ER500 THRU ER506
SUPERFAST RECOVERY RECTIFIERS
VOLTAGE - 50 to 600 Volts CURRENT - 5.0 Amperes
FEATURES
l
Superfast recovery times-epitaxial construction
l
Low forward voltage, high current capability
l
Exceeds environmental standards of MIL-S-19500/228
l
Hermetically sealed
l
Low leakage
l
High surge capability
l
Plastic package has Underwriters Laboratories
Flammability Classification 94V-O utilizing
Flame Retardant Epoxy Molding Compound
MECHANICAL DATA
Case: Molded plastic, DO-201AD
Terminals: Axial leads, solderable to MIL-STD-202,
Method 208
Polarity: Color Band denotes cathode end
Mounting Position: Any
Weight: 0.04 ounce, 1.12 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25
J
ambient temperature unless otherwise specified.
Resistive or inductive load, 60Hz.
ER500
ER501
ER501A
ER502
ER503
ER504
ER506
UNITS
Maximum Recurrent Peak Reverse Voltage
50
100
150
200
300
400
600
V
Maximum RMS Voltage
35
70
105
140
210
320
420
V
Maximum DC Blocking Voltage
50
100
150
200
300
400
600
V
Maximum Average Forward
Current .375"(9.5mm) lead length
at T
A
=55
J
5.0
A
Peak Forward Surge Current, I
FM
(surge):
8.3ms single half sine-wave superimposed
on rated load(JEDEC method)
150.0
A
Maximum Forward Voltage at 5.0A DC
.95
1.25
1.7
V
Maximum DC Reverse Current
at Rated DC Blocking Voltage
5.0
g
A
Maximum DC Reverse Current at
Rated DC Blocking Voltage T
A
=125
J
300
g
A
Maximum Reverse Recovery Time(Note 1)
35.0
ns
Typical Junction capacitance (Note 2)
45
P
F
Typical Junction Resistance(Note 3) R
K
JA
25.0
J
/W
Operating and Storage Temperature Range T
J
-55 to +150
J
NOTES:
1. Reverse Recovery Test Conditions: I
F
=.5A, I
R
=1A, Irr=.25A
2. Measured at 1 MHz and applied reverse voltage of 4.0 VDC
3. Thermal resistance from junction to ambient and from junction to lead length 0.375"(9.5mm) P.C.B. mounted
DO-201AD
RATING AND CHARACTERISTIC CURVES
ER500 THRU ER506
NOTE:1.Rise Time = 7ns max.
Input Impedance = 1 megohm. 22pF
2.Rise Time = 10ns max.
Source Impedance = 50 Ohms
t
rr
+0.5A
0
-0.25
-1.0
SET TIME 1cm
BASE FOR
50 ns/cm
8.0
6.0
4.0
2.0
0
50 75 100
125
150
175
200
ON HEAT SINK
ON PCB
AMBIENT TEMPERATURE,
J
Fig. 1-REVERSE RECOVERY TIME CHARACTERISTIC AND
TEST CIRCUIT DIAGRAM
Fig. 2-MAXIMUM AVERAGE FORWARD
CURRENT RATING
5.0
4.0
3.0
2.0
1.0
0
0
50
100 150
CASE TEMPERATURE,
J
100
10
1
0.1
0.01
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4
ER506
ER500 ~ ER502
ER503 ~ ER504
INSTANTANEOUS FORWARD VOLTAGE, VOLTS
Fig. 3-MAXIMUM AVERAGE FORWARD CCURRENT
RATING
Fig. 4-FORWARD CURRENT DERATING CURVE
y
200
150
125
75
35
1 5 10 50 100
8.3ms SINGLE HALF SINE
WAVE JEDEC METHOD
NUMBER OF CYCLES AT 60Hz
100
10
5
1 10 100
TJ = 25
J
f = 1.0MHz
Vsig = 50mVp-p
REVERSE VOLTAGE, VOLTS
Fig. 5-MAXIMUM NON-REPETITIVE SURGE CURRENT
Fig. 6-TYPICAL JUNCTION CAPACITANCE
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