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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
1
REV 1
Motorola, Inc. 1996
11/96
Low-Voltage CMOS Quad
2-Input NOR Gate
With 5V-Tolerant Inputs
The MC74LCX02 is a high performance, quad 2input NOR gate
operating from a 2.7 to 3.6V supply. High impedance TTL compatible
inputs significantly reduce current loading to input drivers while TTL
compatible outputs offer improved switching noise performance. A VI
specification of 5.5V allows MC74LCX02 inputs to be safely driven from
5V devices.
Current drive capability is 24mA at the outputs.
Designed for 2.7 to 3.6V VCC Operation
5V Tolerant Inputs -- Interface Capability With 5V TTL Logic
LVTTL Compatible
LVCMOS Compatible
24mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current (10
A) Substantially Reduces System
Power Requirements
Latchup Performance Exceeds 500mA
ESD Performance: Human Body Model >2000V; Machine Model >200V
Pinout: 14Lead (Top View)
13
14
12
11
10
9
8
2
1
3
4
5
6
7
VCC
O2
B2
A2
O3
B3
A3
O0
A0
B0
O1
A1
B1
GND
1
O0
2
A0
LOGIC DIAGRAM
3
B0
4
O1
5
A1
6
B1
13
O2
11
A2
12
B2
10
O3
8
A3
9
B3
DT SUFFIX
PLASTIC TSSOP
CASE 948G01
14
1
SD SUFFIX
PLASTIC SSOP
CASE 940A03
14
1
M SUFFIX
PLASTIC SOIC EIAJ
CASE 96501
14
1
D SUFFIX
PLASTIC SOIC
CASE 751A03
14
1
PIN NAMES
Function
Data Inputs
Outputs
Pins
An, Bn
On
MC74LCX02
LOWVOLTAGE CMOS
QUAD 2INPUT NOR GATE
L
L
H
H
L
H
L
H
INPUTS
OUTPUTS
An
Bn
H
L
L
L
On
FUNCTION TABLE
MC74LCX02
MOTOROLA
LCX DATA
BR1339 -- REV 3
2
ABSOLUTE MAXIMUM RATINGS*
Symbol
Parameter
Value
Condition
Unit
VCC
DC Supply Voltage
0.5 to +7.0
V
VI
DC Input Voltage
0.5
VI
+7.0
V
VO
DC Output Voltage
0.5
VO
VCC + 0.5
Note 1.
V
IIK
DC Input Diode Current
50
VI < GND
mA
IOK
DC Output Diode Current
50
VO < GND
mA
+50
VO > VCC
mA
IO
DC Output Source/Sink Current
50
mA
ICC
DC Supply Current Per Supply Pin
100
mA
IGND
DC Ground Current Per Ground Pin
100
mA
TSTG
Storage Temperature Range
65 to +150
C
* Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or
conditions beyond those indicated may adversely affect device reliability. Functional operation under absolutemaximumrated conditions is
not implied.
1. Output in HIGH or LOW State. IO absolute maximum rating must be observed.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Typ
Max
Unit
VCC
Supply Voltage
Operating
Data Retention Only
2.0
1.5
3.3
3.3
3.6
3.6
V
VI
Input Voltage
0
5.5
V
VO
Output Voltage
(HIGH or LOW State)
0
VCC
V
IOH
HIGH Level Output Current, VCC = 3.0V 3.6V
24
mA
IOL
LOW Level Output Current, VCC = 3.0V 3.6V
24
mA
IOH
HIGH Level Output Current, VCC = 2.7V 3.0V
12
mA
IOL
LOW Level Output Current, VCC = 2.7V 3.0V
12
mA
TA
Operating FreeAir Temperature
40
+85
C
t/
V
Input Transition Rise or Fall Rate, VIN from 0.8V to 2.0V,
VCC = 3.0V
0
10
ns/V
DC ELECTRICAL CHARACTERISTICS
TA = 40
C to +85
C
Symbol
Characteristic
Condition
Min
Max
Unit
VIH
HIGH Level Input Voltage (Note 2.)
2.7V
VCC
3.6V
2.0
V
VIL
LOW Level Input Voltage (Note 2.)
2.7V
VCC
3.6V
0.8
V
VOH
HIGH Level Output Voltage
2.7V
VCC
3.6V; IOH = 100
A
VCC 0.2
V
VCC = 2.7V; IOH = 12mA
2.2
VCC = 3.0V; IOH = 18mA
2.4
VCC = 3.0V; IOH = 24mA
2.2
VOL
LOW Level Output Voltage
2.7V
VCC
3.6V; IOL = 100
A
0.2
V
VCC = 2.7V; IOL= 12mA
0.4
VCC = 3.0V; IOL = 16mA
0.4
VCC = 3.0V; IOL = 24mA
0.55
2. These values of VI are used to test DC electrical characteristics only.
MC74LCX02
LCX DATA
BR1339 -- REV 3
3
MOTOROLA
DC ELECTRICAL CHARACTERISTICS
(continued)
TA = 40
C to +85
C
Symbol
Characteristic
Condition
Min
Max
Unit
II
Input Leakage Current
2.7V
VCC
3.6V; 0V
VI
5.5V
5.0
A
ICC
Quiescent Supply Current
2.7
VCC
3.6V; VI = GND or VCC
10
A
2.7
VCC
3.6V; 3.6
VI
5.5V
10
A
ICC
Increase in ICC per Input
2.7
VCC
3.6V; VIH = VCC 0.6V
500
A
AC CHARACTERISTICS (tR = tF = 2.5ns; CL = 50pF; RL = 500
)
Limits
TA = 40
C to +85
C
VCC = 3.0V to 3.6V
VCC = 2.7V
Symbol
Parameter
Waveform
Min
Max
Max
Unit
tPLH
tPHL
Propagation Delay
Input to Output
1
1.5
1.5
5.2
5.2
6.0
6.0
ns
tOSHL
tOSLH
OutputtoOutput Skew
(Note 3.)
1.0
1.0
ns
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGHtoLOW (tOSHL) or LOWtoHIGH (tOSLH); parameter
guaranteed by design.
DYNAMIC SWITCHING CHARACTERISTICS
TA = +25
C
Symbol
Characteristic
Condition
Min
Typ
Max
Unit
VOLP
Dynamic LOW Peak Voltage (Note 4.)
VCC = 3.3V, CL = 50pF, VIH = 3.3V, VIL = 0V
0.8
V
VOLV
Dynamic LOW Valley Voltage (Note 4.)
VCC = 3.3V, CL = 50pF, VIH = 3.3V, VIL = 0V
0.8
V
4. Number of outputs defined as "n". Measured with "n1" outputs switching from HIGHtoLOW or LOWtoHIGH. The remaining output is
measured in the LOW state.
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Condition
Typical
Unit
CIN
Input Capacitance
VCC = 3.3V, VI = 0V or VCC
7
pF
COUT
Output Capacitance
VCC = 3.3V, VI = 0V or VCC
8
pF
CPD
Power Dissipation Capacitance
10MHz, VCC = 3.3V, VI = 0V or VCC
25
pF
MC74LCX02
MOTOROLA
LCX DATA
BR1339 -- REV 3
4
PROPAGATION DELAYS
tR = tF = 2.5ns, 10% to 90%; f = 1MHz; tW = 500ns
2.7V
0V
VOH
VOL
An, Bn
On
tPLH
tPHL
1.5V
1.5V
1.5V
1.5V
Figure 1. AC Waveforms
PULSE
GENERATOR
RT
DUT
VCC
RL
CL
CL = 50pF or equivalent (Includes jig and probe capacitance)
RL = R1 = 500
or equivalent
RT = ZOUT of pulse generator (typically 50
)
Figure 2. Test Circuit
MC74LCX02
LCX DATA
BR1339 -- REV 3
5
MOTOROLA
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A03
ISSUE F
MIN
MIN
MAX
MAX
MILLIMETERS
INCHES
DIM
A
B
C
D
F
G
J
K
M
P
R
8.55
3.80
1.35
0.35
0.40
0.19
0.10
0
5.80
0.25
8.75
4.00
1.75
0.49
1.25
0.25
0.25
7
6.20
0.50
0.337
0.150
0.054
0.014
0.016
0.008
0.004
0
0.228
0.010
0.344
0.157
0.068
0.019
0.049
0.009
0.009
7
0.244
0.019
1.27 BSC
0.050 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
A
B
P
7 PL
G
C
K
SEATING
PLANE
D
14 PL
M
J
R
X 45
1
7
8
14
0.25 (0.010)
T
B
A
M
S
S
B
0.25 (0.010)
M
M
F
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 96501
ISSUE O
Z
D
HE
E
1
14
8
7
b
A1
A
e
L
DIM
MIN
MAX
MIN
MAX
INCHES
---
2.05
--- 0.081
MILLIMETERS
0.05
0.20
0.002
0.008
0.35
0.50
0.014
0.020
0.18
0.27
0.007
0.011
9.90
10.50
0.390
0.413
5.10
5.45
0.201
0.215
1.27 BSC
0.050 BSC
7.40
8.20
0.291
0.323
0.50
0.85
0.020
0.033
1.10
1.50
0.043
0.059
0
0.70
0.90
0.028
0.035
--- 1.42
--- 0.056
A1
A
b
c
D
E
e
L
M
Z
HE
Q1
LE
_
10
_
0
_
10
_
LE
Q1
c
M
_
VIEW P
DETAIL P
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5 THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
0.13 (0.005)
M
0.10 (0.004)
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