ns
t
ASR
0
0
ns
t
CAC
15
15
ns
t
CAH
8
10
ns
t
CAS
8
10,000
10
10,000
ns
t
CLZ
0
0
ns
t
CP
8
10
ns
t
CRP
5
5
ns
t
CSH
38
45
ns
,,
,,,,
,,,
,,
,,
,
,
,
,,,
,,
tCLZ
tCAC
tRAC
tAA
VALID DATA
OPEN
tRCH
tRCS
tASC
tRAH
tRAD
tAR
tCAH
tRCD
tCAS
tCSH
tCRP
tASR
ROW
OPEN
RAS#
V
V
IH
IL
V
V
IH
IL
ADDR
V
V
IH
IL
DQ
V
V
OH
OL
V
V
IH
IL
,,
,,,,
,,,
,,
t OD
t OE
OE#
V
V
IH
IL
COLUMN
,,,
,,,,
,,
WE#
tWHZ
tWPZ
tCP
tASC
tRCS
COLUMN
,
tCLZ
CASL#/CASH#
DON'T CARE
UNDEFINED
,,
,
26
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
t
RC (FPM)
110
ns
t
RC (EDO)
84
104
ns
t
RP
30
40
ns
t
RPC (FPM)
0
ns
t
RPC (EDO)
5
5
ns
t
WRH
8
10
ns
t
WRP
8
10
ns
RAS#-ONLY REFRESH CYCLE
25
,,,
,,,,
,,,
,
,,
,
ROW
V
V
IH
IL
CAS#
V
V
IH
IL
ADDR
V
V
IH
IL
RAS#
tRC
tRAS
tRP
tCRP
tASR
tRAH
ROW
OPEN
DQ
V
V
OH
OL
tRPC
WE#
V
V
IH
IL
,
,,,
,,,,
,,,
,,,,
,,,,
,,,,
,,
-5*
-6
SYMBOL
MIN
MAX
MIN
MAX
UNITS
FAST PAGE MODE AND EDO PAGE MODE
TIMING PARAMETERS
-5*
-6
SYMBOL
MIN
MAX
MIN
MAX
UNITS
t
ASR
0
0
ns
t
CHR
8
10
ns
t
CP
8
10
ns
t
CRP
5
5
ns
t
CSR
5
5
ns
t
RAH
9
10
ns
t
RAS
50
10,000
60
10,000
ns
*EDO version only
CBR REFRESH CYCLE
25
(Addresses = DON'T CARE)
tRP
V
V
IH
IL
RAS#
tRAS
OPEN
tCHR
tCSR
V
V
IH
IL
V
V
OH
OL
CAS#
DQ
tRP
tRAS
tRPC
tCSR
tRPC
tCHR
tCP
V
V
IH
IL
tWRP
tWRH
,
,,,
,,,
,
,,
,,,
,,
,,,
,,
WE#
tWRP
tWRH
DON'T CARE
UNDEFINED
,,
,,
,
27
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
HIDDEN REFRESH CYCLE
20, 25
(WE# = HIGH)
,,
,,,
,
,,
DON'T CARE
UNDEFINED
,
,
,
tCLZ
tOFF
,,
,,,
,,,
,,,
,,,
,,
,,
,,
,
,
OPEN
VALID DATA
OPEN
COLUMN
ROW
tCAC
tRAC
tAA
tCAH
tASC
tRAH
tASR
tRAD
tAR
tCRP
tRCD
tRSH
tRAS
tRC
tRP
tCHR
tRAS
DQx
V
V
IOH
IOL
V
V
IH
IL
ADDR
V
V
IH
IL
V
V
IH
IL
RAS#
,,
,,,,
,,,,
,,
V
V
IH
IL
tOE
tOD
OE#
tORD
CASL#/CASH#
-5*
-6
SYMBOL
MIN
MAX
MIN
MAX
UNITS
t
OFF (EDO)
0
12
0
15
ns
t
ORD
0
0
ns
t
RAC
50
60
ns
t
RAD (FPM)
15
ns
t
RAD (EDO)
9
12
ns
t
RAH
9
10
ns
t
RAS
50
10,000
60
10,000
ns
t
RC (FPM)
110
ns
t
RC (EDO)
84
104
ns
t
RCD (FPM)
20
ns
t
RCD (EDO)
11
14
ns
t
RP
30
40
ns
t
RSH
13
15
ns
FAST PAGE MODE AND EDO PAGE MODE
TIMING PARAMETERS
-5*
-6
SYMBOL
MIN
MAX
MIN
MAX
UNITS
t
AA
25
30
ns
t
AR
38
45
ns
t
ASC
0
0
ns
t
ASR
0
0
ns
t
CAC
15
15
ns
t
CAH
8
10
ns
t
CHR
8
10
ns
t
CLZ (FPM)
3
ns
t
CLZ (EDO)
0
0
ns
t
CRP
5
5
ns
t
OD (FPM)
3
15
ns
t
OD (EDO)
0
12
0
15
ns
t
OE
12
15
ns
t
OFF (FPM)
3
15
ns
*EDO version only
28
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
,,,,,,
SCL
SDA IN
SDA OUT
tLOW
t SU:STA
t HD:STA
tF
tHIGH
tR
tBUF
tDH
tAA
t SU:STO
t SU:DAT
t HD:DAT
UNDEFINED
,
SPD EEPROM
SYMBOL
MIN
MAX
UNITS
t
HIGH
4
s
t
LOW
4.7
s
t
R
1
s
t
SU:DAT
250
ns
t
SU:STA
4.7
s
t
SU:STO
4.7
s
SERIAL PRESENCE-DETECT EEPROM
TIMING PARAMETERS
SYMBOL
MIN
MAX
UNITS
t
AA
0.3
3.5
s
t
BUF
4.7
s
t
DH
300
ns
t
F
300
ns
t
HD:DAT
0
s
t
HD:STA
4
s
29
1, 2 Meg x 32 DRAM DIMMs
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DM81.p65 Rev. 6/98
1998, Micron Technology, Inc.
1, 2 MEG x 32
DRAM DIMMs
OBSOLETE
.350 (8.89)
MAX
.054 (1.37)
.046 (1.17)
.700 (17.78)
TYP
.118 (3.00)
(2X)
.118 (3.00) TYP
.079 (2.00) R
(2X)
PIN 1
.250 (6.35) TYP
.050 (1.27)
TYP
.118 (3.00)
TYP
.039 (1.00)
TYP
.039 (1.00) R(2X)
PIN 50
2.850 (72.39)
1.005 (25.53)
.995 (25.27)
3.557 (90.34)
3.545 (90.04)
.128 (3.25)
.118 (3.00)
(2X)
NOTE:
1. All dimensions in inches (millimeters)
MAX
or typical where noted.
MIN
100-PIN DIMM
DF-1 (4MB)
100-PIN DIMM
DF-2 (8MB)
.200 (5.08)
MAX
.054 (1.37)
.046 (1.17)
1.005 (25.53)
.995 (25.27)
.700 (17.78)
TYP
.118 (3.00)
(2X)
.118 (3.00) TYP
.079 (2.00) R
(2X)
3.557 (90.34)
3.545 (90.04)
PIN 1
.250 (6.35) TYP
.050 (1.27)
TYP
.118 (3.00)
TYP
.039 (1.00)
TYP
.039 (1.00) R(2X)
PIN 50
2.850 (72.39)
.128 (3.25)
.118 (3.00)
(2X)