1
Motorola Sensor Device Data
Integrated Silicon Pressure Sensor
Manifold Absolute Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated
and Calibrated
The Motorola MPX4250 series Manifold Absolute Pressure (MAP) sensor for turbo
boost engine control is designed to sense absolute air pressure within the intake
manifold. This measurement can be used to compute the amount of fuel required for
each cylinder.
The MPX4250 series sensor integrates onchip, bipolar op amp circuitry and thin film
resistor networks to provide a high level analog output signal and temperature
compensation. The small form factor and reliability of onchip integration make the
Motorola MAP sensor a logical and economical choice for automotive system designers.
Features
1.5% Maximum Error Over 0
to 85
C
Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine
Control Systems
Ideally Suited for Direct Microprocessor Interfacing
Patented Silicon Shear Stress Strain Gauge
Temperature Compensated Over 40
to +125
C
Offers Reduction in Weight and Volume Compared to Existing Hybrid Modules
Durable Epoxy Unibody Element
Ideal for NonAutomotive Applications
Application Examples
Manifold Sensing for Automotive Systems
PINS 4, 5 AND 6 ARE NO CONNECTS
Figure 1. Fully Integrated Pressure Sensor Schematic
VS
3
Xducer
SENSING
ELEMENT
1
Vout
2
GND
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
Senseon and Xducer are trademarks of Motorola, Inc.
Order this document
by MPX4250/D
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Motorola, Inc. 1997
MPX4250
SERIES
INTEGRATED
PRESSURE SENSOR
20 to 250 kPa (2.9 to 36.3 psi)
0.2 to 4.9 V OUTPUT
PIN NUMBER
NOTE: Pins 4, 5, and 6 are internal
device connections. Do not connect
to external circuitry or ground. Pin 1
is noted by the notch in the Lead.
BASIC CHIP
CARRIER ELEMENT
CASE 86708, STYLE 1
PORT OPTION
CASE 867B04, STYLE 1
1
2
3
Vout
Gnd
VS
4
5
6
N/C
N/C
N/C
REV 2
MPX4250 SERIES
2
Motorola Sensor Device Data
MAXIMUM RATINGS(1)
Parametrics
Symbol
Value
Unit
Overpressure(2) (P1 > P2)
Pmax
400
kPa
Burst Pressure(2) (P1 > P2)
Pburst
1000
kPa
Storage Temperature
Tstg
40 to +125
C
Operating Temperature
TA
40 to +125
C
1. TC = 25
C unless otherwise noted.
2. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
OPERATING CHARACTERISTICS
(VS = 5.1 Vdc, TA = 25
C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range(1)
POP
20
--
250
kPa
Supply Voltage(2)
VS
4.85
5.1
5.35
Vdc
Supply Current
Io
--
7.0
10
mAdc
Minimum Pressure Offset(3)
(0 to 85
C)
@ VS = 5.1 Volts
VFSS
4.622
4.692
4.762
Vdc
Full Scale Output(4)
(0 to 85
C)
@ VS = 5.1 Volts
VFSS
4.622
4.692
4.762
Vdc
Full Scale Span(5)
(0 to 85
C)
@ VS = 5.1 Volts
VFSS
4.622
4.692
4.762
Vdc
Accuracy(6)
(0 to 85
C)
--
--
--
1.5
%VFSS
Sensitivity
V/
P
--
20
--
mV/kPa
Response Time(7)
tR
--
1.0
--
ms
Output Source Current at Full Scale Output
lo+
--
0.1
--
mAdc
WarmUp Time(8)
--
--
20
--
ms
Offset Stability(9)
--
--
0.5
--
%VFSS
Decoupling circuit shown in Figure 3 required to meet electrical specifications.
MECHANICAL CHARACTERISTICS
Characteristics
Symbol
Min
Typ
Max
Unit
Weight, Basic Element (Case 867)
--
--
4.0
--
Grams
Common Mode Line Pressure(10)
--
--
--
690
kPa
NOTES:
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25
C.
TcSpan:
Output deviation over the temperature range of 0
to 85
C, relative to 25
C.
TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0
to 85
C, relative
to 25
C.
Variation from Nominal:
The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25
C.
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
8. Warmup is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
10. Common mode pressures beyond what is specified may result in leakage at the casetolead interface.
MPX4250 SERIES
3
Motorola Sensor Device Data
Figure 2. CrossSectional Diagram
(Not to Scale)
PROCESSOR
A/D
51 k
50 pF
MPX4250A
OUPUT
(PIN 1)
Figure 3. Typical Decoupling Filter for Sensor to
Microprocessor Interface
SILICONE
DIE COAT
WIRE BOND
STAINLESS STEEL
METAL COVER
RTV DIE
BOND
DIE
P1
P2
EPOXY
CASE
LEAD FRAME
SEALED VACUUM REFERENCE
Figure 2 illustrates the absolute sensing chip in the basic
chip carrier (Case 867). A fluorosilicone gel isolates the die
surface and wire bonds from the environment, while allowing
the pressure signal to be transmitted to the sensor dia-
phragm. The MPX4250A series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor per-
formance and longterm reliability. Contact the factory for in-
formation regarding media compatibility in your application.
Figure 3 shows a typical decoupling circuit for interfacing
the integrated MAP sensor to the A/D input of a microproces-
sor. Proper decoupling of the power supply is recommended.
Figure 4 shows the sensor output signal relative to pres-
sure input. Typical, minimum, and maximum output curves
are shown for operation over temperature range of 0
to
85
C. (The output will saturate outside of the specified pres-
sure range.)
0
OUTPUT
(V
olts)
5.0
4.5
4.0
3.5
3.0
PRESSURE (ref: to sealed vacuum) in kPa
MAX
MIN
0
10
20
30
40 50
60
70
80
90
100
120
130
140
150
160
170
180
190
200
210
220
230
2.5
2.0
1.5
1.0
0.5
Figure 4. Output versus Absolute Pressure
240
250
260
11
0
TYP
TRANSFER FUNCTION:
Vout = VS* (0.004 x P0.04)
Error
VS = 5.1 Vdc
TEMP = 0 to 85
C
MPX4250 SERIES
4
Motorola Sensor Device Data
ORDERING INFORMATION
The MPX4250A series Turbo MAP silicon pressure sensors are available in the basic element package or with pressure port
fittings that provide mounting ease and barbed hose connections.
Device Type
Options
Case No.
MPX Series Order No.
Marking
Basic Element
Absolute, Element
Case 86708
MPX4250A
MPX4250A
Absolute, Ported
Case 867B04
MPX4250AP
MPX4250AP
Ported Elements
Absolute, Stove Pipe Port
Case 867E03
MPX4250AS
MPX4250A
Absolute, Axial Port
Case 867F03
MPX4250ASX
MPX4250A
Transfer Function
Nominal Transfer Value: Vout = VS (P x 0.004 0.04)
Nominal Transfer Value:
+/ (Pressure Error x Temp. Factor x 0.004 x VS)
Nominal Transfer Value:
VS = 5.1 V
0.25 Vdc
Temperature Error Band
Temp
Multiplier
40
3
0 to 85
1
+125
3
Temperature in C
4.0
3.0
2.0
0.0
1.0
40
20
0
20
40
60
140
120
100
80
MPX4250A Series
Temperature
Error
Factor
Pressure Error Band
Pressure in kPa
Pressure
Error (Max)
20 to 250 kPa
3.45 (kPa)
9.0
6.0
3.0
3.0
6.0
9.0
75 100 125 150 175 200
Pressure Error (kPa)
225
25
50
250
NOTE: The Temperature Multiplier is a linear response from 0
to 40
C and from 85
to 125
C.
MPX4250 SERIES
5
Motorola Sensor Device Data
PACKAGE DIMENSIONS
BASIC ELEMENT (D)
CASE 86708
ISSUE N
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
PIN 1
F
G
N
L
R
C
B
M
J
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
A
1
2
3
4
5
6
6 PL
D
SEATING
PLANE
T
M
A
M
0.136 (0.005)
T
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.595
0.630
15.11
16.00
B
0.514
0.534
13.06
13.56
C
0.200
0.220
5.08
5.59
D
0.027
0.033
0.68
0.84
F
0.048
0.064
1.22
1.63
G
0.100 BSC
2.54 BSC
J
0.014
0.016
0.36
0.40
L
0.695
0.725
17.65
18.42
M
30 NOM
30 NOM
N
0.475
0.495
12.07
12.57
R
0.430
0.450
10.92
11.43
S
0.090
0.105
2.29
2.66
_
_
POSITIVE PRESSURE
(P1)
PRESSURE SIDE PORTED (AP)
CASE 867B04
ISSUE E
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
SEATING
PLANE
T
R
N
C
J
PIN 1
P
M
Q
M
0.25 (0.010)
T
B
6 PL
D
G
F
S
K
V
S
P
M
0.13 (0.005)
Q
S
T
PORT #1
POSITIVE
PRESSURE (P1)
Q
L
U
A
1
2
3
4
5
6
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
1.145
1.175
29.08
29.85
B
0.685
0.715
17.40
18.16
C
0.305
0.325
7.75
8.26
D
0.027
0.033
0.68
0.84
F
0.048
0.064
1.22
1.63
G
0.100 BSC
2.54 BSC
J
0.014
0.016
0.36
0.41
K
0.695
0.725
17.65
18.42
L
0.290
0.300
7.37
7.62
N
0.420
0.440
10.67
11.18
P
0.153
0.159
3.89
4.04
Q
0.153
0.159
3.89
4.04
R
0.230
0.250
5.84
6.35
S
U
0.910 BSC
23.11 BSC
V
0.182
0.194
4.62
4.93
0.220
0.240
5.59
6.10
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