MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
2219
REV 6
Motorola, Inc. 1996
9/96
Triple Line Receiver
The MC10H116 is a functional/pinout duplication of the MC10116, with 100%
improvement in propagation delay and no increase in power supply current.
Propagation Delay, 1.0 ns Typical
Power Dissipation 85 mW Typ/Pkg (same as MECL 10K)
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
Voltage Compensated
MECL 10KCompatible
MAXIMUM RATINGS
Characteristic
Symbol
Rating
Unit
Power Supply (VCC = 0)
VEE
8.0 to 0
Vdc
Input Voltage (VCC = 0)
VI
0 to VEE
Vdc
Output Current -- Continuous
-- Surge
Iout
50
100
mA
Operating Temperature Range
TA
0 to +75
C
Storage Temperature Range -- Plastic
-- Ceramic
Tstg
55 to +150
55 to +165
C
C
ELECTRICAL CHARACTERISTICS (VEE = 5.2 V
5%) (2)
0
25
75
Characteristic
Symbol
Min
Max
Min
Max
Min
Max
Unit
Power Supply Current
IE
--
23
--
21
--
23
mA
Input Current High
IinH
--
150
--
95
--
95
A
Input Leakage Current
ICBO
--
1.5
--
1.0
--
1.0
A
Reference Voltage
VBB
1.38
1.27
1.35
1.25
1.31
1.19
Vdc
High Output Voltage
VOH
1.02
0.84
0.98
0.81
0.92
0.735
Vdc
Low Output Voltage
VOL
1.95
1.63
1.95
1.63
1.95
1.60
Vdc
High Input Voltage (1)
VIH
1.17
0.84
1.13
0.81
1.07
0.735
Vdc
Low Input Voltage (1)
VIL
1.95
1.48
1.95
1.48
1.95
1.45
Vdc
Common Mode
Range (3)
VCMR
--
--
2.85 to 0.8
--
--
Vdc
Input Sensitivity (4)
VPP
--
--
150 typ
--
--
mVPP
AC PARAMETERS
Propagation Delay
tpd
0.4
1.3
0.4
1.3
0.45
1.45
ns
Rise Time
tr
0.5
1.5
0.5
1.6
0.5
1.7
ns
Fall Time
tf
0.5
1.5
0.5
1.6
0.5
1.7
ns
NOTES:
1. When VBB is used as the reference voltage.
2. Each MECL 10H series circuit has been designed to meet the specifications shown in the test table, after thermal
equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse
air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50ohm resistor to 2.0 volts.
3. Differential input not to exceed 1.0 Vdc.
4. 150 mVpp differential input required to obtain full logic swing on output.
MC10H116
LOGIC DIAGRAM
DIP PIN ASSIGNMENT
VCC1
AOUT
AOUT
AIN
AIN
BOUT
BOUT
VEE
VCC2
COUT
COUT
CIN
CIN
VBB
BIN
BIN
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
5
4
11
3
2
10
9
7
6
13
12
15
14
*VBB to be used to supply bias to the MC10H116 only
and bypassed (when used) with 0.01
F to 0.1
F
capacitor to ground (0 V). VBB can source < 1.0 mA.
The MC10H116 is designed to be used in sensing
differential signals over long lines. The bias supply
(VBB) is made available to make the device useful as a
Schmitt trigger, or in other applications where a stable
reference voltage is necessary.
Active current sources provide these receivers with
excellent commonmode noise rejection. If any amplifi-
er in a package is not used, one input of that amplifier
must be connected to VBB to prevent unbalancing the
currentsource bias network.
The MC10H116 does not have internalinput pull-
down resistors. This provides high impedance to the
amplifier input and facilitates differential connections.
Applications:
Low Level Receiver
Voltage Level
Schmitt Trigger
Interface
When input pin with
bubble goes positive
it's respective output
pin with bubble goes
positive.
VCC1 = Pin 1
VCC2 = Pin 16
VEE = Pin 8
VBB*
L SUFFIX
CERAMIC PACKAGE
CASE 62010
P SUFFIX
PLASTIC PACKAGE
CASE 64808
D SUFFIX
PLASTIC SOIC
CASE 751B05
FN SUFFIX
PLCC
CASE 77502
Pin assignment is for DualinLine Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 611 of the Motorola MECL Data
Book (DL122/D).
MC10H116
MOTOROLA
MECL Data
DL122 -- Rev 6
2220
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 77502
ISSUE C
NOTES:
1. DATUMS L, M, AND N DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM T, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
M
N
L
Y BRK
W
V
D
D
S
LM
M
0.007 (0.180)
N
S
T
S
LM
M
0.007 (0.180)
N
S
T
S
LM
S
0.010 (0.250)
N
S
T
X
G1
B
U
Z
VIEW DD
20
1
S
LM
M
0.007 (0.180)
N
S
T
S
LM
M
0.007 (0.180)
N
S
T
S
LM
S
0.010 (0.250)
N
S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
T
SEATING
PLANE
S
LM
M
0.007 (0.180)
N
S
T
S
LM
M
0.007 (0.180)
N
S
T
H
VIEW S
K
K1
F
G1
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.385
0.395
9.78
10.03
B
0.385
0.395
9.78
10.03
C
0.165
0.180
4.20
4.57
E
0.090
0.110
2.29
2.79
F
0.013
0.019
0.33
0.48
G
0.050 BSC
1.27 BSC
H
0.026
0.032
0.66
0.81
J
0.020
0.51
K
0.025
0.64
R
0.350
0.356
8.89
9.04
U
0.350
0.356
8.89
9.04
V
0.042
0.048
1.07
1.21
W
0.042
0.048
1.07
1.21
X
0.042
0.056
1.07
1.42
Y
0.020
0.50
Z
2
10
2
10
G1
0.310
0.330
7.88
8.38
K1
0.040
1.02
_
_
_
_
MC10H116
2221
MOTOROLA
MECL Data
DL122 -- Rev 6
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 64808
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
A
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
1
8
9
16
K
PLANE
T
M
A
M
0.25 (0.010)
T
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.740
0.770
18.80
19.55
B
0.250
0.270
6.35
6.85
C
0.145
0.175
3.69
4.44
D
0.015
0.021
0.39
0.53
F
0.040
0.70
1.02
1.77
G
0.100 BSC
2.54 BSC
H
0.050 BSC
1.27 BSC
J
0.008
0.015
0.21
0.38
K
0.110
0.130
2.80
3.30
L
0.295
0.305
7.50
7.74
M
0
10
0
10
S
0.020
0.040
0.51
1.01
_
_
_
_
L SUFFIX
CERAMIC DIP PACKAGE
CASE 62010
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
A
B
T
F
E
G
N
K
C
SEATING
PLANE
16 PL
D
S
A
M
0.25 (0.010)
T
16 PL
J
S
B
M
0.25 (0.010)
T
M
L
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.750
0.785
19.05
19.93
B
0.240
0.295
6.10
7.49
C
0.200
5.08
D
0.015
0.020
0.39
0.50
E
0.050 BSC
1.27 BSC
F
0.055
0.065
1.40
1.65
G
0.100 BSC
2.54 BSC
H
0.008
0.015
0.21
0.38
K
0.125
0.170
3.18
4.31
L
0.300 BSC
7.62 BSC
M
0
15
0
15
N
0.020
0.040
0.51
1.01
_
_
_
_
16
9
1
8
MC10H116
MOTOROLA
MECL Data
DL122 -- Rev 6
2222
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
1
8
16
9
SEATING
PLANE
F
J
M
R
X 45
_
G
8 PL
P
B
A
M
0.25 (0.010)
B
S
T
D
K
C
16 PL
S
B
M
0.25 (0.010)
A
S
T
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
9.80
10.00
0.386
0.393
B
3.80
4.00
0.150
0.157
C
1.35
1.75
0.054
0.068
D
0.35
0.49
0.014
0.019
F
0.40
1.25
0.016
0.049
G
1.27 BSC
0.050 BSC
J
0.19
0.25
0.008
0.009
K
0.10
0.25
0.004
0.009
M
0
7
0
7
P
5.80
6.20
0.229
0.244
R
0.25
0.50
0.010
0.019
_
_
_
_
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals"
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arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
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Opportunity/Affirmative Action Employer.
How to reach us:
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MC10H116/D
*MC10H116/D*
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