MC12079
SEMICONDUCTOR
TECHNICAL DATA
MECL PLL COMPONENTS
64/128/256 PRESCALER
Order this document by MC12079/D
P SUFFIX
PLASTIC PACKAGE
CASE 626
PIN CONNECTIONS
D SUFFIX
PLASTIC PACKAGE
CASE 751
(SO8)
8
1
1
8
IN
(Top View)
8
IN
VCC
SW1
OUT
NC
SW2
Gnd
7
6
5
1
2
3
4
Device
Operating
Temperature Range
Package
ORDERING INFORMATION
MC12079D
MC12079P
TA = 40
to +85
C
SO8
Plastic
2.8 GHz Prescaler
The MC12079 is a single modulus divide by 64, 128, 256 prescaler for low
power frequency division of a 2.8 GHz (typical) high frequency input signal.
Divide ratio control inputs SW1 and SW2 select the required divide ratio of
64,
128, or
256.
An external load resistor is required to terminate the output. A 1.2 k
resistor is recommended to achieve a 1.6 Vpp output swing, when dividing a
1.1 GHz input signal by the minimum divide ratio of 64, assuming a 12 pF
load. Output current can be minimized dependent on conditions such as
output frequency, capacitive load being driven, and output voltage swing
required. Typical values for load resistors are included in the Vout
specification for various divide ratios at 2.8 GHz input frequency.
2.8 GHz Toggle Frequency
Supply Voltage 4.5 to 5.5 V
Low Power 9mA Typical at VCC = 5.0 V
Operating Temperature Range of 40 to 85
C
FUNCTIONAL TABLE
SW1
SW2
Divide Ratio
H
H
64
H
L
128
L
H
128
L
L
256
NOTE:
SW1 & SW2: H = VCC, L = Open.
MAXIMUM RATINGS
Characteristic
Symbol
Range
Unit
Power Supply Voltage, Pin 2
VCC
0.5 to 7.0
Vdc
Operating Temperature Range
TA
40 to 85
C
Storage Temperature Range
Tstg
65 to 150
C
Maximum Output Current, Pin 4
IO
4.0
mA
NOTE:
ESD data available upon request.
Motorola, Inc. 1997
Rev 3
MC12079
2
MOTOROLA RF/IF DEVICE DATA
ELECTRICAL CHARACTERISTICS (VCC = 4.5 to 5.5 V; TA = 40 to 85
C, unless otherwise noted.)
Parameter
Symbol
Min
Typ
Max
Unit
Toggle Frequency (Sine Wave)
ft
0.25
3.4
2.8
GHz
Supply Current Output (Pin 2)
ICC
9.0
11.5
mA
Input Voltage Sensitivity
250500 MHz
5002800 MHz
Vin
400
100
1000
1000
mVpp
Divide Ratio Control Input High (SW)
VIH
VCC
VCC
VCC
V
Divide Ratio Control Input Low (SW)
VIL
Open
Open
Open
Output Voltage Swing
(CL = 12 pF; RL = 1.2 k
; IO = 2.7 mA)1
(CL = 12 pF; RL = 2.2 k
; IO = 1.5 mA)2
(CL = 12 pF; RL = 3.9 k
; IO = 0.85 mA)3
Vout
1.0
1.6
Vpp
NOTES: 1. Divide ratio of
64 at 2.8 GHz.
2. Divide ratio of
128 at 2.8 GHz.
3. Divide ratio of
256 at 2.8 GHz.
D
QB
C
Q
D
Q
C
QB
D
QB
C
Q
In
In
Out
Figure 1. Logic Diagram (MC12079)
D
Q
C
QB
D
QB
C
Q
D
QB
C
Q
D
QB
C
Q
D
QB
C
Q
SW2
SW1
Figure 2. AC Test Circuit
SINE WAVE GENERATOR
50
C1
C2
C3
VCC = 4.5 to 5.5 V
CL
RL
VCC
IN
IN
GND
OUT
EXTERNAL COMPONENTS
C1 = C2 = 1000 pF
C3 = 0.1
F
CL = 12 pF (Including Scope and Jig Capacitance)
RL = 1.2 k
(for
64 at 2.8 GHz)
SW2
SW1
MC12079
4
MOTOROLA RF/IF DEVICE DATA
P SUFFIX
PLASTIC PACKAGE
CASE 62605
ISSUE K
D SUFFIX
PLASTIC PACKAGE
CASE 75106
(SO8)
ISSUE T
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
1
4
5
8
F
NOTE 2
A
B
T
SEATING
PLANE
H
J
G
D
K
N
C
L
M
M
A
M
0.13 (0.005)
B
M
T
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
9.40
10.16
0.370
0.400
B
6.10
6.60
0.240
0.260
C
3.94
4.45
0.155
0.175
D
0.38
0.51
0.015
0.020
F
1.02
1.78
0.040
0.070
G
2.54 BSC
0.100 BSC
H
0.76
1.27
0.030
0.050
J
0.20
0.30
0.008
0.012
K
2.92
3.43
0.115
0.135
L
7.62 BSC
0.300 BSC
M
10
10
N
0.76
1.01
0.030
0.040
_
_
SEATING
PLANE
1
4
5
8
A
0.25
M
C B
S
S
0.25
M
B
M
h
q
C
X 45
_
L
DIM
MIN
MAX
MILLIMETERS
A
1.35
1.75
A1
0.10
0.25
B
0.35
0.49
C
0.19
0.25
D
4.80
5.00
E
1.27 BSC
e
3.80
4.00
H
5.80
6.20
h
0
7
L
0.40
1.25
q
0.25
0.50
_
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETER.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
D
E
H
A
B
e
B
A1
C
A
0.10
OUTLINE DIMENSIONS
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