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Semiconductor Components Industries, LLC, 2005
August, 2005 - Rev. 1
1
Publication Order Number:
MURHS160/D
MURHS160T3
Preferred Device
MEGAHERTZTM
Power Rectifier
Features and Benefits
Ultrafast 35 Nanosecond Recovery Times
175
C Operating Junction Temperature
High Temperature Glass Passivated Junction
High Voltage Capability to 600 V
Applications
Power Supplies
Inverters
Free Wheeling Diodes
Mechanical Characteristics
Case: Epoxy, Molded
Epoxy Meets UL 94 V-0 @ 0.125 in
Weight: 95 mg (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead Temperature for Soldering Purposes:
260
C Max. for 10 Seconds
Cathode Polarity Band
This is a Pb-Free Device
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
600
V
Average Rectified Forward Current
(Rated V
R
, T
L
= 145C)
I
F(AV)
1.0
A
Nonrepetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
I
FSM
15
A
Operating Junction and Storage
Temperature Range
T
J
, T
stg
-65 to +175
C
ESD Ratings:
Machine Model = C
Human Body Model = 3B
> 400
> 8000
V
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
Device
Package
Shipping
ORDERING INFORMATION
MURHS160T3G
SMB
(Pb-Free)
SMB
CASE 403A
PLASTIC
2500 /Tape & Reel
ULTRAFAST RECTIFIER
1.0 AMPERES
600 VOLTS
1
2
Preferred devices are recommended choices for future use
and best overall value.
MARKING DIAGRAM
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For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
UH16
= Specific Device Code
AL
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb-Free Package
(Note: Microdot may be in either location)
ALYWW
UH16G
G
MURHS160T3
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2
THERMAL CHARACTERISTICS
Rating
Symbol
Value
Unit
Maximum Thermal Resistance, Junction-to-Lead (Note 1)
R
qJL
24
C/W
Maximum Thermal Resistance, Junction-to-Ambient (Note 2)
R
qJA
80
C/W
ELECTRICAL CHARACTERISTICS
Rating
Symbol
Typ
Max
Unit
Maximum Instantaneous Forward Voltage (Note 3)
(I
F
= 1.0 A, T
C
= 25C)
(I
F
= 1.0 A, T
C
= 125C)
V
F
1.5
1.2
2.4
1.7
V
Maximum Instantaneous Reverse Current (Note 3)
(Rated dc Voltage, T
C
= 25C)
(Rated dc Voltage, T
C
= 125C)
I
R
0.18
5.0
20
200
mA
Maximum Reverse Recovery Time
(I
F
= 1.0 A, di/dt = 50 A/ms)
(I
F
= 0.5 A, I
R
= 1.0 A, I
REC
= 0.25 A)
t
rr
25
16
35
30
ns
1. Mounted with minimum recommended pad size, PC Board FR4.
2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%.
MURHS160T3
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3
0.1
1
10
0
0.5
1
1.5
2
2.5
3
I
F
, INST
ANT
ANEOUS FOR
W
ARD
CURRENT
(A)
Figure 1. Typical Forward Voltage
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
T
J
= 150C
T
J
= 25C
T
J
= 125C
0.1
1
10
0
0.5
1
1.5
2
2.5
3
3.5
4
Figure 2. Maximum Forward Voltage
I
F
,
INST
ANT
ANEOUS FOR
W
ARD
CURRENT
(A)
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
T
J
= 25C
T
J
= 150C
T
J
= 125C
1.0E-10
1.0E-09
1.0E-08
1.0E-07
1.0E-06
1.0E-05
1.0E-04
1.0E-03
0
100
200
300
400
500
600
I
R
, REVERSE CURRENT (A)
Figure 3. Typical Reverse Current
V
R
, REVERSE VOLTAGE (V)
T
J
= 150C
T
J
= 125C
T
J
= 25C
0
100
200
300
400
500
600
1.0E-10
1.0E-09
1.0E-08
1.0E-07
1.0E-06
1.0E-05
1.0E-04
1.0E-03
I
R
, MAXIMUM REVERSE CURRENT (A)
Figure 4. Maximum Reverse Current
V
R
, REVERSE VOLTAGE (V)
T
J
= 150C
T
J
= 25C
T
J
= 125C
MURHS160T3
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4
C, CAP
ACIT
ANCE
(pF)
1
10
100
0
20
40
60
80
100
V
R
, REVERSE VOLTAGE (V)
T
J
= 25C
0
1
2
50 60 70 80 90 100 110 120 130 140 150 160 170 180
I
F
,
A
VERAGE
FOR
W
ARD CURRENT (A)
Figure 5. Current Derating
T
C
, CASE TEMPERATURE (C)
SQUARE WAVE
dc
Figure 6. Capacitance
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
P
FO
,
A
VERAGE POWER DISSIP
A
TION
(W)
I
O
, AVERAGE FORWARD CURRENT (A)
SQUARE
Figure 7. Forward Power Dissipation
DC
R(t),
TRANSIENT THERMAL RESIST
ANCE
Figure 8. Thermal Response Junction-to-Ambient
t
1
, TIME (sec)
P
(pk)
t
1
t
2
DUTY CYCLE, D = t
1
/t
2
D = 0.6
SINGLE PULSE
D = 0.2
D = 0.1
D = 0.05
D = 0.01
0.01
0.1
1
10
100
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
MURHS160T3
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5
PACKAGE DIMENSIONS
SMB
CASE 403A-03
ISSUE E
E
b
D
c
L1
L
A
A1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
2.261
0.089
2.743
0.108
2.159
0.085
mm
inches
SCALE 8:1
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DIM
A
MIN
NOM
MAX
MIN
MILLIMETERS
1.90
2.13
2.41
0.075
INCHES
A1
0.05
0.10
0.15
0.002
b
1.96
2.03
2.11
0.077
c
0.15
0.23
0.30
0.006
D
3.30
3.56
3.81
0.130
E
4.06
4.32
4.57
0.160
L
0.76
1.02
1.27
0.030
0.084
0.095
0.004
0.006
0.080
0.083
0.009
0.012
0.140
0.150
0.170
0.180
0.040
0.050
NOM
MAX
5.21
5.44
5.59
0.205
0.214
0.220
H
E
0.51 REF
0.020 REF
D
L1
H
E
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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"Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
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Phone: 81-3-5773-3850
MURHS160/D
MEGAHERTZ is a trademark of Semiconductor Components Industries, LLC.
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