Semiconductor Components Industries, LLC, 2004
March, 2004 - Rev. 16
1
Publication Order Number:
MC33269/D
MC33269, NCV33269
800 mA, Adjustable Output,
Low Dropout Voltage
Regulator
The MC33269/NCV33269 series are low dropout, medium current,
fixed and adjustable, positive voltage regulators specifically designed
for use in low input voltage applications. These devices offer the
circuit designer an economical solution for precision voltage
regulation, while keeping power losses to a minimum.
The regulator consists of a 1.0 V dropout composite PNP-NPN pass
transistor, current limiting, and thermal shutdown.
3.3 V, 5.0 V, 12 V and Adjustable Versions.
2.85 V version available as MC34268.
Space Saving DPAK, SOP-8 and SOT-223 Power Packages
1.0 V Dropout
Output Current in Excess of 800 mA
Thermal Protection
Short Circuit Protection
Output Trimmed to 1.0% Tolerance
Pb-Free Package is Available
DEVICE TYPE/NOMINAL OUTPUT VOLTAGE
MC33269D
MC33269DT
NCV33269DTRK*
MC33269T
MC33269D-3.3
MC33269DT-3.3
NCV33269DTRK-3.3*
MC33269T-3.3
MC33269ST-3.3
Adj
Adj
Adj
Adj
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
MC33269D-5.0
MC33269DT-5.0
MC33269T-5.0
MC33269D-12
MC33269DT-12
NCV33269DTRK-12*
MC33269T-12
5.0 V
5.0 V
5.0 V
12 V
12 V
12 V
12 V
*NCV prefix is for automotive and other applications requiring site and change
control.
TO-220AB
T SUFFIX
CASE 221A
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
ORDERING INFORMATION
1
8
7
6
5
1
2
3
4
Gnd/Adj
SO-8
D SUFFIX
CASE 751
DPAK
DT SUFFIX
CASE 369A
V
in
NC
NC
1. GND/Adj
2. V
out
3. V
in
1
(Top View)
V
out
V
out
Heatsink surface (shown as terminal 4 in
case outline drawing) is connected to Pin 2.
SOT-223
ST SUFFIX
CASE 318E
8
2 3
(Top View)
1
3
1
3
(Top View)
1
2
3
1
2
3
1 2 3
(Top View)
Heatsink surface (shown as terminal 4 in
case outline drawing) is connected to Pin 2.
See general marking information in the device marking
section on page 9 of this data sheet.
DEVICE MARKING INFORMATION
1. GND/Adj
2. V
out
3. V
in
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MC33269, NCV33269
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2
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Power Supply Input Voltage
V
in
20
V
Power Dissipation
Case 369A (DPAK)
T
A
= 25
C
P
D
Internally Limited
W
Thermal Resistance, Junction-to-Ambient
q
JA
92
C/W
Thermal Resistance, Junction-to-Case
q
JC
6.0
C/W
Case 751 (SOP-8)
T
A
= 25
C
P
D
Internally Limited
W
Thermal Resistance, Junction-to-Ambient
q
JA
160
C/W
Thermal Resistance, Junction-to-Case
q
JC
25
C/W
Case 221A
T
A
= 25
C
P
D
Internally Limited
W
Thermal Resistance, Junction-to-Ambient
q
JA
65
C/W
Thermal Resistance, Junction-to-Case
q
JC
5.0
C/W
Case 318E
T
A
= 25
C
P
D
Internally Limited
W
Thermal Resistance, Junction-to-Ambient
q
JA
156
C/W
Thermal Resistance, Junction-to-Case
q
JC
15
C/W
Operating Die Junction Temperature Range
T
J
-40 to +150
C
Operating Ambient Temperature Range
MC3326
NCV33269
T
A
-40 to +125
-40 to +125
C
Storage Temperature
T
stg
-55 to +150
C
Electrostatic Discharge Sensitivity (ESD)
Human Body Model (HBM)
Machine Model (MM)
ESD
4000
400
V
MC33269, NCV33269
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3
ELECTRICAL CHARACTERISTICS
(C
O
= 10
m
F, T
A
= 25
C, for min/max values T
A
= -40
C to +125
C, unless otherwise noted.)
Characteristic
Symbol
Min
Typ
Max
Unit
Output Voltage (I
out
= 10 mA, T
A
= 25
C)
3.3 Suffix (V
CC
= 5.3 V)
5.0 Suffix (V
CC
= 7.0 V)
12 Suffix (V
CC
= 14 V)
V
O
3.27
4.95
11.88
3.3
5.0
12
3.33
5.05
12.12
V
Output Voltage (Line, Load and Temperature) (Note 1)
(1.25 V
V
in
- V
out
15 V, I
out
= 500 mA)
(1.35 V
V
in
- V
out
10 V, I
out
= 800 mA)
3.3 Suffix
5.0 Suffix
12 Suffix
V
O
3.23
4.9
11.76
3.3
5.0
12
3.37
5.1
12.24
V
Reference Voltage (I
out
= 10 mA, V
in
- V
out
= 2.0 V, T
A
= 25
C)
for Adjustable Voltage
V
ref
1.235
1.25
1.265
V
Reference Voltage (Line, Load and Temperature) (Note 1)
(1.25 V
V
in
- V
out
15 V, I
out
= 500 mA)
(1.35 V
V
in
- V
out
10 V, I
out
= 800 mA)
for Adjustable Voltage
V
ref
1.225
1.25
1.275
V
Line Regulation
(I
out
= 10 mA, V
in
= [V
out
+ 1.5 V] to V
in
= 20 V, T
A
= 25
C)
Reg
line
-
-
0.3
%
Load Regulation (V
in
= V
out
+ 3.0 V, I
out
= 10 mA to 800 mA, T
A
= 25
C)
Reg
load
-
-
0.5
%
Dropout Voltage
(I
out
= 500 mA)
(I
out
= 800 mA)
V
in
- V
out
-
-
1.0
1.1
1.25
1.35
V
Ripple Rejection
(10 V
pp
, 120 Hz Sinewave; I
out
= 500 mA)
RR
55
-
-
dB
Current Limit (V
in
- V
out
= 10 V)
I
Limit
800
-
-
mA
Quiescent Current (Fixed Output)
(1.5 V
V
out
3.3 V)
(5 V
V
out
12 V)
I
Q
-
-
5.5
-
8.0
20
mA
Minimum Required Load Current
Fixed Output Voltage
Adjustable Voltage
I
Load
-
8.0
-
-
0
-
mA
Adjustment Pin Current
I
Adj
-
-
120
m
A
1. The MC33269-12, V
in
- V
out
is limited to 8.0 V maximum, because of the 20 V maximum rating applied to V
in.
MC33269, NCV33269
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4
V
in
V
out
V
Adj
Gnd
Trim Links
This device contains 38 active transistors.
Figure 1. Internal Schematic
MC33269, NCV33269
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5
I
O
, OUTPUT LOAD CURRENT (mA)
in
V
out
-V
Figure 2. Dropout Voltage versus
Output Load Current
1.5
1.3
1.1
0.9
0.7
0.5
0
200
400
600
800
1000
Figure 3. Transient Load Regulation
, DROPOUT
VOL
T
AGE (V)
20 ms/DIV
C
in
= 10 mF
C
O
= 10 mF Tantalum
V
in
= V
O
+ 3.0 V
Preload = 0.1 A
0 A
0.5 A
100
, OUTPUT
I O
V O
, OUTPUT
VOL
T
AGE DEVIA
TION
CURRENT
T
A
= 25
C
T
A
= -40
C
T
A
= 125
C
mV/Div
-55
900
-25
0
25
50
75
100
125
940
980
1020
1060
1100
Figure 4. Dropout Voltage
versus Temperature
Figure 5. MC33269-XX Output DC Current versus
Input-Output Differential Voltage
V
T
A
, AMBIENT TEMPERATURE (
C)
I
O
= 800 mA
, OVER
VOL
T
AGE INPUT
THRESHOLD (%V )
FB(OV)
FB
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0
2.0
4.0
6.0
8.0
10
12
14
16
INPUT-OUTPUT VOLTAGE DIFFERENTIAL (V)
T
A
= 25
C
MC33269D-XX
L = 25 mm Copper
OUTPUT
CURRENT
(A)
70
0.1
1.0
10
100
60
50
40
30
20
Figure 6. MC33269 Ripple Rejection
versus Frequency
Figure 7. MC33269-ADJ Ripple Rejection
versus Frequency
RR, RIPPLE REJECTION RA
TIO (dB)
f, FREQUENCY (kHz)
20
30
40
50
60
70
RR, RIPPLE REJECTION RA
TIO (dB)
100
10
1.0
f, FREQUENCY (kHz)
V
in
= 8.0 V
V
out
= 5.0 V
I
L
= 800 mA
C
Adj
= 22 mF
T
A
= 25
C
0.1
V
in
= V
O
+ 3.0 V
I
L
= 800 mA
T
A
= 25
C
V
O
= 12 V
V
O
= 3.3 V or 5.0 V
MC33269, NCV33269
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6
R
,
THERMAL
RESIST
ANCE
JA
JUNCTION-T
O-AIR ( C/W)
40
80
120
160
200
240
280
0.35
0.42
0.50
0.63
0.83
1.25
2.50
0
10
20
30
25
15
5.0
L, LENGTH OF COPPER (mm)
P
D(max)
for T
A
= 50
C
Minimum
Size Pad
P D
L
L
, MAXIMUM POWER DISSIP
A
TION (W)
Free Air
Mounted
Vertically
R
qJA
2.0 oz. Copper
Figure 8. SOP-8 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
R
,
THERMAL
RESIST
ANCE,
JA
JUNCTION-T
O-AIR ( C/W)
R
qJA
2.0 oz.
Copper
Graph represents symmetrical layout
3.0 mm
L
L
P
D(max)
for T
A
= 50
C
30
50
70
90
110
130
150
170
L, LENGTH OF COPPER (mm)
0
20
30
50
40
10
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
R
,
THERMAL
RESIST
ANCE,
JA
JUNCTION-T
O-AIR ( C/W)
Figure 9. DPAK Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
L
2.0 oz. Copper
R
qJA
Minimum
Size Pad
Free Air
Mounted
Vertically
P
D(max)
for T
A
= 50
C
L
40
50
60
70
80
90
100
0
10
20
30
25
15
5.0
L, LENGTH OF COPPER (mm)
0
0.4
0.8
1.2
1.6
2.0
2.4
Figure 10. SOT-223 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
MC33269, NCV33269
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7
APPLICATIONS INFORMATION
Figures 11 through 15 are typical application circuits. The
output current capability of the regulator is in excess of
800 mA, with a typical dropout voltage of less than 1.0 V.
Internal protective features include current and thermal
limiting.
* The MC33269 requires an external output capacitor for
stability. The capacitor should be at least 10
mF with an
equivalent series resistance (ESR) of less than 10
W but
greater than 0.2
W over the anticipated operating
temperature
range. With economical electrolytic capacitors,
cold temperature operation can pose a problem. As
temperature decreases, the capacitance also decreases and
the ESR increases, which could cause the circuit to oscillate.
Also capacitance and ESR of a solid tantalum capacitor is
more stable over temperature. The use of a low ESR ceramic
capacitor placed within close proximity to the output of the
device could cause instability.
** An input bypass capacitor is recommended to improve
transient response or if the regulator is connected to the
supply input filter with long wire lengths. This will reduce
the circuit's sensitivity to the input line impedance at high
frequencies. A 0.33
mF or larger tantalum, mylar, ceramic,
or other capacitor having low internal impedance at high
frequencies should be chosen. The bypass capacitor should
be mounted with shortest possible lead or track length
directly across the regulator's input terminals. Applications
should be tested over all operating conditions to insure
stability.
Internal thermal limiting circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated, typically at
170
C, the output is disabled. There is no hysteresis built
into the thermal limiting circuit. As a result, if the device is
overheating, the output will appear to be oscillating. This
feature is provided to prevent catastrophic failures from
accidental device overheating. It is not intended to be used
as a substitute for proper heat-sinking.
Figure 11. Typical Fixed Output Application
MC33269-XX
V
in
V
out
GND
C
o
10 mF
An input capacitor is not necessary for stability, however
it will improve the overall performance.
Figure 12. Typical Adjustable Output Application
MC33269
V
in
V
out
Adj
C
o
10 mF
C
Adj
***
R1
R2
***C
Adj
is optional, however it will improve the ripple rejection.
The MC34269 develops a 1.25 V reference voltage between the
output and the adjust terminal. Resistor R1, operates with
constant current to flow through it and resistor R2. This current
should be set such that the Adjust Pin current causes negligible
drop across resistor R2. The total current with minimum load
should be greater than 8.0 mA.
Figure 13. Current Regulator
MC33269
V
in
I
out
Adj
R
S
Iout +
Figure 14. Battery Backed-Up Power Supply
MC33269-XX
V
in
V
out
MC33269-XX
GND
C
o
10 mF
Figure 15. Digitally Controlled Voltage Regulator
MC33269
V
in
V
out
Adj
C
o
10 mF
R1
R2
R
2
sets the maximum output voltage. Each transistor
reduces the output voltage when turned on.
The Schottky diode in series with the ground leg of the upper
regulator shifts its output voltage higher by the forward
voltage drop of the diode. This will cause the lower device
to remain off until the input voltage is removed.
Vout + 1.25 1 )
R2
R1
) I
Adj R2
1.25
RS
C
in
C
in
C
in
C
o
10 mF
C
in
C
in
GND
C
in
**
**
**
**
**
**
*
*
*
*
*
MC33269, NCV33269
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8
ORDERING INFORMATION
Device
Package
Shipping Information
MC33269D
SO-8
98 Units / Rail
MC33269DR2
SO-8
2500 Units / Tape & Reel
MC33269DR2G
SO-8 (Pb-Free)
2500 Units / Tape & Reel
MC33269DT
DPAK
75 Units / Rail
MC33269DTG
DPAK (Pb-Free)
75 Units / Rail
MC33269DTRK
DPAK
2500 Units / Tape & Reel
MC33269DTRKG
DPAK (Pb-Free)
2500 Units / Tape & Reel
MC33269T
TO-220
50 Units / Rail
MC33269D-3.3
SO-8
98 Units / Rail
MC33269DR2-3.3
SO-8
2500 Units / Tape & Reel
MC33269DR2-3.3G
SO-8 (Pb-Free)
2500 Units / Tape & Reel
MC33269DT-3.3
DPAK
75 Units / Rail
MC33269DT-3.3G
DPAK (Pb-Free)
75 Units / Rail
MC33269DTRK-3.3
DPAK
2500 Units / Tape & Reel
MC33269DTRK-3.3G
DPAK (Pb-Free)
2500 Units / Tape & Reel
MC33269ST-3.3T3
SOT-223
4000 Units / Tape & Reel
MC33269ST-3.3T3G
SOT-223 (Pb-Free)
4000 Units / Tape & Reel
MC33269T-3.3
TO-220
50 Units / Rail
MC33269D-5.0
SO-8
98 Units / Rail
MC33269DR2-5.0
SO-8
2500 Units / Tape & Reel
MC33269DT-5.0
DPAK
75 Units / Rail
MC33269DTRK-5.0
DPAK
2500 Units / Tape & Reel
MC33269DTRK-5.0G
DPAK (Pb-Free)
2500 Units / Tape & Reel
MC33269T-5.0
TO-220
50 Units / Rail
MC33269D-12
SO-8
98 Units / Rail
MC33269DR2-12
SO-8
2500 Units / Tape & Reel
MC33269DT-12
DPAK
75 Units / Rail
MC33269DTRK-12
DPAK
2500 Units / Tape & Reel
MC33269DTRK-12G
DPAK (Pb-Free)
2500 Units / Tape & Reel
MC33269T-12
TO-220
50 Units / Rail
NCV33269DTRK*
DPAK
2500 Units / Tape & Reel
NCV33269DTRK-3.3*
DPAK
2500 Units / Tape & Reel
NCV33269DTRK-12*
DPAK
250 Units / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV prefix is for automotive and other applications requiring site and control changes.
MC33269, NCV33269
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9
MARKING DIAGRAMS
A
= Assembly Location
WL, L
= Wafer Lot
Y
= Year
WW, W = Work Week
SO-8
D SUFFIX
CASE 751
1
269AJ
ALYW
8
1
69-12
ALYW
8
1
269-3
ALYW
8
1
269-5
ALYW
8
1
2
3
269AJ
ALYWW
1
2
3
69-12
ALYWW
1
2
3
269-3
ALYWW
1
2
3
269-5
ALYWW
DPAK
DT SUFFIX
CASE 369A
TO-220AB
T SUFFIX
CASE 221A
1
MC
33269T
AWLYWW
2
3
1
MC
33269T-12
AWLYWW
2
3
1
MC
33269T-3.3
AWLYWW
2
3
1
MC
33269T-5.0
AWLYWW
2
3
1
2
3
ALYW
2693
SOT-223
ST SUFFIX
CASE 318E
MC33269, NCV33269
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10
PACKAGE DIMENSIONS
SO-8
D SUFFIX
CASE 751-07
ISSUE AA
SEATING
PLANE
1
4
5
8
N
J
X 45
_
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. 751-01 THRU 751-06 ARE OBSOLETE. NEW
STANDARD IS 751-07.
A
B
S
D
H
C
0.10 (0.004)
DIM
A
MIN
MAX
MIN
MAX
INCHES
4.80
5.00
0.189
0.197
MILLIMETERS
B
3.80
4.00
0.150
0.157
C
1.35
1.75
0.053
0.069
D
0.33
0.51
0.013
0.020
G
1.27 BSC
0.050 BSC
H
0.10
0.25
0.004
0.010
J
0.19
0.25
0.007
0.010
K
0.40
1.27
0.016
0.050
M
0
8
0
8
N
0.25
0.50
0.010
0.020
S
5.80
6.20
0.228
0.244
-X-
-Y-
G
M
Y
M
0.25 (0.010)
-Z-
Y
M
0.25 (0.010)
Z
S
X
S
M
_
_
_
_
Figure 16. SO-8
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
mm
inches
SCALE 6:1
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
MC33269, NCV33269
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11
DPAK
DT SUFFIX
CASE 369A-13
ISSUE AB
D
A
K
B
R
V
S
F
L
G
2 PL
M
0.13 (0.005)
T
E
C
U
J
H
-T-
SEATING
PLANE
Z
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.235
0.250
5.97
6.35
B
0.250
0.265
6.35
6.73
C
0.086
0.094
2.19
2.38
D
0.027
0.035
0.69
0.88
E
0.033
0.040
0.84
1.01
F
0.037
0.047
0.94
1.19
G
0.180 BSC
4.58 BSC
H
0.034
0.040
0.87
1.01
J
0.018
0.023
0.46
0.58
K
0.102
0.114
2.60
2.89
L
0.090 BSC
2.29 BSC
R
0.175
0.215
4.45
5.46
S
0.020
0.050
0.51
1.27
U
0.020
---
0.51
---
V
0.030
0.050
0.77
1.27
Z
0.138
---
3.51
---
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
1
2
3
4
Figure 17. DPAK
5.80
0.228
2.58
0.101
1.6
0.063
6.20
0.244
3.0
0.118
6.172
0.243
mm
inches
SCALE 3:1
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
MC33269, NCV33269
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12
PACKAGE DIMENSIONS
SOT-223
ST SUFFIX
CASE 318E-04
ISSUE K
H
S
F
A
B
D
G
L
4
1
2
3
0.08 (0003)
C
M
K
J
DIM
A
MIN
MAX
MIN
MAX
MILLIMETERS
0.249
0.263
6.30
6.70
INCHES
B
0.130
0.145
3.30
3.70
C
0.060
0.068
1.50
1.75
D
0.024
0.035
0.60
0.89
F
0.115
0.126
2.90
3.20
G
0.087
0.094
2.20
2.40
H 0.0008 0.0040
0.020
0.100
J
0.009
0.014
0.24
0.35
K
0.060
0.078
1.50
2.00
L
0.033
0.041
0.85
1.05
M
0
10
0
10
S
0.264
0.287
6.70
7.30
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
_
_
_
_
1.5
0.059
Figure 18. SOT-223
mm
inches
SCALE 6:1
3.8
0.15
2.0
0.079
6.3
0.248
2.3
0.091
2.3
0.091
2.0
0.079
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
MC33269, NCV33269
http://onsemi.com
13
TO-220AB
T SUFFIX
CASE 221A-09
ISSUE AA
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.570
0.620
14.48
15.75
B
0.380
0.405
9.66
10.28
C
0.160
0.190
4.07
4.82
D
0.025
0.035
0.64
0.88
F
0.142
0.147
3.61
3.73
G
0.095
0.105
2.42
2.66
H
0.110
0.155
2.80
3.93
J
0.018
0.025
0.46
0.64
K
0.500
0.562
12.70
14.27
L
0.045
0.060
1.15
1.52
N
0.190
0.210
4.83
5.33
Q
0.100
0.120
2.54
3.04
R
0.080
0.110
2.04
2.79
S
0.045
0.055
1.15
1.39
T
0.235
0.255
5.97
6.47
U
0.000
0.050
0.00
1.27
V
0.045
---
1.15
---
Z
---
0.080
---
2.04
B
Q
H
Z
L
V
G
N
A
K
F
1 2 3
4
D
SEATING
PLANE
-T-
C
S
T
U
R
J
MC33269, NCV33269
http://onsemi.com
14
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