1
Motorola Sensor Device Data
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated
and Calibrated
The MPX5700 series piezoresistive transducer is a stateoftheart monolithic silicon
pressure sensor designed for a wide range of applications, but particularly those
employing a microcontroller or microprocessor with A/D inputs. This patented, single
element transducer combines advanced micromachining techniques, thinfilm metalliza-
tion, and bipolar processing to provide an accurate, high level analog output signal that
is proportional to the applied pressure.
Features
2.5% Maximum Error over 0
to 85
C
Ideally Suited for Microprocessor or MicrocontrollerBased Systems
Available in Differential and Gauge Configurations
Patented Silicon Shear Stress Strain Gauge
Durable Epoxy Unibody Element
Figure 1. Fully Integrated Pressure Sensor Schematic
VS
3
Xducer
SENSING
ELEMENT
1
Vout
2
GND
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
PINS 4, 5 AND 6 ARE NO CONNECTS
MAXIMUM RATINGS(1)
Parametrics
Symbol
Value
Unit
Overpressure (P2
v
1 Atmosphere)
P1max
2800
kPa
Burst Pressure (P2
v
1 Atmosphere)
P1burst
5000
kPa
Storage Temperature
Tstg
40 to +125
C
Operating Temperature
TA
40 to +125
C
1. TC = 25
C unless otherwise noted. Maximum Ratings apply to Case 86708 only.
2. Extended exposure at the specified limits may cause permanent damage or degradation to the device.
3. This sensor is designed for applications where P1 is always greater than, or equal to P2.
Senseon and Xducer are trademarks of Motorola, Inc.
Order this document
by MPX5700/D
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Motorola, Inc. 1997
MPX5700
SERIES
INTEGRATED
PRESSURE SENSOR
0 to 700 kPa (0 to 101.5 psi)
0.2 to 4.7 V OUTPUT
PIN NUMBER
NOTE: Pins 4, 5, and 6 are internal
device connections. Do not connect
to external circuitry or ground. Pin 1
is noted by the notch in the Lead.
BASIC CHIP
CARRIER ELEMENT
CASE 86708, STYLE 1
DIFFERENTIAL
PORT OPTION
CASE 867C05, STYLE 1
1
2
3
Vout
Gnd
VS
4
5
6
N/C
N/C
N/C
REV 2
MPX5700 SERIES
2
Motorola Sensor Device Data
OPERATING CHARACTERISTICS
(VS = 5.0 Vdc, TA = 25
C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range(1)
POP
0
--
700
kPa
Supply Voltage(2)
VS
4.75
5.0
5.25
Vdc
Supply Current
Io
7.0
10
mAdc
Zero Pressure Offset(3)
(0 to 85
C)
Voff
0.088
0.2
0.313
Vdc
Full Scale Output(4) (0
to
85
C)
VFSO
4.587
4.7
4.813
Vdc
Full Scale Span(5) (0
to
85
C)
VFSS
--
4.5
--
Vdc
Accuracy(6)
(0 to 85
C)
--
--
--
2.5
%VFSS
Sensitivity
V/P
--
6.4
--
mV/kPa
Response Time(7)
tR
--
1.0
--
ms
Output Source Current at Full Scale Output
IO+
--
0.1
--
mAdc
WarmUp Time(8)
--
--
20
--
ms
Decoupling circuit shown in Figure 4 required to meet electrical specifications.
MECHANICAL CHARACTERISTICS
Characteristic
Symbol
Min
Typ
Max
Unit
Weight, Basic Element (Case 867)
--
--
4.0
--
Grams
Cavity Volume
--
--
--
0.01
IN3
Volumetric Displacement
--
--
--
0.001
IN3
NOTES:
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25
C.
TcSpan:
Output deviation over the temperature range of 0
to 85
C, relative to 25
C.
TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0
to 85
C, relative
to 25
C.
Variation from Nominal:
The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25
C.
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
8. Warmup is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized.
9. P2 max is 500 kPa.
MPX5700 SERIES
3
Motorola Sensor Device Data
ONCHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
Figure 3 illustrates both the Differential/Gauge and the Ab-
solute Sensing Chip in the basic chip carrier (Case 867). A
fluorosilicone gel isolates the die surface and wire bonds from
the environment, while allowing the pressure signal to be
transmitted to the sensor diaphragm. (For use of the
MPX5700D in a high pressure, cyclic application, consult the
factory.)
The MPX5700 series pressure sensor operating character-
istics, and internal reliability and qualification tests are based
on use of dry air as the pressure media. Media, other than dry
air, may have adverse effects on sensor performance and
longterm reliability. Contact the factory for information re-
garding media compatibility in your application.
Figure 4 shows a typical decoupling circuit for interfacing
the sensor to the A/D input of a microprocessor. Proper de-
coupling of the power supply is recommended.
Figure 2 shows the sensor output signal relative to pres-
sure input. Typical, minimum, and maximum output curves
are shown for operation over a temperature range of 0
to
85
C using the decoupling circuit below. (The output will sat-
urate outside of the specified pressure range.)
DIFFERENTIAL PRESSURE (kPa)
Figure 2. Output versus Pressure Differential
5.0
4.0
3.0
2.0
0
700
300
0
500
4.5
3.5
2.5
1.5
100
1.0
0.5
600
200
800
400
TYPICAL
OUTPUT
(V)
TRANSFER FUNCTION:
Vout = VS*(0.0012858*P+0.04)
ERROR
VS = 5.0 Vdc
TEMP = 0 to 85
C
MAX
MIN
FLUORO SILICONE
DIE COAT
LEAD
FRAME
STAINLESS STEEL
METAL COVER
RTV DIE
BOND
DIE
EPOXY CASE
WIRE BOND
Figure 3. CrossSectional Diagram
(Not to Scale)
PROCESSOR
A/D
51 k
50 pF
MPX5700
OUTPUT
(PIN 1)
Figure 4. Typical Decoupling Filter for Sensor to
Microprocessor Interface
P1
P2
MPX5700 SERIES
4
Motorola Sensor Device Data
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluoro silicone gel
which protects the die from harsh media. The Motorola MPX
pressure sensor is designed to operate with positive differen-
tial pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the table
below:
Part Number
Case Type
Pressure (P1)
Side Identifier
MPX5700D
86708
C
Stainless Steel Cap
MPX5700DP
867C05
Side with Part Marking
MPX5700GP
867B04
Side with Port Attached
MPX5700GS
867E03
Side with Port Attached
MPX5700GSX
867F03
Side with Port Attached
ORDERING INFORMATION
The MPX5700 pressure sensor is available in differential and gauge configurations. Devices are available in the basic ele-
ment package or with pressure port fittings that provide printed circuit board mounting ease and barbed hose pressure connec-
tions.
D
i
T
O
i
C
T
MPX Series
Device Type
Options
Case Type
Order Number
Device Marking
Basic Element
Differential
86708
C
MPX5700D
MPX5700D
Ported Elements
Differential Dual Ports
867C05
MPX5700DP
MPX5700DP
Gauge
867B04
MPX5700GP
MPX5700GP
Gauge, Axial
867E03
MPX5700GS
MPX5700D
Gauge, Axial PC Mount
867F03
MPX5700GSX
MPX5700D
MPX5700 SERIES
5
Motorola Sensor Device Data
PACKAGE DIMENSIONS
BASIC ELEMENT (A, D)
CASE 86708
ISSUE N
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.595
0.630
15.11
16.00
B
0.514
0.534
13.06
13.56
C
0.200
0.220
5.08
5.59
D
0.027
0.033
0.68
0.84
F
0.048
0.064
1.22
1.63
G
0.100 BSC
2.54 BSC
J
0.014
0.016
0.36
0.40
L
0.695
0.725
17.65
18.42
M
30 NOM
30 NOM
N
0.475
0.495
12.07
12.57
R
0.430
0.450
10.92
11.43
S
0.090
0.105
2.29
2.66
_
_
PIN 1
F
G
N
L
R
C
B
M
J
S
A
1
2
3
4
5
6
6 PL
D
SEATING
PLANE
T
M
A
M
0.136 (0.005)
T
POSITIVE PRESSURE
(P1)
PRESSURE SIDE PORTED (AP, GP)
CASE 867B04
ISSUE E
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
1.145
1.175
29.08
29.85
B
0.685
0.715
17.40
18.16
C
0.305
0.325
7.75
8.26
D
0.027
0.033
0.68
0.84
F
0.048
0.064
1.22
1.63
G
0.100 BSC
2.54 BSC
J
0.014
0.016
0.36
0.41
K
0.695
0.725
17.65
18.42
L
0.290
0.300
7.37
7.62
N
0.420
0.440
10.67
11.18
P
0.153
0.159
3.89
4.04
Q
0.153
0.159
3.89
4.04
R
0.230
0.250
5.84
6.35
S
U
0.910 BSC
23.11 BSC
V
0.182
0.194
4.62
4.93
0.220
0.240
5.59
6.10
SEATING
PLANE
T
R
N
C
J
PIN 1
P
M
Q
M
0.25 (0.010)
T
B
6 PL
D
G
F
S
K
V
S
P
M
0.13 (0.005)
Q
S
T
PORT #1
POSITIVE
PRESSURE (P1)
Q
L
U
A
1
2
3
4
5
6
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