Semiconductor Components Industries, LLC, 2000
March, 2000 Rev. 0
1
Publication Order Number:
BAS16TT1/D
BAS16TT1
Preferred Device
Advance Information
Silicon Switching Diode
MAXIMUM RATINGS
(T
A
= 25
C)
Rating
Symbol
Max
Unit
Continuous Reverse Voltage
V
R
75
V
Recurrent Peak Forward Current
I
F
200
mA
Peak Forward Surge Current
Pulse Width = 10
m
s
I
FM(surge)
500
mA
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Power Dissipation,
(1)
T
A
= 25
C
P
D
150
mW
Operating and Storage Junction
Temperature Range
T
J
, T
stg
55 to
+150
C
Thermal Resistance,
Junction to Ambient
R
JA
833
C/W
(1) Device mounted on FR4 glass epoxy printed circuit board using the
minimum recommended footpad.
This document contains information on a new product. Specifications and information
herein are subject to change without notice.
Device
Package
Shipping
ORDERING INFORMATION
BAS16TT1
SOT416
http://onsemi.com
CASE 463
SOT416/SC75
STYLE 2
3000 / Tape & Reel
DEVICE MARKING
A6
3
2
1
Preferred devices are recommended choices for future use
and best overall value.
3
CATHODE
1
ANODE
BAS16TT1
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2
ELECTRICAL CHARACTERISTICS
(T
A
= 25
C unless otherwise noted)
Characteristic
Symbol
Min
Max
Unit
Forward Voltage
(I
F
= 1.0 mA)
(I
F
= 10 mA)
(I
F
= 50 mA)
(I
F
= 150 mA)
V
F
--
--
--
--
715
866
1000
1250
mV
Reverse Current
(V
R
= 75 V)
(V
R
= 75 V, T
J
= 150
C)
(V
R
= 25 V, T
J
= 150
C)
I
R
--
--
--
1.0
50
30
A
Capacitance
(V
R
= 0, f = 1.0 MHz)
C
D
--
2.0
pF
Reverse Recovery Time
(I
F
= I
R
= 10 mA, R
L
= 50
) (Figure 1)
t
rr
--
6.0
ns
Stored Charge
(I
F
= 10 mA to V
R
= 6.0 V, R
L
= 500
) (Figure 2)
QS
--
45
PC
Forward Recovery Voltage
(I
F
= 10 mA, t
r
= 20 ns) (Figure 3)
V
FR
--
1.75
V
BAS16TT1
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3
Figure 1. Reverse Recovery Time Equivalent Test Circuit
Figure 2. Recovery Charge Equivalent Test Circuit
Figure 3. Forward Recovery Voltage Equivalent Test Circuit
V
F
1 ns MAX
90%
10%
t
100 ns
t
if
t
rr
I
rr
500
DUT
50
DUTY CYCLE = 2%
V
f
90%
10%
20 ns MAX
t
400 ns
V
C
V
CM
t
VCM +
Qa
C
500
DUT
BAW62
D1
243 pF
100 K
DUTY CYCLE = 2%
V
120 ns
t
2 ns MAX
10%
90%
V
V
fr
1 K
450
50
DUT
DUTY CYCLE = 2%
OSCILLOSCOPE
R
10 M
C
7 pF
BAS16TT1
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4
100
0.2
0.4
V
F
, FORWARD VOLTAGE (VOLTS)
0.6
0.8
1.0
1.2
10
1.0
0.1
T
A
= 85
C
10
0
V
R
, REVERSE VOLTAGE (VOLTS)
1.0
0.1
0.01
0.001
10
20
30
40
50
0.68
0
V
R
, REVERSE VOLTAGE (VOLTS)
0.64
0.60
0.56
0.52
C
D
, DIODE CAP
ACIT
ANCE
(pF)
2
4
6
8
I F
,
FO
R
WA
R
D
CU
RR
ENT
(m
A)
Figure 4. Forward Voltage
Figure 5. Leakage Current
Figure 6. Capacitance
T
A
= 40
C
T
A
= 25
C
T
A
= 150
C
T
A
= 125
C
T
A
= 85
C
T
A
= 55
C
T
A
= 25
C
I R
, REVERSE CURRENT
(
A)
BAS16TT1
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5
INFORMATION FOR USING THE SOT-416 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the
total design. The footprint for the semiconductor packages
must be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
1.4
1
0.5 min. (3x)
0.5 min. (3x)
TYPICAL
0.5
SOLDERING PATTERN
Unit: mm
SOT416/SC75 POWER DISSIPATION
The power dissipation of the SOT416/SC75 is a
function of the pad size. This can vary from the minimum
pad size for soldering to the pad size given for maximum
power dissipation. Power dissipation for a surface mount
device is determined by T
J(max)
, the maximum rated
junction temperature of the die, R
JA
, the thermal
resistance from the device junction to ambient; and the
operating temperature, T
A
. Using the values provided on
the data sheet, P
D
can be calculated as follows.
P
D
=
T
J(max)
T
A
R
JA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values
into the equation for an ambient temperature T
A
of 25
C,
one can calculate the power dissipation of the device which
in this case is 150 milliwatts.
P
D
=
150
C 25
C
625
C/W
= 150 milliwatts
The 625
C/W assumes the use of the recommended
footprint on a glass epoxy printed circuit board to achieve a
power dissipation of 150 milliwatts. Another alternative
would be to use a ceramic substrate or an aluminum core
board such as Thermal Clad
TM
. Using a board material such
as Thermal Clad, a higher power dissipation can be
achieved using the same footprint.
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
Always preheat the device.
The delta temperature between the preheat and
soldering should be 100
C or less.*
When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference should be a maximum of 10
C.
The soldering temperature and time should not exceed
260
C for more than 10 seconds.
When shifting from preheating to soldering, the
maximum temperature gradient should be 5
C or less.
After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
Mechanical stress or shock should not be applied
during cooling
* Soldering a device without preheating can cause
excessive thermal shock and stress which can result in
damage to the device.
BAS16TT1
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6
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones,
and a figure for belt speed. Taken together, these control
settings make up a heating "profile" for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 7 shows a typical heating profile
for use when soldering a surface mount device to a printed
circuit board. This profile will vary among soldering
systems but it is a good starting point. Factors that can
affect the profile include the type of soldering system in
use, density and types of components on the board, type of
solder used, and the type of board or substrate material
being used. This profile shows temperature versus time.
The line on the graph shows the actual temperature that
might be experienced on the surface of a test board at or
near a central solder joint. The two profiles are based on a
high density and a low density board. The Vitronics
SMD310 convection/infrared reflow soldering system was
used to generate this profile. The type of solder used was
62/36/2 Tin Lead Silver with a melting point between
177 189
C. When this type of furnace is used for solder
reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
STEP 1
PREHEAT
ZONE 1
"RAMP"
STEP 2
VENT
"SOAK"
STEP 3
HEATING
ZONES 2 & 5
"RAMP"
STEP 4
HEATING
ZONES 3 & 6
"SOAK"
STEP 5
HEATING
ZONES 4 & 7
"SPIKE"
STEP 6
VENT
STEP 7
COOLING
200
C
150
C
100
C
50
C
TIME (3 TO 7 MINUTES TOTAL)
T
MAX
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
205
TO 219
C
PEAK AT
SOLDER JOINT
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
100
C
150
C
160
C
140
C
Figure 7. Typical Solder Heating Profile
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
170
C
BAS16TT1
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7
PACKAGE DIMENSIONS
SC75 (SC90, SOT416)
CASE 46301
ISSUE B
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
0.70
0.80
0.028
0.031
B
1.40
1.80
0.055
0.071
C
0.60
0.90
0.024
0.035
D
0.15
0.30
0.006
0.012
G
1.00 BSC
0.039 BSC
H
0.10
0.004
J
0.10
0.25
0.004
0.010
K
1.45
1.75
0.057
0.069
L
0.10
0.20
0.004
0.008
S
0.50 BSC
0.020 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
M
0.20 (0.008)
B
A
B
S
D
G
3 PL
0.20 (0.008) A
K
J
L
C
H
3
2
1
STYLE 1:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
STYLE 2:
PIN 1. ANODE
2. N/C
3. CATHODE
STYLE 3:
PIN 1. ANODE
2. ANODE
3. CATHODE
STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. ANODE
BAS16TT1
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8
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BAS16TT1/D
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