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Электронный компонент: XMMA1000P

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1
Motorola Sensor Device Data
Micromachined Accelerometer
The XMMA series of silicon capacitive, micromachined accelerometers
features; signal conditioning, a 4pole low pass filter and temperature
compensation. Zerog offset full scale span and filter cutoff are factory set and
require no external devices. A full system selftest capability verifies system
functionality.
The XMMA series of accelerometers is suitable for automotive crash
detection and recording, vibration monitoring, automotive suspension control,
appliance control systems, etc.
Features
Minimum Full Scale Measurement
44g
Calibrated, SelfTest
Integral Signal Conditioning and 4Pole Filter
Linear Output
Robust, High Shock Survivability
Ratiometric
GCell, Hermetically Sealed at Wafer Level
Two Packaging Options Available:
1) Plastic DIP for Z Axis Sensing (XMMA1000P)
2) Wingback for X Axis Sensing (XMMA2000W)
Typical Applications
Automotive Crash Detection and Recording
Automotive Suspension Control
Vibration Monitoring and Recording
Appliance Control
Mechanical Bearing Monitoring
Computer Hard Drive Protection
Computer Mouse and Joysticks
Virtual Reality Input Devices
Sports Diagnostic Devices and Systems
SIMPLIFIED ACCELEROMETER FUNCTIONAL BLOCK DIAGRAM
GCELL
SENSOR
INTEGRATOR
GAIN
FILTER
TEMP
COMP
SELFTEST
CONTROL LOGIC &
EPROM TRIM CIRCUITS
CLOCK GEN.
OSCILLATOR
VDD
VOUT
VSS
VST
Senseon is a trademark of Motorola, Inc.
Replaces MMA1000P/D
Order this document
by XMMA1000P/D
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
XMMA1000P
XMMA2000W
DIP PACKAGE
CASE 648C03
XMMA1000P
XMMA1000: Z AXIS SENSITIVITY
XMMA2000: X AXIS SENSITIVITY
MICROMACHINED
ACCELEROMETER
50g
1
2 3
4 5
6 7
8
9
10
11
12
13
14
15
16
1
2
3
4
5
6
WB PACKAGE
CASE 45603
XMMA2000W
Motorola, Inc. 1997
XMMA1000P XMMA2000W
2
Motorola Sensor Device Data
MAXIMUM RATINGS
(Maximum ratings are the limits to which the device can be exposed without causing permanent damage.)
Rating
Symbol
Value
Unit
Powered Acceleration (all axis)
Gpd
500
g
Unpowered Acceleration (all axis)
Gupd
2000
g
Supply Voltage
VDD
0.3 to +7.0
V
Drop Test(1)
Ddrop
1.2
m
Storage Temperature Range
Tstg
40 to +105
C
OPERATING RANGE
(These limits define the range of operation for which the part will meet specification.)
Characteristic
Symbol
Min
Typ
Max
Unit
Supply Voltage(2)
VDD
4.75
5.0
5.25
V
Supply Current
IDD
1.0
4.0
5.0
mA
Operating Temperature Range
TA
40
--
+85
C
NOTES:
1. Dropped onto concrete surface from any axis.
2. Within the supply range of 4.75 and 5.25 volts, the device operates as a fully calibrated linear accelerometer. Beyond these supply limits
the device may operate as a linear device but is not guaranteed to be in calibration.
ELECTRO STATIC DISCHARGE (ESD)
Due to the technological advancing semiconductor indus-
try, it has now become increasingly important for semicon-
ductor manufacturers, users of semiconductors and other
electronic components to fully understand the nature and
sources of ESD. More importantly, a thorough understanding
of its impact on quality and reliability must be understood.
Whereas the Motorola accelerometers contain internal
2kV ESD protection circuitry, extra precaution must be taken
by the user to protect the chip from ESD. A charge of over
2000 volts can accumulate on the human body or associated
Automated Test Equipment (ATE). A charge of this magni-
tude can alter the performance or cause failure of the chip.
When proper ESD precautions are followed the discharges
will not be detrimental to the chips performance.
FREQUENTLY ASKED QUESTIONS
Q. What is the gcell?
A. The gcell is the acceleration transducer within the accel-
erometer device. It is hermetically sealed at the wafer level to
ensure a contaminant free environment, resulting in superior
reliability performance.
Q. What does the output typically interface with?
A. The accelerometer device is designed to interface with an
analog to digital converter available on most microcontrol-
lers. The output has a 2.5 V DC offset, therefore positive and
negative acceleration is measurable.
Q. What is the orientation of the gforce in relation to the
output voltage?
A. The accelerometer responds to g forces perpendicular to
the plane of the package. For acceleration directed onto the
top of the package, the output voltage will increase above the
nominal 2.5 V. For acceleration directed away from the top of
the package, the output will decrease below 2.5 V. Refer to
the "Positive Acceleration Sensing Direction'' diagram on
page 7.
Q. What is the resonant frequency of the gcell?
A. The accelerometer's gcell is overdamped. The first reso-
nant mode of the package is 10 kHz for the DIP and 5 kHz for
the Wingback.
Q. What is ratiometricity?
A. Ratiometricity is the sensors ability to track changes in
supply voltage. This is a key feature when interfacing to a
microcontroller or an A/D converter. Ratiometricity allows for
system level cancellation of supply induced errors in the ana-
log to digital conversion process. Refer to the Special Fea-
tures section under the Principle of Operation for more
information.
Q. Is the accelerometer device sensitive to electrostatic
discharge (ESD)?
A. Yes . . . the SENSEON accelerometer should be handled
like other CMOS technology devices.
Q. Can the gcell part "latch''?
A. No, overrange stops have been designed into the gcell
to prevent latching. (Latching is when the middle plate of the
gcell sticks to either the upper or lower plate.)
XMMA1000P XMMA2000W
3
Motorola Sensor Device Data
OPERATING CHARACTERISTICS
(Unless otherwise noted: 40
v
TA
v
+85
, 4.75
v
VDD
v
5.25, Acceleration = 0g, Loaded output(1))
Characteristic
Symbol
Min
Typ
Max
Unit
Sensitivity (TA = 25
C, VDD = 5.0 V)(2)
S
37.2
40
42.8
mV/g
Sensitivity(2)
S
7.36
8.0
8.64
mV/V/g
Zero Accel Output(3) (VDD = 5.0 V)
VOFF
2.2
2.5
2.8
V
Zero Accel Output
VOFF
0.44 VDD
0.5 VDD
0.56 VDD
V
Acceleration Range(4)
G
44
50
--
g
Noise (10 Hz to 400 Hz)(5)
VN
--
--
3.5
mVrms
Clock Noise(6)
VNC
--
2.0
--
mVpk
Filter Cut Off Frequency
F
*
3dB
360
400
440
Hz
SelfTest Output Response
GST
20
25
30
g
SelfTest Input Low
VIL
--
--
1.4
V
SelfTest Input High
VIH
3.7
--
--
V
SelfTest Input Loading(7)
IIN
30
60
120
A
SelfTest Response Time(8)
tST
--
2.0
--
ms
Electrical Saturation Recovery Time(9)
--
--
0.2
--
ms
Full Scale Output Range (IOUT = 200
A)
VFSO
0.3
--
VDD
*
0.3
V
Capacitive Load Drive(10)
CL
--
--
100
pF
Output Impedance
ZO
--
300
--
Nonlinearity
--
--
1.0
--
% FSO
Alignment Error
--
--
"
3.0
--
degrees
Transverse Sensitivity(11)
--
--
3.0
--
% FSO
Package Resonance (DIP/WB)
--
--
10/5
--
kHz
NOTES:
1. For a loaded output the measurements are observed after an RC filter consisting of a 1 k
resistor and a 0.01
F capacitor to ground.
2. The device is calibrated at 20g.
3. The device can measure both + and
*
acceleration. With no input acceleration the output is at midsupply. For positive acceleration the output
will increase above VDD/2 and for negative acceleration the output will decrease below VDD/2.
4. Refer to the Principle of Operation section for a sample g range calculation.
5. Refer to the Principle of Operation section for a sample rms to peak to peak calculation.
6. At clock frequency
^
65 kHz.
7. The digital input pin has an internal pulldown current source to prevent inadvertent self test initiation due to external board level leakages.
8. Time for the output to reach 90% of its final value after a selftest is initiated.
9. Time for amplifiers to recover after an acceleration signal causing them to saturate.
10. Preserves phase margin (60
) to guarantee output amplifier stability.
11. A measure of the devices ability to reject an acceleration applied 90
from the true axis of sensitivity.
XMMA1000P XMMA2000W
4
Motorola Sensor Device Data
Pinout description for the Wingback package:
1
2
3
4
5
6
Pin #
Pin Name
Description
1
--
No internal connection, tie to VSS
2
ST
Logic input pin to initiate self test
3
VOUT
Output voltage
4
--
No internal connection, tie to VSS
5
VSS
Signal ground
6
VDD
Supply voltage (5 V)
--
Wings
Support pins, internally connected to lead frame. Tie to VSS.
Pinout description for the DIP package:
1
2 3
4 5
6 7
8
9
10
11
12
13
14
15
16
Pin #
Pin Name
Description
1
--
No internal connection, tie to VSS
2
--
No internal connection, tie to VSS
3
--
No internal connection, tie to VSS
4
ST
Logic input pin to initiate self test
5
VOUT
Output voltage
6
--
No internal connection, tie to VSS
7
VSS
Signal ground
8
VDD
Supply voltage (5 V)
9
Trim 1
Used for factory trim, tie to VSS
10
Trim 2
Used for factory trim, tie to VSS
11
Trim 3
Used for factory trim, MUST tie to VDD
12
Trim 4
Used for factory trim, tie to VSS
13
Trim 5
Used for factory trim, tie to VSS
14
--
No internal connection, tie to VSS
15
--
No internal connection, tie to VSS
16
--
No internal connection, tie to VSS
XMMA1000P XMMA2000W
5
Motorola Sensor Device Data
PRINCIPLE OF OPERATION
The Motorola accelerometer is a surfacemicromachined
integratedcircuit accelerometer.
The device consists of a surface micromachined capaci-
tive sensing cell (Gcell) and a CMOS signal conditioning
ASIC contained in a single integrated circuit package. The
sensing element is sealed hermetically at the wafer level
using a bulk micromachined "cap'' wafer.
The GCell is a mechanical structure formed from semi-
conductor materials (polysilicon) using semiconductor pro-
cesses (masking and etching). It consists of two stationary
plates with a moveable plate inbetween. The center plate
can be deflected from its rest position by subjecting the sys-
tem to an acceleration (Figure 1).
When the center plate deflects, the distance from it to one
fixed plate will increase by the same amount that the dis-
tance to the other plate decreases. The change in distance is
a measure of acceleration.
The GCell plates form two backtoback capacitors
(Figure 2). As the center plate moves with acceleration, the
distance between the plates changes and each capacitor's
value will change, (C = A
/D). Where A is the area of the
plate,
is the dielectric constant, and D is the distance
between the plates.
The CMOS ASIC uses switched capacitor techniques to
measure the GCell capacitors and extract the acceleration
data from the difference between the two capacitors. The
ASIC also signal conditions and filters (switched capacitor)
the signal, providing a high level output voltage that is ratio-
metric and proportional to acceleration.
Acceleration
Figure 1.
Figure 2.
SPECIAL FEATURES
Filtering
The Motorola accelerometers contain an onboard 4pole
switched capacitor filter. A Bessel implementation is used
because it provides a maximally flat delay response (linear
phase) thus preserving pulse shape integrity. Because the fil-
ter is realized using switched capacitor techniques, there is
no requirement for external passive components (resistors
and capacitors) to set the cutoff frequency.
Noise Calculation
The noise for the Motorola accelerometer is specified as
an rms value which is a statistical value of a gaussian noise
source. To convert the rms values to a peak to peak value at
a particular confidence level refer to Table 1. A sample cal-
culation at a 99.9% confidence level is shown.
Table 1.
Nominal Peak to Peak Value
% Confidence Level
2.0
rms
68%
3.0
rms
87%
4.0
rms
95.40%
5.0
rms
98.80%
6.0
rms
99.73%
6.6
rms
99.90%
Noise rms = 3.5mVrms
Noise peak to peak at a 99.9% confidence level:
3.5mVrms* 6.6 = 23.1mVpp
SelfTest
XMMA sensors provide a selftest feature that allows the
verification of the mechanical and electrical integrity of the
accelerometer at any time before or after installation. This
feature is critical in applications such as automotive airbag
systems where system integrity must be ensured over the life
of the vehicle. A fourth "plate'' is used in the gcell as a self
test plate. This plate is fixed and is located under an ex-
tended portion of the center (moveable) plate. When the user
applies a logic high input to the selftest pin, a calibrated po-
tential is applied across the selftest plate and the moveable
plate. The resulting electrostatic force (Fe = 1/2 AV2/d2)
causes the center plate to deflect. The resultant deflection, is
measured by the accelerometer's control ASIC and a propor-
tional output voltage results. This procedure assures that
both the mechanical (gcell) and electronic sections of the
sensor are functioning.
Ratiometricity
The XMMA1000P and XMMA2000W are designed to be
"ratiometric''. That is, their transfer function will be propor-
tional to the applied supply voltage. This feature allows easy
interfacing to common microcontrollers that use ratiometric
A/D converters for system cost benefits.
In operation, a ratiometric sensor's gain or "sensitivity'' will
change 1:1 with applied supply voltage and the zero signal
output will be at midsupply. (2.5 V for a 5 V VDD and 2.625 V
for a 5.25 VDD).
Minimum G Range Calculation
To calculate the minimum g range values of an accelerom-
eter several factors have to be taken into consideration.
These considerations include, the supply voltage, the
device's sensitivity, offset voltage and output rail. A sample
calculation for the minimum g range is shown below.
To complete the calculation the rail and offset voltages
must be subtracted from the supply voltage, then divided by
the supply voltage multiplied by the device's worst case
(highest) sensitivity.
V
DD
*
0.56V
DD
*
0.3V
V
DD
(8.64mV V g)
+
0.44V
DD
*
0.3V
V
DD
(0.00864)
+
50.93
*
34.72
V
DD
g
Using the standard five volt power supply, the minimum g
range is calculated to be:
50.926
*
34.722
5.00
+
43.98
[
44g
XMMA1000P XMMA2000W
6
Motorola Sensor Device Data
BASIC CONNECTIONS
Circuit Schematic
Figure 3 shows the recommended connection diagram for
operating the accelerometer. Figure 3 (a) shows the 16 pin
DIP package version, the XMMA1000P, while (b) shows the
6 pin Wingback package version, the XMMA2000W. For the
XMMA1000P, pins 1, 2, 3, 6, 14, 15, and 16 have no internal
connections, and pins 9 through 13 are used for calibration
and trimming in the factory. These pins should all be con-
nected to VSS, except pin 11 which must be connected to
VDD. For the XMMA2000W, pins 1 and 4, and the wings
(supporting pins) should be connected to VSS.
XMMA1000P
ST
VDD
TRIM 3
VSS
VOUT
OUTPUT
SIGNAL
R1
1 k
5
C2
0.01
F
4
8
11
7
LOGIC
INPUT
VDD
C1
0.1
F
(a)
XMMA2000W
ST
VDD
VSS
VOUT
OUTPUT
SIGNAL
R1
1 k
3
C2
0.01
F
2
6
5
LOGIC
INPUT
VDD
C1
0.1
F
(b)
Figure 3. Accelerometers with Recommended
Connection Diagram
PCB Layout
P0
A/D IN
VRH
VSS
VDD
ST
VOUT
VSS
VDD
0.01
F
C
1 k
0.1
F
C 0.1
F
POWER SUPPLY
C
R
C
0.1
F
MICROCONTROLLER
ACCELEROMETER
NOTES:
Use a .1
F capacitor on VDD to decouple the power source.
Physical coupling distance of the accelerometer to the
microcontroller should be minimal.
Place a ground plane beneath the accelerometer to reduce
noise, the ground plane should be attached to all of the
open ended terminals shown above.
Use independent supply traces for the A/D reference
(microcontroller) and the accelerometer.
Use an RC filter of 1 k
and 0.01
F on the output of the
accelerometer to minimize induced errors.
PCB layout of power and ground should not couple power
supply noise.
Accelerometer and microcontroller should not be a high
current path.
For ratiometricity purposes the accelerometer VDD and mi-
crocontroller A/D reference pin should be on the same
trace.
A/D sampling rate and any external power supply switching
frequency should be selected such that they do not inter-
fere with the internal accelerometer sampling frequency.
This will prevent aliasing errors.
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals"
must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
XMMA1000P XMMA2000W
7
Motorola Sensor Device Data
16
9
1
8
*
DIP PACKAGE
* When positioned as shown, the Earth's gravity will result in a positive 1g output
Positive Acceleration Sensing Direction
WINGBACK PACKAGE
12
1
6
7
*
.13
0.088
0.588
.100 .200 .300 .400 .500
.000
.095 2X
.000
.045 2X
.030 6X
PIN 1
.627
Measurement in inches
Drilling Patterns
WB PACKAGE DRILLING PATTERN
ORDERING INFORMATION
Device
Temperature Range
Case No.
Package
XMMA1000P
40 to +85
C
Case 648C03
Plastic DIP
XMMA2000W
40 to +85
C
Case 45603
Plastic Wingback
XMMA1000P XMMA2000W
8
Motorola Sensor Device Data
PACKAGE DIMENSIONS
CASE 648C03
ISSUE C
DIP PACKAGE
A
B
16
9
1
8
F
D
G
E
N
K
C
NOTE 5
16 PL
S
A
M
0.13 (0.005)
T
T
SEATING
PLANE
S
B
M
0.13 (0.005)
T
J
16 PL
M
L
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.740
0.840
18.80
21.34
B
0.240
0.260
6.10
6.60
C
0.145
0.185
3.69
4.69
D
0.015
0.021
0.38
0.53
E
0.050 BSC
1.27 BSC
F
0.040
0.70
1.02
1.78
G
0.100 BSC
2.54 BSC
J
0.008
0.015
0.20
0.38
K
0.115
0.135
2.92
3.43
L
0.300 BSC
7.62 BSC
M
0
10
0
10
N
0.015
0.040
0.39
1.01
_
_
_
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. INTERNAL LEAD CONNECTION BETWEEN 4 AND
5, 12 AND 13.
CASE 45603
ISSUE D
WB PACKAGE
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
15.70
0.638
0.618
16.21
B
6.35
0.270
0.250
6.86
C
3.30
0.135
0.130
3.43
D
0.38
0.021
0.015
0.53
E
8.33
0.368
0.328
9.35
G
0.100 BSC
2.54 BSC
H
0.050 BSC
1.27 BSC
J
0.009
0.012
0.23
0.30
K
0.125
0.140
3.18
3.56
L
0.063
0.070
1.60
1.78
M
0.015
0.025
0.38
0.64
N
0.036
0.044
0.91
1.12
P
0.110
0.120
2.79
3.05
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
A
M
A
M
0.13 (0.005)
B
M
T
12
1
6
7
G
H
K
D
6 PL
C
B
L
J
N
P
E
T
M
F
F
2.84
0.112
3.05
0.120
S
S
0.025
0.035
0.64
0.89
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XMMA1000P/D