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Semiconductor Components Industries, LLC, 2000
March, 2000 Rev. 2
1
Publication Order Number:
MC74HCU04A/D
MC74HCU04A
Hex Unbuffered Inverter
HighPerformance SiliconGate CMOS
The MC74HCU04A is identical in pinout to the LS04 and the
MC14069UB. The device inputs are compatible with standard CMOS
outputs; with pullup resistors, they are compatible with LSTTL
outputs.
This device consists of six singlestage inverters. These inverters
are well suited for use as oscillators, pulse shapers, and in many other
applications requiring a highinput impedance amplifier. For digital
applications, the HC04A is recommended.
Output Drive Capability: 10 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2 to 6 V; 2.5 to 6 V in Oscillator
Configurations
Low Input Current: 1
A
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
Chip Complexity: 12 FETs or 3 Equivalent Gates
LOGIC DIAGRAM
Y1
A1
A2
A3
A4
A5
A6
Y2
Y3
Y4
Y5
Y6
1
3
5
9
11
13
2
4
6
8
10
12
Y = A
PIN 14 = VCC
PIN 7 = GND
FUNCTION TABLE
Inputs
A
L
H
Outputs
Y
H
L
Device
Package
Shipping
ORDERING INFORMATION
MC74HCU04AN
PDIP14
2000 / Box
MC74HCU04AD
SOIC14
http://onsemi.com
55 / Rail
MC74HCU04ADR2
SOIC14
2500 / Reel
MARKING
DIAGRAMS
A
= Assembly Location
WL or L
= Wafer Lot
YY or Y
= Year
WW or W = Work Week
MC74HCU04ADT
TSSOP14
96 / Rail
MC74HCU04ADTR2
TSSOP14
2500 / Reel
TSSOP14
DT SUFFIX
CASE 948G
HCU
04A
ALYW
1
14
1
14
PDIP14
N SUFFIX
CASE 646
MC74HCU04AN
AWLYYWW
SOIC14
D SUFFIX
CASE 751A
1
14
HCU04A
AWLYWW
PIN ASSIGNMENT
11
12
13
14
8
9
10
5
4
3
2
1
7
6
Y5
A5
Y6
A6
VCC
Y4
A4
Y2
A2
Y1
A1
GND
Y3
A3
MC74HCU04A
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2
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage (Referenced to GND)
0.5 to + 7.0
V
Vin
DC Input Voltage (Referenced to GND)
0.5 to VCC + 0.5
V
Vout
DC Output Voltage (Referenced to GND)
0.5 to VCC + 0.5
V
Iin
DC Input Current, per Pin
20
mA
Iout
DC Output Current, per Pin
25
mA
ICC
DC Supply Current, VCC and GND Pins
50
mA
PD
Power Dissipation in Still Air
Plastic DIP
SOIC Package
TSSOP Package
750
500
450
mW
Tstg
Storage Temperature
65 to + 150
_
C
TL
Lead Temperature, 1 mm from case for 10 Seconds
Plastic DIP, SOIC or TSSOP Package
260
_
C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
Derating -- Plastic DIP: 10mW/
_
C from 65
_
to 125
_
C
SOIC Package: 7mW/
_
C from 65
_
to 125
_
C
TSSOP Package: 6.1 mW/
_
C from 65
_
to 125
_
C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage (Referenced to GND)
2.0
6.0
V
Vin, Vout
DC Input Voltage, Output Voltage (Referenced to GND)
0
VCC
V
TA
Operating Temperature, All Package Types
55
+ 125
_
C
tr, tf
Input Rise and Fall Time (Figure 1)
--
No
Limit
ns
DC ELECTRICAL CHARACTERISTICS
(Voltages Referenced to GND)
Guaranteed Limit
Symbol
Parameter
Test Conditions
VCC
V
55 to
25
_
C
v
85
_
C
v
125
_
C
Unit
VIH
Minimum HighLevel Input
Voltage
Vout = 0.5 V*
|Iout|
v
20
A
2.0
3.0
4.5
6.0
1.7
2.5
3.6
4.8
1.7
2.5
3.6
4.8
l.7
2.5
3.6
4.8
V
VIL
Maximum LowLevel Input
Voltage
Vout = VCC 0.5 V*
|Iout|
v
20
A
2.0
3.0
4.5
6.0
0.3
0.5
0.8
1.1
0.3
0.5
0.8
1.1
0.3
0.5
0.8
1.1
V
VOH
Minimum HighLevel Output
Voltage
Vin = GND
|Iout|
v
20
A
2.0
4.5
6.0
1.8
4.0
5.5
1.8
4.0
5.5
1.8
4.0
5.5
V
Vin = GND
|Iout|
v
2.4 mA
|Iout|
v
4.0 mA
|Iout|
v
5.2 mA
3.0
4.5
6.0
2.36
3.86
5.36
2.26
3.76
5.26
2.20
3.70
5.20
VOL
Maximum LowLevel Output
Voltage
Vin = VCC
|Iout|
v
20
A
2.0
4.5
6.0
0.2
0.5
0.5
0.2
0.5
0.5
0.2
0.5
0.5
V
Vin = VCC
|Iout|
v
2.4 mA
|Iout|
v
4.0 mA
|Iout|
v
5.2 mA
3.0
4.5
6.0
0.32
0.32
0.32
0.32
0.37
0.37
0.32
0.40
0.40
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this highimpedance cir-
cuit. For proper operation, Vin and
Vout should be constrained to the
range GND
v
(Vin or Vout)
v
VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
MC74HCU04A
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3
DC ELECTRICAL CHARACTERISTICS
(Voltages Referenced to GND)
Guaranteed Limit
Unit
v
125
_
C
v
85
_
C
55 to
25
_
C
VCC
V
Test Conditions
Parameter
Symbol
Iin
Maximum Input Leakage
Current
Vin = VCC or GND
6.0
0.1
1.0
1.0
A
ICC
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
Iout = 0
A
6.0
1
10
40
A
NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).
*For VCC = 2.0 V, Vout = 0.2 V or VCC 0.2 V.
AC ELECTRICAL CHARACTERISTICS
(CL = 50 pF, Input tr = tf = 6 ns)
Guaranteed Limit
Symbol
Parameter
VCC
V
55 to
25
_
C
v
85
_
C
v
125
_
C
Unit
tPLH,
tPHL
Maximum Propagation Delay, Input A to Output Y
(Figures 1 and 2)
2.0
3.0
4.5
6.0
70
40
14
12
90
45
18
15
105
50
21
18
ns
tTLH,
tTHL
Maximum Output Transition Time, Any Output
(Figures 1 and 2)
2.0
3.0
4.5
6.0
75
27
15
13
95
32
19
16
110
36
22
19
ns
Cin
Maximum Input Capacitance
--
10
10
10
pF
NOTES:
1. For propagation delays with loads other than 50 pF, see Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).
2. Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).
Typical @ 25
C, VCC = 5.0 V
CPD
Power Dissipation Capacitance (Per Inverter)*
15
pF
* Used to determine the noload dynamic power consumption: PD = CPD VCC2f + ICC VCC. For load considerations, see Chapter 2 of the
ON Semiconductor HighSpeed CMOS Data Book (DL129/D).
MC74HCU04A
http://onsemi.com
4
Figure 1. Switching Waveforms
tr
VCC
GND
90%
50%
10%
90%
50%
10%
INPUT A
OUTPUT Y
tPHL
tPLH
tTHL
tTLH
*Includes all probe and jig capacitance
Figure 2. Test Circuit
CL*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
LOGIC DETAIL
(1/6 of Device Shown)
tf
A
VCC
Y
MC74HCU04A
http://onsemi.com
5
Crystal Oscillator
Stable RC Oscillator
Schmitt Trigger
High Input Impedance SingleStage Amplifier
with a 2 to 6 V Supply Range
MultiStage Amplifier
LED Driver
For reduced power supply current, use highefficiency LEDs
such as the HewlettPackard HLMP series or equivalent.
R2
1/6 HCU04A
C1
R2 > > R1
C1 < C2
Vout
C2
R1
R2
R1
C
1/6 HCU04A
1/6 HCU04A
1/6 HCU04A
Vout
R2
R1
Vin
Vout
1/6 HCU04A
1/6 HCU04A
R2 > 6R1
VCC
INPUT
OUTPUT
1 M
1 M
1/6 HCU04A
VCC
INPUT
OUTPUT
1/6 HCU04A
1/6 HCU04A
1/6 HCU04A
+ V
1/6 HCU04A
TYPICAL APPLICATIONS
MC74HCU04A
http://onsemi.com
6
PACKAGE DIMENSIONS
PDIP14
N SUFFIX
CASE 64606
ISSUE L
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
1
7
14
8
B
A
F
H
G
D
K
C
N
L
J
M
SEATING
PLANE
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.715
0.770
18.16
19.56
B
0.240
0.260
6.10
6.60
C
0.145
0.185
3.69
4.69
D
0.015
0.021
0.38
0.53
F
0.040
0.070
1.02
1.78
G
0.100 BSC
2.54 BSC
H
0.052
0.095
1.32
2.41
J
0.008
0.015
0.20
0.38
K
0.115
0.135
2.92
3.43
L
0.300 BSC
7.62 BSC
M
0
10 0 10
N
0.015
0.039
0.39
1.01
_
_
_
_
SOIC14
D SUFFIX
CASE 751A03
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
A
B
G
P
7 PL
14
8
7
1
M
0.25 (0.010)
B
M
S
B
M
0.25 (0.010)
A
S
T
T
F
R
X 45
SEATING
PLANE
D
14 PL
K
C
J
M
_
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
8.55
8.75
0.337
0.344
B
3.80
4.00
0.150
0.157
C
1.35
1.75
0.054
0.068
D
0.35
0.49
0.014
0.019
F
0.40
1.25
0.016
0.049
G
1.27 BSC
0.050 BSC
J
0.19
0.25
0.008
0.009
K
0.10
0.25
0.004
0.009
M
0
7
0
7
P
5.80
6.20
0.228
0.244
R
0.25
0.50
0.010
0.019
_
_
_
_
MC74HCU04A
http://onsemi.com
7
PACKAGE DIMENSIONS
TSSOP14
DT SUFFIX
CASE 948G01
ISSUE O
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
4.90
5.10
0.193
0.200
B
4.30
4.50
0.169
0.177
C
1.20
0.047
D
0.05
0.15
0.002
0.006
F
0.50
0.75
0.020
0.030
G
0.65 BSC
0.026 BSC
H
0.50
0.60
0.020
0.024
J
0.09
0.20
0.004
0.008
J1
0.09
0.16
0.004
0.006
K
0.19
0.30
0.007
0.012
K1
0.19
0.25
0.007
0.010
L
6.40 BSC
0.252 BSC
M
0
8
0
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE W.
_
_
_
_
S
U
0.15 (0.006) T
2X
L/2
S
U
M
0.10 (0.004)
V
S
T
L
U
SEATING
PLANE
0.10 (0.004)
T
SECTION NN
DETAIL E
J J1
K
K1
DETAIL E
F
M
W
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U
0.15 (0.006) T
V
14X REF
K
N
N
MC74HCU04A
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8
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without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be
validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold
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attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
CENTRAL/SOUTH AMERICA:
Spanish Phone: 3033087143 (MonFri 8:00am to 5:00pm MST)
Email: ONlitspanish@hibbertco.com
ASIA/PACIFIC: LDC for ON Semiconductor Asia Support
Phone: 3036752121 (TueFri 9:00am to 1:00pm, Hong Kong Time)
Toll Free from Hong Kong & Singapore:
00180044223781
Email: ONlitasia@hibbertco.com
JAPAN: ON Semiconductor, Japan Customer Focus Center
4321 NishiGotanda, Shinagawaku, Tokyo, Japan 1418549
Phone: 81357402745
Email: r14525@onsemi.com
ON Semiconductor Website: http://onsemi.com
For additional information, please contact your local
Sales Representative.
MC74HCU04A/D
NORTH AMERICA Literature Fulfillment:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 3036752175 or 8003443860 Toll Free USA/Canada
Fax: 3036752176 or 8003443867 Toll Free USA/Canada
Email: ONlit@hibbertco.com
Fax Response Line: 3036752167 or 8003443810 Toll Free USA/Canada
N. American Technical Support: 8002829855 Toll Free USA/Canada
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German Phone: (+1) 3033087140 (MF 1:00pm to 5:00pm Munich Time)
Email: ONlitgerman@hibbertco.com
French Phone: (+1) 3033087141 (MF 1:00pm to 5:00pm Toulouse Time)
Email: ONlitfrench@hibbertco.com
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