Semiconductor Components Industries, LLC, 2005
February, 2005 - Rev. 2
1
Publication Order Number:
SS26/D
SS26
Surface Mount
Schottky Power Rectifier
SMB Power Surface Mount Package
. . . employing the Schottky Barrier principle in a metal-to-silicon
power rectifier. Features epitaxial construction with oxide passivation
and metal overlay contact. Ideally suited for low voltage, high
frequency switching power supplies; free wheeling diodes and
polarity protection diodes.
Features
Compact Package with J-Bend Leads Ideal for Automated Handling
Highly Stable Oxide Passivated Junction
Guardring for Overvoltage Protection
Low Forward Voltage Drop
Pb-Free Package is Available
Mechanical Characteristics:
Case: Molded Epoxy
Epoxy Meets UL 94, V-O at 0.125 in
Weight: 95 mg (approximately)
Cathode Polarity Band
Lead and Mounting Surface Temperature for Soldering Purposes:
260
C Max. for 10 Seconds
Available in 12 mm Tape, 2500 Units per 13
Reel, Add "T3" Suffix
to Part Number
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
ESD Ratings: Human Body Model = 3B
Machine Model = C
Marking: SS26
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
60
V
Average Rectified Forward Current
(At Rated V
R
, T
L
= 95C)
I
O
2.0
A
Non-Repetitive Peak Surge Current
(Surge Applied at Rated Load Condi-
tions Halfwave, Single Phase, 60 Hz)
I
FSM
40
A
Storage/Operating Case Temperature
T
stg
, T
C
-55 to +150
C
Operating Junction Temperature
T
J
-55 to +150
C
Voltage Rate of Change
(Rated V
R
, T
J
= 25C)
dv/dt
10,000
V/ms
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
Device
Package
Shipping
ORDERING INFORMATION
SMB
CASE 403A
PLASTIC
SS26T3
SMB
2500 / Tape & Reel
SCHOTTKY BARRIER
RECTIFIER
2.0 AMPERES
60 VOLTS
MARKING DIAGRAM
SS26
SS26 = Device Code
http://onsemi.com
SS26T3G
SMB
(Pb-Free)
2500 / Tape & Reel
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
SS26
http://onsemi.com
2
THERMAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
Thermal Resistance - Junction-to-Lead (Note 1)
Thermal Resistance - Junction-to-Ambient (Note 2)
R
qJL
R
qJA
24
80
C/W
1. Mounted with minimum recommended pad size, PC Board FR4.
2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.
ELECTRICAL CHARACTERISTICS
Value
Characteristic
Symbol
T
J
= 25C
T
J
= 125C
Unit
Maximum Instantaneous Forward Voltage
(Note 3)
(i
F
= 1.0 A)
(i
F
= 2.0 A)
v
F
0.51
0.63
0.475
0.55
V
Maximum Instantaneous Reverse Current (Note 3)
(V
R
= 60 V)
I
R
0.2
10
mA
3. Pulse Test: Pulse Width 250 ms, Duty Cycle 2.0%.
Figure 1. Typical Forward Voltage
0.1
0.2
0.4
0.7
0.6
10
0.1
1
I
F
,
INST
ANT
ANEOUS
FOR
W
ARD
CURRENT (A)
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 2. Maximum Forward Voltage
0.2
0.8
0.4
0.6
0.3
0.5
10
0.1
1
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
I
F
, INST
ANT
ANEOUS FOR
W
ARD
CURRENT (A)
Figure 3. Typical Reverse Current
10
30
0
20
40
I
R
,
REVERSE CURRENT (A)
V
R
, REVERSE VOLTAGE (V)
Figure 4. Typical Capacitance
75C
25C
1.0E-02
125C
75C
25C
10
30
0
20
40
10
C, CAP
ACIT
ANCE
(pF)
V
R
, REVERSE VOLTAGE (V)
0.3
0.5
0.8
125C
75C
25C
125C
60
50
50
60
100
0.7
0.1
1.0E-03
1.0E-04
1.0E-05
1.0E-06
1.0E-07
25C
f = 1 MHz
SS26
http://onsemi.com
3
Figure 5. Current Derating - Junction to Lead
70
90
60
80
100
1.5
I
F
,
A
VERAGE
FOR
W
ARD CURRENT (A)
T
L
, LEAD TEMPERATURE (C)
Figure 6. Forward Power Dissipation
2.5
3
3.5
0.5
1.5
0
1
2
0
0.2
P
FO
,
A
VERAGE POWER DISSIP
A
T
ION
(W)
I
O
, AVERAGE FORWARD CURRENT (A)
0.4
0.6
120
110
130
2.5
3
1
1.8
2
0
0.5
1
2
dc
SQUARE WAVE
0.8
1.2
1.4
1.6
dc
SQUARE WAVE
Figure 7. Thermal Response - Junction to Case
Figure 8. Thermal Response - Junction to Ambient
0.1
0.00001
t, TIME (s)
1.0E+00
1.0E-01
1.0E-02
1.0E-03
1.0E-04
0.0001
0.001
0.01
1.0
10
100
1000
50%
20%
10%
5.0%
2.0%
1.0%
R
tjl(t)
= R
tjl*r(t)
t, TIME (s)
1.0E+00
1.0E-01
1.0E-02
1.0E-03
1.0E-04
50%
20%
10%
5.0%
2.0%
1.0%
R
T
, TRANSIENT THERMAL RESIST
ANCE (NORMALIZED)
R
T
, TRANSIENT THERMAL RESIST
ANCE (NORMALIZED)
0.1
0.00001
0.0001
0.001
0.01
1.0
10
100
1000
R
tjl(t)
= R
tjl*r(t)
SS26
http://onsemi.com
4
PACKAGE DIMENSIONS
SMB
PLASTIC PACKAGE
CASE 403A-03
ISSUE D
A
S
D
B
J
P
K
C
H
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN
DIMENSION P.
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.160
0.180
4.06
4.57
B
0.130
0.150
3.30
3.81
C
0.075
0.095
1.90
2.41
D
0.077
0.083
1.96
2.11
H 0.0020 0.0060
0.051
0.152
J
0.006
0.012
0.15
0.30
K
0.030
0.050
0.76
1.27
P
0.020 REF
0.51 REF
S
0.205
0.220
5.21
5.59
mm
inches
SCALE 8:1
2.743
0.108
2.159
0.085
2.261
0.089
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
"Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
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SS26/D
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