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Semiconductor Components Industries, LLC, 2005
February, 2005 - Rev. 12
1
Publication Order Number:
MC34064/D
MC34064, MC33064,
NCV33064
Undervoltage Sensing
Circuit
The MC34064 is an undervoltage sensing circuit specifically
designed for use as a reset controller in microprocessor-based
systems. It offers the designer an economical solution for low voltage
detection with a single external resistor. The MC34064 features a
trimmed-in-package bandgap reference, and a comparator with
precise thresholds and built-in hysteresis to prevent erratic reset
operation. The open collector reset output is capable of sinking in
excess of 10 mA, and operation is guaranteed down to 1.0 V input with
low standby current. The MC devices are packaged in 3-pin TO-92,
micro size TSOP-5, 8-pin SOIC-8 and Micro8
t surface mount
packages. The NCV device is packaged in SOIC-8 and TO-92.
Applications include direct monitoring of the 5.0 V MPU/logic
power supply used in appliance, automotive, consumer and industrial
equipment.
Features
Trimmed-In-Package Temperature Compensated Reference
Comparator Threshold of 4.6 V at 25
C
Precise Comparator Thresholds Guaranteed Over Temperature
Comparator Hysteresis Prevents Erratic Reset
Reset Output Capable of Sinking in Excess of 10 mA
Internal Clamp Diode for Discharging Delay Capacitor
Guaranteed Reset Operation with 1.0 V Input
Low Standby Current
Economical TO-92, TSOP-5, SOIC-8 and Micro8 Surface Mount
Packages
NCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
Pb-Free Packages are Available
1.2 V
ref
2 (2)
1 (1)
3 (4)
Reset
GND
Input
=
Sink Only
Positive True Logic
Pin numbers adjacent to terminals are for the 3-pin TO-92 package.
Pin numbers in parenthesis are for the 8-lead packages.
This device contains 21 active transistors.
Figure 1. Representative Block Diagram
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1
2
3
Pin 1. Reset
2. Input
3. Ground
TO-92
P SUFFIX
CASE 29
8
1
(Top View)
3
1
N.C.
Ground
N.C.
N.C.
2
4
8
7
6
5
N.C.
N.C.
Input
Reset
8
1
PIN CONNECTIONS
ORDERING INFORMATION
SOIC-8
D SUFFIX
CASE 751
Micro8
DM SUFFIX
CASE 846A
TSOP-5
SN SUFFIX
CASE 483
1
5
Pin 1. Reset
2. Input
3. Ground
4. NC
5. NC
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
See general marking information in the device marking
section on page 7 of this data sheet.
DEVICE MARKING INFORMATION
MC34064, MC33064, NCV33064
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2
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Power Input Supply Voltage
V
in
-1.0 to 10
V
Reset Output Voltage
V
O
10
V
Reset Output Sink Current (Note 2)
I
Sink
Internally
Limited
mA
Clamp Diode Forward Current, Pin 1 to 2 (Note 2)
I
F
100
mA
Power Dissipation and Thermal Characteristics
P Suffix, Plastic Package
Maximum Power Dissipation @ T
A
= 25
C
Thermal Resistance, Junction-to-Air
D Suffix, Plastic Package
Maximum Power Dissipation @ T
A
= 25
C
Thermal Resistance, Junction-to-Air
DM Suffix, Plastic Package
Maximum Power Dissipation @ T
A
= 25
C
Thermal Resistance, Junction-to-Air
P
D
R
q
JA
P
D
R
q
JA
P
D
R
q
JA
625
200
625
200
520
240
mW
C/W
mW
C/W
mW
C/W
Operating Junction Temperature
T
J
+150
C
Operating Ambient Temperature
MC34064
MC33064
NCV33064
T
A
0 to +70
-40 to +85
-40 to +125
C
Storage Temperature Range
T
stg
-65 to +150
C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. ESD data available upon request.
ELECTRICAL CHARACTERISTICS
(For typical values T
A
= 25
C, for min/max values T
A
is the operating ambient temperature range
that applies [Notes 3 and 4] unless otherwise noted.)
Characteristics
Symbol
Min
Typ
Max
Unit
COMPARATOR
Threshold Voltage
High State Output (V
in
Increasing)
Low State Output (V
in
Decreasing)
Hysteresis
V
IH
V
IL
V
H
4.5
4.5
0.01
4.61
4.59
0.02
4.7
4.7
0.05
V
RESET OUTPUT
Output Sink Saturation
(V
in
= 4.0 V, I
Sink
= 8.0 mA)
(V
in
= 4.0 V, I
Sink
= 2.0 mA)
(V
in
= 1.0 V, I
Sink
= 0.1 mA)
V
OL
-
-
-
0.46
0.15
-
1.0
0.4
0.1
V
Output Sink Current (V
in
, Reset = 4.0 V)
I
Sink
10
27
60
mA
Output Off-State Leakage (V
in
, Reset = 5.0 V)
I
OH
-
0.02
0.5
m
A
Clamp Diode Forward Voltage, Pin 1 to 2 (I
F
= 10 mA)
V
F
0.6
0.9
1.2
V
TOTAL DEVICE
Operating Input Voltage Range
V
in
1.0 to 6.5
-
-
V
Quiescent Input Current (V
in
= 5.0 V)
I
in
-
390
500
m
A
2. Maximum package power dissipation limits must be observed.
3. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
4. T
low
= 0
C for MC34064
T
high
= +70
C for MC34064
-40
C for MC33064
+85
C for MC33064
-40
C for NCV33064
+125
C for NCV33064
5. NCV prefix is for automotive and other applications requiring site and change control.
MC34064, MC33064, NCV33064
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3
V
O
, OUTPUT
VOL
T
AGE (V)
V
O
, OUTPUT
VOL
T
AGE (V)
Figure 2. Reset Output Voltage versus
Input Voltage
Figure 3. Reset Output Voltage versus
Input Voltage
Figure 4. Comparator Threshold Voltage
versus Temperature
Figure 5. Input Current versus Input Voltage
Figure 6. Reset Output Saturation versus
Sink Current
Figure 7. Reset Delay Time
V
in
, INPUT VOLTAGE (V)
10
8.0
6.0
4.0
2.0
0
0
2.0
4.0
6.0
8.0
10
R
L
= 10 k to V
in
T
A
= 25
C
V
in
, INPUT VOLTAGE (V)
5.0
4.0
3.0
2.0
1.0
0
4.560
4.580
4.600
4.620
4.640
R
L
= 10 k to V
in
T
A
= 25
C
T
A
, AMBIENT TEMPERATURE (
C)
th
,
THRESHOLD VOL
T
AGE (V)
4.630
4.620
4.610
4.600
4.590
4.580
4.570
-55
-25
0
25
50
75
100
125
V
R
L
= 10 k to V
in
Upper Threshold
High State Output
Lower Threshold
Low State Output
V
in
, INPUT VOLTAGE (V)
in
, INPUT
CURRENT
(mA)
1.0
0.8
0.6
0.4
0.2
0
0
2.0
4.0
6.0
8.0
10
I
T
A
= +25
C
-40
C
T
A
= +25
C
+85
C
-40
C
V
OL
, OUTPUT
SA
TURA
TION (V)
I
Sink
, SINK CURRENT (mA)
2.0
1.5
1.0
0.5
0
0
10
20
30
40
V
in
= 4.0 V
T
A
= 85
C
T
A
= 25
C
T
A
= -40
C
90%
5.0 V -
4.0 V -
10%
+85
C
Reset
V
in
5.0V
4.0V
REF
10k
200 ns/DIV
Reset
V
in
V
in
= 5.0 V to 4.0 V
R
L
= 10 k
T
A
= 25
C
MC34064, MC33064, NCV33064
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4
Figure 8. Clamp Diode Forward Current versus Voltage
Figure 9. Low Voltage Microprocessor Reset
Figure 10. Low Voltage Microprocessor Reset with Additional Hysteresis
80
60
40
20
0
0
0.4
0.8
1.2
1.6
V
F
, FORWARD VOLTAGE (V)
, FOR
W
ARD CURRENT
(mA)
FI
V
in
= 0 V
T
A
= 25
C
A time delayed reset can be accomplished with the
addition of C
DLY
. For systems with extremely fast
power supply rise times (<500 ns) it is recommended
that the RC
DLY
time constant be greater than 5.0
ms.
V
th(MPU)
is the microprocessor reset input threshold.
t
DLY
= RC
DLY
In
1
1 -
V
th(MPU)
Power
Supply
+
-
2 (2)
R
1 (1)
Reset
C
DLY
Microprocessor
Circuit
1.2 V
ref
3 (4)
-
+
Power
Supply
+
-
2 (2)
R
L
1 (1)
Reset
Microprocessor
Circuit
1.2V
ref
3 (4)
-
+
V
H
4.6 R
H
+ 0.02
DV
th(lower)
340 R
H
x 10
-6
Where: R
H
150
W
Where:
R
L
1.5
W,
10 k
W
Comparator hysteresis can be increased with the addition of resistor R
H
. The hysteresis equation has been
simplified and does not account for the change of input current I
in
as V
CC
crosses the comparator threshold
(Figure 4). An increase of the lower threshold
DV
th(lower)
will be observed due to I
in
which is typically 340
mA at
4.59 V. The equations are accurate to
10% with R
H
less than 150
W and R
L
between 1.5 k
W and 10 kW.
I
in
R
H
V
in
R
L
TEST DATA
V
H
(mV)
D
V
th
(mV)
R
H
(
W
)
R
L
(k
W
)
20
51
40
81
71
112
100
164
190
327
276
480
0
3.4
6.8
6.8
10
10
16
16
34
34
51
51
0
10
20
20
30
30
47
47
100
100
150
150
0
1.5
4.7
1.5
2.7
1.5
2.7
1.5
2.7
1.5
2.7
1.5
Figure 11. Voltage Monitor
Figure 12. Solar Powered Battery Charger
Figure 13. Low Power Switching Regulator
Figure 14. MOSFET Low Voltage Gate Drive Protection
Overheating of the logic level power MOSFET due to insufficient gate voltage can be prevented with the above
circuit. When the input signal is below the 4.6 V threshold of the MC34064, its output grounds the gate of the L
2
MOSFET.
270
4.6V
V
CC
R
L
MTP3055EL
2 (2)
1 (1)
3 (4)
-
+
1.2V
ref
2 (2)
1 (1)
3 (4)
-
+
1.2V
ref
Power
Supply
+
-
1.0k
2 (2)
1 (1)
3 (4)
-
+
1.2V
ref
+
-
Solar
Cells
2 (2)
1 (1)
3 (4)
-
+
1.2V
ref
V
in
= 11.5
to 14.5V
470
+
MPSW51A
25
mH
V
O
= 5.0 V
I
O
= 50 mA
470
+
680
22
+
1N5819
1.2k
330
1N756
4.7k
MC34064, MC33064, NCV33064
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5
Test
Conditions
Results
Line Regulation
V
in
= 11.5 V to 14.5 V, I
O
= 50 mA
35 mV
Load Regulation
V
in
= 12.6 V, I
O
= 0 mA to 50 mA
12 mV
Output Ripple
V
in
= 12.6 V, I
O
= 50 mA
60 mVpp
Efficiency
V
in
= 12.6 V, I
O
= 50 mA
77%
MC34064, MC33064, NCV33064
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6
ORDERING INFORMATION
Device
Operating Temperature Range
Package
Shipping
MC34064D-005
SOIC-8
98 Units / Rail
MC34064D-005G
SOIC-8
(Pb-Free)
98 Units / Rail
MC34064D-5R2
SOIC-8
2500 Units/ Tape & Reel
MC34064D-5R2G
SOIC-8
(Pb-Free)
2500 Units/ Tape & Reel
MC34064DM-5R2
Micro8
4000 Units / Tape & Reel
MC34064DM-5R2G
Micro8
(Pb-Free)
4000 Units / Tape & Reel
MC34064P-005
T
0
C to +70
C
TO-92
2000 Units / Bag
MC34064P-005G
T
A
= 0
C to +70
C
TO-92
(Pb-Free)
2000 Units / Bag
MC34064P-5RA
TO-92
2000 Units / Tape & Reel
MC34064P-5RAG
TO-92
(Pb-Free)
2000 Units / Tape & Reel
MC34064P-5RP
TO-92
2000 Units / Ammo Pack
MC34064P-5RPG
TO-92
(Pb-Free)
2000 Units / Ammo Pack
MC34064P-5RM
TO-92
2000 Units / Ammo Pack
MC34064SN-5T1
TSOP-5
3000 Units / Tape & Reel
MC33064D-005
SOIC-8
98 Units / Rail
MC33064D-005G
SOIC-8
(Pb-Free)
98 Units / Rail
MC33064D-5R2
SOIC-8
2500 Units / Tape & Reel
MC33064D-5R2G
SOIC-8
(Pb-Free)
2500 Units / Tape & Reel
MC33064DM-5R2
Micro8
4000 Units / Tape & Reel
MC33064DM-5R2G
T = 40
C to +85
C
Micro8
(Pb-Free)
4000 Units / Tape & Reel
MC33064P-005
T
J
= -40
C to +85
C
TO-92
2000 Units / Bag
MC33064P-005G
TO-92
(Pb-Free)
2000 Units / Bag
MC33064P-5RA
TO-92
2000 Units / Tape & Reel
MC33064P-5RAG
TO-92
(Pb-Free)
2000 Units / Tape & Reel
MC33064P-5RP
TO-92
2000 Units / Ammo Pack
MC33064P-5RPG
TO-92
(Pb-Free)
2000 Units / Ammo Pack
NCV33064D-5R2*
SOIC-8
2500 Units / Tape & Reel
NCV33064D-5R2G*
SOIC-8
(Pb-Free)
2500 Units / Tape & Reel
NCV33064P-5RA*
T
A
= -40
C to +125
C
TO-92
2000 Units / Tape & Reel
NCV33064P-5RP*
TO-92
2000 Units / Ammo Pack
NCV33064DM-5R2*
Micro8
4000 Units / Tape & Reel
*NCV33064: T
low
= -40
C, T
high
= +125
C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and change
control.
MC34064, MC33064, NCV33064
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7
ALYW5
3x064
SOIC-8
D SUFFIX
CASE 751
SDY
= Device Code
x
= 3 or 4
y
= I or C
A
= Assembly Location
WL, L = Wafer Lot
YY, Y
= Year
WW, W = Work Week
MARKING DIAGRAMS
Micro8
DM SUFFIX
CASE 846A
Ly50
AYW
1
8
TO-92
P SUFFIX
CASE 29
MC3x0
64P-5
ALYWW
1 2 3
*
*This marking diagram also applies to NCV33064P.
TSOP-5
SN SUFFIX
CASE 483
SDYYW
1
2 3
5
4
1
8
MC34064, MC33064, NCV33064
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8
PACKAGE DIMENSIONS
P SUFFIX
PLASTIC PACKAGE
CASE 29-11
(TO-92)
ISSUE AL
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
R
A
P
J
L
B
K
G
H
SECTION X-X
C
V
D
N
N
X X
SEATING
PLANE
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.175
0.205
4.45
5.20
B
0.170
0.210
4.32
5.33
C
0.125
0.165
3.18
4.19
D
0.016
0.021
0.407
0.533
G
0.045
0.055
1.15
1.39
H
0.095
0.105
2.42
2.66
J
0.015
0.020
0.39
0.50
K
0.500
---
12.70
---
L
0.250
---
6.35
---
N
0.080
0.105
2.04
2.66
P
---
0.100
---
2.54
R
0.115
---
2.93
---
V
0.135
---
3.43
---
1
MC34064, MC33064, NCV33064
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9
PACKAGE DIMENSIONS
SN SUFFIX
PLASTIC PACKAGE
CASE 483-02
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. A AND B DIMENSIONS DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
2.90
3.10 0.1142 0.1220
B
1.30
1.70 0.0512 0.0669
C
0.90
1.10 0.0354 0.0433
D
0.25
0.50 0.0098 0.0197
G
0.85
1.05 0.0335 0.0413
H
0.013
0.100 0.0005 0.0040
J
0.10
0.26 0.0040 0.0102
K
0.20
0.60 0.0079 0.0236
L
1.25
1.55 0.0493 0.0610
M
0
10
0
10
S
2.50
3.00 0.0985 0.1181
0.05 (0.002)
1
2
3
5
4
S
A
G
L
B
D
H
C
K
M
J
_
_
_
_
0.7
0.028
1.0
0.039
mm
inches
SCALE 10:1
0.95
0.037
2.4
0.094
1.9
0.074
SOLDERING FOOTPRINT
MC34064, MC33064, NCV33064
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10
PACKAGE DIMENSIONS
D SUFFIX
PLASTIC PACKAGE
CASE 751-07
(SOIC-8 NB)
ISSUE AE
SEATING
PLANE
1
4
5
8
N
J
X 45
_
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751-01 THRU 751-06 ARE OBSOLETE. NEW
STANDARD IS 751-07.
A
B
S
D
H
C
0.10 (0.004)
DIM
A
MIN
MAX
MIN
MAX
INCHES
4.80
5.00
0.189
0.197
MILLIMETERS
B
3.80
4.00
0.150
0.157
C
1.35
1.75
0.053
0.069
D
0.33
0.51
0.013
0.020
G
1.27 BSC
0.050 BSC
H
0.10
0.25
0.004
0.010
J
0.19
0.25
0.007
0.010
K
0.40
1.27
0.016
0.050
M
0
8
0
8
N
0.25
0.50
0.010
0.020
S
5.80
6.20
0.228
0.244
-X-
-Y-
G
M
Y
M
0.25 (0.010)
-Z-
Y
M
0.25 (0.010)
Z
S
X
S
M
_
_
_
_
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
mm
inches
SCALE 6:1
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
MC34064, MC33064, NCV33064
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11
PACKAGE DIMENSIONS
S
B
M
0.08 (0.003)
A
S
T
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
2.90
3.10
0.114
0.122
B
2.90
3.10
0.114
0.122
C
---
1.10
---
0.043
D
0.25
0.40
0.010
0.016
G
0.65 BSC
0.026 BSC
H
0.05
0.15
0.002
0.006
J
0.13
0.23
0.005
0.009
K
4.75
5.05
0.187
0.199
L
0.40
0.70
0.016
0.028
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.
-B-
-A-
D
K
G
PIN 1 ID
8 PL
0.038 (0.0015)
-T-
SEATING
PLANE
C
H
J
L
DM SUFFIX
PLASTIC PACKAGE
CASE 846A-02
(Micro8)
ISSUE F
8X
8X
6X
mm
inches
SCALE 8:1
1.04
0.041
0.38
0.015
5.28
0.208
4.24
0.167
3.20
0.126
0.65
0.0256
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
MC34064, MC33064, NCV33064
http://onsemi.com
12
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MC34064/D
Micro8 is a trademark of International Rectifier.
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