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Электронный компонент: MT90826

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1
Features
4,096
4,096 channel non-blocking switching
at 8.192 or 16.384 Mb/s
Per-channel variable or constant throughput
delay
Accept ST-BUS streams of 2.048Mb/s,
4.096Mb/s, 8.192Mb/s, or 16.384 Mb/s
Split Rate mode allows mix of two bit rates and
rate conversions
Automatic frame offset delay measurement for
ST-BUS input and output streams
Per-stream frame delay offset programming
Per-channel high impedance output control
Bit Error Monitoring on selected ST-BUS input
and output channels.
Per-channel message mode
Connection memory block programming
IEEE-1149.1 (JTAG) Test Port
3.3V local I/O with 5V tolerant inputs and TTL
compatible outputs
Applications
Medium and large switching platforms
CTI application
Voice/data multiplexer
Digital cross connects
WAN access system
Wireless base stations
Description
The MT90826 Quad Digital Switch has a non-
blocking switch capacity of 4,096 x 4,096 channels at
a serial bit rate of 8.192Mb/s or 16.384 Mb/s, 2,048 x
2,048 channels at 4.096Mb/s and 1024 x 1024
channels at 2.048Mb/s. The device has many
features that are programmable on a per stream or
per channel basis, including message mode, input
offset delay and high impedance output control.
The per stream input and output delay control is
particularly useful for managing large multi-chip
switches with a distributed backplane.
Operating in Split Rate mode allows for switching
between two groups of bit rate streams.
Figure 1 - Functional Block Diagram
Test Port
STo0
STo1


STo31
STi0/FEi0
STi1/FEi1


STi31/FEi31
Parallel
to
Serial
Converter
Output
MUX
Microprocessor Interface
Timing
Unit
Internal
Registers
F0i
DS
CS
R/W
A13-A0
DTA
D15-D0
ODE
V
SS
Connection
Memory
CLK
V
DD
TDI
TDO
IC1
RESET
TCK
TRST
Serial
to
Parallel
Converter
TMS
Multiple Buffer
Data Memory
IC3
PLLV
SS
PLLV
DD
DT1 AT1
IC2
DS5197
ISSUE 2
June 1999
Ordering Information
MT90826AL
160 Pin MQFP
MT90826AG
160 Pin PBGA
-40 to +85 C
MT90826
Quad Digital Switch
Advanced Information
MT90826
CMOS
Advanced Information
2
Figure 2 - 160-Pin MQFP Pin Connections
STo16
STo17
STo18
STo19
STo20
STo21
STo22
STo23
ODE
STo24
STo25
STo26
STi0/FEi0
STi1/FEi1
STi2/FEi2
STi3/FEi3
STi4/FEi4
STi5/FEi5
STi6/FEi6
STi7/FEi7
STi8/FEi8
STi9/FEi9
STi10/FEi10
STi12/FEi12
A3
TCK
TDO
A8
A9
A10
A11
A12
A13
A2
STo27
STo28
STo29
STo30
STo31
STi11/FEi11
STi15/FEi15
STi14/FEi14
STi13/FEi13
TDI
D1
D3
D4
D5
D6
D7
D9
D10
D11
D12
D13
DT
A
TRST
D2
D0
IC1
TMS
160 Pin MQFP
RESET
103
109
111
113
95
97
99
101
117
91
115
93
89
107
105
119
135
141
143
145
127
129
131
133
149
123
147
125
121
139
137
151
57
55
53
51
49
65
67
63
61
59
47
45
43
69
71
41
17
15
13
11
9
25
27
23
21
19
7
5
3
29
31
1
STi16/FEi16
STi17/FEi17
STi18/FEi18
STi19/FEi19
STi20/FEi20
VSS
STi21/FEi21
STi22/FEi22
STi23/FEi23
STi24/FEi24
STi25/FEi25
STI26/FEi26
STi27/FEi27
STi28/FEi28
STi29/FEi29
STi31/FEi31
VSS
VDD
CLK
VSS
STo13
STo12
STo7
STo6
STo5
STo4
STo3
VDD
VSS
D8
A4
IC2
STo8
STo15
STo14
STo9
87
83
85
81
STo10
33
35
37
39
CS
R/
W
DS
A0
A1
153
157
155
159
STo11
D14
D15
73
75
77
79
F0i
PLLGND
DT1
IC3
VDD
VSS
VDD
VSS
VSS
NC
AT1
PLLVDD
VDD
VDD
VSS
VSS
VSS
VSS
VSS
VDD
VSS
VDD
VSS
VSS
VDD
VSS
VDD
VDD
VSS
VDD
VSS
STi30/FEi30
STo2
VSS
STo0
STo1
XTM2
NC
VSS
VDD
NC
VSS
XTM1
NC
NC
A7
A6
A5
NC
VSS
NC
NC
NC
28mm x 28mm
Pin Pitch 0.65mm
Advanced Information
CMOS
MT90826
3
Figure 3 - 160-Pin PBGA Pin Connections
Pin Description
Pin # MQFP
Pin # PBGA
Name
Description
12,22,33,54,
66,77,90,101,
112,125,136,
147,157
D5,D6,D7,D8,D9,
E4,E10,F4,
F10,G4,G10,
H4,J4,J10,K5,
K6,K7
V
DD
+3.3 Volt Power Supply
11,21,32,45,
53,60,65,71,
76,84,89,95,
100,106,111,
117,124,130,
135,141,146,
156
D4,D10,E5,E6,E7
,
E8,E9,F5,F9,G5,
G9,H5,H9,H10,J5
,
J6,J7,J8,J9,K4
V
ss
Ground
B
C
D
E
F
G
H
J
K
L
M
N
1
2
3
4
5
6
7
8
9
10
11
12
13
1
1 - A1 corner is identified by metallized markings.
A
STo22
STo24
STo27
STi29
NC
STi31
STo30
STo31
D2
D4
D5
D6
D10
D13
D11
D14
D12
NC
D15
NC
R/W
NC
A1
DS
A2
A4
A5
A6
TMS
A12
A13
TDO
TCK
IC1
RESET
IC2
IC3
CLK
F0i
ODE
AT1
DT1
STi0
STi1
STi2
STi6
STi7
STo4
STo2
STo5
STo6
STo3
STo7
STi12
STi15
STo16
NC
A9
PLLGND
STi13
D7
A10
PLLVDD
STo0
STi14
D0
VDD
VDD
VDD
VDD
VDD
GND
GND
XTM1
NC
VDD
VDD
VDD
GND
XTM2
GND
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
GND
GND
GND
GND
GND
STi26
STi24 STo20
STi22 STi20
STi18
STi16
STo15
ST013
STo10 STo8
STi10
STi9
STi27
STi25
STo21
STi23
STi21
STi19 STi17
STo14
STo12
STo11
STo9 STi11
STi8
STo26 STo25
STo23
STo19
STo18 STo17
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
STi28
NC
STi30
STi3
STo1
STi4
STi5
STo28
STo29
D1
D3
D9
D8
DTA
CS
A0
A3
A8
A7
A11
TDI
TRST
23mm x 23mm
TOP VIEW
Ball Pitch 1.5mm
MT90826
CMOS
Advanced Information
4
34
N11
TMS
Test Mode Select (3.3V Input with Internal pull-up):
JTAG signal that controls the state transitions of the TAP
controller. This pin is pulled high by an internal pull-up
when not driven.
35
M11
TDI
Test Serial Data In (3.3V Input with Internal pull-up):
JTAG serial test instructions and data are shifted in on
this pin. This pin is pulled high by an internal pull-up when
not driven.
36
N12
TDO
Test Serial Data Out (3.3V Output): JTAG serial data is
output on this pin on the falling edge of TCK. This pin is
held in high impedance state when JTAG scan is not
enabled.
37
N13
TCK
Test Clock (5V Tolerant Input): Provides the clock to the
JTAG test logic.
38
M12
TRST
Test Reset (3.3V Input with internal pull-up):
Asynchronously initializes the JTAG TAP controller by
putting it in the Test-Logic-Reset state. This pin is pulled
by an internal pull-up when not driven. This pin should be
pulsed low on power-up, or held low, to ensure that the
device is in the normal functional mode.
40
K11
XTM1
PLL Test Access 1 (3.3V Input): Use for PLL testing
only. No connect for normal operation.
41
J11
XTM2
PLL Test Access 1 (3.3V Input): Use for PLL testing
only. No connect for normal operation.
42
L11
IC1
Internal Connection 1 (3.3V Input with internal pull-
down):
Connect to V
SS
for normal operation.
43
M13
RESET
Device Reset (5V Tolerant Input): This input (active
LOW) puts the device in its reset state which clears the
device internal counters and registers.
44
L12
IC2
Internal Connection 2 (3.3V Input with internal pull-
down):
Connect to V
SS
for normal operation.
When IC3 pin is tied to 3.3V, this pin is used as the PLL
bypass clock input for PLL testing only.
46
L13
IC3
Internal Connection 3 (3.3V Input with internal pull-
down):
Connect to V
SS
for normal operation.
When this pin is tied to 3.3V, it enables the PLL bypass
mode for PLL testing only.
47
K12
F0i
Master Frame Pulse (5V Tolerant Input): This input
accepts a 60ns wide negative frame pulse.
48
J12
AT1
Analog Test Access (Bidirectional): Use for PLL testing
only. No connect for normal operation.
49
H11
DT1
Digital Test Access Output (Output): Use for PLL
testing only. No connect for normal operation.
50
K10
PLLGND
Phase Lock Loop Ground.
51
K9
PLLVDD
Phase Lock Loop Power Supply: 3.3V
Pin Description (continued)
Pin # MQFP
Pin # PBGA
Name
Description
Advanced Information
CMOS
MT90826
5
52
K13
CLK
Master Clock (5V Tolerant Input): Serial clock for
shifting data in/out on the serial streams. This pin accepts
a clock frequency of 8.192MHz or 16.384 MHz. The CPLL
bit in the control register determines the usage of the
clock frequency. See Table 6 for details.
55
J13
ODE
Output Drive Enable (5V Tolerant Input): This is the
output-enable control pin for the STo0 to STo31 serial
outputs. See Table 2 for details.
56
57
58
59
67-70
78,79
82,83
91-94
102-105
113-116
126-129
137-140
H13
H12
G13
G12
F13,F12,E13,E12
B13,A13
A12,B12
C11,C10,C9,C8
A7,B7,A6,B6
A5,B5,A4,B4
A2,B2,A1,B1
E2,F2,E1,F1
STi0/FEi0,
STi1/FEi1
STi2/FEi2
STi3/FEi3
STi4-7/FEi4-7
STi8-9/FEi8-9
STi10-11/FEi10-11
STi12-15/FEi12-15
STi16-19/FEi16-19
STi20-23/FEi20-23
STi24-27/FEi24-27
STi28-31/FEi28-31
Serial Input Streams 0 to 31 and Frame Evaluation
Inputs 0 to 31 (5V Tolerant Inputs):
Serial data input
streams. These streams may have data rates of 2.048,
4.096, 8.192 or 16.384 Mb/s, depending upon the value
programmed at bits DR0 - DR2 in the control register. In
the frame evaluation mode, they are used as the frame
evaluation inputs.
61-64
72-75
85-88
96-99
107-110
118,119
122,123
131-134
142-145
G11,F11,E11,D11
D13,C13,D12,C12
A11,B11,A10,B10
B9,A9,B8,A8
C7,C6,C5,C4
A3,B3
D3,C3
D2,C2,C1,D1
G1,G2,H1,H2
STo0 - 3
STo4 - 7
STo8 - 11
STo12 - 15
STo16 - 19
STo20, STo21
STo22, STo23
STo24 - 27
STo28 - 31
ST-BUS Output 0 to 31 (Three-state Outputs). Serial
data output streams. These streams may have data rates
of 2.048, 4.096, 8.192, or 16.384 Mb/s, depending upon
the value programmed at bits DR0 - DR2 in the control
register.
148-153
154,155
158
3-7
8,9
G3,J1,H3,J2,J3,K1,
K2,K3
L1
L2,M1,M2,M3,N1,
N2,N3
D0 - 5,
D6,D7
D8
D9 - 13
D14,D15
Data Bus 0 -15 (5V Tolerant I/O): These pins form the
16-bit data bus of the microprocessor port.
10
M4
DTA
Data Transfer Acknowledgment (Three-state Output):
This output pulses low from tristate to indicate that a
databus transfer is complete. A pull-up resistor is required
to hold a HIGH level when the pin is tristated.
15
N5
DS
Data Strobe (5V Tolerant Input): This active low input
works in conjunction with CS to enable the read and write
operations.
14
N4
R/W
Read/Write (5V Tolerant Input): This input controls the
direction of the data bus lines (D0-D15) during a
microprocessor access.
13
M5
CS
Chip Select (5V Tolerant Input): Active low input used
by a microprocessor to activate the microprocessor port.
16-20
23-31
M6,N6,N7,M7,N8
N9,N10,M8,M9,L7
L8,M10,L9,A10
A0 - A4
A5-A13
Address 0 - 13 (5V Tolerant Input): These lines provide
the A0 - A13 address lines when accessing the internal
registers or memories.
1,2,39,80,81,120,
121,159,160
E3,F3,K8,
L3,L4,L5,L6
NC
No Connect
Pin Description (continued)
Pin # MQFP
Pin # PBGA
Name
Description
MT90826
CMOS
Advanced Information
6
Serial Interface Mode
Input Stream
Input Data Rate
Output Stream
Output Data Rate
8 Mb/s
STi0-31
8 Mb/s
STo0-31
8 Mb/s
16 Mb/s
STi0-15
16 Mb/s
STo0-15
16 Mb/s
4 Mb/s and 8 Mb/s
STi0-15
4 Mbs/
STo0-15
4 Mb/s
STi15-31
8 Mb/s
STo16-31
8 Mb/s
16 Mb/s and 8 Mb/s
STi0-11
16 Mb/s
STo0-11
16 Mb/s
STi12-19
8 Mb/s
STo12-19
8 Mb/s
4 Mb/s
STi0-31
4 Mb/s
STo0-31
4 Mb/s
2 Mb/s and 4 Mb/s
STi0-15
2 Mb/s
STo0-15
2 Mb/s
STi16-31
4 Mb/s
STo16-31
4 Mb/s
2 Mb/s
STi0-31
2 Mb/s
STo0-31
2 Mb/s
Table 1 - Stream Usage and External Clock Rates
Device Overview
The MT90826 Quad Digital Switch is capable of
switching up to 4,096
4,096 channels. The
MT90826 is designed to switch 64 kbit/s PCM or N x
64k bit/s data. The device maintains frame integrity
in data applications and minimum throughput delay
for voice applications on a per channel basis.
The serial input streams of the MT90826 can have a
bit rate of 2.048, 4.096, 8.192 or 16.384 Mbit/s and
are arranged in 125
s wide frames, which contain
32, 64,128 or 256 channels, respectively. The data
rates on input and output streams match. All inputs
and outputs may be programmed to 2.048, 4.096 or
8.192 Mb/s. STi0-15 and STo0-15 may be set to
16.384 Mb/s. Combinations of two bit rates,
N and
2N are provided. See Table 1.
By using Mitel's message mode capability, the
microprocessor can access input and output
timeslots on a per channel basis. This feature is
useful for transferring control and status information
for external circuits or other ST-BUS devices.
The frame offset calibration function allows users to
measure the frame offset delay for streams STi0 to
STi31. The offset calibration is activated by a frame
evaluation bit in the frame evaluation register. The
evaluation result is stored in the frame evaluation
registers and can be used to program the input offset
delay for individual streams using internal frame
input offset registers.
The microport interface is compatible with Motorola
non-multiplexed buses. Connection memory
locations may be directly written to or read from; data
memory locations may be directly read from. A DTA
signal is provided to hold the bus until the
asynchronous microport operation is queued into the
device. For applications that require no wait states,
indirect reading and writing may be used.
Intermediary registers are directly programmed with
the write data and address, or read address. The
data in the intermediary registers is internally
transferred synchronous with the operation of the
internal state machines. Completion of the operation
is indicated by a status register flag.
Functional Description
A functional Block Diagram of the MT90826 is shown
in Figure 1.
Data and Connection Memory
For all data rates, the received serial data is
converted to parallel format by internal serial-to-
parallel converters and stored sequentially in the
data memory. Depending upon the selected
operation programmed in the control register, the
usable data memory may be as large as 4,096 bytes.
The sequential addressing of the data memory is
performed by an internal counter, which is reset by
the input 8 kHz frame pulse (F0i) to mark the frame
boundaries of the incoming serial data streams.
Data to be output on the serial streams may come
from either the data memory or connection memory.
Advanced Information
CMOS
MT90826
7
Locations in the connection memory are associated
with particular ST-BUS output channels. When a
channel is due to be transmitted on an ST-BUS
output, the data for this channel can be switched
either from an ST-BUS input in connection mode, or
from the lower half of the connection memory in
message mode. Data destined for a particular
channel on a serial output stream is read from the
data memory or connection memory during the
previous channel timeslot. This allows enough time
for memory access and parallel-to-serial conversion.
Connection and Message Modes
In the connection mode, the addresses of the input
source data for all output channels are stored in the
connection memory. The connection memory is
mapped in such a way that each location
corresponds to an output channel on the output
streams. For details on the use of the source
address data (CAB and SAB bits), see Table 18.
Once the source address bits are programmed by
the microprocessor, the contents of the data memory
at the selected address are transferred to the
parallel-to-serial converters and then onto an ST-
BUS output stream.
By having several output channels connected to the
same input source channel, data can be broadcasted
from one input channel to several output channels.
In message mode, the microprocessor writes data to
the connection memory locations corresponding to
the output stream and channel number. The lower
half (8 least significant bits) of the connection
memory content is transferred directly to the parallel-
to-serial converter. This data will be output on the
ST-BUS streams in every frame until the data is
changed by the microprocessor.
The three most significant bits of the connection
memory controls the following for an output channel:
message or connection mode, constant or variable
delay mode, enables/tristate the ST-BUS output
drivers and bit error test pattern enable. If an output
channel is set to a high-impedance state by setting
the OE bit to zero in the connection memory, the ST-
BUS output will be in a high impedance state for the
duration of that channel. In addition to the per-
channel control, all channels on the ST-BUS outputs
can be placed in a high impedance state by pulling
the ODE input pin low and programming the output
stand by (OSB) bit in the control register to low. This
action overrides the individual per-channel
programming by the connection memory bits. See
Table 2 for detail.
The connection memory data can be accessed via
the microprocessor interface through the D0 to D15
pins. The addressing of the device internal registers,
data and connection memories is performed through
the address input pins and the Memory Select (MS)
bit of the control register.
Clock Timing Requirements
The master clock (CLK) frequency must be either at
8.192 or 16.384MHz for serial data rate of 2.048,
4.096, 8.192 and 16.384Mb/s; see Table 6 for the
selections of the master clock frequency.
Switching Configurations
The MT90826 maximum non-blocking switching
configurations is determined by the data rates
selected for the serial inputs and outputs. The
switching configuration is selected by three DR bits
in the control register. See Table 5 and Table 6.
8Mb/s mode (DR2=0, DR1=0, DR0=0)
When the 8Mb/s mode is selected, the device is
configured with 32-input/32-output data streams
each having 128 64Kbit/s channels. This mode
allows a maximum non-blocking capacity of 4,096 x
4,096 channels. Table 1 summarizes the switching
configurations and the relationship between different
serial data rates and the master clock frequencies.
ODE pin
OSB bit in Control register
OE bit in Connection Memory
ST-BUS Output Driver
0
0
X
High-Z
X
X
0
Per Channel High-Z
1
0
1
Enable
0
1
1
Enable
1
1
1
Enable
Table 2 - Output High Impedance Control
MT90826
CMOS
Advanced Information
8
16Mb/s mode (DR2=0, DR1=0, DR0 =1)
When the 16Mb/s mode is selected, the device is
configured with 16-input/16-output data streams
each having 256 64Kbit/s channels. This mode
allows a maximum non-blocking capacity of 4,096 x
4,096 channels.
4Mb/s and 8Mb/s mode (DR2=0, DR1=1, DR0=0)
When the 4Mb/s and 8Mb/s mode is selected, the
device is configured with 32-input/32-output data
streams. STi0-15/STo0-15 have a data rate of 4Mb/s
and STi16-31/STo16-31 have a data rate of 8Mb/s.
This mode allows a maximum non-blocking capacity
of 3,072 x 3,072 channels.
16Mb/s and 8Mb/s mode (DR2=0, DR1=1, DR0=1)
When the 16Mb/s and 8Mb/s mode is selected, the
device is configured with 20-input/20-output data
streams. STi0-11/STo0-11 have a data rate of 16Mb/
s and STi12-19/STo12-19 have a data rate of 8Mb/s.
This mode allows a maximum non-blocking capacity
of 4,096 x 4,096 channels.
4Mb/s mode (DR2=1, DR1=0, DR0=0)
When the 4Mb/s mode is selected, the device is
configured with 32-input/32-output data streams
each having 64 64Kbit/s channels. This mode allows
a maximum non-blocking capacity of 2,048 x 2,048
channels.
2Mb/s and 4Mb/s mode (DR2=1, DR1=0, DR0=1)
When the 2Mb/s and 4Mb/s mode is selected, the
device is configured with 32-input/32-output data
streams. STi0-15/STo0-15 have a data rate of 2Mb/s
and STi16-31/STo16-31 have a data rate of 4Mb/s.
This mode allows a maximum non-blocking capacity
of 1,536 x 1,536 channels.
2Mb/s mode (DR2=1, DR1=1, DR0 =0)
When the 2Mb/s mode is selected, the device is
configured with 32-input/32-output data streams
each having 32 64Kbit/s channels. This mode allows
a maximum non-blocking capacity of 1,024 x 1,024
channels.
Serial Input Frame Alignment Evaluation
The MT90826 provides the frame evaluation inputs,
FEi0 to FEi31, to determine different data input
delays with respect to the frame pulse F0i. By using
the frame evaluation input select bits (FE0 to FE4) of
the frame alignment register (FAR), users can select
one of the thirty-two frame evaluation inputs for the
frame alignment measurement.
The internal master clock, which has a fixed
relationship with the CLK and F0i depending upon
the mode of operation, is used as the reference
timing signal to determine the input frame delays.
See Figure 4 for the signal alignments between the
internal and the external master clocks.
A measurement cycle is started by setting the start
frame evaluation (SFE) bit low for at least one frame.
Then the evaluation starts when the SFE bit in the
control register is changed from low to high. Two
frames later, the complete frame evaluation (CFE) bit
of the frame alignment register changes from low to
high to signal that a valid offset measurement is
ready to be read from bits 0 to 9 of the FAR register.
The SFE bit must be set to zero before a new
measurement cycle started.
The falling edge of the frame measurement signal
(FEi) is evaluated against the falling edge of the
frame pulse (F0i). See Table 7 for the description of
the frame alignment register.
Input Frame Offset Selection
Input frame offset selection allows the channel
alignment of individual input streams, which operate
at 4.096Mb/s, 8.192Mb/s or 16.384Mb/s, to be
shifted against the input frame pulse (F0i). The input
offset selection is not available for streams operated
at 2.048Mb/s. This feature is useful in compensating
for variable path delays caused by serial backplanes
of variable lengths, which may be implemented in
large centralized and distributed switching systems.
Each input stream has its own delay offset value
programmed by the input delay offset registers. Each
delay offset register can control 4 input streams.
There are eight delay offset registers (DOS0 to
DOS7) to control 32 input streams. Possible
adjustment can range up to +4.5 internal master
clock periods forward with resolution of 1/2 internal
master clock period. See Table 8 and Table 9 for
frame input delay offset programming.
Output Advance Offset Selection
The MT90826 allows users to advance individual
output streams up to 45ns with a resolution of 15ns
when the device is in 8Mb/s, 16Mb/s, 4 and 8 Mb/s or
16 and 8 Mb/s mode. The output delay adjustment is
useful in compensating for variable output delays
caused by various output loading conditions. The
frame output offset registers (FOR0 & FOR3) control
the output offset delays for each output streams via
the programming of the OFn bits.
Advanced Information
CMOS
MT90826
9
See Table 10 and Table 11 for the frame output offset
programming.
Memory Block Programming
The MT90826 provides users with the capability of
initializing the entire connection memory block in two
frames. Bits 13 to 15 of every connection memory
location will be programmed with the pattern stored
in bits 13 to 15 of the control register.
The block programming mode is enabled by setting
the memory block program (MBP) bit of the control
register high. When the block programming enable
(BPE) bit of the control register is set to high, the
block programming data will be loaded into the bits
13 to 15 of every connection memory location. The
other connection memory bits (bit 0 to 12) are loaded
with zeros. When the memory block programming is
complete, the device resets the BPE bit to zero.
Bit Error Monitoring
The MT90826 allows users to perform bit error
monitoring by sending a pseudo random pattern to a
selected ST-BUS output channel and receiving the
pattern from a selected ST-BUS input channel. The
pseudo random pattern is internally generated by the
device with the polynomial of 2
15
-1.
Users can select the pseudo random pattern to be
presented on a ST-BUS channel by programming the
TM0 and TM1 bits in the connection memory. When
TM0 and TM1 bits are high, the pseudo random
pattern is output to the selected ST-BUS output
channel. The pseudo random pattern is then
received by a ST-BUS input channel which is
selected using the BSA and BCA bits in the bit error
rate input register (BISR). An internal bit error
counter keeps track of the error counts which is then
stored in the bit error count register (BECR).
The bit error test is enabled and disabled by the
SBER bit in the control register. Setting the bit from
zero to one initiates the bit error test and enables the
internal bit error counter. When the bit is
programmed from one to zero, the internal bit error
counter transfers the error counts to the bit error
count register.
In the control register, a zero to one transition of the
CBER bit resets the bit error count register and the
internal bit error counter.
Delay Through the MT90826
The switching of information from the input serial
streams to the output serial streams results in a
throughput delay. The device can be programmed to
perform timeslot interchange functions with different
throughput delay capabilities on the per-channel
basis. For voice application, select variable
throughput delay to ensure minimum delay between
input and output data. In wideband data applications,
select constant throughput delay to maintain the
frame integrity of the information through the switch.
The delay through the device varies according to the
type of throughput delay selected by the TM bits in
the connection memory.
Variable Delay Mode (TM1=0, TM0=0)
The delay in this mode is dependent only on the
combination of source and destination channels and
is independent of input and output streams.
Constant Delay Mode (TM1=1, TM0=0)
In this mode, frame integrity is maintained in all
switching configurations by making use of a multiple
data memory buffer.
Microprocessor Interface
The MT90826 provides a parallel microprocessor
interface for non-multiplexed bus structures. This
interface is compatible with Motorola non-multiplexed
buses. The required microprocessor signals are the
16-bit data bus (D0-D15), 14-bit address bus (A0-
A13) and 4 control lines (CS, DS, R/W and DTA).
See Figure 14 for Motorola non-multiplexed
microport timing.
The MT90826 microport provides access to the
internal registers, connection and data memories. All
locations provide read/write access except for the
data memory, DRR and BECR registers which are
read only.
For data memory read operations, two consecutive
microprocessor cycles are required. The read
address (A0-A13) should remain the same for the
two consecutive read cycles. The data memory
content from the first read cycle should be ignored.
The correct data memory content will be presented
to the data bus (D0-D15) on the second read cycle.
MT90826
CMOS
Advanced Information
10
A13
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
Location
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Control Register, CR
0
0
0
0
0
0
0
0
0
0
0
0
0
1
Frame Alignment Register, FAR
0
0
0
0
0
0
0
0
0
0
0
0
1
0
Input Offset Selection Register 0, DOS0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
Input Offset Selection Register 1, DOS1
0
0
0
0
0
0
0
0
0
0
0
1
0
0
Input Offset Selection Register 2, DOS2
0
0
0
0
0
0
0
0
0
0
0
1
0
1
Input Offset Selection Register 3, DOS3
0
0
0
0
0
0
0
0
0
0
0
1
1
0
Input Offset Selection Register 4, DOS4
0
0
0
0
0
0
0
0
0
0
0
1
1
1
Input Offset Selection Register 5, DOS5
0
0
0
0
0
0
0
0
0
0
1
0
0
0
Input Offset Selection Register 6, DOS6
0
0
0
0
0
0
0
0
0
0
1
0
0
1
Input Offset Selection Register 7, DOS7
0
0
0
0
0
0
0
0
0
0
1
0
1
0
Frame Output Offset Register, FOR0
0
0
0
0
0
0
0
0
0
0
1
0
1
1
Frame Output Offset Register, FOR1
0
0
0
0
0
0
0
0
0
0
1
1
0
0
Frame Output Offset Register, FOR2
0
0
0
0
0
0
0
0
0
0
1
1
0
1
Frame Output Offset Register, FOR3
0
0
0
0
0
0
0
0
0
0
1
1
1
0
Unused
0
0
0
0
0
0
0
0
0
0
1
1
1
1
Unused
0
0
0
0
0
0
0
0
0
1
0
0
0
0
Unused
0
0
0
0
0
0
0
0
0
1
0
0
0
1
Bit Error Input Selection Register, BISR
0
0
0
0
0
0
0
0
0
1
0
0
1
0
Bit Error Count Register, BECR
Table 3 - Address Map for Registers (A13 = 0)
A13
Stream Address (ST0-31)
Channel Address (Ch0-255)
A12
A11
A10
A9
A8
Stream
Location
A7
A6
A5
A4
A3
A2
A1
A0
Channel
Location
1
1
1
1
1
1
1
1
1
.
.
.
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
.
.
.
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
.
.
.
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
.
.
.
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
.
.
.
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
.
.
.
0
1
0
1
0
1
0
1
0
1
Stream 0
Stream 1
Stream 2
Stream 3
Stream 4
Stream 5
Stream 6
Stream 7
Stream 8
.
.
.
Stream 22
Stream 23
Stream 24
Stream 25
Stream 26
Stream 27
Stream 28
Stream 29
Stream 30
Stream 31
0
0
.
.
0
0
0
0
.
.
0
0
0
0
.
0
0
1
1
.
1
1
0
0
.
.
0
0
0
0
.
.
0
0
1
1
.
1
1
0
0
.
1
1
0
0
.
.
0
0
1
1
.
.
1
1
0
0
.
1
1
0
0
.
1
1
0
0
.
.
1
1
0
0
.
.
1
1
0
0
.
1
1
0
0
.
1
1
0
0
.
.
1
1
0
0
.
.
1
1
0
0
.
1
1
0
0
.
1
1
0
0
.
.
1
1
0
0
.
.
1
1
0
0
.
1
1
0
0
.
1
1
0
0
.
.
1
1
0
0
.
.
1
1
0
0
.
1
1
0
0
.
1
1
0
1
.
.
0
1
0
1
.
.
0
1
0
1
.
0
1
0
1
.
0
1
Ch 0
Ch 1
.
.
Ch 30
Ch 31 (Note 2)
Ch 32
Ch 33
.
.
Ch 62
Ch 63 (Note 3)
Ch 64
Ch 65
.
Ch 126
Ch 127 (Note 4)
Ch 128
Ch 129
.
Ch 254
Ch 255 (Note 5)
1. Bit A13 must be high for access to data and connection memory positions. Bit A13 must be low for access to registers.
2. Channels 0 to 31 are used when serial stream is at 2Mb/s.
3. Channels 0 to 63 are used when serial stream is at 4Mb/s
4. Channels 0 to 127 are used when serial stream is at 8Mb/s
5. Channels 0 to 255 are used when serial stream is at 16Mb/s
Table 4 - Address Map for Memory Locations (A13 = 1)
Advanced Information
CMOS
MT90826
11
Memory Mapping
The address bus on the microprocessor interface
selects the internal registers and memories of the
MT90826. If the A13 address input is low, then the
registers are addressed by A12 to A0 according to
Table 3.
If the A13 is high, the remaining address input lines
are used to select location in the data or connection
memory depending upon MS bit in the control
register. For data memory reads, the serial inputs
are selected. For connection memory writes, the
serial outputs are selected. The destination stream
address bits and channel address bits are defined by
A12 to A8 and A7 to A0 respectively. See Table 4 for
the memory address mapping.
The control register controls all the major functions
of the device. It selects the internal memory
locations that specify the input and output channels
selected for switching and should be programmed
immediately after system power-up to establish the
desired switching configuration as explained in the
Frame Alignment Timing & Switching Configurations
sections.
The data in the control register consists of the block
programming bits (BPD0-2), the block programming
enable bit (BPE), the memory block programming bit
(MBP), the memory select bits (MS), the start frame
evaluation bit (SFE), the output stand by bit (OSB),
the wide frame pulse control bit (WFP) and the data
rate selection bits (DR0-2). See Table 5 for the
description of the control register bits.
Connection Memory Control
The connection memory controls the switching
configuration of the device. Locations in the
connection memory are associated with particular
STo output streams.
The TM0 and TM1 bits of each connection memory
location allows the selection of the variable
throughput delay mode, the constant throughput
delay mode, the message mode or the bit error test
mode for all STo channels.
When the variable or constant throughput delay
mode is selected, (TM1=0/1, TM0=0), the contents of
the stream address bit (SAB) and the channel
address bit (CAB) of the connection memory defines
the source information (stream and channel) of the
timeslot that will be switched to the STo streams.
When the message mode is selected, (TM1=0,
TM0=1) , only the lower half byte (8 least significant
bits) of the connection memory is transferred to the
associated STo output channel.
When the bit error test mode is selected, (TM1=1,
TM0=1), the pseudo random pattern will be output on
the associated STo output channel.
See Table 17 for the description of the connection
memory bits.
DTA Data Transfer Acknowledgment Pin
The DTA pin is driven LOW by internal logic, to
indicate to the CPU that a data bus transfer is
complete. When the read or write cycle ends, this pin
changes to the high-impedance state.
Initialization of the MT90826
During power up, the TRST pin should be pulsed low,
or held low continuously, to ensure that the MT90826
is in the normal functional mode. A 5K pull-down
resistor can be connected to the TRST pin so that
the device will not enter the JTAG test mode during
power up.
After power up, the contents of the connection
memory can be in any state. The ODE pin should be
held low after power up to keep all serial outputs in a
high impedance state until the microprocessor has
initialized the switching matrix. This procedure
prevents two serial outputs from driving the same
stream simultaneously.
During the microprocessor initialization routine, the
microprocessor should program the desired active
paths through the switch. Users can also consider
using the memory block programming feature to
quickly initialize the OE, TM0 and TM1 bits in the
connection memory. When this process is complete,
the microprocessor controlling the matrices can
either bring the ODE pin high or enable the OSB bit
in control register to relinquish the high impedance
state control.
MT90826
CMOS
Advanced Information
12
Bit
Name
Description
15-13
BPD2-0
Block Programming Data. These bits carry the value to be loaded into the connection memory
block whenever the memory block programming feature is activated. After the MBP bit is set to 1
and the BPE bit is set to 1, the contents of the bits BPD2- 0 are loaded into bit 15 to bit 13 of the
connection memory. Bit 12 to bit 0 of the connection memory are set to 0.
12
Unused
Must be zero for normal operation.
11
CPLL
PLL Input Frequency Select. When zero, the CLK input is 16.384MHz. When 1, the CLK input
is 8.192MHz or 16.384MHz. See Table 6 for the usage of the clock frequency.
10
CBER
Clear Bit Error Rate Register. A zero to one transition in this bit resets the internal bit error
counter and the bit error count register to zero.
9
SBER
Start Bit Error Rate Test. A zero to one transition in this bit starts the bit error rate test. The bit
error test result is kept in the bit error count register. A one to zero transition stops the bit error
rate test and the internal bit error counter.
8
SFE
Start Frame Evaluation. A zero to one transition in this bit starts the frame evaluation
procedure. When the CFE bit in the frame alignement (FAR) register changes from zero to one,
the evaluation procedure stops. To start another frame evaluation cycle, set this bit to zero.
7
Unused
Must be zero for normal operation.
6
BPE
Begin Block programming Enable. A zero to one transition of this bit enables the memory
block programming function. The BPE and BPD2-0 bits have to be defined in the same write
operation. Once the BPE bit is set high, the device requires two frames to complete the block
programming. After the programming function has finished, the BPE bit returns to zero to
indicate the operation is completed. When the BPE = 1, the BPE or MBP can be set to 0 to abort
the programming operation.
When BPE = 1, the other bits in the control register must not be changed for two frames to
ensure proper operation.
5
MBP
Memory Block Program. When 1, the connection memory block programming feature is ready
to program Bit13 to Bit15 of the connection memory. When 0, feature is disabled.
4
MS
Memory Select. When 0, connection memory is selected for read or write operations. When 1,
the data memory is selected for read operations and connection memory is selected for write
operations. (No microprocessor write operation is allowed for the data memory.)
For data memory read operations, two consecutive microprocessor cycles are required. The
read address should remain the same for the two consecutive read cycles. The data memory
content from the first read cycle should be ignored. The correct data memory content will be
presented to the data bus on the second read cycle.
3
OSB
Output Stand By. This bit controls the device output drivers.
OSB bit ODE pin OE bit
STo0 - 31
0 1 1 Enable
1 0 1 Enable
1 1 1 Enable
0 0 X High impedance state
X X 0 Per-channel high impedance
2 - 0
DR2-0
Data Rate Select. Input/Output data rate selection. See next table (Table 6) for detailed
programming.
Table 5 - Control Register Bits
Read/Write Address:
0000
H
,
Reset Value:
0000
H
.
7
6
5
4
3
2
1
0
8
9
10
11
12
13
DR0
DR1
BPE
14
15
SFE
0
OSB
MBP
MS
SBER
BPD2
BPD1
BPD0
CBER
0
DR2
CPLL
Advanced Information
CMOS
MT90826
13
Table 7 - Frame Alignment (FAR) Register Bits
DR2
DR1
DR0
Serial Interface Mode
CLK
(CPLL=0)
CLK
(CPLL=1)
0
0
0
8 Mb/s
16.384MHz
16.384MHz
0
0
1
16 Mb/s
0
1
0
4 and 8 Mb/s
0
1
1
16 and 8 Mb/s
1
0
0
4 Mb/s
16.384MHz
8.192MHz
1
0
1
2 and 4 Mb/s
1
1
0
2 Mb/s
16.384MHz
8.192MHz
Table 6 - Serial Data Rate Selections and External Clock Rates
Bit
Name
Description
15-11
FE4-0
Frame Evaluation Input Select. The binary value expressed in these bits
refers to the frame evaluation inputs, FEi0 to FEi31.
10
CFE
Complete Frame Evaluation. When CFE = 1, the frame evaluation is
completed and FD9 to FD0 bits contains a valid frame alignment offset.
This bit is reset to zero, when SFE bit in the control register is changed from 1
to 0.
9
FD9
Frame Delay Bit 9. The falling edge of FEi input is sampled during the internal
master clock high phase (FD9 = 1) or during the low phase (FD9 = 0). This bit
allows the measurement resolution to 1/2 internal master clock cycle.
See Figure 4 for clock signal alignment.
Internal Master Clock
Operation Mode
C8i 2Mb/s
C16i 4Mb/s, 2&4Mb/s
C32i 8Mb/s, 16Mb/s, 4&8Mb/s, 16&8Mb/s
8-0
FD8-0
Frame Delay Bits. The binary value expressed in these bits refers to the
measured input offset value. These bits are reset to zero when the SFE bit of
the control register changes from 1 to 0. (FD8 = MSB, FD0 = LSB)
Read/Write Address:
0001
H
,
Reset Value:
0000
H
.
7
6
5
4
3
2
1
0
8
9
10
11
12
13
FD0
FD1
FD2
FD3
FD4
FD5
FD6
FD7
FD8
FD9
CFE
FE0
FE1
FE2
FE3
FE4
14
15
MT90826
CMOS
Advanced Information
14
Figure 4 - Example for Frame Alignment Measurement
F0i
FEi Input
(FD9 = 0, sample at internal C32i low phase)
Offset Value
(FD[8:0] = 06
H
, frame offset of six C32i clock cycles)
1
0
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Internal
CLK
Frame Boundary
at 32MHz
master clock
For 8Mb/s, 16Mb/s, 4&8Mb/s and 16&8Mb/s modes
F0i
FEi Input
(FD9 = 0, sample at internal C16i low phase)
Offset Value
(FD[8:0] = 03
H
, frame offset of three C16i clock cycles)
1
0
2
3
4
5
6
7
Internal
CLK
at 16 MHz
master clock
For 4Mb/s and 2&4Mb/s modes
8
F0i
FEi Input
(FD9 = 1, sample at internal C8i high phase)
Offset Value
(FD[8:0] = 02
H
, frame offset of two C8i clock cycles)
1
0
2
3
4
Internal
CLK
at 8MHz
master clock
For 2Mb/s mode
(16.384MHz)
(16.384MHz)
(16.384MHz)
Advanced Information
CMOS
MT90826
15
Name
(Note 1)
Description
IFn3-0
Input Offset Bits 3,2,1 & 0. These four bits define how long the serial interface receiver
takes to recognize and store bit 0 from the STi pin: i.e., to start a new frame. The input
frame offset can be selected to +2.25 clock periods from the point where the external
frame pulse input signal is applied to the F0i inputs of the device. See Table 9.
When the STi pin has a stream rate of 2.048Mb/s, the input offset can not be adjusted
and the input offset bits have to be set to zero.
Note 1: n denotes a STi stream number from 0 to 31.
Table 8 - Frame Delay Offset Register (DOS) Bits
Read/Write Address:
02
H
for DOS0 register,
03
H
for DOS1 register,
04
H
for DOS2 register,
05
H
for DOS3 register,
06
H
for DOS4 register,
07
H
for DOS5 register,
08
H
for DOS6 register,
09
H
for DOS7 register,
Reset value:
0000
H
for all DOS registers.
7
6
5
4
3
2
1
0
8
9
10
11
12
13
IF00
IF01
IF02
14
15
IF10
IF11
IF12
IF20
IF21
IF22
IF30
IF31
IF32
IF33
DOS0 register
DOS1 register
IF40
IF41
IF42
IF50
IF51
IF52
IF60
IF61
IF62
IF70
IF71
IF72
IF73
DOS2 register
IF80
IF81
IF82
IF90
IF91
IF92
IF100
IF101
IF102
IF110
IF111
IF112
DOS3 register
IF120
IF121
IF122
IF130
IF131
IF132
IF140
IF141
IF142
IF150
IF151
IF152
DOS4 register
IF160
IF161
IF162
IF170
IF171
IF172
IF180
IF181
IF182
IF190
IF191
IF192
DOS5 register
IF200
IF201
IF202
IF210
IF211
IF212
IF220
IF221
IF222
IF230
IF231
IF232
DOS6 register
IF240
IF241
IF242
IF250
IF251
IF252
IF260
IF261
IF262
IF270
IF271
IF272
DOS7 register
IF280
IF281
IF282
IF290
IF291
IF292
IF300
IF301
IF302
IF310
IF311
IF312
IF03
IF13
IF23
IF43
IF53
IF63
IF83
IF93
IF103
IF113
IF123
IF133
IF153
IF143
IF163
IF173
IF183
IF193
IF203
IF213
IF223
IF233
IF243
IF253
IF263
IF273
IF283
IF293
IF303
IF313
MT90826
CMOS
Advanced Information
16
Figure 4 - Examples for Input Offset Delay Timing
Input Stream
Offset
Measurement Result from
Frame Delay Bits
Corresponding Input Offset Bits
FD9
FD2
FD1
FD0
IFn3
IFn2
IFn1
IFn0
No internal master clock shift
(Default)
1
0
0
0
0
0
0
0
+ 1/4 internal master clock shift
0
0
0
0
0
0
0
1
+ 1/2 internal master clock shift
1
0
0
1
0
0
1
0
+ 3/4 internal master clock shift
0
0
0
1
0
0
1
1
+ 1.00 internal master clock shift
1
0
1
0
0
1
0
0
+ 1.25 internal master clock shift
0
0
1
0
0
1
0
1
+ 1.50 internal master clock shift
1
0
1
1
0
1
1
0
+ 1.75 internal master clock shift
0
0
1
1
0
1
1
1
+ 2.00 internal master clock shift
1
1
0
0
1
0
0
0
+ 2.25 internal master clock shift
0
1
0
0
1
0
0
1
Table 9 - Frame delay Bits (FD9, FD2-0) and Input Offset Bits (IFn3-0)
F0i
CLK
8Mb/s STi Stream
8Mb/s STi Stream
IFn=0000
IFn=0100
Bit 7
Bit 7
denotes the 3/4 point of the bit cell
(16.384MHz)
Internal
at 32MHz
master clock
F0i
CLK
16Mb/s STi Stream
16Mb/s STi Stream
IFn=0000
IFn=0100
Bit 7
Bit 7
(16.384MHz)
Internal
at 32MHz
master clock
Advanced Information
CMOS
MT90826
17
Figure 5 - Examples for Frame Output Offset Timing
Name
(Note 1)
Description
OFn1, OFn0
(n = 0 to 31)
Output Offset Bits 1 - 0. These two bits define how soon the serial interface transmitter
output the bit 0 from the STo pin. The output stream offset can be selected to -45ns from
the point where the external frame pulse input signal is applied to the F0i inputs of the
device. See Table 11 and Figure 5
Table 10 - Frame Output Offset (FOR) Register Bits
Corresponding Output Offset Bits
Output Stream Offset for
8Mb/s, 16Mb/s, 4&8Mb/s and 16&8Mb/s modes
(Not available for 2Mb/s, 4Mb/s and 2&4 Mb/s modes)
OFn1
OFn0
0
0
0ns
0
1
-15ns
1
0
-30ns
1
1
-45ns
Table 11 - Output Offset Bits (FD9, FD2-0)
Read/Write Address:
000A
H
for FOR0 register,
000B
H
for FOR1 register,
000C
H
for FOR2 register,
000D
H
for FOR3 register,
Reset value:
0000
H
for all FOR registers.
7
6
5
4
3
2
1
0
8
9
10
11
12
13
OF00
OF01
OF10
OF11
14
15
OF20
OF21
OF30
OF31
OF40
OF41
OF50
OF51
OF60
OF61
OF70
OF71
FOR0 register
FOR1 register
OF80
OF81
OF90
OF91
OF100
OF101
OF110
OF111
OF120
OF121
OF130
OF131
OF140
OF141
OF150
OF151
OF160
OF161
OF170
O171
OF180
OF181
OF190
OF191
OF200
OF201
OF210
OF211
OF220
OF221
OF230
OF231
FOR2 register
FOR3 register
OF240
OF241
OF250
OF251
OF260
OF261
OF270
OF271
OF280
OF281
OF290
OF291
OF300
OF301
OF310
OF311
F0i
CLK
STo Stream
STo Stream
offset=00, (0ns)
offset=01, (-15ns)
Bit 7
Bit 7
denotes the starting point of the bit cell
(16.384MHz)
MT90826
CMOS
Advanced Information
18
Bit
Name
Description
12 - 8
BSA4 - BSA0
BER Input Stream Address Bits. The number expressed in binary notation on
these bits refers to the input data stream which receives the pseudo random
pattern.
7 - 0
BCA7 - BCA0
BER Input Channel Address Bits. The number expressed in binary notation
on these bits refers to the input channel which receives the pseudo random
pattern.
Table 12 - Bit Error Input Selection (BISR) Register Bits
Bit
Name
Description
15 - 0
BER15 - BER0
Bit Error Rate Count Bits. The number expressed in binary notation on these
bits refers to the bit error counts. The register content can be cleared by
programming the CBER bit in the control register from zero to one.
Table 13 - Bit Error Count (BECR) Register Bits
Read/Write Address:
0011
H
for BISR register,
Reset value:
0000
H
7
6
5
4
3
2
1
0
8
9
10
11
12
13
BCA0
BCA1
BCA2
BCA3
14
15
BCA4
BCA5
BCA6
BCA7
BSA0
BSA1
BSA2
BSA3
BSA4
0
0
0
Read Address:
0012
H
for BECR register,
Reset value:
0000
H
7
6
5
4
3
2
1
0
8
9
10
11
12
13
14
15
WR0
WR1
WR2
WR3
BER4
BER5
BER6
BER7
BER8
BER9
BER10
BER11
BER12
BER13
BER14
BER15
Advanced Information
CMOS
MT90826
19
Table 14 - Connection Memory Bits
Table 15 - SAB and CAB Bits Programming for various interface mode
Bit
Name
Description
15-14
TM1-0
Mode Select Bits.
TM1 TM0
Mode Selection
0 0 Variable Throughput Delay mode
1 0 Constant Throughput Delay mode
0 1 Message mode; the contents of the connection memory are
output on the corresponding output channel and stream. Only
the lower byte (bit 7 - bit 0) will be output to the ST-BUS output
pins.
1 1 Bit Error Test mode; the pseudo random test pattern will be
output on the output channel and stream associated with this
location.
13
OE
Output Enable. This bit enables the drivers of STo pins on a per-channel
basis. When 1, the STo output driver functions normally. When 0, the STo
output driver is in a high-impedance state.
12-8
SAB4-0
Source Stream Address Bits. The binary value is the number of the data
stream for the source of the connection.
7-0
CAB7-0
Source Channel Address Bits. The binary value is the number of the channel
for the source of the connection. When the message mode is enabled, these
entire 8 bits are output on the output channel and stream associated with this
location.
Data Rate
SAB4 to SAB0 Bits Used to Determine
the Source Stream of the connection
CAB Bits Used to Determine the Source
Channel of the Connection
8 Mb/s
SAB4 to SAB0 (STi0 to STi31)
CAB6 to CAB0 (128 channel/frame)
16Mb/s
SAB3 to SAB0 (STi0 to STi15)
CAB7 to CAB0 (256 channel/frame)
4 Mb/s & 8 Mb/s
SAB4 to SAB0 (STi0 to STi31)
CAB6 to CAB0 (64 or 128 channel/frame)
16 Mb/s & 8 Mb/s
SAB3 to SAB0 (STi0 to STi19)
CAB7 to CAB0 (128 or 256 channel/frame)
4 Mb/s
SAB4 to SAB0 (STi0 to STi31)
CAB5 to CAB0 (64 channel/frame)
2 Mb/s & 4 Mb/s
SAB4 to SAB0 (STi0 to STi31)
CAB5 to CAB0 (32 or 64 channel/frame)
2 Mb/s
SAB4 to SAB0 (STi0 to STi31)
CAB4 to CAB0 (32 channel/frame)
7
6
5
4
3
2
1
0
8
9
10
11
12
13
CAB
CAB
CAB
CAB
CAB
CAB
CAB
SAB
SAB
SAB
14
TM0
15
OE
TM1
2
1
0
7
6
5
4
3
2
1
0
CAB
3
SAB
SAB
4
MT90826
CMOS
Advanced Information
20
JTAG Support
The MT90826 JTAG interface conforms to the
Boundary-Scan standard IEEE1149.1. This standard
specifies a design-for-testability technique called
Boundary-Scan test (BST). The operation of the
boundary-scan circuitry is controlled by an external
test access port (TAP) Controller.
Test Access Port (TAP)
The Test Access Port (TAP) provides access to the
many test functions of the MT90826. It consists of
three input pins and one output pin. The following
pins are from the TAP.
Test Clock Input (TCK)
TCK provides the clock for the test logic. The
TCK does not interfere with any on-chip clock
and thus remain independent. The TCK permits
shifting of test data into or out of the Boundary-
Scan register cells concurrently with the
operation of the device and without interfering
with the on-chip logic.
Test Mode Select Input (TMS)
The logic signals received at the TMS input are
interpreted by the TAP Controller to control the
test operations. The TMS signals are sampled
at the rising edge of the TCK pulse. This pin is
internally pulled to Vdd when it is not driven
from an external source.
Test Data Input (TDI)
Serial input data applied to this port is fed
either into the instruction register or into a test
data register, depending on the sequence
previously applied to the TMS input. Both
registers are described in a subsequent
section. The received input data is sampled at
the rising edge of TCK pulses. This pin is
internally pulled to Vdd when it is not driven
from an external source.
Test Data Output (TDO)
Depending on the sequence previously applied
to the TMS input, the contents of either the
instruction register or data register are serially
shifted out towards the TDO. The data out of
the TDO is clocked on the falling edge of the
TCK pulses. When no data is shifted through
the boundary scan cells, the TDO driver is set
to a high impedance state.
Test Reset (TRST)
Resets the JTAG scan structure. This pin is
internally pulled to VDD.
Instruction Register
In accordance with the IEEE 1149.1 standard, the
MT90863 uses public instructions. The JTAG
Interface contains a two-bit instruction register.
Instructions are serially loaded into the instruction
register from the TDI when the TAP Controller is in
its shifted-IR state. Subsequently, the instructions
are decoded to achieve two basic functions: to select
the test data register that may operate while the
instruction is current, and to define the serial test
data register path, which is used to shift data
between TDI and DO during data register scanning.
Test Data Register
As specified in IEEE 1149.1, the MT90826 JTAG
Interface contains three test data registers:
The Boundary-Scan register
The Boundary-Scan register consists of a
series of Boundary-Scan cells arranged to form
a scan path around the boundary of the
MT90863 core logic.
The Bypass Register
The Bypass register is a single stage shift
register that provides a one-bit path from TDI to
its TDO.
The Device Identification Register
The device identification register is a 32-bit
register with the register contain of:
The LSB bit in the device identification register is
the first bit clock out.
The MT90826 scan register contains 165 bits.
MSB
LSB
0000 0000 1000 0010 0110 0001 0100 1011
Advanced Information
CMOS
MT90826
21
Device Pin
Boundary Scan Bit 0 to Bit 165
Tri-state
Control
Output
Scan Cell
Input
Scan Cell
F0i
CLK
ODE
0
1
2
STi0
STi1
STi2
STi3
STo0
STo1
STo2
STo3
STi4
STi5
STi6
STi7
STo4
STo5
STo6
STo7
STi8
STi9
STi10
STi11
STo8
STo9
STo10
STo11
STi12
STi13
STi14
STi15
STo12
STo13
STo14
STo15
STi16
STi17
STi18
STi19
STo16
STo17
STo18
STo19
STi20
STi21
STi22
STi23
STo20
STo21
STo22
STo23
STi24
STi25
STi26
STi27
STo24
STo25
STo26
STo27
7
9
11
13
19
21
23
25
31
33
35
37
43
45
47
49
55
57
69
61
67
69
71
73
79
81
83
85
8
10
12
14
20
22
24
26
32
34
36
38
44
46
48
50
56
58
60
62
68
70
72
74
80
82
84
86
3
4
5
6
15
16
17
18
27
28
29
30
39
40
41
42
51
52
53
54
63
64
65
66
75
76
77
78
STi28
STi29
STi30
STi31
STo28
ST029
ST030
STo31
91
93
95
97
92
94
96
98
87
88
89
90
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
D12
D13
D14
D15
99
102
105
108
111
114
117
120
123
126
129
132
135
138
141
144
100
103
106
109
112
115
118
121
124
127
130
133
136
139
142
145
101
104
107
110
113
116
119
122
125
128
131
134
137
140
143
146
DTA
CS
R/W
DS
147
148
149
150
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
RESETb
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
Device Pin
Boundary Scan Bit 0 to Bit 165
Tri-state
Control
Output
Scan Cell
Input
Scan Cell
MT90826
CMOS
Advanced Information
22
* Exceeding these values may cause permanent damage. Functional operation under these conditions is not implied
.
Note:
1. Maximum leakage on pins (output or I/O pins in high impedance state) is over an applied voltage (V)
Absolute Maximum Ratings*
Parameter
Symbol
Min
Max
Units
1
Supply Voltage
V
DD
-0.3
5.0
V
2
Voltage on any 3.3V tolerant pin I/O (other than sup-
ply pins)
V
I
V
SS
- 0.3
V
DD
+ 0.3
V
3
Voltage on any 5V tolerant pin I/O (other than sup-
ply pins)
V
I
V
SS
- 0.3
5.0
V
4
Continuous Current at digital outputs
I
o
20
mA
5
Package power dissipation
P
D
1
W
6
Storage temperature
T
S
- 65
+125
C
Recommended Operating Conditions -
Voltages are with respect to ground (V
ss
) unless otherwise stated.
Characteristics
Sym
Min
Typ
Max
Units
Test Conditions
1
Operating Temperature
T
OP
-40
+85
C
2
Positive Supply
V
DD
3.0
3.6
V
3
Input High Voltage
V
IH
0.7V
DD
V
DD
V
4
Input High Voltage on 5V Tolerant Inputs
V
IH
5.5
V
5
Input Low Voltage
V
IL
V
SS
0.3V
DD
V
DC Electrical Characteristics -
Voltages are with respect to ground (V
ss
) unless otherwise stated.
Characteristics
Sym
Min
Typ
Max
Units
Test Conditions
1
I
N
P
U
T
S
Supply Current
I
DD
64
100
mA
Output unloaded
2
Input High Voltage
V
IH
0.7V
DD
V
3
Input Low Voltage
V
IL
0.3V
DD
V
4
Input Leakage (input pins)
Input Leakage (with pull-up
or pull-down)
I
IL
I
BL
15
50
A
A
0
<V
V
DD
See Note 1
5
Input Pin Capacitance
C
I
10
pF
6
O
U
T
P
U
T
S
Output High Voltage
V
OH
0.8V
DD
V
I
OH
= 10mA
7
Output Low Voltage
V
OL
0.4
V
I
OL
= 10mA
8
High Impedance Leakage
I
OZ
5
A
0 < V < V
DD
See Note 1
9
Output Pin Capacitance
C
O
10
pF
AC Electrical Characteristics - Timing Parameter Measurement Voltage Levels
Characteristics
Sym
Level
Units
Conditions
1
CMOS Threshold Voltage
V
TT
0.5V
DD
V
2
CMOS Rise/Fall Threshold Voltage High
V
HM
0.7V
DD
V
3
CMOS Rise/Fall Threshold Voltage Low
V
LM
0.3V
DD
V
Advanced Information
CMOS
MT90826
23
Note:1. High Impedance is measured by pulling to the appropriate rail with R
L
, with timing corrected to cancel time taken to discharge C
L
.
Figure 6 - ST-BUS Timing for Stream rate of 16.384 Mb/s
AC Electrical Characteristics - Frame Pulse and CLK
Characteristic
Sym
Min
Typ
Max
Units
CLK
1
Frame pulse width
t
FPW
55
65
ns
16.384MHz
2
Frame Pulse Setup time before CLK falling
t
FPS
5
ns
3
Frame Pulse Hold Time from CLK falling
t
FPH
10
ns
4
CLK Period
t
CP
55
70
ns
5
CLK Pulse Width High
t
CH
20
40
ns
6
CLK Pulse Width Low
t
CL
20
40
ns
7
Frame pulse width
t
FPW8
115
145
ns
8.192MHz
8
Frame Pulse Setup time before CLK falling
t
FPS8
5
ns
9
Frame Pulse Hold Time from CLK falling
t
FPH8
10
ns
10 CLK Period
t
CP8
110
150
ns
11 CLK Pulse Width High
t
CH8
50
75
ns
12 CLK Pulse Width Low
t
CL8
50
75
ns
13 Clock Rise/Fall Time
t
r
, t
f
-10
+10
ns
AC Electrical Characteristics - Serial Streams for ST-BUS
Characteristic
Sym
Min
Typ
Max
Units
Test Conditions
1
STi Set-up Time
t
SIS
0
ns
2
STi Hold Time
t
SIH
8
ns
3
STo Delay - Active to Active
t
SOD
8
11
30
43
ns
C
L
=30pF
C
L
=200pF
4
Output Driver Enable (ODE) Delay
t
ODE
35
ns
R
L
=1K, C
L
=200pF, See
Note 1
5
STo delay - Active to High-Z
- High-Z to Active
t
ZD
35
ns
R
L
=1K, C
L
=200pF, See
Note 1
V
TT
V
TT
F0i
CLK
t
FPW
STo
STi
t
FPH
t
SOD
t
SIH
t
CH
t
CL
t
FPS
t
CP
t
SIS
V
TT
V
TT
V
HM
V
LM
t
r
t
f
Ch0
Bit5
Ch0
Bit6
Ch0
Bit7
Ch255
Bit0
Ch255
Bit1
Ch0
Bit2
Ch0
Bit3
Ch0
Bit4
Ch0
Bit1
Ch0
Bit5
Ch0
Bit6
Ch0
Bit7
Ch255
Bit0
Ch255
Bit1
Ch0
Bit2
Ch0
Bit3
Ch0
Bit4
Ch0
Bit1
(16.384MHz)
(16Mb/s)
(16Mb/s)
MT90826
CMOS
Advanced Information
24
Figure 7 - ST-BUS Timing for Stream rate of 8.192 Mb/s
Figure 8 - ST-BUS Timing for Stream rate of 4.096 Mb/s when CLK = 16.384MHz
Figure 9 - ST-BUS Timing for Stream rate of 4.096 Mb/s when CLK = 8.192MHz
Figure 10 - ST-BUS Timing for Stream rate of 2.048 Mb/s when CLK = 16.384MHz
V
TT
V
TT
F0i
CLK
t
FPW
STo
STi
t
FPH
t
SOD
t
SIH
t
CH
t
CL
Bit 0, Last Channel
t
FPS
t
CP
t
SIS
V
TT
V
TT
Bit 7, Channel 0
Bit 6, Channel 0
Bit 5, Channel 0
Bit 0, Last Channel
Bit 7, Channel 0
Bit 6, Channel 0
Bit 5, Channel 0
V
HM
V
LM
t
r
t
f
(16.384MHz)
V
TT
V
TT
F0i
CLK
t
FPW
STo
STi
t
FPH
t
SOD
t
SIH
t
CH
t
CL
t
FPS
t
CP
t
SIS
V
TT
V
TT
V
HM
V
LM
t
f
Ch0 Bit 7
(16.384MHz)
(4Mb/s)
(4Mb/s)
Ch0 Bit 6
Ch0 Bit 7
Ch0 Bit 6
Ch63 Bit 0
Ch63 Bit 0
t
r
V
TT
V
TT
F0i
CLK
t
FPW8
STo
STi
t
FPH8
t
SOD
t
SIH
t
FPS8
t
CP8
t
SIS
V
TT
V
TT
V
HM
V
LM
Ch0 Bit 7
(8.192MHz)
(4Mb/s)
(4Mb/s)
Ch0 Bit 6
Ch0 Bit 7
Ch0 Bit 6
Ch63 Bit 0
Ch63 Bit 0
t
CH8
t
CL8
t
r
t
f
F0i
CLK
t
FPW
t
FPH
t
SOD
t
CH
t
CL
t
FPS
t
CP
V
TT
V
TT
V
HM
V
LM
t
r
t
f
(16.384MHz)
V
TT
V
TT
STo
STi
t
SIH
t
SIS
Ch0 Bit 7
(2Mb/s)
(2Mb/s)
Ch0 Bit 6
Ch0 Bit 7
Ch0 Bit 6
Ch31 Bit 0
Ch31 Bit 0
Advanced Information
CMOS
MT90826
25
Figure 11 - ST-BUS Timing for Stream rate of 2.048 Mb/s when CLK = 8.192MHzMHz
t
SOD
V
TT
V
TT
STo
STi
t
SIH
t
SIS
Ch0 Bit 7
(2Mb/s)
(2Mb/s)
Ch0 Bit 6
Ch0 Bit 7
Ch0 Bit 6
Ch31 Bit 0
Ch31 Bit 0
F0i
CLK
t
FPH8
t
FPS8
t
CP8
V
TT
V
TT
V
HM
V
LM
(8.192MHz)
t
CH8
t
CL8
Figure 12 - Serial Output and External Control
Figure 13 - Output Driver Enable (ODE)
t
DZ
STo
t
ZD
STo
CLK
V
TT
V
TT
HiZ
Valid Data
V
TT
HiZ
Valid Data
V
TT
HiZ
HiZ
STo
ODE
t
ODE
t
ODE
Valid Data
V
TT
MT90826
CMOS
Advanced Information
26
Note:
1. High Impedance is measured by pulling to the appropriate rail with R
L
, with timing corrected to cancel time taken to discharge C
L
.
Figure 14 - Motorola Non-Multiplexed Bus Timing
AC Electrical Characteristics - Motorola Non-Multiplexed Bus Mode
Characteristics
Sym
Min
Typ
Max
Units
Test Conditions
1
CS setup from DS falling
t
CSS
0
ns
2
R/W setup from DS falling
t
RWS
10
ns
3
Address setup from DS falling
t
ADS
2
ns
4
CS hold after DS rising
t
CSH
0
ns
5
R/W hold after DS rising
t
RWH
2
ns
6
Address hold after DS rising
t
ADH
10
ns
7
Data setup from DTA Low on Read
t
DDR
27
ns
C
L
=150pF
8
Data hold on read
t
DHR
12
20
ns
C
L
=150pF, R
L
=1K
Note 1
9
Data setup on write (fast write)
t
DSW
0
ns
10
Valid Data Delay on write (slow write)
t
SWD
50
85
185
ns
11
Data hold on write
t
DHW
13
ns
12a Acknowledgment Delay: Register RD or WR
t
AKD
55
ns
C
L
=150pF
12b Acknowledgment Delay: Memory RD or WR
16Mb/s, 16&8Mb/s, 8Mb/s, 4&8Mb/s
4Mb/s, 4&2Mb/s
2Mb/s
t
AKD
100
140
240
ns
ns
ns
C
L
=150pF
13
Acknowledgment Hold Time
t
AKH
24
ns
C
L
=150pF, R
L
=1K,
Note 1
DS
A0-A7
CS
D0-D15
D0-D15
READ
WRITE
t
CSS
t
CSH
t
ADH
t
DHR
t
RWS
R/W
t
ADS
t
RWH
t
DHW
t
AKD
t
SWD
t
DDR
t
AKH
DTA
V
TT
V
TT
V
TT
V
TT
V
TT
V
TT
V
TT
t
DSW
Valid Address
Valid Read Data
Valid Write Data
Package Outlines
Ball Gate Array
120-BGA
144-BGA
160-BGA
MT90823
MT90863
MT90826
20.00 REF
20.00 REF
3.00*45
Pin #1 Corner
1.00(3X) REF.
1 2 3 4 5 6 7 8 9 10 11 12 13
A
B
C
D
E
F
G
H
J
K
L
M
N
A
B
C
D
E
F
G
H
J
K
L
M
N
1
2
3
4
5
6
7
8
9
10
11
12
13
23.00
0.20
18.00
1.50
23.00
0.20
18.00
1.50
0.75
0.15 (169X)
B
A
0.60
0.10
2.13
0.13
30
Typ.
Seating Plane
0.56 REF
0.97 REF
C
Note: All governing dimensions are in millimetres for design purposes
(4x)
Package Outlines
Metric Quad Flat Pack - L Suffix
NOTE: Governing controlling dimensions in parenthesis ( ) are in millimeters.
Dim
44-Pin
64-Pin
100-Pin
128-Pin
Min
Max
Min
Max
Min
Max
Min
Max
A
-
0.096
(2.45)
-
0.134
(3.40)
-
0.134
(3.40)
-
0.154
(3.85)
A1
0.01
(0.25)
-
0.01
(0.25)
-
0.01
(0.25)
-
0.00
0.01
(0.25)
A2
0.077
(1.95)
0.083
(2.10)
0.1
(2.55)
0.12
(3.05)
0.1
(2.55)
0.12
(3.05)
0.125
(3.17)
0.144
(3.60)
b
0.01
(0.30)
0.018
(0.45)
0.013
(0.35)
0.02
(0.50)
0.009
(0.22)
0.015
(0.38)
0.019
(0.30)
0.018
(0.45)
D
0.547 BSC
(13.90 BSC)
0.941 BSC
(23.90 BSC)
0.941 BSC
(23.90 BSC)
1.23 BSC
(31.2 BSC)
D
1
0.394 BSC
(10.00 BSC)
0.787 BSC
(20.00 BSC)
0.787 BSC
(20.00 BSC)
1.102 BSC
(28.00 BSC)
E
0.547 BSC
(13.90 BSC)
0.705 BSC
(17.90 BSC)
0.705 BSC
(17.90 BSC)
1.23 BSC
(31.2 BSC)
E
1
0.394 BSC
(10.00 BSC)
0.551 BSC
(14.00 BSC)
0.551 BSC
(14.00 BSC)
1.102 BSC
(28.00 BSC)
e
0.031 BSC
(0.80 BSC)
0.039 BSC
(1.0 BSC)
0.256 BSC
(0.65 BSC)
0.031 BSC
(0.80 BSC)
L
0.029
(0.73)
0.04
(1.03)
0.029
(0.73)
0.04
(1.03)
0.029
(0.73)
0.04
(1.03)
0.029
(0.73)
0.04
(1.03)
L1
0.077 REF
(1.95 REF)
0.077 REF
(1.95 REF)
0.077 REF
(1.95 REF)
0.063 REF
(1.60 REF)
A
1
A
Index
D
1
b
e
E
1
E
Pin 1
D
A
2
Notes:
1) Not to scale
2) Top dimensions in inches
WARNING:
This package diagram does not apply to the MT90810AK
100 Pin Package. Please refer to the data sheet for
exact dimensions.
L
L1
3) The governing controlling
dimensions are in millimeters
for design purposes ( )
Package Outlines
NOTE: Governing controlling dimensions in parenthesis ( ) are in millimeters.
Dim
160-Pin
208-Pin
240-Pin
Min
Max
Min
Max
Min
Max
A
-
0.154
(3.92)
.161
(4.10)
-
0.161
(4.10)
A1
0.01
(0.25)
0.01
(0.25)
0.02
(0.50)
0.01
(0.25)
0.02
(0.50)
A2
0.125
(3.17)
0.144
(3.67)
.126
(3.20)
.142
(3.60)
0.126
(3.2)
0.142
(3.60)
b
0.009
(0.22)
0.015
(0.38)
.007
(0.17)
.011
(0.27)
0.007
(0.17)
0.010
(0.27)
D
1.23 BSC
(31.2 BSC)
1.204
(30.6)
1.360 BSC
(34.6 BSC)
D
1
1.102 BSC
(28.00 BSC)
1.102
(28.00)
1.26 BSC
(32.00 BSC)
E
1.23 BSC
(31.2 BSC)
1.204 BSC
(30.6 BSC)
1.360 BSC
(34.6 BSC)
E
1
1.102 BSC
(28.00 BSC)
1.102 BSC
(28.00 BSC)
1.26 BSC
(32.00 BSC)
e
0.025 BSC
(0.65 BSC)
0.020 BSC
(0.50 BSC)
0.0197 BSC
(0.50 BSC)
L
0.029
(0.73)
0.04
(1.03)
0.018
(0.45)
0.029
(0.75)
0.018
(0.45)
0.029
(0.75)
L1
0.063 REF
(1.60 REF)
0.051 REF
(1.30 REF)
0.051 REF
(1.30 REF)
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